市場調查報告書
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1384952
下一代記憶體全球市場規模、佔有率和行業趨勢分析報告:2023-2030年按技術、晶圓尺寸、行業和地區分類的展望和預測Global Next Generation Memory Market Size, Share & Industry Trends Analysis Report By Technology, By Wafer Size (300 mm, and 200 mm), By Vertical, By Regional Outlook and Forecast, 2023 - 2030 |
2030年,下一代記憶體市場規模預計將達到218億美元,預測期內市場年複合成長率率為17.2%。
根據 KBV Cardinal Matrix 發表的分析,三星電子預計到 2030 年將達到 218 億美元。三星電子有限公司是該市場的領導者。美光科技公司、霍尼韋爾國際公司和英飛凌科技股份公司等公司是該市場的主要創新者。 2023 年 10 月,美光科技推出 16Gb DDR5 內存,以加強產品系列。此新產品採用 4 相時脈、時脈接收器和高 k CMOS 元件技術。此外,與上一代產品相比,新產品的性能提高了 50%,每瓦性能提高了 33%。
市場成長要素
對高效能資料處理的需求不斷成長
資料密集型應用的複雜性不斷增加,以及需要更有效率的記憶體解決方案來滿足不斷成長的處理要求,推動了對高效能資料處理需求的快速成長。包括 MRAM、PCM 等在內的下一代儲存技術具有獨特的優勢來滿足這些需求,並且它們與各個領域的整合帶來了一些顯著的發展。需求增加的顯著結果之一是下一代記憶體產業技術創新的加速。下一代記憶體解決方案對於記憶體內運算的成功也至關重要,因為它們提供記憶體內運算所需的高速資料存取。總之,對高效能資料處理的需求不斷成長正在推動市場轉型。
擴大新興技術的使用
隨著技術不斷進步以及邊緣運算、物聯網 (IoT)、5G 和人工智慧 (AI) 等新範式的發展勢頭,對能夠滿足性能和可靠性要求的內存解決方案的需求不斷成長。 。這種協同效應作用最顯著的成果之一是下一代記憶體技術和邊緣運算的融合。邊緣運算需要在網路外圍、靠近資料來源的地方有效率地處理資料。新一代記憶體的快速資料存取和低延遲使其成為邊緣設備和閘道器的理想合作夥伴。隨著邊緣運算對於自動駕駛汽車、智慧城市和工業自動化等應用變得至關重要,下一代記憶體技術將確保邊緣的快速資料處理和即時決策。隨著人工智慧不斷發展和塑造醫療保健、金融和自主系統等產業,對先進儲存技術的需求只會增加。因此,新興市場的所有這些開拓都將支持市場擴張。
市場抑制因素
製造成本大幅急劇上升
開發和製造 MRAM 和 3D XPoint 等下一代記憶體需要複雜且專業的流程。這些過程通常需要先進的製造設施、設備和熟練的勞動力。建立此類基礎設施所需的初始投資可能令人望而卻步,導致小型企業難以在市場上競爭。此外,高製造成本直接影響下一代記憶體產品的定價。當製造成本增加時,製造商通常會將這些成本轉嫁給消費者,導致零售價格上漲。在價格敏感的消費性電子領域,下一代記憶體技術的採用可能會因其相對成本而受到阻礙。
技術展望
依技術,市場分為波動性和非波動性。在 2022 年的市場中,非波動性細分市場的收益佔有率最高。非揮發性技術具有許多對現代企業至關重要的優勢。即使在斷電的情況下也能保存資料,這是其最顯著的屬性之一。非揮發性技術可實現更快的啟動時間並提高資料完整性,這對於金融交易和資料儲存等資料一致性至關重要的應用程式至關重要。需要非揮發性記憶體來提高能源效率、延長行動裝置的電池壽命並降低資料中心的營運成本。
晶圓尺寸展望
依晶圓尺寸,市場分為200nm和300nm。 2022 年,200 奈米細分市場將在市場中佔據重要的收益佔有率。半導體產業從 200mm 晶圓尺寸的使用中受益匪淺。成本效益是一個主要優勢,因為生產較小的晶圓通常更便宜。這對於希望在不犧牲下一代記憶體組件的性能和品質的情況下降低成本和簡化製造流程的公司來說很有吸引力。當小產量就足夠時,200mm 晶圓對於專業應用和利基市場特別有吸引力。其彈性使公司能夠滿足特定客戶的需求,而無需大型生產設施。
產業展望
依產業分類,可分為 BFSI、消費性電子、政府、通訊、資訊科技、企業儲存、汽車/運輸等。 2022年,企業儲存市場將佔據最大的收益佔有率。與NAND快閃記憶體等傳統儲存解決方案相比,MRAM 和 PCM 等新一代儲存技術可大幅縮短資料存取時間。這減少了延遲,使企業能夠更快地存取和處理資料。減少延遲是即時資料分析、高頻交易和資料庫應用程式的遊戲規則改變者。大多數新一代記憶體都是非揮發性的,這意味著即使電源關閉它也能保留資料。這在企業儲存系統中是有利的,因為它可以保證資料完整性並在斷電和斷電期間保留關鍵資訊。
區域展望
從區域來看,我們對北美、歐洲、亞太地區和拉丁美洲/中東/非洲的市場進行了分析。 2022 年,亞太地區佔據市場最大收益佔有率。隨著商業環境的變化,該地區正在迅速採用下一代記憶體技術。亞太國家物聯網設備的快速成長增加了對節能記憶體解決方案的需求,這些解決方案即使在斷電情況下也能保留資料。該地區智慧型設備的普及和精通技術的消費者群直接推動了這一需求。亞太地區以其強大的製造生態系統已成為半導體製造的熱點。
下一代記憶體市場部署的最新策略
夥伴關係、聯盟和協議:
產品公告和產品擴展:
收購和合併
地理擴張
The Global Next Generation Memory Market size is expected to reach $21.8 billion by 2030, rising at a market growth of 17.2% CAGR during the forecast period.
Integrating next generation memory technologies brings significant benefits to the forefront of the BFSI industry. These solutions' rapidity and effectiveness are essential for enhancing data analytics and real-time transaction processing capabilities. Therefore, the BFSI sector would generate 1/5th share of the market by 2030. Financial institutions are able to make decisions more quickly and accurately, which is crucial in markets where even milliseconds can have a significant impact. Additionally, data integrity is guaranteed by the non-volatile nature of some next generation memory types, which is crucial for upholding regulatory compliance and preserving trust. Enhancing operational efficiency as well as data security in the BFSI sector is mainly dependent on next generation memory due to the growing volume of financial data and the requirement for strong security measures.
The major strategies followed by the market participants are Product Launches as the key developmental strategy to keep pace with the changing demands of end users. For instance, In October, 2023, Everspin Technologies, Inc. launched the EMxxLX to enhance the high-density STT-MRAM product family. The EMxxLX is an xSPI serial interface for persistent memory. The new product has the features of a clock frequency of 200 MHz and a bandwidth of 400 megabytes per second using eight I/O signals. Additionally, In July, 2023, Samsung Electronics Co. Ltd. launched the Graphics Double Data Rate 7 (GDDR7) DRAM. The new product helps enhance user experiences and provides exceptional graphics performance on game consoles and workstations. Additionally, the new product has applications in AI and automotive vehicles.
Based on the Analysis presented in the KBV Cardinal matrix; Samsung Electronics Co. Ltd. is the forerunner in the Market. Companies such as Micron Technology, Inc., Honeywell International, Inc., Infineon Technologies AG are some of the key innovators in the Market. In October, 2023, Micron Technology, Inc. launched the 16Gb DDR5 memory to enhance its 1B (1-beta) process node technology product portfolio. The new product has the features of 4-phase clocking, clock-sync and high-k CMOS device technology. Additionally, the new product helps to increase performance by 50% and provides an improvement in performance per watt of 33% over the previous generation.
Market Growth Factors
Rising demand for high-performance data processing
The surge in demand for high-performance data processing is driven by the growing complexity of data-intensive applications and the need for more efficient memory solutions that can keep pace with the escalating processing requirements. Next Generation Memory technologies, including MRAM, PCM, and others, are uniquely positioned to meet these demands, and their integration into various sectors has ushered in several notable developments. One prominent consequence of this heightened demand is the acceleration of innovation within the Next Generation Memory industry. Next Generation Memory solutions are also crucial for the success of in-memory computing, as they provide the high-speed data access required for this approach. In conclusion, the growing demand for high-performance data processing has been a catalyst for transformative change within the market.
Increasing use of emerging technologies
As technology continues to advance and new paradigms such as edge computing, the Internet of Things (IoT), 5G, and artificial intelligence (AI) gain momentum, the demand for memory solutions that can meet the performance and reliability requirements grows. One of the most noteworthy outcomes of this synergy is the convergence of Next Generation Memory technologies with edge computing. Edge computing requires efficient data handling at the network's periphery, close to data sources. Next-generation memory's high-speed data access and low latency make it an ideal companion for edge devices and gateways. As edge computing becomes integral to applications like autonomous vehicles, smart cities, and industrial automation, Next Generation Memory technologies ensure rapid data processing and real-time decision-making at the edge. As AI continues to evolve and shape industries such as healthcare, finance, and autonomous systems, the demand for advanced memory technologies will intensify. Therefore, all of these developments will aid in the expansion of the market.
Market Restraining Factors
Significantly high manufacturing costs
The development and production of next-generation memory, such as MRAM and 3D XPoint, involves intricate and specialized processes. These processes often require sophisticated manufacturing facilities, equipment, and a skilled workforce. The initial investment needed to establish such infrastructure can be prohibitively high, making it challenging for smaller players to compete in the market. Moreover, high manufacturing costs directly impact the pricing of Next Generation Memory products. When production expenses are substantial, manufacturers often transfer these costs to consumers, resulting in higher retail prices. In the consumer electronics sector, where price sensitivity is prevalent, the adoption of these technologies may be hampered by their relatively high cost.
Technology Outlook
Based on technology, the market is bifurcated into volatile and non-volatile. The non-volatile segment garnered the highest revenue share in the market in 2022. Non-volatile technology offers a number of benefits that are essential for contemporary enterprises. Their capacity to store data even in the absence of power is one of their most notable qualities. Faster boot times and better data integrity are made possible by non-volatile technology, which is essential for applications like financial transactions and crucial data storage where data consistency is vital. Non-volatile memory is necessary for improving energy efficiency, extending mobile device battery life, and lowering data center operating expenses.
Wafer Size Outlook
On the basis of wafer size, the market is divided into 200 nm and 300 nm. The 200 nm segment recorded a substantial revenue share in the market in 2022. The semiconductor industry benefits significantly from the use of 200 mm wafer size. Cost-effectiveness is a major advantage since producing smaller wafers is typically less expensive. This is appealing to companies looking to cut costs and streamline their manufacturing processes without sacrificing the performance and quality of next generation memory components. When smaller production volumes are adequate, 200 mm wafers are especially appealing for specialized applications and niche markets. Their flexibility enables businesses to meet specific customer needs without requiring large-scale production facilities.
Vertical Outlook
By vertical, the market is segmented into BFSI, consumer electronics, government, telecommunications, information technology, enterprise storage, automotive & transportation, and others. The enterprise storage region witnessed the largest revenue share in the market in 2022. Next Generation memory technologies, such as MRAM and PCM, provide significantly faster data access times compared to traditional storage solutions like NAND flash. This translates to reduced latency, allowing enterprises to access and process data more quickly. In real-time data analysis, high-frequency trading, and database applications, reduced latency is a game-changer. Many next generation memory types are non-volatile, meaning they retain data even when power is removed. This is advantageous in enterprise storage systems, as it guarantees data integrity and preserves critical information in the event of power failures or outages.
Regional Outlook
Region-wise, the market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific region acquired the maximum revenue share in the market in 2022. Next Generation memory technology is rapidly being adopted in this region due to a number of factors that are in line with the changing business environment in the region. The demand for energy-efficient memory solutions to preserve data in power-off scenarios has increased due to the rapid development of IoT devices throughout Asia Pacific countries. The proliferation of smart devices and the tech-savvy consumer base in the region are the direct causes of this demand. Asia Pacific is a hotspot for the production of semiconductors due to its robust manufacturing ecosystem.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co. Ltd., Micron Technology, Inc., Fujitsu Limited, Toshiba Corporation, Honeywell International, Inc., Microchip Technology, Inc., Everspin Technologies, Inc., Infineon Technologies AG, Kingston Technology Company, Inc., and Intel Corporation.
Recent Strategy Deployed in the Next-generation Memory Market
Partnerships, Collaborations, and Agreements:
Oct-2023: Micron Technology, Inc. joined hands with Qualcomm Technologies, Inc., a company engaged in developing wireless telecommunication products. Under this collaboration, Micron Technology utilized the Snapdragon 8 Gen 3 mobile platform of Qualcomm Technologies to introduce the 5X (LPDDR5X) memory, which has low power but a double data rate. The new product works at a speed grade of 9.6 gigabits per second (Gbps) and offers the fast performance required for operating generative artificial intelligence (AI).
Oct-2023: Fujitsu Limited collaborated with TOPPAN Holdings Inc., a Japanese global printing company. Under this collaboration, the analytical technology of TOPPAN Holdings was amalgamated with the data cleansing technology of Fujitsu within the boundaries of a medical record database. Additionally, this collaboration assisted the companies in conducting analysis of medical big data and provided services for enhancing research and development in healthcare.
Sep-2023: Silicon Storage Technology, Inc., a subsidiary of Microchip Technology, Inc., formed a partnership with GlobalFoundries U.S. Inc., a multinational semiconductor contract manufacturing company. Under this partnership, the SST ESF3 third-generation embedded SuperFlash technology NVM solution was introduced.
Nov-2022: Infineon Technologies AG came into a partnership with Taiwan Semiconductor Manufacturing Company Limited, a Taiwanese multinational semiconductor contract manufacturing company. Under this partnership, the Resistive RAM (RRAM) Non-Volatile Memory (NVM) technology of TSMC was incorporated into the AURIX microcontrollers (MCU) of Infineon Technologies.
May-2022: Samsung Electronics Co. Ltd. teamed up with Red Hat, Inc., an American software company. Under this collaboration, open-source software technologies were developed for storage and memory products. Additionally, the collaboration built an ecosystem for establishing a combination of software and hardware.
Product Launches and Product Expansions:
Oct-2023: Micron Technology, Inc. launched the 16Gb DDR5 memory to enhance its 1B (1-beta) process node technology product portfolio. The new product has the features of 4-phase clocking, clock-sync and high-k CMOS device technology. Additionally, the new product helps to increase performance by 50% and provides an improvement in performance per watt of 33% over the previous generation.
Oct-2023: Everspin Technologies, Inc. launched the EMxxLX to enhance the high-density STT-MRAM product family. The EMxxLX is an xSPI serial interface for persistent memory. The new product has the features of a clock frequency of 200 MHz and a bandwidth of 400 megabytes per second using eight I/O signals.
Sep-2023: Toshiba Electronic Devices & Storage Corporation, a subsidiary of Toshiba Corporation, launched the MG10F Series 22TB HDD, a traditional magnetic recording (CMR) HDD device. The MG10F 22TB offers 10% more capability than the previous generation 20TB model of Toshiba. Additionally, the new product has a variety of applications in both traditional datacentre and cloud-scale use cases.
Jul-2023: Samsung Electronics Co. Ltd. launched the Graphics Double Data Rate 7 (GDDR7) DRAM. The new product helps enhance user experiences and provides exceptional graphics performance on game consoles and workstations. Additionally, the new product has applications in AI and automotive vehicles.
Apr-2023: Infineon Technologies AG introduced the SEMPER X1 LPDDR Flash, a LPDDR Flash memory assisting next-generation automotive E/E architectures. The SEMPER X1 LPDDR Flash offers safe and reliable real-time code execution. Additionally, the new product offers 8 times better performance than the current NOR Flash memory and 20 times quicker transactions for real-time applications.
Feb-2023: Fujitsu Limited unveiled the Fujitsu Web3 Acceleration Platform, a platform offering a variety of service APIs based on high-performance computing and blockchain technologies. The new product provides an opportunity for individuals in start-ups and universities to develop several Web3 applications and services. Additionally, the new product connects users to the Computing as a Service Data e-TRUST modules and the Computing as a Service applications of Fujitsu.
Dec-2022: Samsung Electronics Co., Ltd. introduced the 16-gigabit (Gb) DDR5 DRAM, a technology built using the 12-nanometer (nm)-class process technology. The new product assists in developing the market-wide operations of DDR5 DRAM.
Aug-2022: Microchip Technology Inc. unveiled the SMC 2000 series of Compute Express Link (CXL)-based Smart Memory Controllers to enhance its serial-attached memory controller product portfolio. The new product helps the CPUs, SoCs and GPUs use CXL interfaces for DDR5 and DDR4 memory. Additionally, the new product offers more bandwidth and memory per core and reduces the Total Cost of Ownership (TCO) in the data centre through optimization of application workloads.
Acquisition and Mergers:
Mar-2021: Honeywell International, Inc. completed the acquisition of Fiplex Communications, Inc., a worldwide manufacturer of telecommunication products. Through this acquisition, Honeywell enhanced its communications and building connectivity products.
Dec-2020: Honeywell International, Inc. completed the acquisition of Sparta Systems, a company providing enterprise quality management software (QMS). Through this acquisition, Honeywell solidified its position in the industrial automation and enterprise performance management software markets.
Oct-2020: Microchip Technology Inc. completed the acquisition of Tekron International Limited, a company producing high-precision atomic and GPS clocks. Through this acquisition, Microchip enhanced its product offering and established its position in the smart energy and industrial markets.
Geographical Expansions:
May-2023: Micron Technology, Inc. expanded its geographical footprints in Japan through the introduction of ultraviolet (EUV) technology. Through this geographical expansion, sophisticated patterning technology was used in order to develop the 1-gamma (1γ) node, the next generation of DRAM.
Market Segments covered in the Report:
By Technology
By Wafer Size
By Vertical
By Geography
Companies Profiled
Unique Offerings from KBV Research