查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
封面
市場調查報告書
商品編碼
1465122

半導體和IC封裝材料市場：按類型、技術和最終用途分類 - 2024-2030 年全球預測

Semiconductor & IC Packaging Materials Market by Type (Bonding wires, Ceramic Packages, Die Attach Materials), Technology (Dual Flat No-leads, Dual-in-line, Grid Array), End-use - Global Forecast 2024-2030
出版日期: | 出版商: 360iResearch | 英文 186 Pages | 商品交期: 最快1-2個工作天內

價格

※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

預計2023年半導體和IC封裝材料市場規模為384.4億美元，2024年達421.6億美元，2030年達766.4億美元，複合年成長率為10.35%。

半導體和積體電路 (IC) 封裝材料包括用於封裝和保護電子電路和半導體的各種材料和組件。這些材料可作為物理屏蔽，在散熱、電絕緣以及提高半導體可靠性和性能方面發揮重要作用。其應用的擴展主要是由家用電子電器、通訊設備和汽車電子需求的快速成長所推動的。隨著技術進步和電子設備變得更小、更強大，對高效、耐用和耐熱包裝材料的需求不斷增加。然而，該行業面臨挑戰，特別是一些包裝材料對環境的影響，以及尋找能夠在越來越高的溫度下承受惡劣工作條件的材料。解決這些缺點需要持續研究和開發，以發現更永續的材料和創新的包裝技術，以減少廢棄物並提高性能。然而，5G 技術、物聯網 (IoT)、人工智慧 (AI) 的出現以及電動車 (EV) 的日益普及預計將刺激進一步成長。此外，具有更強運算能力的較小設備的趨勢表明，對能夠適應這些趨勢的先進封裝解決方案的需求不斷增加。材料科學的創新，例如開發環保和高導熱材料，有望滿足技術環境不斷變化的需求，並為該產業擴張開闢新途徑。

主要市場統計
基準年[2023] 384.4億美元
預測年份 [2024] 421.6億美元
預測年份 [2030] 766.4億美元
複合年成長率（%） 10.35%

陶瓷封裝類型對於高效能和高可靠性應用的適用性

鍵合線是細金屬線，通常由金、鋁或銅製成，用於在半導體裝置內進行電氣連接。它們在半導體的功能中發揮關鍵作用，促進晶片內部和外部世界之間的電訊號和電力的流動。陶瓷封裝是一種封裝半導體晶片的保護殼，可提供高水準的保護，免受潮濕、溫度變化和物理應力等環境因素的影響。陶瓷具有優異的熱絕緣性能和電絕緣性能，適合高性能、高可靠性應用。連接材料是用於將半導體晶粒（或晶片）黏合到基板或封裝黏劑或金屬合金。它對於機械支撐和溫度控管都很重要，可確保晶粒牢固固定，同時促進晶片散熱。

封裝樹脂是用於封裝和保護半導體晶片及其內部連接的聚合物。導線架是半導體封裝內的金屬結構，用於機械支撐並電連接矽晶片和外部電路。導線架對於向晶片分配電源和訊號至關重要，並且在設備的整體性能中起著關鍵作用。有機基板用作建構半導體裝置的基礎層。這些基板由有機聚合物製成，旨在支援各種電子元件，為半導體封裝內的互連提供平台，影響最終產品。球柵陣列 (BGA) 封裝中使用的焊球是小型焊球，形成半導體封裝和印刷電路基板(PCB) 之間的電氣連接。焊球對於在晶片封裝與其外部環境之間建立可靠的實體和電氣介面至關重要。熱感界面材料 (TIM) 是插入半導體裝置及其散熱器之間以促進熱傳遞的物質。透過提高從晶片到散熱組件的熱傳遞效率，TIM 在管理半導體裝置的動作溫度並將其保持在安全工作範圍內發揮至關重要的作用。

最終用途 由於出色的電絕緣性和溫度控管，在家用電子電器中普及

在航太和國防領域，所使用的半導體封裝材料必須能夠承受高輻射、極端溫度和機械應力等惡劣條件。高性能陶瓷和堅固的複合材料通常用於確保航太和國防應用中半導體的使用壽命和可靠性。這些材料在導航、通訊和監視系統中發揮重要作用。隨著汽車中使用的電子元件數量不斷增加，汽車產業正在經歷一場變革。汽車產業的包裝材料必須確保車輛在整個生命週期（通常是在惡劣的環境下）的高可靠性。所使用的材料必須能夠承受振動、高溫和潮濕。矽膠和先進聚合物因其耐用性和耐熱性而被廣泛使用。智慧型手機、筆記型電腦和穿戴式裝置等家用電器需要能夠實現輕量、緊湊和高效設計的半導體封裝材料。這裡的重點是提高性能，同時最大限度地減少空間。環氧樹脂和塑膠化合物因其優異的電絕緣性和溫度控管性能而成為首選。在醫療保健領域，半導體有著廣泛的應用，從診斷設備到穿戴式健康監視器。醫療器材的包裝材料必須符合嚴格的生物相容性、滅菌相容性和可靠性標準。對人體安全且在醫療環境中可靠工作的特殊聚合物和陶瓷是保護和提高醫療設備中使用的半導體性能的關鍵。在 IT 和通訊領域，對更快資料處理和通訊的需求正在推動對先進半導體封裝材料的需求。這些材料必須支援高速訊號傳輸，同時有效散熱以防止過熱。高導熱材料（包括碳化矽和先進聚合物）用於滿足這些需求，並確保資料中心、伺服器和通訊設備可靠且有效率的運作。

區域洞察

在美洲，美國憑藉先進的研發能力和主要半導體製造商的存在，在半導體封裝材料市場中佔據主導地位。在對更高性能、更小和更節能設備的需求的推動下，該地區正在轉向更複雜的封裝解決方案。矽樹脂、塑膠和玻璃等材料經常與先進複合材料一起使用。對可再生能源和電動車的投資增加也影響了該地區對半導體封裝材料的需求。由於不同國家的經濟和技術成熟度不同，歐洲、中東和非洲地區呈現多種情境。歐洲處於領先地位，擁有強大的汽車和工業部門，需要高可靠性的半導體封裝。特別需要能夠承受惡劣環境的先進封裝技術。中東和非洲雖然正在成長，但僅佔全球市場的一小部分，但隨著對通訊和基礎設施的投資，它們正在快速發展。在中國、韓國、台灣和日本等國家的推動下，亞太地區是半導體和IC封裝材料最具活力和成長最快的地區。這些國家是一些世界上最大的電子產品製造商的所在地，並推動了對各種包裝材料的需求。該地區市場的特點是消費性電子產品數量龐大，包括智慧型手機、平板電腦和其他行動裝置，需要經濟高效且高效能的創新封裝解決方案。

FPNV定位矩陣

FPNV定位矩陣對於評估半導體和IC封裝材料市場至關重要。我們檢視與業務策略和產品滿意度相關的關鍵指標，以對供應商進行全面評估。這種深入的分析使用戶能夠根據自己的要求做出明智的決策。根據評估，供應商被分為四個成功程度不同的像限：前沿（F）、探路者（P）、利基（N）和重要（V）。

市場佔有率分析

市場佔有率分析是一種綜合工具，可以對半導體和IC封裝材料市場供應商的現狀進行深入而深入的研究。全面比較和分析供應商在整體收益、基本客群和其他關鍵指標方面的貢獻，以便更好地了解公司的績效及其在爭奪市場佔有率時面臨的挑戰。此外，該分析還提供了對該行業競爭特徵的寶貴見解，包括在研究基準年觀察到的累積、分散主導地位和合併特徵等因素。這種詳細程度的提高使供應商能夠做出更明智的決策並制定有效的策略，從而在市場上獲得競爭優勢。

該報告對以下幾個方面提供了寶貴的見解：

1. 市場滲透率：提供有關主要企業所服務的市場的全面資訊。

2. 市場開拓：我們深入研究利潤豐厚的新興市場，並分析其在成熟細分市場的滲透率。

3. 市場多元化：提供有關新產品發布、開拓地區、最新發展和投資的詳細資訊。

4. 競爭評估和情報：對主要企業的市場佔有率、策略、產品、認證、監管狀況、專利狀況和製造能力進行全面評估。

5. 產品開發與創新：提供對未來技術、研發活動和突破性產品開發的見解。

本報告解決了以下關鍵問題：

1.半導體/ IC封裝材料市場規模及預測如何？

2.半導體和IC封裝材料市場預測期間需要考慮投資的產品、細分市場、應用和領域有哪些？

3.半導體/ IC封裝材料市場的技術趨勢和法規結構是什麼？

4.半導體/ IC封裝材料市場主要廠商的市場佔有率是多少？

5.進入半導體/ IC封裝材料市場的合適型態和策略手段是什麼？

目錄

第1章 前言

第2章調查方法

第3章執行摘要

第4章市場概況

第5章市場洞察

  • 市場動態
    • 促進因素
      • 家用電子電器對半導體和IC封裝材料的需求增加
      • 支持創新包裝材料的技術不斷進步
      • 電子設備領域小型化、高密度化進展
    • 抑制因素
      • 半導體產業外包和測試中的智慧財產權問題
    • 機會
      • 與先進技術融合
      • 介紹 5G 和自動駕駛汽車
    • 任務
      • 加強有關材料使用和處置的環境法規
  • 市場區隔分析
    • 類型：陶瓷封裝，適合高效能、高可靠性應用
    • 最終用途：具有良好電絕緣性和良好溫度控管的家用電子電器的普及
  • 市場擾動分析
  • 波特五力分析
  • 價值鍊和關鍵路徑分析
  • 價格分析
  • 技術分析
  • 專利分析
  • 貿易分析
  • 法規結構分析

第6章半導體/ IC封裝材料市場：依類型

  • 鍵合線
  • 陶瓷封裝
  • 晶片貼裝材料
  • 封裝樹脂
  • 導線架
  • 有機基材
  • 焊球
  • 導熱材料

第7章半導體/ IC封裝材料市場：依技術分類

  • 雙扁平無引線
  • 雙列直插式
  • 網格陣列
  • 四方扁平無引線
  • 四方扁平封裝
  • 小外形封裝

第8章半導體/ IC封裝材料市場：依最終用途分類

  • 航太和國防
  • 車
  • 家用電器
  • 衛生保健
  • 資訊科技和通訊

第9章 美洲半導體/ IC封裝材料市場

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美國

第10章亞太半導體/ IC封裝材料市場

  • 澳洲
  • 中國
  • 印度
  • 印尼
  • 日本
  • 馬來西亞
  • 菲律賓
  • 新加坡
  • 韓國
  • 台灣
  • 泰國
  • 越南

第11章 歐洲、中東、非洲半導體/ IC封裝材料市場

  • 丹麥
  • 埃及
  • 芬蘭
  • 法國
  • 德國
  • 以色列
  • 義大利
  • 荷蘭
  • 奈及利亞
  • 挪威
  • 波蘭
  • 卡達
  • 俄羅斯
  • 沙烏地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公國
  • 英國

第12章競爭格局

  • 2023 年市場佔有率分析
  • FPNV 定位矩陣，2023
  • 競爭情境分析
    • Amkor 與 Apple 結成策略聯盟，建造最大的先進半導體封裝廠
    • Resonac 在矽谷開設新的封裝解決方案中心，為半導體創新奠定基礎
    • 半導體封裝的策略擴張與創新
  • 戰略分析和建議

第13章競爭產品組合

  • 主要企業簡介
  • 主要產品系列
Product Code: MRR-7A22CB0E5917

[186 Pages Report] The Semiconductor & IC Packaging Materials Market size was estimated at USD 38.44 billion in 2023 and expected to reach USD 42.16 billion in 2024, at a CAGR 10.35% to reach USD 76.64 billion by 2030.

Semiconductor and Integrated Circuit (IC) packaging materials include a broad range of substances and components used to encase and protect electronic circuits or semiconductors. These materials serve as a physical shield and play critical roles in heat dissipation, electrical insulation, and enhancing the reliability and performance of the semiconductors. The expansion in their use is primarily driven by the burgeoning demand for consumer electronics, telecommunications equipment, and automotive electronics. As technology advances and electronic devices become more compact and powerful, the need for efficient, durable, and heat-resistant packaging materials has escalated. However, the industry faces challenges, notably concerning the environmental impact of some packaging materials and the quest for materials that can withstand increasingly high temperatures and harsh operating conditions. Addressing these disadvantages requires ongoing research and development to discover more sustainable materials and innovative packaging techniques that reduce waste and enhance performance. Nevertheless, the advent of 5G technology, the Internet of Things (IoT), artificial intelligence (AI), and the increasing adoption of electric vehicles (EVs) are expected to spur further growth. Moreover, the drive towards miniaturized devices with higher computing power signals a growing demand for advanced packaging solutions that can accommodate these trends. Innovations in materials science, such as the development of eco-friendly and high thermal conductivity materials, are poised to open new avenues for industry expansion, catering to the evolving needs of the technology landscape.

KEY MARKET STATISTICS
Base Year [2023] USD 38.44 billion
Estimated Year [2024] USD 42.16 billion
Forecast Year [2030] USD 76.64 billion
CAGR (%) 10.35%

Type: Suitability of ceramic packages for high-performance and high-reliability applications

Bonding wires are thin metal wires, often made from gold, aluminum, or copper, used to create electrical connections within a semiconductor device. They play a critical role in the functionality of the semiconductor, facilitating the flow of electrical signals and power within the chip and between the chip and the outside world. Ceramic packages are protective casings used to enclose semiconductor chips, offering high levels of protection against environmental factors such as moisture, temperature changes, and physical stress. Ceramics are preferred for their excellent thermal and electrical insulation properties, making them suitable for high-performance and high-reliability applications. Attach materials are adhesives or metal alloys used to bind the semiconductor die (or chip) to the substrate or package. They are crucial for both mechanical support and thermal management, ensuring the die remains firmly in place while also facilitating heat dissipation away from the chip.

Encapsulation resins are polymers used to encapsulate and protect the semiconductor chip and its internal connections. Leadframes are the metal structures within a semiconductor package that provide mechanical support and electrical connections between the silicon chip & the external circuitry. They are essential for the distribution of power and signals to and from the chip, playing a significant role in the device's overall performance. An organic substrate acts as the base layer upon which semiconductor devices are built. Made from organic polymers and designed to support various electronic components, these substrates offer a platform for interconnections within the semiconductor package, influencing the electrical performance and integration level of the final product. Solder balls, used in ball grid array (BGA) packaging, are tiny spheres of solder that form the electrical connections between the semiconductor package and the printed circuit board (PCB). They are critical for establishing a reliable physical and electrical interface between the chip package and its external environment. Thermal interface materials (TIMs) are substances inserted between the semiconductor device and its heat sink to enhance thermal conduction. By improving heat transfer efficiency from the chip to the heat-dissipating components, TIMs play a pivotal role in managing the operational temperature of semiconductor devices, ensuring they remain within safe operating limits.

End-use: Proliferation in consumer electronics for excellent electrical insulation and good thermal management

In the Aerospace & Defense sector, Semiconductor packaging materials used need to withstand extreme conditions, such as high radiation, extreme temperatures, and mechanical stress. High-performance ceramics and robust compound materials are commonly utilized to ensure the longevity and reliability of semiconductors in aerospace and defense applications. These materials enable crucial functions in navigation, communication, and surveillance systems. The automotive industry is witnessing a transformation with the increase in electronic components used in vehicles. Packaging materials in the automotive sector must ensure high reliability over the vehicle's lifespan, often in harsh environments. Materials used must resist vibrations, high temperatures, and moisture. Silicones and advanced polymers, known for their durability and heat resistance, are widely used. Consumer electronics, including smartphones, laptops, and wearables, demand semiconductor packaging materials that allow for lightweight, compact, and efficient designs. The focus here is on enhancing performance while minimizing space. Epoxy resins and plastic compounds, offering excellent electrical insulation and good thermal management, are preferred. In the healthcare sector, semiconductors are used in a wide array of applications, from diagnostic equipment to wearable health monitors. Packaging materials in healthcare devices must meet stringent criteria for biocompatibility, sterilization compatibility, and reliability. Specialized polymers and ceramics, safe for human exposure and capable of operating reliably in medical environments, are key to protecting and enhancing the performance of semiconductors in medical devices. In IT & telecommunications, the demand for faster data processing and communication drives the need for advanced semiconductor packaging materials. These materials must support high-speed signal transmission while dissipating heat efficiently to prevent overheating. High thermal conductivity materials including silicon carbide and advanced polymers are used to meet these needs, ensuring reliable and efficient operation of data centers, servers, and telecommunication equipment.

Regional Insights

In the Americas, the United States plays a leading role in the semiconductor packaging materials market in the face of advanced R&D capabilities and the presence of major semiconductor manufacturers. The region is experiencing a shift towards more sophisticated packaging solutions, driven by the demand for higher performance and smaller, more energy-efficient devices. Materials such as silicon, plastic, and glass, along with advanced composites, are heavily used. Increased investment in renewable energy & electric vehicles is also shaping the demand for semiconductor packaging materials in this region. The EMEA region presents a diverse scenario due to its varied economic and technological maturity across countries. Europe is at the forefront, characterized by its robust automotive and industrial sectors, which demand high-reliability semiconductor packages. Advanced packaging technologies that can withstand harsh environments are particularly in demand. The Middle East and Africa, though growing, represent a smaller segment of the global market but are rapidly evolving with investments in telecommunications and infrastructure development. The Asia Pacific region showcases the most dynamic and fastest-growing landscape for semiconductor and IC packaging materials, led by countries including China, South Korea, Taiwan, and Japan. These countries host some of the world's largest electronics manufacturers, driving the demand for a wide range of packaging materials. The region's market is characterized by a high volume of consumer electronics production, including smartphones, tablets, and other portable devices, requiring innovative packaging solutions that are cost-effective yet high-performing.

FPNV Positioning Matrix

The FPNV Positioning Matrix is pivotal in evaluating the Semiconductor & IC Packaging Materials Market. It offers a comprehensive assessment of vendors, examining key metrics related to Business Strategy and Product Satisfaction. This in-depth analysis empowers users to make well-informed decisions aligned with their requirements. Based on the evaluation, the vendors are then categorized into four distinct quadrants representing varying levels of success: Forefront (F), Pathfinder (P), Niche (N), or Vital (V).

Market Share Analysis

The Market Share Analysis is a comprehensive tool that provides an insightful and in-depth examination of the current state of vendors in the Semiconductor & IC Packaging Materials Market. By meticulously comparing and analyzing vendor contributions in terms of overall revenue, customer base, and other key metrics, we can offer companies a greater understanding of their performance and the challenges they face when competing for market share. Additionally, this analysis provides valuable insights into the competitive nature of the sector, including factors such as accumulation, fragmentation dominance, and amalgamation traits observed over the base year period studied. With this expanded level of detail, vendors can make more informed decisions and devise effective strategies to gain a competitive edge in the market.

Key Company Profiles

The report delves into recent significant developments in the Semiconductor & IC Packaging Materials Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Advanced Semiconductor Engineering Inc, AMETEK Electronic Components & Packaging, Amtech Microelectronics, Inc., ASE Group, California Fine Wire Co., Canatu Oy, Ceramtec GmbH, Chipbond Technology Corporation, Chipmos Technologies Inc., Deca Technologies, FlipChip International LLC, Fujitsu Semiconductor Limited, Henkel AG & Co. KGaA, Intel Corporation, Interconnect Systems Inc. (ISI), Kyocera Chemical Corporation, Microchip Technology, Powertech Technology, Inc., Samsung Electronics Co. Ltd, Siemens AG, Sumitomo Chemical Co., Ltd., Taiwan Semiconductor Manufacturing Company, Tianshui Huatian Technology Co., Ltd., Toray Industries, Inc., Unisem Berhad, and UTAC Group.

Market Segmentation & Coverage

This research report categorizes the Semiconductor & IC Packaging Materials Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Type
    • Bonding wires
    • Ceramic Packages
    • Die Attach Materials
    • Encapsulation Resins
    • Leadframes
    • Organic substrate
    • Solder Balls
    • Thermal Interface Materials
  • Technology
    • Dual Flat No-leads
    • Dual-in-line
    • Grid Array
    • Quad Flat no-leads
    • Quad Flat Packages
    • Small Outline Package
  • End-use
    • Aerospace & Defense
    • Automotive
    • Consumer Electronics
    • Healthcare
    • IT & Telecommunication
  • Region
    • Americas
      • Argentina
      • Brazil
      • Canada
      • Mexico
      • United States
        • California
        • Florida
        • Illinois
        • New York
        • Ohio
        • Pennsylvania
        • Texas
    • Asia-Pacific
      • Australia
      • China
      • India
      • Indonesia
      • Japan
      • Malaysia
      • Philippines
      • Singapore
      • South Korea
      • Taiwan
      • Thailand
      • Vietnam
    • Europe, Middle East & Africa
      • Denmark
      • Egypt
      • Finland
      • France
      • Germany
      • Israel
      • Italy
      • Netherlands
      • Nigeria
      • Norway
      • Poland
      • Qatar
      • Russia
      • Saudi Arabia
      • South Africa
      • Spain
      • Sweden
      • Switzerland
      • Turkey
      • United Arab Emirates
      • United Kingdom

The report offers valuable insights on the following aspects:

1. Market Penetration: It presents comprehensive information on the market provided by key players.

2. Market Development: It delves deep into lucrative emerging markets and analyzes the penetration across mature market segments.

3. Market Diversification: It provides detailed information on new product launches, untapped geographic regions, recent developments, and investments.

4. Competitive Assessment & Intelligence: It conducts an exhaustive assessment of market shares, strategies, products, certifications, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players.

5. Product Development & Innovation: It offers intelligent insights on future technologies, R&D activities, and breakthrough product developments.

The report addresses key questions such as:

1. What is the market size and forecast of the Semiconductor & IC Packaging Materials Market?

2. Which products, segments, applications, and areas should one consider investing in over the forecast period in the Semiconductor & IC Packaging Materials Market?

3. What are the technology trends and regulatory frameworks in the Semiconductor & IC Packaging Materials Market?

4. What is the market share of the leading vendors in the Semiconductor & IC Packaging Materials Market?

5. Which modes and strategic moves are suitable for entering the Semiconductor & IC Packaging Materials Market?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Rising demand for semiconductor and IC packaging materials for consumer electronics
      • 5.1.1.2. Relentless advancement in technology supporting innovative packaging materials
      • 5.1.1.3. Growing miniaturization and densification in electronic sector
    • 5.1.2. Restraints
      • 5.1.2.1. IP Concerns of semiconductor industry in outsourcing and testing
    • 5.1.3. Opportunities
      • 5.1.3.1. Integration with advance technologies
      • 5.1.3.2. Adoption of 5G and autonomous vehicles
    • 5.1.4. Challenges
      • 5.1.4.1. Increasing environmental regulations regarding the use and disposal of materials
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Type: Suitability of ceramic packages for high-performance and high-reliability applications
    • 5.2.2. End-use: Proliferation in consumer electronics for excellent electrical insulation and good thermal management
  • 5.3. Market Disruption Analysis
  • 5.4. Porter's Five Forces Analysis
    • 5.4.1. Threat of New Entrants
    • 5.4.2. Threat of Substitutes
    • 5.4.3. Bargaining Power of Customers
    • 5.4.4. Bargaining Power of Suppliers
    • 5.4.5. Industry Rivalry
  • 5.5. Value Chain & Critical Path Analysis
  • 5.6. Pricing Analysis
  • 5.7. Technology Analysis
  • 5.8. Patent Analysis
  • 5.9. Trade Analysis
  • 5.10. Regulatory Framework Analysis

6. Semiconductor & IC Packaging Materials Market, by Type

  • 6.1. Introduction
  • 6.2. Bonding wires
  • 6.3. Ceramic Packages
  • 6.4. Die Attach Materials
  • 6.5. Encapsulation Resins
  • 6.6. Leadframes
  • 6.7. Organic substrate
  • 6.8. Solder Balls
  • 6.9. Thermal Interface Materials

7. Semiconductor & IC Packaging Materials Market, by Technology

  • 7.1. Introduction
  • 7.2. Dual Flat No-leads
  • 7.3. Dual-in-line
  • 7.4. Grid Array
  • 7.5. Quad Flat no-leads
  • 7.6. Quad Flat Packages
  • 7.7. Small Outline Package

8. Semiconductor & IC Packaging Materials Market, by End-use

  • 8.1. Introduction
  • 8.2. Aerospace & Defense
  • 8.3. Automotive
  • 8.4. Consumer Electronics
  • 8.5. Healthcare
  • 8.6. IT & Telecommunication

9. Americas Semiconductor & IC Packaging Materials Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific Semiconductor & IC Packaging Materials Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa Semiconductor & IC Packaging Materials Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
    • 12.3.1. Amkor and Apple Forge Strategic Alliance to Build Largest Advanced Semiconductor Packaging Facility
    • 12.3.2. Resonac Sets Foundation for Semiconductor Innovation with New Packaging Solution Center in Silicon Valley
    • 12.3.3. Strategic Expansion and Innovation in Semiconductor Packaging
  • 12.4. Strategy Analysis & Recommendation

13. Competitive Portfolio

  • 13.1. Key Company Profiles
  • 13.2. Key Product Portfolio

LIST OF FIGURES

  • FIGURE 1. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET RESEARCH PROCESS
  • FIGURE 2. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2023 VS 2030 (%)
  • FIGURE 5. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET DYNAMICS
  • FIGURE 7. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
  • FIGURE 8. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 9. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
  • FIGURE 10. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 11. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2023 VS 2030 (%)
  • FIGURE 12. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 13. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 14. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 15. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 16. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 17. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 18. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 19. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 20. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 21. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 22. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2018-2023 (USD MILLION)
  • TABLE 4. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2024-2030 (USD MILLION)
  • TABLE 5. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 6. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 7. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 8. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 9. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BONDING WIRES, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 10. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BONDING WIRES, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 11. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CERAMIC PACKAGES, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 12. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CERAMIC PACKAGES, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 13. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH MATERIALS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 14. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH MATERIALS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 15. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULATION RESINS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 16. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULATION RESINS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 17. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEADFRAMES, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 18. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEADFRAMES, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 19. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ORGANIC SUBSTRATE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 20. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ORGANIC SUBSTRATE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 21. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALLS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 22. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALLS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 23. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY THERMAL INTERFACE MATERIALS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 24. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY THERMAL INTERFACE MATERIALS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 25. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 26. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 27. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DUAL FLAT NO-LEADS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 28. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DUAL FLAT NO-LEADS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 29. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DUAL-IN-LINE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 30. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DUAL-IN-LINE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 31. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY GRID ARRAY, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 32. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY GRID ARRAY, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 33. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY QUAD FLAT NO-LEADS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 34. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY QUAD FLAT NO-LEADS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 35. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY QUAD FLAT PACKAGES, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 36. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY QUAD FLAT PACKAGES, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 37. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMALL OUTLINE PACKAGE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 38. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMALL OUTLINE PACKAGE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 39. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 40. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 41. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 42. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 43. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 44. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 45. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 46. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 47. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 48. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 49. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IT & TELECOMMUNICATION, BY REGION, 2018-2023 (USD MILLION)
  • TABLE 50. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY IT & TELECOMMUNICATION, BY REGION, 2024-2030 (USD MILLION)
  • TABLE 51. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 52. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 53. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 54. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 55. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 56. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 57. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2023 (USD MILLION)
  • TABLE 58. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024-2030 (USD MILLION)
  • TABLE 59. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 60. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 61. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 62. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 63. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 64. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 65. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 66. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 67. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 68. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 69. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 70. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 71. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 72. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 73. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 74. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 75. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 76. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 77. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 78. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 79. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 80. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 81. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 82. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 83. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 84. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 85. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 86. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 87. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 88. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 89. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2018-2023 (USD MILLION)
  • TABLE 90. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2024-2030 (USD MILLION)
  • TABLE 91. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 92. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 93. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 94. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 95. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 96. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 97. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2023 (USD MILLION)
  • TABLE 98. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024-2030 (USD MILLION)
  • TABLE 99. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 100. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 101. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 102. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 103. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 104. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 105. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 106. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 107. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 108. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 109. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 110. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 111. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 112. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 113. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 114. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 115. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 116. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 117. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 118. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 119. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 120. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 121. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 122. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 123. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 124. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 125. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 126. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 127. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 128. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 129. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 130. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 131. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 132. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 133. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 134. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 135. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 136. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 137. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 138. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 139. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 140. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 141. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 142. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 143. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 144. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 145. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 146. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 147. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 148. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 149. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 150. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 151. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 152. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 153. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 154. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 155. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 156. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 157. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 158. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 159. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 160. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 161. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 162. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 163. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 164. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 165. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 166. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 167. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 168. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 169. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 170. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 171. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 172. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 173. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 174. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 175. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 176. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 177. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2023 (USD MILLION)
  • TABLE 178. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2024-2030 (USD MILLION)
  • TABLE 179. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 180. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 181. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 182. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 183. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 184. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 185. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 186. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 187. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 188. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 189. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 190. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 191. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 192. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 193. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 194. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 195. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 196. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 197. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 198. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 199. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 200. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 201. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 202. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 203. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 204. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 205. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 206. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 207. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 208. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 209. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 210. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 211. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 212. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 213. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 214. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 215. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 216. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 217. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 218. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 219. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 220. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 221. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 222. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 223. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 224. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 225. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 226. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 227. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 228. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 229. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 230. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 231. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 232. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 233. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 234. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 235. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 236. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 237. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 238. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 239. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 240. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 241. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 242. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 243. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 244. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 245. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 246. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 247. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 248. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 249. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 250. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 251. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 252. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 253. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 254. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 255. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 256. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 257. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 258. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 259. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 260. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 261. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 262. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 263. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 264. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 265. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 266. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 267. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 268. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 269. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 270. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 271. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 272. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 273. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 274. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 275. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 276. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 277. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 278. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 279. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 280. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 281. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 282. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 283. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 284. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 285. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 286. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 287. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 288. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 289. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 290. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 291. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 292. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2024-2030 (USD MILLION)
  • TABLE 293. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2023 (USD MILLION)
  • TABLE 294. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2024-2030 (USD MILLION)
  • TABLE 295. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2023 (USD MILLION)
  • TABLE 296. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2024-2030 (USD MILLION)
  • TABLE 297. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY END-USE, 2018-2023 (USD MILLION)
  • TABLE 298. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARK