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市場調查報告書
商品編碼
1621333

半導體/ IC封裝材料市場:按類型、技術、封裝技術、應用分類 - 2025-2030 年全球預測

Semiconductor & IC Packaging Materials Market by Type (Bonding wires, Ceramic Packages, Die Attach Materials), Technology (Flip Chip, Grid Array, Quad Flat Package), Packaging Technology, Application - Global Forecast 2025-2030

出版日期: | 出版商: 360iResearch | 英文 196 Pages | 商品交期: 最快1-2個工作天內

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2023年半導體及IC封裝材料市場規模為384.4億美元,預計2024年將達到421.6億美元,複合年成長率為10.35%,2030年將達766.4億美元。

半導體和 IC 封裝材料市場包括用於保護和絕緣半導體裝置並確保其功能和效率的材料。產品範圍包括基板、導線架、接合線、晶片連接材料、封裝、熱界面材料等。這些材料對於電子設備的小型化和提高性能至關重要,並在消費性電子、汽車、通訊和工業領域中得到應用。對更小、更有效率、更節能的電子設備的需求推動了對高性能封裝材料的需求,並且材料技術正在快速發展以滿足下一代半導體的需求。

主要市場統計
基準年[2023] 384.4億美元
預測年份 [2024] 421.6億美元
預測年份 [2030] 766.4億美元
複合年成長率(%) 10.35%

主要成長要素包括物聯網設備的激增、人工智慧和機器學習的進步以及 5G 網路的擴展,這將推動半導體消費。電動車的日益普及和可再生能源系統的日益普及存在著機遇,這兩者都需要先進的半導體解決方案。為了抓住這些機遇,新興市場必須專注於開發環保且具成本效益的材料,並遵守環保意識日益增強的市場的法規。然而,市場也面臨原料成本高、製造流程複雜、品質標準嚴格等挑戰,可能會限制成長潛力。

在技​​術創新方面,探索和開發具有優異熱電性能的先進複合材料是有希望的。此外,奈米技術和生物基材料的研究也具有巨大的潛力。公司應該投資研發來創造能夠實現異質整合整合並支援先進封裝技術(例如 3D 堆疊和系統級封裝 (SiP) 架構)的材料。市場的特點是技術日新月異,適應性和持續創新對於保持競爭優勢至關重要。透過專注於永續性、品質和成本效率,公司可以利用不斷擴大的半導體格局。

市場動態:快速發展的半導體和IC封裝材料市場的關鍵市場洞察

半導體和IC封裝材料市場正因供需的動態互動而轉變。透過了解這些不斷變化的市場動態,公司可以準備好做出明智的投資決策、完善策略決策並抓住新的商機。全面了解這些趨勢可以幫助企業降低政治、地理、技術、社會和經濟領域的風險,同時消費行為及其對製造成本的影響以及對採購趨勢的影響。

  • 市場促進因素
    • 消費性電子產品對半導體和IC封裝材料的需求增加
    • 支持創新包裝材料的技術不斷進步
    • 電子領域小型化、高密度化進展
  • 市場限制因素
    • 半導體產業外包和測試中的智慧財產權問題
  • 市場機會
    • 與先進技術的融合
    • 5G 和自動駕駛汽車的採用
  • 市場挑戰
    • 增加有關材料使用和處置的環境法規

波特五力:駕馭半導體與IC封裝材料市場的策略工具

波特的五力框架是了解市場競爭格局的重要工具。波特的五力框架為評估公司的競爭地位和探索策略機會提供了清晰的方法。該框架可幫助公司評估市場動態並確定新業務的盈利。這些見解使公司能夠利用自己的優勢,解決弱點並避免潛在的挑戰,從而確保更強大的市場地位。

PESTLE分析:了解外部對半導體和IC封裝材料市場的影響

外部宏觀環境因素對半導體和IC封裝材料市場的表現動態起著至關重要的作用。對政治、經濟、社會、技術、法律和環境因素的分析提供了應對這些影響所需的資訊。透過調查 PESTLE 因素,公司可以更了解潛在的風險和機會。這種分析可以幫助公司預測法規、消費者偏好和經濟趨勢的變化,並為他們做出積極主動的決策做好準備。

市場佔有率分析 了解半導體/ IC封裝材料市場競爭狀況

對半導體和IC封裝材料市場的詳細市場佔有率分析可以對供應商績效進行全面評估。公司可以透過比較收益、客戶群和成長率等關鍵指標來揭示其競爭地位。該分析揭示了市場集中、分散和整合的趨勢,為供應商提供了製定策略決策所需的洞察力,使他們能夠在日益激烈的競爭中佔有一席之地。

FPNV定位矩陣半導體及IC封裝材料市場廠商績效評估

FPNV定位矩陣是評估半導體和IC封裝材料市場供應商的重要工具。此矩陣允許業務組織根據商務策略和產品滿意度評估供應商,從而做出與其目標相符的明智決策。這四個象限使您能夠清晰、準確地分類供應商,並確定最能滿足您的策略目標的合作夥伴和解決方案。

策略分析和建議,規劃半導體和IC封裝材料市場的成功之路

半導體和IC封裝材料市場的策略分析對於旨在加強其在全球市場的影響力的公司至關重要。透過審查關鍵資源、能力和績效指標,公司可以識別成長機會並努力改進。這種方法使您能夠克服競爭環境中的挑戰,利用新的商機並取得長期成功。

本報告對市場進行了全面分析,涵蓋關鍵重點領域:

1. 市場滲透率:對當前市場環境的詳細審查、主要企業的廣泛資料、對其在市場中的影響力和整體影響力的評估。

2. 市場開發:辨識新興市場的成長機會,評估現有領域的擴張潛力,並提供未來成長的策略藍圖。

3. 市場多元化:分析近期產品發布、未開發地區、關鍵產業進展、塑造市場的策略投資。

4. 競爭評估與情報:徹底分析競爭格局,檢驗市場佔有率、業務策略、產品系列、認證、監理核准、專利趨勢、主要企業的技術進步等。

5. 產品開發與創新:重點在於有望推動未來市場成長的最尖端科技、研發活動和產品創新。

我們也回答重要問題,幫助相關人員做出明智的決策:

1.目前的市場規模和未來的成長預測是多少?

2. 哪些產品、區隔市場和地區提供最佳投資機會?

3.塑造市場的主要技術趨勢和監管影響是什麼?

4.主要廠商的市場佔有率和競爭地位如何?

5. 推動供應商市場進入和退出策略的收益來源和策略機會是什麼?

目錄

第1章 前言

第2章調查方法

第3章執行摘要

第4章市場概況

第5章市場洞察

  • 市場動態
    • 促進因素
      • 家電半導體和IC封裝材料需求增加
      • 支持創新包裝材料的技術不斷進步
      • 電子設備領域小型化、高密度化進展
    • 抑制因素
      • 半導體產業外包和測試的智慧財產權問題
    • 機會
      • 與先進技術融合
      • 介紹 5G 和自動駕駛汽車
    • 任務
      • 加強有關材料使用和處置的環境法規
  • 市場區隔分析
    • 類型:陶瓷封裝,適合高效能、高可靠性應用
    • 應用:汽車產業中半導體和積體電路 (IC) 封裝材料使用的演變
  • 波特五力分析
  • PESTEL分析
    • 政治的
    • 經濟
    • 社群
    • 技術的
    • 合法地
    • 環境

第6章半導體/ IC封裝材料市場:依類型

  • 鍵合線
  • 陶瓷封裝
  • 晶片貼裝材料
  • 封裝樹脂
  • 導線架
  • 有機基材物
  • 焊球
  • 導熱材料

第7章半導體/ IC封裝材料市場:依技術分類

  • 覆晶
  • 網格陣列
  • 四方扁平封裝
  • 小外形封裝

第8章半導體/ IC封裝材料市場封裝技術

  • 2.5D IC
  • 3D IC
  • 穿透矽通孔
  • 晶圓級封裝

第9章半導體/ IC封裝材料市場:依應用分類

  • 航太和國防
  • 運算和網路
  • 家電
  • 衛生保健
  • 產業
  • 通訊

第10章 美洲半導體/ IC封裝材料市場

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美國

第11章亞太半導體/ IC封裝材料市場

  • 澳洲
  • 中國
  • 印度
  • 印尼
  • 日本
  • 馬來西亞
  • 菲律賓
  • 新加坡
  • 韓國
  • 台灣
  • 泰國
  • 越南

第12章 歐洲、中東、非洲半導體/ IC封裝材料市場

  • 丹麥
  • 埃及
  • 芬蘭
  • 法國
  • 德國
  • 以色列
  • 義大利
  • 荷蘭
  • 奈及利亞
  • 挪威
  • 波蘭
  • 卡達
  • 俄羅斯
  • 沙烏地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公國
  • 英國

第13章競爭格局

  • 2023 年市場佔有率分析
  • FPNV 定位矩陣,2023
  • 競爭情境分析
    • Amkor 與 Apple 結成策略聯盟,建造最大的先進半導體封裝廠
    • Resonac 在矽谷開設新的封裝解決方案中心,為半導體創新奠定基礎
    • 半導體封裝的策略擴張與創新
  • 戰略分析和建議

公司名單

  • 3M Company
  • Advanced Semiconductor Engineering Inc
  • AMETEK Electronic Components & Packaging
  • Amtech Microelectronics, Inc.
  • ASE Group
  • California Fine Wire Co.
  • Canatu Oy
  • Ceramtec GmbH
  • Chipbond Technology Corporation
  • Chipmos Technologies Inc.
  • Deca Technologies
  • FlipChip International LLC
  • Fujitsu Semiconductor Limited
  • Henkel AG & Co. KGaA
  • Intel Corporation
  • Interconnect Systems Inc.(ISI)
  • Kyocera Chemical Corporation
  • Microchip Technology
  • Powertech Technology, Inc.
  • Samsung Electronics Co. Ltd
  • Siemens AG
  • Sumitomo Chemical Co., Ltd.
  • Taiwan Semiconductor Manufacturing Company
  • Tianshui Huatian Technology Co., Ltd.
  • Toray Industries, Inc.
  • Unisem Berhad
  • UTAC Group
Product Code: MRR-7A22CB0E5917

The Semiconductor & IC Packaging Materials Market was valued at USD 38.44 billion in 2023, expected to reach USD 42.16 billion in 2024, and is projected to grow at a CAGR of 10.35%, to USD 76.64 billion by 2030.

The semiconductor and IC packaging materials market encompasses materials used to protect and insulate semiconductor devices, ensuring their functionality and efficiency. The scope includes substrates, lead frames, bonding wires, die-attach materials, encapsulants, and thermal interface materials. These materials are crucial for the miniaturization and performance enhancement of electronic devices, finding applications in consumer electronics, automotive, telecommunications, and industrial sectors. The necessity of high-performance packaging materials is driven by the demand for compact, efficient, and energy-saving electronic devices, leading to rapid evolution in material technologies to pace with next-gen semiconductor requirements.

KEY MARKET STATISTICS
Base Year [2023] USD 38.44 billion
Estimated Year [2024] USD 42.16 billion
Forecast Year [2030] USD 76.64 billion
CAGR (%) 10.35%

Key growth factors include the proliferation of IoT devices, advancements in AI and machine learning, and the expansion of 5G networks, which drive semiconductor consumption. Opportunities lie in the growing adoption of electric vehicles and the increasing deployment of renewable energy systems, both of which require sophisticated semiconductor solutions. Companies should focus on developing eco-friendly and cost-efficient materials to seize these opportunities, meeting the regulatory compliance of an increasingly eco-conscious market. However, the market also faces challenges such as high raw material costs, complex manufacturing processes, and stringent quality standards, which could limit growth potential.

In terms of innovation, exploring and developing advanced composite materials with superior thermal and electrical properties is promising. Additionally, research into nanotechnology and bio-based materials offers significant potential. Companies should invest in R&D for creating materials that allow for heterogeneous integration and support advanced packaging techniques like 3D stacking or system-in-package (SiP) architectures. The market is characterized by rapid technological change, making adaptability and continuous innovation crucial for maintaining competitive advantage. By focusing on sustainability, quality, and cost-effectiveness, businesses can position themselves to capitalize on the expanding semiconductor landscape.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Semiconductor & IC Packaging Materials Market

The Semiconductor & IC Packaging Materials Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Rising demand for semiconductor and IC packaging materials for consumer electronics
    • Relentless advancement in technology supporting innovative packaging materials
    • Growing miniaturization and densification in electronic sector
  • Market Restraints
    • IP Concerns of semiconductor industry in outsourcing and testing
  • Market Opportunities
    • Integration with advance technologies
    • Adoption of 5G and autonomous vehicles
  • Market Challenges
    • Increasing environmental regulations regarding the use and disposal of materials

Porter's Five Forces: A Strategic Tool for Navigating the Semiconductor & IC Packaging Materials Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Semiconductor & IC Packaging Materials Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Semiconductor & IC Packaging Materials Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Semiconductor & IC Packaging Materials Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Semiconductor & IC Packaging Materials Market

A detailed market share analysis in the Semiconductor & IC Packaging Materials Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Semiconductor & IC Packaging Materials Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Semiconductor & IC Packaging Materials Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Semiconductor & IC Packaging Materials Market

A strategic analysis of the Semiconductor & IC Packaging Materials Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Semiconductor & IC Packaging Materials Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Advanced Semiconductor Engineering Inc, AMETEK Electronic Components & Packaging, Amtech Microelectronics, Inc., ASE Group, California Fine Wire Co., Canatu Oy, Ceramtec GmbH, Chipbond Technology Corporation, Chipmos Technologies Inc., Deca Technologies, FlipChip International LLC, Fujitsu Semiconductor Limited, Henkel AG & Co. KGaA, Intel Corporation, Interconnect Systems Inc. (ISI), Kyocera Chemical Corporation, Microchip Technology, Powertech Technology, Inc., Samsung Electronics Co. Ltd, Siemens AG, Sumitomo Chemical Co., Ltd., Taiwan Semiconductor Manufacturing Company, Tianshui Huatian Technology Co., Ltd., Toray Industries, Inc., Unisem Berhad, and UTAC Group.

Market Segmentation & Coverage

This research report categorizes the Semiconductor & IC Packaging Materials Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Type, market is studied across Bonding wires, Ceramic Packages, Die Attach Materials, Encapsulation Resins, Leadframes, Organic substrate, Solder Balls, and Thermal Interface Materials.
  • Based on Technology, market is studied across Flip Chip, Grid Array, Quad Flat Package, and Small Outline Package.
  • Based on Packaging Technology, market is studied across 2.5D IC, 3D IC, Through-silicon Via, and Wafer-level Packaging.
  • Based on Application, market is studied across Aerospace & Defense, Automotive, Computing & Networking, Consumer Electronics, Healthcare, Industrial, and Telecommunications.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Rising demand for semiconductor and IC packaging materials for consumer electronics
      • 5.1.1.2. Relentless advancement in technology supporting innovative packaging materials
      • 5.1.1.3. Growing miniaturization and densification in electronic sector
    • 5.1.2. Restraints
      • 5.1.2.1. IP Concerns of semiconductor industry in outsourcing and testing
    • 5.1.3. Opportunities
      • 5.1.3.1. Integration with advance technologies
      • 5.1.3.2. Adoption of 5G and autonomous vehicles
    • 5.1.4. Challenges
      • 5.1.4.1. Increasing environmental regulations regarding the use and disposal of materials
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Type: Suitability of ceramic packages for high-performance and high-reliability applications
    • 5.2.2. Applications: Evolving usage of the semiconductor and integrated circuit (IC) packaging materials across the automotive sector
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Semiconductor & IC Packaging Materials Market, by Type

  • 6.1. Introduction
  • 6.2. Bonding wires
  • 6.3. Ceramic Packages
  • 6.4. Die Attach Materials
  • 6.5. Encapsulation Resins
  • 6.6. Leadframes
  • 6.7. Organic substrate
  • 6.8. Solder Balls
  • 6.9. Thermal Interface Materials

7. Semiconductor & IC Packaging Materials Market, by Technology

  • 7.1. Introduction
  • 7.2. Flip Chip
  • 7.3. Grid Array
  • 7.4. Quad Flat Package
  • 7.5. Small Outline Package

8. Semiconductor & IC Packaging Materials Market, by Packaging Technology

  • 8.1. Introduction
  • 8.2. 2.5D IC
  • 8.3. 3D IC
  • 8.4. Through-silicon Via
  • 8.5. Wafer-level Packaging

9. Semiconductor & IC Packaging Materials Market, by Application

  • 9.1. Introduction
  • 9.2. Aerospace & Defense
  • 9.3. Automotive
  • 9.4. Computing & Networking
  • 9.5. Consumer Electronics
  • 9.6. Healthcare
  • 9.7. Industrial
  • 9.8. Telecommunications

10. Americas Semiconductor & IC Packaging Materials Market

  • 10.1. Introduction
  • 10.2. Argentina
  • 10.3. Brazil
  • 10.4. Canada
  • 10.5. Mexico
  • 10.6. United States

11. Asia-Pacific Semiconductor & IC Packaging Materials Market

  • 11.1. Introduction
  • 11.2. Australia
  • 11.3. China
  • 11.4. India
  • 11.5. Indonesia
  • 11.6. Japan
  • 11.7. Malaysia
  • 11.8. Philippines
  • 11.9. Singapore
  • 11.10. South Korea
  • 11.11. Taiwan
  • 11.12. Thailand
  • 11.13. Vietnam

12. Europe, Middle East & Africa Semiconductor & IC Packaging Materials Market

  • 12.1. Introduction
  • 12.2. Denmark
  • 12.3. Egypt
  • 12.4. Finland
  • 12.5. France
  • 12.6. Germany
  • 12.7. Israel
  • 12.8. Italy
  • 12.9. Netherlands
  • 12.10. Nigeria
  • 12.11. Norway
  • 12.12. Poland
  • 12.13. Qatar
  • 12.14. Russia
  • 12.15. Saudi Arabia
  • 12.16. South Africa
  • 12.17. Spain
  • 12.18. Sweden
  • 12.19. Switzerland
  • 12.20. Turkey
  • 12.21. United Arab Emirates
  • 12.22. United Kingdom

13. Competitive Landscape

  • 13.1. Market Share Analysis, 2023
  • 13.2. FPNV Positioning Matrix, 2023
  • 13.3. Competitive Scenario Analysis
    • 13.3.1. Amkor and Apple Forge Strategic Alliance to Build Largest Advanced Semiconductor Packaging Facility
    • 13.3.2. Resonac Sets Foundation for Semiconductor Innovation with New Packaging Solution Center in Silicon Valley
    • 13.3.3. Strategic Expansion and Innovation in Semiconductor Packaging
  • 13.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. 3M Company
  • 2. Advanced Semiconductor Engineering Inc
  • 3. AMETEK Electronic Components & Packaging
  • 4. Amtech Microelectronics, Inc.
  • 5. ASE Group
  • 6. California Fine Wire Co.
  • 7. Canatu Oy
  • 8. Ceramtec GmbH
  • 9. Chipbond Technology Corporation
  • 10. Chipmos Technologies Inc.
  • 11. Deca Technologies
  • 12. FlipChip International LLC
  • 13. Fujitsu Semiconductor Limited
  • 14. Henkel AG & Co. KGaA
  • 15. Intel Corporation
  • 16. Interconnect Systems Inc. (ISI)
  • 17. Kyocera Chemical Corporation
  • 18. Microchip Technology
  • 19. Powertech Technology, Inc.
  • 20. Samsung Electronics Co. Ltd
  • 21. Siemens AG
  • 22. Sumitomo Chemical Co., Ltd.
  • 23. Taiwan Semiconductor Manufacturing Company
  • 24. Tianshui Huatian Technology Co., Ltd.
  • 25. Toray Industries, Inc.
  • 26. Unisem Berhad
  • 27. UTAC Group

LIST OF FIGURES

  • FIGURE 1. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET RESEARCH PROCESS
  • FIGURE 2. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2023 VS 2030 (%)
  • FIGURE 11. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
  • FIGURE 13. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 15. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 17. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 19. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 20. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 21. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 22. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 23. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET DYNAMICS
  • TABLE 7. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY BONDING WIRES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CERAMIC PACKAGES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY DIE ATTACH MATERIALS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ENCAPSULATION RESINS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY LEADFRAMES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY ORGANIC SUBSTRATE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SOLDER BALLS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY THERMAL INTERFACE MATERIALS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY FLIP CHIP, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY GRID ARRAY, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY QUAD FLAT PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 20. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY SMALL OUTLINE PACKAGE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 21. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 22. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY 2.5D IC, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 23. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY 3D IC, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 24. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY THROUGH-SILICON VIA, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 25. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY WAFER-LEVEL PACKAGING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 26. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 27. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AEROSPACE & DEFENSE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 28. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 29. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COMPUTING & NETWORKING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 30. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 31. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 32. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY INDUSTRIAL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 33. GLOBAL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 34. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 35. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 36. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 37. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 38. AMERICAS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 39. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 40. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 41. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 42. ARGENTINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 43. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 44. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 45. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 46. BRAZIL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 47. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 48. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 49. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 50. CANADA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 51. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 52. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 53. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 54. MEXICO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 55. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 56. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 57. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 58. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 59. UNITED STATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 60. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 61. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 62. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 63. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 64. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 65. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 66. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 67. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 68. AUSTRALIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 69. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 70. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 71. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 72. CHINA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 73. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 74. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 75. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 76. INDIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 77. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 78. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 79. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 80. INDONESIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 81. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 82. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 83. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 84. JAPAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 85. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 86. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 87. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 88. MALAYSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 89. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 90. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 91. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 92. PHILIPPINES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 93. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 94. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 95. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 96. SINGAPORE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 97. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 98. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 99. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 100. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 101. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 102. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 103. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 104. TAIWAN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 105. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 106. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 107. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 108. THAILAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 109. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 110. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 111. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 112. VIETNAM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 113. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 114. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 115. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 116. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 117. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 118. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 119. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 120. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 121. DENMARK SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 122. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 123. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 124. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 125. EGYPT SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 126. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 127. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 128. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 129. FINLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 130. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 131. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 132. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 133. FRANCE SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 134. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 135. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 136. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 137. GERMANY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 138. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 139. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 140. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 141. ISRAEL SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 142. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 143. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 144. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 145. ITALY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 146. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 147. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 148. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 149. NETHERLANDS SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 150. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 151. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 152. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 153. NIGERIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 154. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 155. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 156. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 157. NORWAY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 158. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 159. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 160. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 161. POLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 162. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 163. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 164. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 165. QATAR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 166. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 167. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 168. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 169. RUSSIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 170. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 171. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 172. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 173. SAUDI ARABIA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 174. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 175. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 176. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 177. SOUTH AFRICA SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 178. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 179. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 180. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 181. SPAIN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 182. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 183. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 184. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 185. SWEDEN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 186. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 187. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 188. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 189. SWITZERLAND SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 190. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 191. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 192. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 193. TURKEY SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 194. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 195. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 196. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 197. UNITED ARAB EMIRATES SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 198. UNITED KINGDOM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TYPE, 2018-2030 (USD MILLION)
  • TABLE 199. UNITED KINGDOM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 200. UNITED KINGDOM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY PACKAGING TECHNOLOGY, 2018-2030 (USD MILLION)
  • TABLE 201. UNITED KINGDOM SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 202. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 203. SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, FPNV POSITIONING MATRIX, 2023