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市場調查報告書
商品編碼
1456999

全球晶圓製造設備市場－2024年至2029年預測

Global Wafer Fabrication Equipment Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 121 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

晶圓製造設備市場預計將從 2022 年的 656.64 億美元增至 2029 年的 963.95 億美元，預測期內複合年成長率為 5.64%。

晶圓是一塊矽或其他半導體材料，設計成非常薄的磁碟。晶圓製造是使用各種類型的正片方法在給定或每個半導體晶圓上開發光子或某種類型的完整電路的過程。晶圓製造直接用於製造和開發具有指定電氣結構的組件。

市場促進因素：

  • 家電產業需求不斷增加

半導體晶圓製造在家用電子電器領域有多種應用，涵蓋音訊/視訊設備和各種型態的娛樂產品，如電視、智慧型手機、尋呼機、影印機和汽車零件。典型的製程涉及多個化學步驟來製造半導體裝置。

對家用電子電器和設備的需求不斷成長極大地推動了製造設備市場的擴張。 2022年，美國行動電話進口數量將達1.78億支。此外，由於研發投資的增加以及對產品創新的關注，市場正在成長。

  • 半導體技術創新

人工智慧 (AI) 正在跨行業部署，包括研究、醫療保健、高科技和消費性電子產品。為了支援人工智慧積體電路，半導體架構正在快速改進，透過增加功耗和更有效率的記憶體系統，更快地將資料移入和移出記憶體。

除了人工智慧之外，重力波檢測器、醫療產業的無電池感測器、行動 CMOS 成像儀和物聯網的 MEMS 振動能量收集器等創新都廣泛依賴半導體技術。這些新穎的創新正在影響晶圓製造設備市場。

市場限制因素：

  • 龐大的投資

儘管製造設備市場正在成長，但高度具體的原料要求、最先進的機械要求和巨額投資等挑戰對新興市場參與企業構成了挑戰，限制了市場成長。

晶圓製造設備市場依設備類型分為氧化設備、擴散設備、外延反應器、微影製程設備等。

晶圓製造設備市場按設備類型分為氧化設備、擴散設備、外延反應器、微影術設備和其他雜項設備。氧化劑在利用高溫和氧氣或蒸氣在矽晶圓表面形成薄氧化膜方面發揮重要作用。擴散裝置負責將摻雜劑原子引入矽晶圓並改變其電導率。

外延反應器有助於在晶圓表面沉積矽晶型層，從而實現電晶體的製造。微影術設備有助於使用光和光敏抗蝕劑材料在晶圓上形成所需的電路佈局。 「其他」類別包括各種晶圓製造製程中使用的各種設備。

預計亞太地區將佔據晶圓製造設備市場的主要佔有率。

從地區來看，亞太地區預計將呈現最快的成長速度。這是由於中國、日本和台灣代工廠的發展，以及家用電子電器需求的不斷成長。

市場開拓：

  • 2023 年 7 月 - 全球半導體領導者 Analog Devices, Inc. 投資超過 10 億美元擴建其位於奧勒岡州的半導體晶圓廠。這項資本投資將無塵室空間擴大到約 118,000 平方英尺，並使公司在 180 奈米及以上技術節點運行的產品的內部製造能力幾乎翻倍。
  • 2023 年 6 月 - Lam Research Corp. 推出 Coronus DX，號稱是世界上第一個傾斜沉澱解決方案，旨在提高晶片製造的產量比率。此創新解決方案經過最佳化，可解決下一代邏輯、3D NAND 和先進封裝應用中的關鍵製造挑戰。
  • 2022 年 11 月 - Lam Research Corp. 宣布成功完成從 Gruenwald Equity 和其他投資者手中收購全球濕式半導體設備供應商 SEMSYSCO GmbH。 SEMSYSCO 的整合增強了泛林在先進封裝領域的能力，特別是針對高效能運算 (HPC)、人工智慧 (AI) 和其他資料密集型應用的尖端邏輯晶片和基於晶片組的解決方案。

目錄

第1章 簡介

  • 市場概況
  • 市場定義
  • 調查範圍
  • 市場區隔
  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要利益

第2章調查方法

  • 研究設計
  • 調查過程

第3章執行摘要

  • 主要發現
  • 分析師觀點

第4章市場動態

  • 市場促進因素
  • 市場限制因素
  • 波特五力分析
  • 產業價值鏈分析
  • 分析師觀點

第5章全球晶圓製造設備市場：依設備類型

  • 介紹
  • 氧化系統
  • 擴散系統
  • 外延反應器
  • 微影製程設備
  • 其他

第6章全球晶圓製造設備市場：依規模分類

  • 介紹
  • 50mm～100mm
  • 100mm～200mm
  • 200mm～300mm
  • 300mm～450mm

第7章全球晶圓製造設備市場：按地區

  • 介紹
  • 美洲
  • 歐洲 中東/非洲
  • 亞太地區

第8章競爭環境及分析

  • 主要企業及策略分析
  • 市場佔有率分析
  • 合併、收購、協議和合作
  • 競爭對手儀表板

第9章 公司簡介

  • LAM RESEARCH CORPORATION
  • SCREEN Semiconductor Solutions Co., Ltd
  • Tokyo Electron Limited
  • Pacifica Partners Inc
  • Hitachi High-Technologies Corporation
  • KLA-Tencor Corporation
簡介目錄
Product Code: KSI061611346

Wafer Fabrication Equipment Market is projected to grow at a CAGR of 5.64% during the forecast period to reach US$96.395 billion by 2029, from US$65.664 billion in 2022.

A wafer is a piece of silicon or other semiconductor material, designed in the form of a very thin disc. Wafer fabrication is a process that has been developed using various types of affirmative methods to develop photonic or several types of fully electrical circuits on the given or respective semiconductor wafers. Wafer fabrication is directly used to build and develop components with the given electrical structures.

Market Drivers:

  • Growing demand from the consumer electronics industry-

Semiconductor wafer fabrication finds diverse applications in the consumer electronics sector, spanning audio/video devices and various forms of entertainment products, including televisions, smartphones, pagers, copiers, and automotive components. The typical process involves multiple chemical steps to create semiconductor devices.

The escalating demand for consumer electronics and devices is significantly driving the expansion of the fabrication equipment market. In 2022, U.S. imports of cellular phones reached 178 million units. Additionally, the market is experiencing growth due to increased investments in research and development as well as a focus on product innovation.

  • Innovation in semiconductor technology-

Artificial Intelligence (AI) has been rolled out across industry verticals like research, healthcare, high-tech, and consumer electronics. To support AI-integrated circuits, improvements in semiconductor architectures have been urged to speed the movement of data in and out of memory with increased power and more efficient memory systems.

Apart from AI, other innovations in the form of gravitational wave detectors, battery-free sensors for the medical industry, mobile CMOS imagers, MEMS Vibrational Energy Harvesters for IoT, etc., rely on semiconductor technologies extensively. These novel innovations are factoring into the market for wafer fabrication equipment.

Market Restraint:

  • Huge investments-

Although the fabrication equipment market is witnessing growth, factors such as the requirement of very specific raw materials, state-of-the-art machinery requirements, and huge investments bring challenges to emerging market players, thus restricting the growth of the market.

The global wafer fabrication equipment market is segmented by equipment type into oxidation systems, diffusion systems, epitaxial reactors, photolithography equipment, and others.

The global wafer fabrication equipment market is categorized by equipment type, including oxidation systems, diffusion systems, epitaxial reactors, photolithography equipment, and other miscellaneous equipment. Oxidation systems play a crucial role in generating a thin oxide layer on the silicon wafer surface, achieved through high temperatures and the introduction of oxygen or steam. Diffusion systems are responsible for incorporating dopant atoms into the silicon wafer, thereby modifying its electrical conductivity.

Epitaxial reactors facilitate the deposition of a single-crystal silicon layer on the wafer surface, enabling the creation of transistors. Photolithography equipment is instrumental in shaping the desired circuit layout onto the wafer using light and a photosensitive resist material. The "Others" category encompasses a diverse array of equipment utilized in various wafer fabrication processes.

APAC is anticipated to hold a significant share of the wafer fabrication equipment market.

By geography, the Asia-Pacific region is poised to show the fastest growth rate in the market. This is attributed to the development of foundries in China, Japan, and Taiwan and the increasing demand for consumer electronics.

Market Developments:

  • July 2023- Analog Devices, Inc., a prominent global semiconductor leader, celebrated its investment of over $1 billion to expand its semiconductor wafer fab in Beaverton, Oregon. The facility investment expanded cleanroom space to approximately 118,000 sq-ft and nearly doubled internal manufacturing capacity for products operating on the 180-nanometer technology node and above.
  • June 2023- Lam Research Corp. introduced Coronus DX, hailed as the world's first bevel deposition solution, aimed at enhancing yield in chip production. This innovative solution was optimized to tackle crucial manufacturing challenges in next-generation logic, 3D NAND, and advanced packaging applications.
  • November 2022- Lam Research Corp. announced the successful completion of the acquisition of SEMSYSCO GmbH, a worldwide supplier of wet processing semiconductor equipment, from Gruenwald Equity and other investors. Through the integration of SEMSYSCO, Lam enhanced its capabilities in advanced packaging, particularly for cutting-edge logic chips and chipset-based solutions catering to high-performance computing (HPC), artificial intelligence (AI), and other data-intensive applications.

Market Segmentation:

By Equipment Type

  • Oxidation Systems
  • Diffusion Systems
  • Epitaxial Reactors
  • Photolithography Equipment
  • Others

By Size

  • 50 mm-100 mm
  • 100 mm-200 mm
  • 200 mm-300 mm
  • 300 mm-450 mm

By Geography

  • Americas
  • USA
  • Others
  • Europe Middle East and Africa
  • Germany
  • France
  • Israel
  • Others
  • Asia Pacific
  • China
  • Japan
  • South Korea
  • Taiwan
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline
  • 1.8. Key benefits to the stakeholder

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. GLOBAL WAFER FABRICATION EQUIPMENT MARKET BY EQUIPMENT TYPE

  • 5.1. Introduction
  • 5.2. Oxidation Systems
    • 5.2.1. Market opportunities and trends
    • 5.2.2. Growth prospects
    • 5.2.3. Geographic lucrativeness
  • 5.3. Diffusion Systems
    • 5.3.1. Market opportunities and trends
    • 5.3.2. Growth prospects
    • 5.3.3. Geographic lucrativeness
  • 5.4. Epitaxial Reactors
    • 5.4.1. Market opportunities and trends
    • 5.4.2. Growth prospects
    • 5.4.3. Geographic lucrativeness
  • 5.5. Photolithography Equipment
    • 5.5.1. Market opportunities and trends
    • 5.5.2. Growth prospects
    • 5.5.3. Geographic lucrativeness
  • 5.6. Others
    • 5.6.1. Market opportunities and trends
    • 5.6.2. Growth prospects
    • 5.6.3. Geographic lucrativeness

6. GLOBAL WAFER FABRICATION EQUIPMENT MARKET BY SIZE

  • 6.1. Introduction
  • 6.2. 50 mm-100 mm
    • 6.2.1. Market opportunities and trends
    • 6.2.2. Growth prospects
    • 6.2.3. Geographic lucrativeness
  • 6.3. 100 mm-200 mm
    • 6.3.1. Market opportunities and trends
    • 6.3.2. Growth prospects
    • 6.3.3. Geographic lucrativeness
  • 6.4. 200 mm-300 mm
    • 6.4.1. Market opportunities and trends
    • 6.4.2. Growth prospects
    • 6.4.3. Geographic lucrativeness
  • 6.5. 300 mm-450 mm
    • 6.5.1. Market opportunities and trends
    • 6.5.2. Growth prospects
    • 6.5.3. Geographic lucrativeness

7. GLOBAL WAFER FABRICATION EQUIPMENT MARKET BY GEOGRAPHY

  • 7.1. Introduction
  • 7.2. Americas
    • 7.2.1. By Equipment Type
    • 7.2.2. By Size
    • 7.2.3. By Country
      • 7.2.3.1. United States
        • 7.2.3.1.1. Market Trends and Opportunities
        • 7.2.3.1.2. Growth Prospects
      • 7.2.3.2. Others
        • 7.2.3.2.1. Market Trends and Opportunities
        • 7.2.3.2.2. Growth Prospects
  • 7.3. Europe Middle East and Africa
    • 7.3.1. By Equipment Type
    • 7.3.2. By Size
    • 7.3.3. By Country
      • 7.3.3.1. Germany
        • 7.3.3.1.1. Market Trends and Opportunities
        • 7.3.3.1.2. Growth Prospects
      • 7.3.3.2. France
        • 7.3.3.2.1. Market Trends and Opportunities
        • 7.3.3.2.2. Growth Prospects
      • 7.3.3.3. Israel
        • 7.3.3.3.1. Market Trends and Opportunities
        • 7.3.3.3.2. Growth Prospects
      • 7.3.3.4. Others
        • 7.3.3.4.1. Market Trends and Opportunities
        • 7.3.3.4.2. Growth Prospects
  • 7.4. Asia Pacific
    • 7.4.1. By Equipment Type
    • 7.4.2. By Size
    • 7.4.3. By Country
      • 7.4.3.1. China
        • 7.4.3.1.1. Market Trends and Opportunities
        • 7.4.3.1.2. Growth Prospects
      • 7.4.3.2. Japan
        • 7.4.3.2.1. Market Trends and Opportunities
        • 7.4.3.2.2. Growth Prospects
      • 7.4.3.3. South Korea
        • 7.4.3.3.1. Market Trends and Opportunities
        • 7.4.3.3.2. Growth Prospects
      • 7.4.3.4. Taiwan
        • 7.4.3.4.1. Market Trends and Opportunities
        • 7.4.3.4.2. Growth Prospects
      • 7.4.3.5. Others
        • 7.4.3.5.1. Market Trends and Opportunities
        • 7.4.3.5.2. Growth Prospects

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 8.1. Major Players and Strategy Analysis
  • 8.2. Market Share Analysis
  • 8.3. Mergers, Acquisition, Agreements, and Collaborations
  • 8.4. Competitive Dashboard

9. COMPANY PROFILES

  • 9.1. LAM RESEARCH CORPORATION
  • 9.2. SCREEN Semiconductor Solutions Co., Ltd
  • 9.3. Tokyo Electron Limited
  • 9.4. Pacifica Partners Inc
  • 9.5. Hitachi High-Technologies Corporation
  • 9.6. KLA-Tencor Corporation