封面
市場調查報告書
商品編碼
1615838

下一代記憶體市場:各類型,各用途,各技術,各地區,2024年~2031年

Next-Generation Memory Market By Type (Mass Storage, Embedded Storage), Application (Consumer Electronics, Enterprise Storage, Manufacturing), Technology (Volatile, Hybrid Memory Cube (HMC), DRAM), & Region for 2024-2031

出版日期: | 出版商: Verified Market Research | 英文 202 Pages | 商品交期: 2-3個工作天內

價格
簡介目錄

2024-2031 年新一代記憶體市場評估

人工智慧 (AI)、機器學習 (ML) 和物聯網 (IoT) 等許多領域的資料驅動應用迅速崛起,正在推動下一代記憶體市場的需求成長。隨著企業渴望利用大數據來實現更好的決策、營運效率和客戶體驗,大容量、高速記憶體解決方案變得越來越重要,預計到2031 年將超過銷售額並達到約304.1 億美元的估值。

雲端運算和行動裝置的激增正在推動對下一代記憶體解決方案的需求。隨著越來越多的企業遷移到雲端平台,對能夠處理巨大工作負載並提供快速資料檢索的彈性記憶體架構的需求將變得非常重要,從2024年到2031年,複合年增長率將達到27.03 %。

下一代記憶體市場定義/概述

下一代記憶體 (NGM) 是指改進的記憶體技術,可解決 DRAM 和 NAND 快閃記憶體等傳統記憶體系統的限制。這些新型記憶體旨在提高速度、效率和可擴展性,以滿足當今人工智慧 (AI)、機器學習、大數據分析和物聯網 (IoT) 等應用程式不斷增長的需求。

該技術正逐漸整合到各種應用中,以提高各行業的性能和效率。高效能運算 (HPC) 是一項重要的應用,它需要更快的資料處理速度。超級電腦和資料中心利用 3D NAND 和擴展 DRAM 等技術來實現即時分析和高速資料存取。

下一代記憶體(NGM)技術的未來應用預計將改變各行業的資料儲存和處理能力。人工智慧 (AI) 和機器學習是一項值得注意的應用,NGM 可加速資料存取和處理。

對高效能資料處理日益增長的需求會推動下一代記憶體市場嗎?

對高效能資料處理的需求不斷增長是下一代記憶體市場的主要驅動力。這一趨勢的推動因素包括數據輸出的指數級增長、數據密集型應用的激增以及人工智慧 (AI)、機器學習 (ML) 和物聯網 (IoT) 等新興技術的日益接受度。根據國際數據公司 (IDC) 的數據,全球數據圈預計將從 2018 年的 33 澤字節成長到 2025 年的 175 澤字節,複合年增長率為 61%。

此外,根據美國能源部的數據,資料中心目前使用的電力約占美國總電力的 2%,預計到 2030 年這一數字將上升至 8%。這凸顯了對更節能的記憶體解決方案的需求,以滿足不斷增長的資料處理需求。 2020年至2022年,美國國家科學基金會(NSF)為人工智慧研發活動提供了超過5億美元的資助。此外,美國政府於2019年宣布的美國人工智慧計畫旨在刺激人工智慧創新,推動對高效能記憶體解決方案的需求。

高製造成本會阻礙下一代記憶體市場嗎?

製造成本飆升可能會嚴重阻礙下一代記憶體市場的成長。隨著製造商採用先進技術和新穎工藝來提供高效能記憶體解決方案,研發、設備和設施所需的初始資本可能會很大。尤其是 3D NAND 和即將推出的非揮發性記憶體等尖端技術,製造的複雜性和精度推高了生產價格。這些不斷上升的製造成本可能會提高消費者和企業的價格,抑制採用並限制市場擴張。

原物料價格波動和供應鏈中斷將推高下一代記憶體領域的製造成本。

半導體產業極易受到矽、稀土元素和特種化學品等基本資源的可用性和成本波動的影響。此外,地緣政治衝突和全球供應鏈問題(例如複雜的 COVID-19 局勢)可能會導致製造延誤並增加成本。如果無法解決這些生產問題,可能會阻礙研發投資,並最終限制記憶體技術的改進。

目錄

第1章 下一代記憶體的全球市場:簡介

  • 市場概要
  • 調查範圍
  • 前提條件

第2章 摘要整理

第3章 VERIFIED MARKET RESEARCH的調查手法

  • 資料探勘
  • 檢驗
  • 主要採訪
  • 資料來源一覽

第4章 下一代記憶體的全球市場展望

  • 概要
  • 市場動態
    • 促進因素
    • 阻礙因素
    • 機會
  • 波特的五力分析
  • 價值鏈分析

第5章 下一代記憶體的全球市場:各技術

  • 概要
  • 揮發性
  • 不變性

第6章 下一代記憶體的全球市場:各類型

  • 概要
  • 高容量儲存
  • 嵌入式儲存

第7章 下一代記憶體的全球市場:各用途

  • 概要
  • 消費者電子產品
  • 企業儲存
  • 製造業
  • IT·通訊
  • 航太·防衛
  • 產業
  • 汽車·運輸
  • 其他

第8章 下一代記憶體的全球市場:各地區

  • 概要
  • 北美
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 其他歐洲
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 其他亞太地區
  • 全球其他地區
    • 中東·非洲
    • 南美

第9章 下一代記憶體的全球市場:競爭情形

  • 概要
  • 各公司的市場排行榜
  • 主要的發展策略

第10章 企業簡介

  • Intel
  • Toshiba
  • Fujitsu
  • Micron Technology
  • SK Hynix
  • Western Digital
  • Samsung
  • Everspin
  • Microchip Technology
  • Adesto Technologies

第11章 主要發展

  • 產品上市/開發
  • 合併和收購
  • 事業擴大
  • 夥伴關係和合作

第12章 附錄

  • 相關調查
簡介目錄
Product Code: 3855

Next-Generation Memory Market Valuation - 2024-2031

The fast rise of data-driven applications in many sectors such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT) is driving the expanding demand for the next-generation memory market. As enterprises aspire to use big data for better decision-making, operational efficiency, and customer experiences, high-capacity, high-speed memory solutions have become increasingly important by enabling the market to surpass a revenue of USD 4.49 Billion in 2024 and reach a valuation of aroundUSD 30.41 Billion by 2031.

Cloud computing and the proliferation of mobile devices are driving up demand for next-generation memory solutions. As more businesses migrate to cloud platforms, the demand for resilient memory architectures that can handle huge workloads and deliver fast data retrieval becomes critical by enabling the market to grow at aCAGR of 27.03% from 2024 to 2031.

Next-Generation Memory Market: Definition/ Overview

Next Generation Memory (NGM) refers to improved memory technologies that address the constraints of traditional memory systems such as DRAM and NAND flash. These novel memory types are intended to improve speed, efficiency, and scalability meeting the expanding demands of current applications such as artificial intelligence (AI), machine learning, big data analytics, and the Internet of Things (IoT).

The technologies are progressively being integrated into a wide range of applications improving performance and efficiency across industries. One significant use is high-performance computing (HPC) where the need for faster data processing is critical. Supercomputers and data centers leverage technologies like 3D NAND and enhanced DRAM to provide real-time analytics and fast data access.

The future application of next generation memory (NGM) technologies is expected to alter data storage and processing capacities across a variety of industries. One notable application is in artificial intelligence (AI) and machine learning where NGM will speed up data access and processing.

What's inside a VMR industry report?

Our reports include actionable data and forward-looking analysis that help you craft pitches, create business plans, build presentations and write proposals.

Will the Rising Demand for High-Performance Data Processing Drive the Next-Generation Memory Market?

The increasing demand for high-performance data processing is a major driver of the next-generation memory market. This trend is being driven by the exponential increase in data output, the proliferation of data-intensive applications, and the growing acceptance of advanced technologies such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT). According to the International Data Corporation (IDC), the global datasphere is expected to increase from 33 zettabytes in 2018 to 175 zettabytes by 2025 indicating a 61% compound annual growth rate (CAGR).

Furthermore, the US Department of Energy says that data centers currently utilize around 2% of all electricity in the United States with this figure anticipated to rise to 8% by 2030. This emphasizes the need for more energy-efficient memory solutions to meet the increasing need for data processing. Between 2020 and 2022, the National Science Foundation (NSF) funded more than $500 million in AI research and development activities. Furthermore, the US government's American AI Initiative which was announced in 2019 aims to stimulate AI innovation, increasing demand for high-performance memory solutions.

Will High Manufacturing Costs Hamper the Next-Generation Memory Market?

High production costs may severely impede the growth of the next-generation memory market. As manufacturers engage in sophisticated technologies and novel processes to provide high-performance memory solutions, the initial capital required for research and development, equipment, and facilities can be significant. This is especially true for cutting-edge technologies like 3D NAND and upcoming non-volatile memory types where fabrication complexity and precision requirements drive up production prices. These high manufacturing costs can raise prices for consumers and businesses, discouraging widespread adoption and limiting market expansion.

Fluctuating raw material prices and supply chain interruptions drive increased manufacturing costs in the next-generation memory sector.

The semiconductor industry is extremely vulnerable to changes in the availability and cost of essential resources including silicon, rare earth elements, and specialty chemicals. Furthermore, geopolitical conflicts and global supply chain concerns as shown by incidents such as the COVID-19 epidemic can cause delays and increased costs complicating the landscape. If these production issues are not addressed, they may impede investment in R&D, ultimately limiting memory technology improvements.

Category-Wise Acumens

Will the Cost-Efficiency and Faster Memory Solutions Drive the Technology Segment?

The non-volatile memory sector is expected to dominate the memory market due to the exponential development of data generation across numerous industries. With the introduction of big data analytics, Internet of Things (IoT) devices, and cloud computing, enterprises are dealing with an unprecedented volume of data necessitating high-performance and cost-effective memory solutions. Non-volatile memory technologies such as NAND flash and developing alternatives like 3D XPoint are increasingly valued for their ability to maintain data even when power is lost.

The growing popularity of wearables, high-performance computing (HPC), and other consumer gadgets increases the demand for sophisticated non-volatile memory solutions. Wearables, for example, require compact, energy-efficient storage capable of processing health data and user interactions. Similarly, HPC applications demand memory that can handle sophisticated computations and enormous datasets which makes non-volatile systems more appealing.

Will Reliability and Scalability in Enterprise Storage Environments Contribute to the Dominance of the Application Segment within the Market?

Next-generation memory technologies play a critical role in improving enterprise storage systems such as data centers, servers, and cloud storage. These advanced memory technologies such as 3D NAND and non-volatile memory express are intended to provide extraordinary speed and efficiency allowing for quick data access and low latency storage. In today's data-driven world, organizations are bombarded with massive amounts of information that must be effectively managed and retrieved.

The deployment of sophisticated memory technologies improves reliability and scalability in enterprise storage infrastructures. These technologies are designed to resist the rigors of continuous operation providing the durability and performance consistency that businesses seek. Organizations may easily extend their storage capabilities without compromising performance allowing them to react to evolving business needs and effectively manage expanding data workloads.

Country/Region-wise Acumens

Will the Rapid Expansion of Mobile Technology and the Internet of Things (IoT) Drive the Market in the Asia Pacific Region?

The Asia Pacific region dominates the next generation memory market due to its significant presence in semiconductor manufacturing and quick adoption of sophisticated technologies. This dominance is fueled by the region's tremendous expansion in mobile technology and the Internet of Things (IoT) which has created an enormous need for high-performance, energy-efficient memory solutions. Asia Pacific's mobile technology sector is growing at an unparalleled rate. The International Data Corporation (IDC) predicts that smartphone shipments in Asia Pacific will reach 878 million units by 2025, reflecting a 2.9% compound annual growth rate (CAGR) between 2020 and 2025.

According to the Global Mobile Suppliers Association (GSA), by 2023, there will be 233 commercial 5G networks in 87 countries with Asia Pacific leading in installations. As of 2022, China alone had installed approximately 1.43 million 5G base stations covering all prefecture-level cities, according to the Ministry of Industry and Information Technology. This vast 5G infrastructure is fueling the growth of edge computing and AI applications that require high-performance memory. The Korea Information Society Development Institute projects that South Korea's 5G industry will reach USD 73 Billion by 2026, reflecting a 43% CAGR from 2020 to 2026.

Will the Growing Focus on Data Security and Compliance Regulations Drive the Market in the North American Region?

The Asia Pacific region is experiencing the greatest growth in the next generation memory market owing to rapid technical developments and increased data center investments. Countries such as China, Japan, and South Korea have had exceptionally rapid growth. The Asia Pacific region's next generation memory market is being driven by a growing emphasis on data security and regulatory compliance. According to International Association of Privacy Professionals (IAPP) research, 65% of Asia Pacific countries have comprehensive data protection laws in place as of 2023.

According to the Asian Development Bank, the Asia Pacific IoT market is expected to develop at a CAGR of 28.6% between 2021 and 2026, reaching USD 436.77 Billion. This rapid increase in IoT combined with severe data protection rules is driving demand for next-generation memory technologies that provide stronger security features, quicker data processing capabilities, and more energy efficiency.

Competitive Landscape

The Next-Generation Memory Market is a dynamic and competitive space characterized by diverse players vying for market share. These players are on the run for solidifying their presence through the adoption of strategic plans such as collaborations, mergers, acquisitions, and political support. The organizations are focusing on innovating their product line to serve the vast population in diverse regions.

Some of the prominent players operating in the next-generation memory market include:

Samsung

Micron Technology, Inc.

Fujitsu

SK HYNIX INC

Honeywell International, Inc.

Microchip Technology, Inc

Everspin Technologies, Inc

Infineon Technologies AG

Kingston Technology Europe Co LLP

KIOXIA Singapore Pte. Ltd

Latest Developments

In April 2024, Samsung unveiled the Evo Select and Evo Plus microSD memory cards in the United States, touting higher read speeds of up to 160 MB/s, 30 MB/s faster than the previous 2023 models. These improved memory card lines are meant to considerably improve data transfer speeds, meeting consumers' growing demand for quicker and more dependable storage options across multiple devices.

In May 2024, Micron Technology, Inc. stated that it will begin shipping a new high-performance memory for data centers. Their 128GB DDR5 RDIMM has quicker speeds and greater capacity than prior models, with a maximum transfer rate of 5,600 MT/s. This improvement will address the needs of modern data centers, which require efficient and powerful computing.

TABLE OF CONTENTS

1 INTRODUCTION OF GLOBAL NEXT-GENERATION MEMORY MARKET

  • 1.1 Overview of the Market
  • 1.2 Scope of Report
  • 1.3 Assumptions

2 EXECUTIVE SUMMARY

3 RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

  • 3.1 Data Mining
  • 3.2 Validation
  • 3.3 Primary Interviews
  • 3.4 List of Data Sources

4 GLOBAL NEXT-GENERATION MEMORY MARKET OUTLOOK

  • 4.1 Overview
  • 4.2 Market Dynamics
    • 4.2.1 Drivers
    • 4.2.2 Restraints
    • 4.2.3 Opportunities
  • 4.3 Porters Five Force Model
  • 4.4 Value Chain Analysis

5 GLOBAL NEXT-GENERATION MEMORY MARKET, BY TECHNOLOGY

  • 5.1 Overview
  • 5.2 Volatile
  • 5.3 Non-volatile

6 GLOBAL NEXT-GENERATION MEMORY MARKET, BY TYPE

  • 6.1 Overview
  • 6.2 Mass Storage
  • 6.3 Embedded Storage

7 GLOBAL NEXT-GENERATION MEMORY MARKET, BY APPLICATION

  • 7.1 Overview
  • 7.2 Consumer Electronics
  • 7.3 Enterprise Storage
  • 7.4 Manufacturing
  • 7.5 IT and Telecommunication
  • 7.6 Aerospace and Defense
  • 7.7 Industrial
  • 7.8 Automotive and Transportation
  • 7.9 Others

8 GLOBAL NEXT-GENERATION MEMORY MARKET, BY GEOGRAPHY

  • 8.1 Overview
  • 8.2 North America
    • 8.2.1 U.S.
    • 8.2.2 Canada
    • 8.2.3 Mexico
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 U.K.
    • 8.3.3 France
    • 8.3.4 Rest of Europe
  • 8.4 Asia Pacific
    • 8.4.1 China
    • 8.4.2 Japan
    • 8.4.3 India
    • 8.4.4 Rest of Asia Pacific
  • 8.5 Rest of the World
    • 8.5.1 Middle East and Africa
    • 8.5.2 Latin America

9 GLOBAL NEXT-GENERATION MEMORY MARKET COMPETITIVE LANDSCAPE

  • 9.1 Overview
  • 9.2 Company Market Ranking
  • 9.3 Key Development Strategies

10 COMPANY PROFILES

  • 10.1 Intel
    • 10.1.1 Overview
    • 10.1.2 Financial Performance
    • 10.1.3 Product Outlook
    • 10.1.4 Key Developments
  • 10.2 Toshiba
    • 10.2.1 Overview
    • 10.2.2 Financial Performance
    • 10.2.3 Product Outlook
    • 10.2.4 Key Developments
  • 10.3 Fujitsu
    • 10.3.1 Overview
    • 10.3.2 Financial Performance
    • 10.3.3 Product Outlook
    • 10.3.4 Key Developments
  • 10.4 Micron Technology
    • 10.4.1 Overview
    • 10.4.2 Financial Performance
    • 10.4.3 Product Outlook
    • 10.4.4 Key Developments
  • 10.5 SK Hynix
    • 10.5.1 Overview
    • 10.5.2 Financial Performance
    • 10.5.3 Product Outlook
    • 10.5.4 Key Developments
  • 10.6 Western Digital
    • 10.6.1 Overview
    • 10.6.2 Financial Performance
    • 10.6.3 Product Outlook
    • 10.6.4 Key Developments
  • 10.7 Samsung
    • 10.7.1 Overview
    • 10.7.2 Financial Performance
    • 10.7.3 Product Outlook
    • 10.7.4 Key Developments
  • 10.8 Everspin
    • 10.8.1 Overview
    • 10.8.2 Financial Performance
    • 10.8.3 Product Outlook
    • 10.8.4 Key Developments
  • 10.9 Microchip Technology
    • 10.9.1 Overview
    • 10.9.2 Financial Performance
    • 10.9.3 Product Outlook
    • 10.9.4 Key Developments
  • 10.10 Adesto Technologies
    • 10.10.1 Overview
    • 10.10.2 Financial Performance
    • 10.10.3 Product Outlook
    • 10.10.4 Key Developments

11 KEY DEVELOPMENTS

  • 11.1 Product Launches/Developments
  • 11.2 Mergers and Acquisitions
  • 11.3 Business Expansions
  • 11.4 Partnerships and Collaborations

12 Appendix

    • 12.1.1 Related Research