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市場調查報告書
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1596385

半導體封裝材料市場：按類型、封裝技術分類 - 2025-2030 年全球預測

Semiconductor Packaging Materials Market by Type (Bonding Wires, Ceramic Packages, Die Attach Materials), Packaging Technology (Dual Flat No Leads, Dual In Line Package, Grid Array) - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 192 Pages | 商品交期: 最快1-2個工作天內

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2023年半導體封裝材料市場規模為406億美元，預計2024年將達450.8億美元，複合年成長率為11.53%，預計2030年將達871.6億美元。

半導體封裝材料在封裝、保護和連接積體電路和其他半導體元件方面發揮至關重要的作用。包括有機基板、鍵合線、導線架、封裝、底部填充材料和晶片連接材料等材料。這些材料對於保護敏感電子元件免受環境損害、提供電氣連接和輔助溫度控管至關重要，這使得它們在從家用電子電器到汽車再到工業領域的廣泛應用中變得至關重要。通訊、航太、汽車和醫療等最終用途產業正在迅速發展，導致對穩健和創新包裝解決方案的需求不斷成長。市場成長很大程度上受到對更小、更複雜電子設備的需求不斷成長、物聯網應用的快速成長以及3D封裝、系統級封裝（SiP）和小晶片異質整合等先進封裝技術的開拓的影響。然而，嚴格的環境法規、高製造成本和供應鏈中斷等挑戰是限制因素。此外，市場還面臨與材料相容性和熱耐久性相關的技術挑戰。生物分解性材料和先進奈米材料的創新為市場差異化提供了潛在的機會。智慧聚合物化合物和軟性電子產品等領域的研究和開發可以釋放新的可能性。為了利用這些機會，企業應該投資於永續材料的開發，並加強與環保實踐的合作。此外，與技術創新者的合作和夥伴關係可以加快新穎解決方案的上市時間。儘管存在固有的挑戰，半導體封裝材料市場本質上是動態的，並受到不斷發展的技術趨勢和不斷成長的全球電子產品滲透率的推動。因此，利用尖端研發並策略性地專注於永續實踐的公司可以從該細分市場的新成長軌跡中受益。

主要市場統計
基準年[2023] 406億美元
預測年份 [2024] 450.8億美元
預測年份 [2030] 871.6億美元
複合年成長率（%） 11.53%

市場動態：揭示快速發展的半導體封裝材料市場的關鍵市場洞察

半導體封裝材料市場正因供需的動態交互作用而轉變。透過了解這些不斷變化的市場動態，公司可以準備好做出明智的投資決策、完善策略決策並抓住新的商機。全面了解這些趨勢可以幫助企業降低政治、地理、技術、社會和經濟領域的風險，同時也能幫助企業了解消費行為及其對製造業的影響。

  • 市場促進因素
    • 對消費性電子產品和穿戴式裝置的需求增加
    • 製造業快速數位化
    • 加大半導體製造投資
  • 市場限制因素
    • 半導體封裝材料價格波動
  • 市場機會
    • 透過研發改良半導體封裝技術
    • 設備和電子元件小型化的需求
  • 市場問題
    • 封裝技術複雜性

波特五力：駕馭半導體封裝材料市場的策略工具

波特的五力框架是了解市場競爭格局的重要工具。波特的五力框架描述了評估公司競爭和探索策略機會的清晰方法。該框架可幫助公司評估市場動態並確定新業務的盈利。這些見解使公司能夠利用自己的優勢，解決弱點並避免潛在的挑戰，從而確保更強大的市場地位。

PESTLE分析：了解半導體封裝材料市場的外部影響

外部宏觀環境因素對半導體封裝材料市場的表現動態起著至關重要的作用。對政治、經濟、社會、技術、法律和環境因素的分析提供了應對這些影響所需的資訊。透過調查 PESTLE 因素，公司可以更了解潛在的風險和機會。這種分析可以幫助公司預測法規、消費者偏好和經濟趨勢的變化，並幫助他們做出積極主動的決策。

市場佔有率分析：了解半導體封裝材料市場競爭格局

對半導體封裝材料市場的詳細市場佔有率分析可以對供應商績效進行全面評估。公司可以透過比較收益、客戶群和成長率等關鍵指標來揭示其競爭地位。該分析揭示了市場集中、細分和整合的趨勢，為供應商提供了製定策略決策所需的洞察力，使他們能夠在日益激烈的競爭中佔有一席之地。

FPNV定位矩陣：半導體封裝材料市場供應商績效評估

FPNV定位矩陣是評估半導體封裝材料市場供應商的重要工具。此矩陣允許業務組織根據供應商的商務策略和產品滿意度評估供應商，從而做出符合其目標的明智決策。這四個象限使您能夠清晰、準確地分類供應商，並確定最能滿足您的策略目標的合作夥伴和解決方案。

策略分析與建議：規劃半導體封裝材料市場的成功之路

對於旨在加強其在全球市場的影響力的公司來說，對半導體封裝材料市場的策略分析至關重要。透過審查關鍵資源、能力和績效指標，公司可以識別成長機會並努力改進。這種方法使您能夠克服競爭格局中的挑戰，利用新的商機並取得長期成功。

該報告對涵蓋關鍵焦點細分市場的市場進行了全面分析。

1. 市場滲透率：詳細檢視當前市場環境，主要企業的廣泛資料，評估其在市場中的影響力和整體影響力。

2. 市場開拓：辨識新興市場的成長機會，評估現有細分市場的擴張潛力，並提供未來成長的策略藍圖。

3. 市場多元化：分析近期產品發布、開拓地區、主要產業進展、塑造市場的策略投資。

4. 競爭評估與情報：徹底分析競爭格局，檢驗市場佔有率、業務策略、產品系列、認證、監理核准、專利趨勢、主要企業的技術進步等。

5. 產品開發與創新：重點在於有望推動未來市場成長的最尖端科技、研發活動和產品創新。

我們也回答重要問題，以幫助相關人員做出明智的決策。

1.目前的市場規模和未來的成長預測是多少？

2. 哪些產品和地區提供最佳投資機會？

3.塑造市場的關鍵技術趨勢和監管影響是什麼？

4.主要廠商的市場佔有率和競爭地位如何？

5. 推動供應商市場進入和退出策略的收益來源和策略機會是什麼？

目錄

第1章 前言

第2章調查方法

第3章執行摘要

第4章市場概況

第5章市場洞察

  • 市場動態
    • 促進因素
      • 對消費性電子產品和穿戴式裝置的需求增加
      • 製造業快速數位化
      • 增加半導體生產投資
    • 抑制因素
      • 半導體封裝材料價格波動
    • 機會
      • 透過研究開發和改進半導體封裝技術
      • 設備及電子元件小型化的需求
    • 任務
      • 封裝技術涉及的技術複雜性
  • 市場區隔分析
  • 波特五力分析
  • PESTEL分析
    • 政治
    • 經濟
    • 社會
    • 科技
    • 法律
    • 環境

第6章半導體封裝材料市場：依類型

  • 介紹
  • 鍵合線
  • 陶瓷封裝
  • 晶片貼裝材料
  • 封裝樹脂
  • 導線架
  • 有機基材物
  • 焊球
  • 導熱材料

第7章半導體封裝材料市場：依封裝技術分類

  • 介紹
  • 雙扁平無引線
  • 雙列直插式封裝
  • 網格陣列
  • 四方扁平封裝
  • 小外形封裝

第8章美洲半導體封裝材料市場

  • 介紹
  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美國

第9章亞太半導體封裝材料市場

  • 介紹
  • 澳洲
  • 中國
  • 印度
  • 印尼
  • 日本
  • 馬來西亞
  • 菲律賓
  • 新加坡
  • 韓國
  • 台灣
  • 泰國
  • 越南

第10章歐洲/中東/非洲半導體封裝材料市場

  • 介紹
  • 丹麥
  • 埃及
  • 芬蘭
  • 法國
  • 德國
  • 以色列
  • 義大利
  • 荷蘭
  • 奈及利亞
  • 挪威
  • 波蘭
  • 卡達
  • 俄羅斯
  • 沙烏地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公國
  • 英國

第11章競爭格局

  • 2023 年市場佔有率分析
  • FPNV 定位矩陣，2023
  • 競爭情境分析
  • 戰略分析和建議

公司名單

  • Amkor Technology Inc.
  • ChipMOS Technologies Inc.
  • DuPont de Nemours Inc.
  • Henkel AG & Co. KGaA
  • Heraeus Holding GmbH
  • Hitachi Ltd.
  • Honeywell International Inc.
  • Indium Corporation
  • IQE PLC
  • Kyocera Corp.
  • LG Innotek
  • Nan Ya PCB Co. Ltd.
  • Nippon Steel Corp.
  • Powertech Technology Inc.
  • Shin Etsu Chemical Co., Ltd.
Product Code: MRR-957C47F929D9

The Semiconductor Packaging Materials Market was valued at USD 40.60 billion in 2023, expected to reach USD 45.08 billion in 2024, and is projected to grow at a CAGR of 11.53%, to USD 87.16 billion by 2030.

Semiconductor packaging materials play a critical role in the encapsulation, protection, and connection of integrated circuits and other semiconductor devices. The scope encompasses materials such as organic substrates, bonding wires, lead frames, encapsulants, underfill materials, and die-attach materials, among others. These materials are essential for safeguarding sensitive electronic components from environmental damages, providing electrical connections, and aiding thermal management, making them indispensable in applications ranging from consumer electronics to automotive and industrial sectors. End-use industries such as telecommunication, aerospace, automotive, and healthcare are advancing rapidly, contributing to the heightened demand for robust and innovative packaging solutions. Market growth is significantly influenced by the rising demand for miniaturized and sophisticated electronic devices, the surge in IoT applications, and developments in advanced packaging technologies like 3D packaging, System-in-Package (SiP), and chiplet heterogenous integration. Nonetheless, challenges including stringent environmental regulations, high production costs, and supply chain disruptions pose limitations. Moreover, the market faces technical difficulties related to material compatibility and thermal endurance. Innovations in biodegradable materials and advanced nanomaterials present potential opportunities for differentiation within the market. R&D in areas such as smart polymer compounds and flexible electronics could unlock new potentials. To tap into these opportunities, businesses should invest in sustainable material development and enhance their alignment with eco-friendly practices. Furthermore, collaborations and partnerships with technology innovators can accelerate time-to-market for novel solutions. Despite its inherent challenges, the semiconductor packaging materials market is inherently dynamic, driven by evolving technology trends and increasing electronic device penetration globally. Therefore, businesses positioned to leverage cutting-edge R&D, along with a strategic focus on sustainable practices, stand to gain from emerging growth trajectories in this sector.

KEY MARKET STATISTICS
Base Year [2023] USD 40.60 billion
Estimated Year [2024] USD 45.08 billion
Forecast Year [2030] USD 87.16 billion
CAGR (%) 11.53%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Semiconductor Packaging Materials Market

The Semiconductor Packaging Materials Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Increasing demand for consumer electronic and wearable devices
    • Rapid digitalization of manufacturing sectors
    • Rising investments in semiconductor production
  • Market Restraints
    • Price volatility of semiconductor packaging materials
  • Market Opportunities
    • Developments and improvements in semiconductor packaging technology through research
    • Demand for miniaturization of devices and electronic components
  • Market Challenges
    • Technical complexities involved in packaging technologies

Porter's Five Forces: A Strategic Tool for Navigating the Semiconductor Packaging Materials Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Semiconductor Packaging Materials Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Semiconductor Packaging Materials Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Semiconductor Packaging Materials Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Semiconductor Packaging Materials Market

A detailed market share analysis in the Semiconductor Packaging Materials Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Semiconductor Packaging Materials Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Semiconductor Packaging Materials Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Semiconductor Packaging Materials Market

A strategic analysis of the Semiconductor Packaging Materials Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Semiconductor Packaging Materials Market, highlighting leading vendors and their innovative profiles. These include Amkor Technology Inc., ChipMOS Technologies Inc., DuPont de Nemours Inc., Henkel AG & Co. KGaA, Heraeus Holding GmbH, Hitachi Ltd., Honeywell International Inc., Indium Corporation, IQE PLC, Kyocera Corp., LG Innotek, Nan Ya PCB Co. Ltd., Nippon Steel Corp., Powertech Technology Inc., and Shin Etsu Chemical Co., Ltd..

Market Segmentation & Coverage

This research report categorizes the Semiconductor Packaging Materials Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Type, market is studied across Bonding Wires, Ceramic Packages, Die Attach Materials, Encapsulation Resins, Leadframes, Organic Substrates, Solder Balls, and Thermal Interface Materials.
  • Based on Packaging Technology, market is studied across Dual Flat No Leads, Dual In Line Package, Grid Array, Quad Flat Package, and Small Outline Package.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Increasing demand for consumer electronic and wearable devices
      • 5.1.1.2. Rapid digitalization of manufacturing sectors
      • 5.1.1.3. Rising investments in semiconductor production
    • 5.1.2. Restraints
      • 5.1.2.1. Price volatility of semiconductor packaging materials
    • 5.1.3. Opportunities
      • 5.1.3.1. Developments and improvements in semiconductor packaging technology through research
      • 5.1.3.2. Demand for miniaturization of devices and electronic components
    • 5.1.4. Challenges
      • 5.1.4.1. Technical complexities involved in packaging technologies
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Semiconductor Packaging Materials Market, by Type

  • 6.1. Introduction
  • 6.2. Bonding Wires
  • 6.3. Ceramic Packages
  • 6.4. Die Attach Materials
  • 6.5. Encapsulation Resins
  • 6.6. Leadframes
  • 6.7. Organic Substrates
  • 6.8. Solder Balls
  • 6.9. Thermal Interface Materials

7. Semiconductor Packaging Materials Market, by Packaging Technology

  • 7.1. Introduction
  • 7.2. Dual Flat No Leads
  • 7.3. Dual In Line Package
  • 7.4. Grid Array
  • 7.5. Quad Flat Package
  • 7.6. Small Outline Package

8. Americas Semiconductor Packaging Materials Market

  • 8.1. Introduction
  • 8.2. Argentina
  • 8.3. Brazil
  • 8.4. Canada
  • 8.5. Mexico
  • 8.6. United States

9. Asia-Pacific Semiconductor Packaging Materials Market

  • 9.1. Introduction
  • 9.2. Australia
  • 9.3. China
  • 9.4. India
  • 9.5. Indonesia
  • 9.6. Japan
  • 9.7. Malaysia
  • 9.8. Philippines
  • 9.9. Singapore
  • 9.10. South Korea
  • 9.11. Taiwan
  • 9.12. Thailand
  • 9.13. Vietnam

10. Europe, Middle East & Africa Semiconductor Packaging Materials Market

  • 10.1. Introduction
  • 10.2. Denmark
  • 10.3. Egypt
  • 10.4. Finland
  • 10.5. France
  • 10.6. Germany
  • 10.7. Israel
  • 10.8. Italy
  • 10.9. Netherlands
  • 10.10. Nigeria
  • 10.11. Norway
  • 10.12. Poland
  • 10.13. Qatar
  • 10.14. Russia
  • 10.15. Saudi Arabia
  • 10.16. South Africa
  • 10.17. Spain
  • 10.18. Sweden
  • 10.19. Switzerland
  • 10.20. Turkey
  • 10.21. United Arab Emirates
  • 10.22. United Kingdom

11. Competitive Landscape

  • 11.1. Market Share Analysis, 2023
  • 11.2. FPNV Positioning Matrix, 2023
  • 11.3. Competitive Scenario Analysis
  • 11.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Amkor Technology Inc.
  • 2. ChipMOS Technologies Inc.
  • 3. DuPont de Nemours Inc.
  • 4. Henkel AG & Co. KGaA
  • 5. Heraeus Holding GmbH
  • 6. Hitachi Ltd.
  • 7. Honeywell International Inc.
  • 8. Indium Corporation
  • 9. IQE PLC
  • 10. Kyocera Corp.
  • 11. LG Innotek
  • 12. Nan Ya PCB Co. Ltd.
  • 13. Nippon Steel Corp.
  • 14. Powertech Technology Inc.
  • 15. Shin Etsu Chemical Co., Ltd.

LIST OF FIGURES

  • FIGURE 1. SEMICONDUCTOR PACKAGING MATERIALS MARKET RESEARCH PROCESS
  • FIGURE 2. SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 11. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 13. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. ASIA-PACIFIC SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 15. ASIA-PACIFIC SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. SEMICONDUCTOR PACKAGING MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 19. SEMICONDUCTOR PACKAGING MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. SEMICONDUCTOR PACKAGING MATERIALS MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. SEMICONDUCTOR PACKAGING MATERIALS MARKET DYNAMICS
  • TABLE 7. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY BONDING WIRES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY CERAMIC PACKAGES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH MATERIALS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULATION RESINS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY LEADFRAMES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY ORGANIC SUBSTRATES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALLS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY THERMAL INTERFACE MATERIALS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY DUAL FLAT NO LEADS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY DUAL IN LINE PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY GRID ARRAY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 20. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY QUAD FLAT PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 21. GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY SMALL OUTLINE PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 22. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 23. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 24. AMERICAS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 25. ARGENTINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 26. ARGENTINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 27. BRAZIL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 28. BRAZIL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 29. CANADA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 30. CANADA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 31. MEXICO SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 32. MEXICO SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 33. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 34. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 35. UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 36. ASIA-PACIFIC SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 37. ASIA-PACIFIC SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 38. ASIA-PACIFIC SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 39. AUSTRALIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 40. AUSTRALIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 41. CHINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 42. CHINA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 43. INDIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 44. INDIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 45. INDONESIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 46. INDONESIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 47. JAPAN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 48. JAPAN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 49. MALAYSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 50. MALAYSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 51. PHILIPPINES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 52. PHILIPPINES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 53. SINGAPORE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 54. SINGAPORE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 55. SOUTH KOREA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 56. SOUTH KOREA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 57. TAIWAN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 58. TAIWAN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 59. THAILAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 60. THAILAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 61. VIETNAM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 62. VIETNAM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 63. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 64. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 65. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 66. DENMARK SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 67. DENMARK SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 68. EGYPT SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 69. EGYPT SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 70. FINLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 71. FINLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 72. FRANCE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 73. FRANCE SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 74. GERMANY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 75. GERMANY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 76. ISRAEL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 77. ISRAEL SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 78. ITALY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 79. ITALY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 80. NETHERLANDS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 81. NETHERLANDS SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 82. NIGERIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 83. NIGERIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 84. NORWAY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 85. NORWAY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 86. POLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 87. POLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 88. QATAR SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 89. QATAR SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 90. RUSSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 91. RUSSIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 92. SAUDI ARABIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 93. SAUDI ARABIA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 94. SOUTH AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 95. SOUTH AFRICA SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 96. SPAIN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 97. SPAIN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 98. SWEDEN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 99. SWEDEN SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 100. SWITZERLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 101. SWITZERLAND SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 102. TURKEY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 103. TURKEY SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 104. UNITED ARAB EMIRATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 105. UNITED ARAB EMIRATES SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 106. UNITED KINGDOM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 107. UNITED KINGDOM SEMICONDUCTOR PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 108. SEMICONDUCTOR PACKAGING MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 109. SEMICONDUCTOR PACKAGING MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023