半導體和 IC 封裝材料市場機會、成長動力、產業趨勢分析和預測 2024 - 2032

Semiconductor and IC Packaging Materials Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032

出版日期: 2024年10月01日 | 出版商:

Global Market Insights Inc. | 英文 230 Pages | 商品交期: 2-3個工作天內

價格

簡介目錄

2023年全球半導體和IC封裝材料市場估值為41億美元，預計2024年至2032年複合年成長率為10%。的設備，增加了對先進封裝解決方案的需求。物聯網 (IoT) 的興起也促進了市場的成長，因為智慧家庭、醫療保健和醫療保健製造等行業的連網設備數量激增。根據 GSMA 2023 報告，物聯網連線預計將增加一倍以上，從 2022 年的 25 億增加到 2030 年的超過 50 億。

連接設備的爆炸性成長推動了對半導體和 IC 的需求，從而對提供保護、高效散熱和增強電氣性能的封裝材料產生了更高的需求。市場按類型細分，包括有機基板、鍵合線、引線框架、封裝樹脂、晶片黏接材料、熱界面材料、陶瓷封裝等。 %。

有機基材廣泛應用於消費性電子產品，特別是智慧型手機、平板電腦和穿戴式裝置等裝置。由於技術的快速進步，對這些電子產品的需求不斷增加，從而推動了對這些基板的需求。就最終用途產業而言，半導體和IC封裝材料市場服務於航太和國防、汽車、消費性電子、醫療保健、IT和電信等產業。 IT 和電信產業預計將佔據主導地位，到 2032 年將資料超過 30 億美元的收入。性能包裝材料。

市場範圍
開始年份	2023年
預測年份	2024-2032
起始值	41 億美元
預測值	100 億美元
複合年成長率	10%

北美半導體和IC封裝材料市場將經歷顯著成長，預計到2032年複合年成長率將超過10%。英特爾、AMD 和高通等主要半導體公司集中在北美，協助推動產業發展並制定全球創新標準

產業生態系統分析
供應商矩陣
利潤率分析
技術與創新格局
專利分析
重要新聞和舉措
監管環境
衝擊力
- 成長動力
  - 擴大半導體在工業自動化的應用
  - 半導體技術的進步
  - 消費性電子產品的擴展
  - 物聯網設備的激增
  - 對 5G 和高效能運算的需求不斷成長
- 產業陷阱與挑戰
  - 製造複雜性和成本
  - 技術和檢驗問題
成長潛力分析
波特的分析
PESTEL分析

第 4 章：競爭格局

介紹
公司市佔率分析
競爭定位矩陣
戰略展望矩陣

第 5 章：市場估計與預測：按類型，2021-2032 年

主要趨勢
有機基材
鍵合線
引線框架
封裝樹脂
陶瓷封裝
晶片黏接材料
熱界面材料
其他

第 6 章：市場估計與預測：依封裝技術，2021-2032 年

主要趨勢
引線鍵合
覆晶封裝
晶圓級封裝 (WLP)
系統級封裝 (SiP)
其他

第 7 章：市場估計與預測：依最終用途產業，2021-2032 年

主要趨勢
航太與國防
汽車
消費性電子產品
衛生保健
資訊科技與電信
其他

第 8 章：市場估計與預測：按地區，2021-2032 年

主要趨勢
北美洲
- 美國
- 加拿大
歐洲
- 英國
- 德國
- 法國
- 義大利
- 西班牙
- 歐洲其他地區
亞太地區
- 中國
- 印度
- 日本
- 韓國
- 澳新銀行
- 亞太地區其他地區
拉丁美洲
- 巴西
- 墨西哥
- 拉丁美洲其他地區
MEA
- 阿拉伯聯合大公國
- 南非
- 沙烏地阿拉伯
- MEA 的其餘部分

第 9 章：公司簡介

ASE
Chang Chun Group
DuPont
Henkel
Hitachi High-Tech
Indium
Kyocera
LG Chem
MacDermid Alpha Electronics Solutions
Nan Ya Plastics
Powertech Technology
Samsung Electro-Mechanics
Shin-Etsu Chemical
Sumitomo Bakelite
Sumitomo Chemical
Tanaka Holdings
Texas Instruments
Toppan Printing
Toray Industries
VeriSilicon

簡介目錄

Product Code: 11659

The Global Semiconductor And IC Packaging Materials Market was valued at USD 4.1 billion in 2023 and is projected to grow at a CAGR of 10% from 2024 to 2032. This growth is primarily driven by the rapid expansion of consumer electronics, such as smartphones and wearable devices, increasing the demand for advanced packaging solutions. The rise of the Internet of Things (IoT) has also contributed to the market's growth, as the number of connected devices across industries such as smart homes, healthcare, and healthcare manufacturing surged. According to the GSMA 2023 report, IoT connections are expected to more than double, from 2.5 billion in 2022 to over 5 billion by 2030.

This explosion in connected devices fuels the need for semiconductors and ICs, creating a higher demand for packaging materials that offer protection, efficient heat dissipation, and enhanced electrical performance. The market is segmented by type, including organic substrates, bonding wires, lead frames, encapsulation resins, die attach materials, thermal interface materials, ceramic packages, and others.Among these, the organic substrate segment is projected to grow at a CAGR of over 10% throughout 2024-2032.

Organic substrates find extensive usage in consumer electronics, particularly in devices like smartphones, tablets, and wearables. Increasing demand for these electronics, spurred by rapid technological advances, drives the need for these substrates. In terms of end-use industries, the semiconductor and IC packaging materials market serves sectors such as aerospace and defense, automotive, consumer electronics, healthcare, IT and telecommunications, and others. The IT and telecommunications sector is projected to dominate, generating over USD 3 billion in revenue by 2032. The ongoing rollout of 5G networks, the expansion of data centers, and the development of cutting-edge communication infrastructure are key factors driving demand in this sector for high-performance packaging materials.

Market Scope
Start Year	2023
Forecast Year	2024-2032
Start Value	$4.1 Billion
Forecast Value	$10 Billion
CAGR	10%

North America is set to experience significant growth in the semiconductor and IC packaging materials market, with a projected CAGR of over 10% by 2032. The region's established technological infrastructure, heavy investment in research and development, and strong manufacturing capabilities contribute to its leadership position. Major semiconductor companies like Intel, AMD, and Qualcomm, concentrated in North America, help advance the industry and set global standards for innovation

Chapter 1 Methodology & Scope

1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Industry 360° synopsis, 2021-2032

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Profit margin analysis
3.4 Technology & innovation landscape
3.5 Patent analysis
3.6 Key news and initiatives
3.7 Regulatory landscape
3.8 Impact forces
- 3.8.1 Growth drivers
  - 3.8.1.1 Expanding semiconductor applications in industrial automation
  - 3.8.1.2 Advancement in semiconductor technologies
  - 3.8.1.3 Expansion of consumer electronics
  - 3.8.1.4 Proliferation of IoT devices
  - 3.8.1.5 Rising demand for 5G and high-performance computing
- 3.8.2 Industry pitfalls & challenges
  - 3.8.2.1 Manufacturing complexity and costs
  - 3.8.2.2 Technical and inspection issues
3.9 Growth potential analysis
3.10 Porter's analysis
- 3.10.1 Supplier power
- 3.10.2 Buyer power
- 3.10.3 Threat of new entrants
- 3.10.4 Threat of substitutes
- 3.10.5 Industry rivalry
3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Type, 2021-2032 (USD Million)

5.1 Key trends
5.2 Organic substrate
5.3 Bonding wires
5.4 Lead frames
5.5 Encapsulation resins
5.6 Ceramic packages
5.7 Die attach materials
5.8 Thermal interface materials
5.9 Others

Chapter 6 Market Estimates & Forecast, By Packaging Technology, 2021-2032 (USD Million)

6.1 Key trends
6.2 Wire bonding
6.3 Flip-chip packaging
6.4 Wafer-level packaging (WLP)
6.5 System-in-package (SiP)
6.6 Others

Chapter 7 Market Estimates & Forecast, By End Use Industry, 2021-2032 (USD Million)

7.1 Key trends
7.2 Aerospace & defense
7.3 Automotive
7.4 Consumer electronics
7.5 Healthcare
7.6 IT & telecommunication
7.7 Others

Chapter 8 Market Estimates & Forecast, By Region, 2021-2032 (USD Million)

8.1 Key trends
8.2 North America
- 8.2.1 U.S.
- 8.2.2 Canada
8.3 Europe
- 8.3.1 UK
- 8.3.2 Germany
- 8.3.3 France
- 8.3.4 Italy
- 8.3.5 Spain
- 8.3.6 Rest of Europe
8.4 Asia Pacific
- 8.4.1 China
- 8.4.2 India
- 8.4.3 Japan
- 8.4.4 South Korea
- 8.4.5 ANZ
- 8.4.6 Rest of Asia Pacific
8.5 Latin America
- 8.5.1 Brazil
- 8.5.2 Mexico
- 8.5.3 Rest of Latin America
8.6 MEA
- 8.6.1 UAE
- 8.6.2 South Africa
- 8.6.3 Saudi Arabia
- 8.6.4 Rest of MEA