半導體封裝材料的全球市場2024

半導體封裝材料市場正經歷顯著成長，預計將從2022年的250億美元成長到2030年的超過400億美元，複合年增長率約為7%。半導體技術的不斷進步、消費性電子產品的使用不斷增加以及電子產品小型化的持續趨勢都促進了對封裝材料的需求。

本報告提供半導體封裝材料市場詳細評估，並深入探討以下幾點:

產品概要

主要的半導體包裝零組件所使用的功能與主要材料定義

• 粘晶
• 封裝材
• 底部填充
• 熱介面材料
• 晶圓基板包裝等

半導體封裝材料的全球市場概要

半導體封裝材料的現在(2022年)與預測(2030年)的全球市場相關洞察。包括對影響市場成長和材料選擇的主要趨勢和驅動因素的分析。

各材料類型的全球市場市場區隔

所使用的主要各材料的全球市場市場區隔- 聚合物，金屬，陶瓷，複合材料等

含隔熱性和彈性等的參數相關之客戶迴響，材料選擇的主要選擇標準或性能參數

競爭概要:

主要的競爭企業簡介包含有 DuPont, Henkel, Kyocera, Heraeus, Panasonic等的20公司以上的競爭形勢分析。

專利概要:

過去4-5年的主要受讓人約40專利系列分析。還有專利的調查對象，也包含討論中的材料，相關用途相關洞察。

市場展望

在廣泛的二次和初步研究驗證的支持下，本報告還提供了對市場前景及其影響因素的權威看法。

目錄

第1章 簡介

• 報告概要
• 產品焦點
• 調查手法

第2章 流程概要

• 薄膜成型
• 光刻
• 蝕刻
• 摻雜
• CMP
• 切割
• 引線接合法
• 包裝

第3章 價值鏈概要

第4章 市場概要

第5章 詳細市場評估

• 半導體包裝

第5章 專利概要

第6章 市場展望

第7章 市場展望附錄

The Semiconductor packaging materials market is poised for remarkable growth, projected to surpass USD 40 billion by 2030, with a compelling CAGR of approximately 7% from a value of USD 25 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for packaging materials.

This report provides a deep-dive into the following points in this detailed assessment of semiconductor packaging materials market:

Product Overview

Defining the functions and the key materials used for major semiconductor packaging components:

• Die-attach
• Encapsulants
• Underfills
• Thermal interface material
• Wafer substrate packaging, etc.

Global Semiconductor Packaging Materials Market overview

Insight on current (2022) and forecasted (2030) global market for Semiconductor Packaging Materials including an analysis of the key trends and drivers impacting market growth and choice of materials.

Global market segmentation by material type

Global market segmentation by key materials used – Polymers, Metals, Ceramics, Composites, etc.

Key Selection criteria or Performance Parameters for material selection including voice of customer on parameters such as Thermal insulation and flexibility

Competition overview:

Key competitor profiles and analyzing the competitor landscape of 20+ companies including DuPont, Henkel, Kyocera, Heraeus, Panasonic, etc.

Patent overview:

Analyzing about 40 patent families by key assignees in the last 4-5 years. Report also includes insights on the research focus of the patents, materials under consideration and the associated applications.

Market outlook

Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.

Table of Contents

1. Introduction

• 1.1 Report Overview
• 1.2 Product Focus
• 1.3 Methodology

2. Process Overview

• 2.1 Thin Film Molding
• 2.2 Photolithography
• 2.3 Etching
• 2.4 Doping
• 2.5 CMP
• 2.6 Dicing
• 2.7 Wire Bonding
• 2.8 Packaging

3. Value Chain Overview

4. Market Overview

5. Detailed Market Assessment

• 5.1 Semiconductor Packaging

5. Patent Overview

6. Market Outlook

7. Annexure

List of Tables

• Table 4.1: Global Semiconductor Materials Market - By Material Type
• Table 4.2: Global Semiconductor Materials Market - Key Competitors
• Table 5.1.1: Global Semiconductor Packaging Materials Market - By Material Type
• Table 5.1.2: Manufacturers v/s Component and Material Used - Semiconductor Packaging Materials
• Table 6.1: Patent Publications by Geography - Semiconductor Packaging Materials
• Table 6.2: Patent Listing - Semiconductor Packaging Materials

List of Figures

• Chart 4.1: Global Semiconductor Materials Market
• Chart 4.2: Global Semiconductor Materials Market - By Material Type
• Chart 4.3: Global Semiconductor Materials Market - By Component
• Chart 5.1.1: Global Semiconductor Packaging Materials Market
• Chart 5.1.2: Global Semiconductor Packaging Materials Market, By Material
• Chart 6.1: Patent Publication Trend - Semiconductor Packaging Materials