查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
全球晶圓接合設備市場：2031 年預測
市場調查報告書
商品編碼
1691624

全球晶圓接合設備市場：2031 年預測

Global Wafer Bonding Equipment Market Insights, Forecast to 2031
出版日期: | 出版商: QYResearch | 英文 181 Pages | 商品交期: 2-3個工作天內

價格

※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

全球晶圓接合設備市場預計將從 2025 年的 3.44 億美元成長到 2031 年的 4.4433 億美元，預測期內的年複合成長率（CAGR）為 4.36%。

全球主要的晶圓接合設備製造商包括EV集團、SUSS MicroTec、東京電子、Applied Microengineering、日本電產工具機、步美工業、上海微電子、U-Precision Tech、Hutem等，2024年全球主要企業約佔總銷售額的84%。

本報告研究了全球晶圓接合設備市場，並提供了市場概況、類型、應用和地區的趨勢，以及參與市場的公司概況。

目錄

第1章 調查範圍

  • 晶圓接合設備產品介紹
  • 按類型分類的市場
  • 按應用分類的市場
  • 假設和限制
  • 研究目標
  • 目標年份

第 2 章執行摘要

第3章 廠商間的競爭

第4章 市場規模（按類型）

  • 全球晶圓接合設備銷售額（按類型）
  • 全球晶圓接合設備收益（按類型）
  • 全球晶圓接合設備價格（按類型）

第5章 市場規模（依應用）

  • 全球晶圓接合設備銷售額（按應用）
  • 全球晶圓接合設備收益（按應用）
  • 全球晶圓接合設備價格（按應用）

第 6 章 北美

第7章 歐洲

第 8 章 亞太地區

第9章 南美洲

第10章 中東和非洲

第11章主要企業簡介

  • EV Group
  • SUSS MicroTec
  • Tokyo Electron
  • Applied Microengineering
  • Nidec Machine Tool
  • Ayumi Industry
  • Shanghai Micro Electronics
  • U-Precision Tech
  • Hutem
  • Canon
  • Bondtech
  • TAZMO
  • Aimechatec

第12章晶圓接合設備製造成本分析

第 13 章銷售管道、經銷商、貿易商和經銷商

第14章 市場動態

第 15 章全球晶圓接合設備市場的主要發現

第16章 附錄

The global Wafer Bonding Equipment market is projected to grow from US$ 344.00 million in 2025 to US$ 444.33 million by 2031, at a Compound Annual Growth Rate (CAGR) of 4.36% during the forecast period.

The global key manufacturers of Wafer Bonding Equipment include EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Shanghai Micro Electronics, U-Precision Tech, and Hutem, etc. In 2024, the global top five players had a share approximately 84% in terms of revenue.

In terms of production side, this report researches the Wafer Bonding Equipment production, growth rate, market share by manufacturers and by region (region level and country level), from 2020 to 2025, and forecast to 2031.

In terms of consumption side, this report focuses on the sales of Wafer Bonding Equipment by region (region level and country level), by company, by Type and by Application. from 2020 to 2025 and forecast to 2031.

Report Includes:

This report presents an overview of global market for Wafer Bonding Equipment, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2020 - 2024, estimates for 2025, and projections of CAGR through 2031.

This report researches the key producers of Wafer Bonding Equipment, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Wafer Bonding Equipment, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.

This report focuses on the Wafer Bonding Equipment sales, revenue, market share and industry ranking of main manufacturers, data from 2020 to 2025. Identification of the major stakeholders in the global Wafer Bonding Equipment market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.

This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2020 to 2031. Evaluation and forecast the market size for Wafer Bonding Equipment sales, projected growth trends, production technology, application and end-user industry.

Descriptive company profiles of the major global players, including EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Shanghai Micro Electronics, U-Precision Tech, and Hutem, etc.

By Company

  • EV Group
  • SUSS MicroTec
  • Tokyo Electron
  • Applied Microengineering
  • Nidec Machine Tool
  • Ayumi Industry
  • Shanghai Micro Electronics
  • U-Precision Tech
  • Hutem
  • Canon
  • Bondtech
  • TAZMO
  • Aimechatec

Segment by Type

  • Fully Automatic
  • Semi Automatic

Segment by Application

  • MEMS
  • Advanced Packaging
  • CIS
  • Others

Sales by Region

North America

  • U.S.
  • Canada
  • Mexico

Asia Pacific

  • Japan
  • China
  • South Korea
  • India
  • Southeast Asia
  • Others

Europe

  • Germany
  • France
  • U.K.
  • Italy
  • Russia
  • Others

South America

  • Brazil
  • Others

Middle East, Africa

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Sales (consumption), revenue of Wafer Bonding Equipment in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.

Chapter 3: Detailed analysis of Wafer Bonding Equipment manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.

Chapter 4: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 5: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 6-10: Region by Type, by Application and by country, sales, and revenue for each segment.

Chapter 11: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Wafer Bonding Equipment sales, revenue, price, gross margin, and recent development, etc.

Chapter 12-14: Analysis of industrial chain, sales channel, key raw materials, distributors and customers. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 15: The main points and conclusions of the report.

Table of Contents

1 Study Coverage

  • 1.1 Wafer Bonding Equipment Product Introduction
  • 1.2 Market by Type
    • 1.2.1 Global Wafer Bonding Equipment Market Size by Type, 2020 VS 2024 VS 2031
    • 1.2.2 Market by Type
  • 1.3 Market by Application
    • 1.3.1 Global Wafer Bonding Equipment Market Size by Application, 2020 VS 2024 VS 2031
    • 1.3.2 Market by Application
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Executive Summary

  • 2.1 Global Wafer Bonding Equipment Revenue Estimates and Forecasts 2020-2031
  • 2.2 Global Wafer Bonding Equipment Revenue by Region
    • 2.2.1 Global Wafer Bonding Equipment Revenue by Region: 2020 VS 2024 VS 2031
    • 2.2.2 Global Wafer Bonding Equipment Revenue by Region (2020-2025)
    • 2.2.3 Global Wafer Bonding Equipment Revenue by Region (2026-2031)
    • 2.2.4 Global Wafer Bonding Equipment Revenue Market Share by Region (2020-2031)
  • 2.3 Global Wafer Bonding Equipment Sales Estimates and Forecasts 2020-2031
  • 2.4 Global Wafer Bonding Equipment Sales by Region
    • 2.4.1 Global Wafer Bonding Equipment Sales by Region: 2020 VS 2024 VS 2031
    • 2.4.2 Global Wafer Bonding Equipment Sales by Region (2020-2025)
    • 2.4.3 Global Wafer Bonding Equipment Sales by Region (2026-2031)
    • 2.4.4 Global Wafer Bonding Equipment Sales Market Share by Region (2020-2031)
  • 2.5 North America
  • 2.6 Europe
  • 2.7 Asia Pacific
  • 2.8 South America
  • 2.9 Middle East, Africa

3 Competition by Manufacturers

  • 3.1 Global Wafer Bonding Equipment Sales by Manufacturers
    • 3.1.1 Global Wafer Bonding Equipment Sales by Manufacturers (2021-2024)
    • 3.1.2 Global Wafer Bonding Equipment Sales Market Share by Manufacturers (2021-2024)
  • 3.2 Global Wafer Bonding Equipment Revenue by Manufacturers
    • 3.2.1 Global Wafer Bonding Equipment Revenue by Manufacturers (2021-2024)
    • 3.2.2 Global Wafer Bonding Equipment Revenue Market Share by Manufacturers (2021-2024)
  • 3.3 Global Wafer Bonding Equipment Sales Price by Manufacturers (2021-2024)
  • 3.4 Analysis of Competitive Landscape
    • 3.4.1 Manufacturers Market Concentration Ratio
    • 3.4.2 Global Wafer Bonding Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
  • 3.5 Global Key Manufacturers of Wafer Bonding Equipment, Manufacturing Base Distribution and Headquarters
  • 3.6 Mergers & Acquisitions, Expansion Plans

4 Market Size by Type

  • 4.1 Global Wafer Bonding Equipment Sales by Type
    • 4.1.1 Global Wafer Bonding Equipment Historical Sales by Type (2020-2025)
    • 4.1.2 Global Wafer Bonding Equipment Forecasted Sales by Type (2026-2031)
    • 4.1.3 Global Wafer Bonding Equipment Sales Market Share by Type (2020-2031)
  • 4.2 Global Wafer Bonding Equipment Revenue by Type
    • 4.2.1 Global Wafer Bonding Equipment Historical Revenue by Type (2020-2025)
    • 4.2.2 Global Wafer Bonding Equipment Forecasted Revenue by Type (2026-2031)
    • 4.2.3 Global Wafer Bonding Equipment Revenue Market Share by Type (2020-2031)
  • 4.3 Global Wafer Bonding Equipment Price by Type
    • 4.3.1 Global Wafer Bonding Equipment Price by Type (2020-2025)
    • 4.3.2 Global Wafer Bonding Equipment Price Forecast by Type (2026-2031)

5 Market Size by Application

  • 5.1 Global Wafer Bonding Equipment Sales by Application
    • 5.1.1 Global Wafer Bonding Equipment Historical Sales by Application (2020-2025)
    • 5.1.2 Global Wafer Bonding Equipment Forecasted Sales by Application (2026-2031)
    • 5.1.3 Global Wafer Bonding Equipment Sales Market Share by Application (2020-2031)
  • 5.2 Global Wafer Bonding Equipment Revenue by Application
    • 5.2.1 Global Wafer Bonding Equipment Historical Revenue by Application (2020-2025)
    • 5.2.2 Global Wafer Bonding Equipment Forecasted Revenue by Application (2026-2031)
    • 5.2.3 Global Wafer Bonding Equipment Revenue Market Share by Application (2020-2031)
  • 5.3 Global Wafer Bonding Equipment Price by Application
    • 5.3.1 Global Wafer Bonding Equipment Price by Application (2020-2025)
    • 5.3.2 Global Wafer Bonding Equipment Price Forecast by Application (2026-2031)

6 North America

  • 6.1 North America Wafer Bonding Equipment Market Size by Type
    • 6.1.1 North America Wafer Bonding Equipment Sales by Type (2020-2031)
    • 6.1.2 North America Wafer Bonding Equipment Revenue by Type (2020-2031)
  • 6.2 North America Wafer Bonding Equipment Market Size by Application
    • 6.2.1 North America Wafer Bonding Equipment Sales by Application (2020-2031)
    • 6.2.2 North America Wafer Bonding Equipment Revenue by Application (2020-2031)
  • 6.3 North America Wafer Bonding Equipment Market Size by Country
    • 6.3.1 North America Wafer Bonding Equipment Revenue by Country (2020-2031)
    • 6.3.2 North America Wafer Bonding Equipment Sales by Country (2020-2031)
    • 6.3.3 US
    • 6.3.4 Canada
    • 6.3.5 Mexico

7 Europe

  • 7.1 Europe Wafer Bonding Equipment Market Size by Type
    • 7.1.1 Europe Wafer Bonding Equipment Sales by Type (2020-2031)
    • 7.1.2 Europe Wafer Bonding Equipment Revenue by Type (2020-2031)
  • 7.2 Europe Wafer Bonding Equipment Market Size by Application
    • 7.2.1 Europe Wafer Bonding Equipment Sales by Application (2020-2031)
    • 7.2.2 Europe Wafer Bonding Equipment Revenue by Application (2020-2031)
  • 7.3 Europe Wafer Bonding Equipment Market Size by Country
    • 7.3.1 Europe Wafer Bonding Equipment Revenue by Country (2020-2031)
    • 7.3.2 Europe Wafer Bonding Equipment Sales by Country (2020-2031)
    • 7.3.3 Germany
    • 7.3.4 France
    • 7.3.5 U.K.
    • 7.3.6 Italy
    • 7.3.7 Russia

8 Asia Pacific

  • 8.1 Asia Pacific Wafer Bonding Equipment Market Size by Type
    • 8.1.1 Asia Pacific Wafer Bonding Equipment Sales by Type (2020-2031)
    • 8.1.2 Asia Pacific Wafer Bonding Equipment Revenue by Type (2020-2031)
  • 8.2 Asia Pacific Wafer Bonding Equipment Market Size by Application
    • 8.2.1 Asia Pacific Wafer Bonding Equipment Sales by Application (2020-2031)
    • 8.2.2 Asia Pacific Wafer Bonding Equipment Revenue by Application (2020-2031)
  • 8.3 Asia Pacific Wafer Bonding Equipment Market Size by Region
    • 8.3.1 Asia Pacific Wafer Bonding Equipment Revenue by Region (2020-2031)
    • 8.3.2 Asia Pacific Wafer Bonding Equipment Sales by Region (2020-2031)
    • 8.3.3 China
    • 8.3.4 Japan
    • 8.3.5 South Korea
    • 8.3.6 India
    • 8.3.7 Southeast Asia

9 South America

  • 9.1 South America Wafer Bonding Equipment Market Size by Type
    • 9.1.1 South America Wafer Bonding Equipment Sales by Type (2020-2031)
    • 9.1.2 South America Wafer Bonding Equipment Revenue by Type (2020-2031)
  • 9.2 South America Wafer Bonding Equipment Market Size by Application
    • 9.2.1 South America Wafer Bonding Equipment Sales by Application (2020-2031)
    • 9.2.2 South America Wafer Bonding Equipment Revenue by Application (2020-2031)
  • 9.3 South America Wafer Bonding Equipment Market Size by Country
    • 9.3.1 South America Wafer Bonding Equipment Revenue by Country (2020-2031)
    • 9.3.2 South America Wafer Bonding Equipment Sales by Country (2020-2031)
    • 9.3.3 Brazil

10 Middle East and Africa

  • 10.1 Middle East and Africa Wafer Bonding Equipment Market Size by Type
    • 10.1.1 Middle East and Africa Wafer Bonding Equipment Sales by Type (2020-2031)
    • 10.1.2 Middle East and Africa Wafer Bonding Equipment Revenue by Type (2020-2031)
  • 10.2 Middle East and Africa Wafer Bonding Equipment Market Size by Application
    • 10.2.1 Middle East and Africa Wafer Bonding Equipment Sales by Application (2020-2031)
    • 10.2.2 Middle East and Africa Wafer Bonding Equipment Revenue by Application (2020-2031)
  • 10.3 Middle East and Africa Wafer Bonding Equipment Market Size by Country
    • 10.3.1 Middle East and Africa Wafer Bonding Equipment Revenue by Country (2020-2031)
    • 10.3.2 Middle East and Africa Wafer Bonding Equipment Sales by Country (2020-2031)

11 Key Players Profiles

  • 11.1 EV Group
    • 11.1.1 EV Group Company Details
    • 11.1.2 Company and Business Overview
    • 11.1.3 Wafer Bonding Equipment Introduction
    • 11.1.4 EV Group Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • 11.2 SUSS MicroTec
    • 11.2.1 SUSS MicroTec Company Details
    • 11.2.2 Company and Business Overview
    • 11.2.3 Wafer Bonding Equipment Introduction
    • 11.2.4 SUSS MicroTec Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • 11.3 Tokyo Electron
    • 11.3.1 Tokyo Electron Company Details
    • 11.3.2 Company and Business Overview
    • 11.3.3 Wafer Bonding Equipment Introduction
    • 11.3.4 Tokyo Electron Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • 11.4 Applied Microengineering
    • 11.4.1 Applied Microengineering Company Details
    • 11.4.2 Company and Business Overview
    • 11.4.3 Wafer Bonding Equipment Introduction
    • 11.4.4 Applied Microengineering Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • 11.5 Nidec Machine Tool
    • 11.5.1 Nidec Machine Tool Company Details
    • 11.5.2 Company and Business Overview
    • 11.5.3 Wafer Bonding Equipment Introduction
    • 11.5.4 Nidec Machine Tool Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • 11.6 Ayumi Industry
    • 11.6.1 Ayumi Industry Company Details
    • 11.6.2 Company and Business Overview
    • 11.6.3 Wafer Bonding Equipment Introduction
    • 11.6.4 Ayumi Industry Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • 11.7 Shanghai Micro Electronics
    • 11.7.1 Shanghai Micro Electronics Company Details
    • 11.7.2 Company and Business Overview
    • 11.7.3 Wafer Bonding Equipment Introduction
    • 11.7.4 Shanghai Micro Electronics Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • 11.8 U-Precision Tech
    • 11.8.1 U-Precision Tech Company Details
    • 11.8.2 Company and Business Overview
    • 11.8.3 Wafer Bonding Equipment Introduction
    • 11.8.4 U-Precision Tech Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • 11.9 Hutem
    • 11.9.1 Hutem Company Details
    • 11.9.2 Company and Business Overview
    • 11.9.3 Wafer Bonding Equipment Introduction
    • 11.9.4 Hutem Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • 11.10 Canon
    • 11.10.1 Canon Company Details
    • 11.10.2 Company and Business Overview
    • 11.10.3 Wafer Bonding Equipment Introduction
    • 11.10.4 Canon Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • 11.11 Bondtech
    • 11.11.1 Bondtech Company Details
    • 11.11.2 Company and Business Overview
    • 11.11.3 Wafer Bonding Equipment Introduction
    • 11.11.4 Bondtech Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • 11.12 TAZMO
    • 11.12.1 TAZMO Company Details
    • 11.12.2 Company and Business Overview
    • 11.12.3 Wafer Bonding Equipment Introduction
    • 11.12.4 TAZMO Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • 11.13 Aimechatec
    • 11.13.1 Aimechatec Company Details
    • 11.13.2 Company and Business Overview
    • 11.13.3 Wafer Bonding Equipment Introduction
    • 11.13.4 Aimechatec Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)

12 Wafer Bonding Equipment Manufacturing Cost Analysis

  • 12.1 Wafer Bonding Equipment Key Raw Materials Analysis
    • 12.1.1 Key Raw Materials
    • 12.1.2 Key Raw Materials Price Trend
  • 12.2 Key Raw Materials Steel SFE Price Trend (Yuan/MT)
  • 12.3 Key Raw Materials Aluminum LME Price Trend (USD/Tonne)
  • 12.4 Key Raw Materials Copper LME Price Trend (USD/LBs)
  • 12.5 Proportion of Manufacturing Cost Structure
    • 12.5.1 Raw Materials
    • 12.5.2 Labor Cost
    • 12.5.3 Manufacturing Expenses
  • 12.6 Manufacturing Process Analysis of Wafer Bonding Equipment

13 Sales Channel, Distributors, Traders and Dealers

  • 13.1 Sales Channel
    • 13.1.1 Direct Channel
    • 13.1.2 Indirect Channel
  • 13.2 Marketing Channels Status of Wafer Bonding Equipment
  • 13.3 Market Positioning
    • 13.3.1 Pricing Strategy
    • 13.3.2 Brand Strategy
  • 13.4 Wafer Bonding Equipment Distributors
  • 13.5 Wafer Bonding Equipment Customers

14 Market Dynamics

  • 14.1 Market Trends
  • 14.2 Challenges
  • 14.3 Market Favorable Factors and Unfavorable Factors
  • 14.4 Market Risks
  • 14.5 Industry Enters Major Barriers
  • 14.6 Porter's Five Forces Analysis

15 Key Findings in the Global Wafer Bonding Equipment Study

16 Appendix

  • 16.1 Research Methodology
    • 16.1.1 Methodology/Research Approach
    • 16.1.2 Data Source
  • 16.2 Author Details
  • 16.3 Disclaimer

List of Tables

  • Table 1. Global Wafer Bonding Equipment Market Size Growth Rate by Type, 2020 VS 2024 VS 2031 (US$ Million)
  • Table 2. Market by Type
  • Table 3. Global Wafer Bonding Equipment Market Size Growth Rate by Application, 2020 VS 2024 VS 2031 (US$ Million)
  • Table 4. Market by Application
  • Table 5. Global Wafer Bonding Equipment Revenue Grow Rate (CAGR) by Region: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 6. Global Wafer Bonding Equipment Revenue by Region (2020-2025) & (US$ Million)
  • Table 7. Global Wafer Bonding Equipment Revenue by Region (2026-2031) & (US$ Million)
  • Table 8. Global Wafer Bonding Equipment Revenue Market Share by Region (2020-2025)
  • Table 9. Global Wafer Bonding Equipment Revenue Market Share by Region (2026-2031)
  • Table 10. Global Wafer Bonding Equipment Sales Grow Rate (CAGR) by Region: 2020 VS 2024 VS 2031 (Units)
  • Table 11. Global Wafer Bonding Equipment Sales by Region (2020-2025) & (Units)
  • Table 12. Global Wafer Bonding Equipment Sales by Region (2026-2031) & (Units)
  • Table 13. Global Wafer Bonding Equipment Sales Market Share by Region (2020-2025)
  • Table 14. Global Wafer Bonding Equipment Sales Market Share by Region (2026-2031)
  • Table 15. Global Wafer Bonding Equipment Sales by Manufacturers (2021-2024) & (Units)
  • Table 16. Global Wafer Bonding Equipment Sales Share by Manufacturers (2021-2024)
  • Table 17. Global Wafer Bonding Equipment Revenue by Manufacturers (2021-2024) & (US$ Million)
  • Table 18. Global Wafer Bonding Equipment Revenue Market Share by Manufacturers (2021-2024)
  • Table 19. Wafer Bonding Equipment Price by Manufacturers (2021-2024) & (K USD/Unit)
  • Table 20. Global Wafer Bonding Equipment Manufacturers Market Concentration Ratio (CR5)
  • Table 21. Global Wafer Bonding Equipment by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Bonding Equipment as of 2024)
  • Table 22. Global Key Manufacturers of Wafer Bonding Equipment, Manufacturing Base Distribution and Headquarters
  • Table 23. Mergers & Acquisitions, Expansion Plans
  • Table 24. Global Wafer Bonding Equipment Sales by Type (2020-2025) & (Units)
  • Table 25. Global Wafer Bonding Equipment Sales by Type (2026-2031) & (Units)
  • Table 26. Global Wafer Bonding Equipment Sales Share by Type (2020-2025)
  • Table 27. Global Wafer Bonding Equipment Sales Share by Type (2026-2031)
  • Table 28. Global Wafer Bonding Equipment Revenue by Type (2020-2025) & (US$ Million)
  • Table 29. Global Wafer Bonding Equipment Revenue by Type (2026-2031) & (US$ Million)
  • Table 30. Global Wafer Bonding Equipment Revenue Share by Type (2020-2025)
  • Table 31. Global Wafer Bonding Equipment Revenue Share by Type (2026-2031)
  • Table 32. Wafer Bonding Equipment Price by Type (2020-2025) & (K USD/Unit)
  • Table 33. Global Wafer Bonding Equipment Price Forecast by Type (2026-2031) & (K USD/Unit)
  • Table 34. Global Wafer Bonding Equipment Sales by Application (2020-2025) & (Units)
  • Table 35. Global Wafer Bonding Equipment Sales by Application (2026-2031) & (Units)
  • Table 36. Global Wafer Bonding Equipment Sales Share by Application (2020-2025)
  • Table 37. Global Wafer Bonding Equipment Sales Share by Application (2026-2031)
  • Table 38. Global Wafer Bonding Equipment Revenue by Application (2020-2025) & (US$ Million)
  • Table 39. Global Wafer Bonding Equipment Revenue by Application (2026-2031) & (US$ Million)
  • Table 40. Global Wafer Bonding Equipment Revenue Share by Application (2020-2025)
  • Table 41. Global Wafer Bonding Equipment Revenue Share by Application (2026-2031)
  • Table 42. Wafer Bonding Equipment Price by Application (2020-2025) & (K USD/Unit)
  • Table 43. Global Wafer Bonding Equipment Price Forecast by Application (2026-2031) & (K USD/Unit)
  • Table 44. North America Wafer Bonding Equipment Sales by Type (2020-2025) & (Units)
  • Table 45. North America Wafer Bonding Equipment Sales by Type (2026-2031) & (Units)
  • Table 46. North America Wafer Bonding Equipment Revenue by Type (2020-2025) & (US$ Million)
  • Table 47. North America Wafer Bonding Equipment Revenue by Type (2026-2031) & (US$ Million)
  • Table 48. North America Wafer Bonding Equipment Sales by Application (2020-2025) & (Units)
  • Table 49. North America Wafer Bonding Equipment Sales by Application (2026-2031) & (Units)
  • Table 50. North America Wafer Bonding Equipment Revenue by Application (2020-2025) & (US$ Million)
  • Table 51. North America Wafer Bonding Equipment Revenue by Application (2026-2031) & (US$ Million)
  • Table 52. North America Wafer Bonding Equipment Revenue by Country (2020-2025) & (US$ Million)
  • Table 53. North America Wafer Bonding Equipment Revenue by Country (2026-2031) & (US$ Million)
  • Table 54. North America Wafer Bonding Equipment Sales by Country (2020-2025) & (Units)
  • Table 55. North America Wafer Bonding Equipment Sales by Country (2026-2031) & (Units)
  • Table 56. Europe Wafer Bonding Equipment Sales by Type (2020-2025) & (Units)
  • Table 57. Europe Wafer Bonding Equipment Sales by Type (2026-2031) & (Units)
  • Table 58. Europe Wafer Bonding Equipment Revenue by Type (2020-2025) & (US$ Million)
  • Table 59. Europe Wafer Bonding Equipment Revenue by Type (2026-2031) & (US$ Million)
  • Table 60. Europe Wafer Bonding Equipment Sales by Application (2020-2025) & (Units)
  • Table 61. Europe Wafer Bonding Equipment Sales by Application (2026-2031) & (Units)
  • Table 62. Europe Wafer Bonding Equipment Revenue by Application (2020-2025) & (US$ Million)
  • Table 63. Europe Wafer Bonding Equipment Revenue by Application (2026-2031) & (US$ Million)
  • Table 64. Europe Wafer Bonding Equipment Revenue by Country (2020-2025) & (US$ Million)
  • Table 65. Europe Wafer Bonding Equipment Revenue by Country (2026-2031) & (US$ Million)
  • Table 66. Europe Wafer Bonding Equipment Sales by Country (2020-2025) & (Units)
  • Table 67. Europe Wafer Bonding Equipment Sales by Country (2026-2031) & (Units)
  • Table 68. Asia Pacific Wafer Bonding Equipment Sales by Type (2020-2025) & (Units)
  • Table 69. Asia Pacific Wafer Bonding Equipment Sales by Type (2026-2031) & (Units)
  • Table 70. Asia Pacific Wafer Bonding Equipment Revenue by Type (2020-2025) & (US$ Million)
  • Table 71. Asia Pacific Wafer Bonding Equipment Revenue by Type (2026-2031) & (US$ Million)
  • Table 72. Asia Pacific Wafer Bonding Equipment Sales by Application (2020-2025) & (Units)
  • Table 73. Asia Pacific Wafer Bonding Equipment Sales by Application (2026-2031) & (Units)
  • Table 74. Asia Pacific Wafer Bonding Equipment Revenue by Application (2020-2025) & (US$ Million)
  • Table 75. Asia Pacific Wafer Bonding Equipment Revenue by Application (2026-2031) & (US$ Million)
  • Table 76. Asia Pacific Wafer Bonding Equipment Revenue by Region (2020-2025) & (US$ Million)
  • Table 77. Asia Pacific Wafer Bonding Equipment Revenue by Region (2026-2031) & (US$ Million)
  • Table 78. Asia Pacific Wafer Bonding Equipment Sales by Region (2020-2025) & (Units)
  • Table 79. Asia Pacific Wafer Bonding Equipment Sales by Region (2026-2031) & (Units)
  • Table 80. South America Wafer Bonding Equipment Sales by Type (2020-2025) & (Units)
  • Table 81. South America Wafer Bonding Equipment Sales by Type (2026-2031) & (Units)
  • Table 82. South America Wafer Bonding Equipment Revenue by Type (2020-2025) & (US$ Million)
  • Table 83. South America Wafer Bonding Equipment Revenue by Type (2026-2031) & (US$ Million)
  • Table 84. South America Wafer Bonding Equipment Sales by Application (2020-2025) & (Units)
  • Table 85. South America Wafer Bonding Equipment Sales by Application (2026-2031) & (Units)
  • Table 86. South America Wafer Bonding Equipment Revenue by Application (2020-2025) & (US$ Million)
  • Table 87. South America Wafer Bonding Equipment Revenue by Application (2026-2031) & (US$ Million)
  • Table 88. South America Wafer Bonding Equipment Revenue by Country (2020-2025) & (US$ Million)
  • Table 89. South America Wafer Bonding Equipment Revenue by Country (2026-2031) & (US$ Million)
  • Table 90. South America Wafer Bonding Equipment Sales by Country (2020-2025) & (Units)
  • Table 91. South America Wafer Bonding Equipment Sales by Country (2026-2031) & (Units)
  • Table 92. Middle East and Africa Wafer Bonding Equipment Sales by Type (2020-2025) & (Units)
  • Table 93. Middle East and Africa Wafer Bonding Equipment Sales by Type (2026-2031) & (Units)
  • Table 94. Middle East and Africa Wafer Bonding Equipment Revenue by Type (2020-2025) & (US$ Million)
  • Table 95. Middle East and Africa Wafer Bonding Equipment Revenue by Type (2026-2031) & (US$ Million)
  • Table 96. Middle East and Africa Wafer Bonding Equipment Sales by Application (2020-2025) & (Units)
  • Table 97. Middle East and Africa Wafer Bonding Equipment Sales by Application (2026-2031) & (Units)
  • Table 98. Middle East and Africa Wafer Bonding Equipment Revenue by Application (2020-2025) & (US$ Million)
  • Table 99. Middle East and Africa Wafer Bonding Equipment Revenue by Application (2026-2031) & (US$ Million)
  • Table 100. Middle East and Africa Wafer Bonding Equipment Revenue by Country (2020-2025) & (US$ Million)
  • Table 101. Middle East and Africa Wafer Bonding Equipment Revenue by Country (2026-2031) & (US$ Million)
  • Table 102. Middle East and Africa Wafer Bonding Equipment Sales by Country (2020-2025) & (Units)
  • Table 103. Middle East and Africa Wafer Bonding Equipment Sales by Country (2026-2031) & (Units)
  • Table 104. EV Group Company Details
  • Table 105. Company and Business Overview
  • Table 106. EV Group Wafer Bonding Equipment Introduction
  • Table 107. EV Group Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • Table 108. SUSS MicroTec Company Details
  • Table 109. Company and Business Overview
  • Table 110. SUSS MicroTec Wafer Bonding Equipment Introduction
  • Table 111. SUSS MicroTec Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • Table 112. Tokyo Electron Company Details
  • Table 113. Company and Business Overview
  • Table 114. Tokyo Electron Wafer Bonding Equipment Introduction
  • Table 115. Tokyo Electron Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • Table 116. Applied Microengineering Company Details
  • Table 117. Company and Business Overview
  • Table 118. Applied Microengineering Wafer Bonding Equipment Introduction
  • Table 119. Applied Microengineering Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • Table 120. Nidec Machine Tool Company Details
  • Table 121. Company and Business Overview
  • Table 122. Nidec Machine Tool Wafer Bonding Equipment Introduction
  • Table 123. Nidec Machine Tool Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • Table 124. Ayumi Industry Company Details
  • Table 125. Company and Business Overview
  • Table 126. Ayumi Industry Wafer Bonding Equipment Introduction
  • Table 127. Ayumi Industry Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • Table 128. Shanghai Micro Electronics Company Details
  • Table 129. Company and Business Overview
  • Table 130. Shanghai Micro Electronics Wafer Bonding Equipment Introduction
  • Table 131. Shanghai Micro Electronics Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • Table 132. U-Precision Tech Company Details
  • Table 133. Company and Business Overview
  • Table 134. U-Precision Tech Wafer Bonding Equipment Introduction
  • Table 135. U-Precision Tech Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • Table 136. Hutem Company Details
  • Table 137. Company and Business Overview
  • Table 138. Hutem Wafer Bonding Equipment Introduction
  • Table 139. Hutem Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • Table 140. Canon Company Details
  • Table 141. Company and Business Overview
  • Table 142. Canon Wafer Bonding Equipment Introduction
  • Table 143. Canon Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • Table 144. Bondtech Company Details
  • Table 145. Company and Business Overview
  • Table 146. Bondtech Wafer Bonding Equipment Introduction
  • Table 147. Bondtech Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • Table 148. TAZMO Company Details
  • Table 149. Company and Business Overview
  • Table 150. TAZMO Wafer Bonding Equipment Introduction
  • Table 151. TAZMO Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • Table 152. Aimechatec Company Details
  • Table 153. Company and Business Overview
  • Table 154. Aimechatec Wafer Bonding Equipment Introduction
  • Table 155. Aimechatec Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
  • Table 156. Key Raw Materials
  • Table 157. Wafer Bonding Equipment Distributors List
  • Table 158. Wafer Bonding Equipment Customers List
  • Table 159. Market Key Trends
  • Table 160. Key Challenges
  • Table 161. Market Favorable Factors and Unfavorable Factors
  • Table 162. Market Risks
  • Table 163. Industry Enters Major Barriers
  • Table 164. Research Programs/Design for This Report
  • Table 165. Key Data Information from Secondary Sources
  • Table 166. Key Data Information from Primary Sources
  • Table 167. QYR Business Unit and Senior & Team Lead Analysts

List of Figures

  • Figure 1. Wafer Bonding Equipment Product Picture
  • Figure 2. Global Wafer Bonding Equipment Market Share by Type: 2024
  • Figure 3. Global Wafer Bonding Equipment Market Share by Application in 2024
  • Figure 4. Global Wafer Bonding Equipment Revenue 2020-2031 (US$ Million)
  • Figure 5. Global Wafer Bonding Equipment Revenue Market Share by Region in Percentage: 2024
  • Figure 6. Global Wafer Bonding Equipment Revenue Market Share by Region 2024
  • Figure 7. Global Wafer Bonding Equipment Sales 2020-2031 (Units)
  • Figure 8. Global Wafer Bonding Equipment Sales Market Share by Region 2024
  • Figure 9. North America Wafer Bonding Equipment Sales YoY (2020-2031) & (Units)
  • Figure 10. North America Wafer Bonding Equipment Revenue YoY (2020-2031) & (US$ Million)
  • Figure 11. Europe Wafer Bonding Equipment Sales YoY (2020-2031) & (Units)
  • Figure 12. Europe Wafer Bonding Equipment Revenue YoY (2020-2031) & (US$ Million)
  • Figure 13. Asia Pacific Wafer Bonding Equipment Sales YoY (2020-2031) & (Units)
  • Figure 14. Asia Pacific Wafer Bonding Equipment Revenue YoY (2020-2031) & (US$ Million)
  • Figure 15. South America Wafer Bonding Equipment Sales YoY (2020-2031) & (Units)
  • Figure 16. South America Wafer Bonding Equipment Revenue YoY (2020-2031) & (US$ Million)
  • Figure 17. Middle East, Africa Wafer Bonding Equipment Sales YoY (2020-2031) & (Units)
  • Figure 18. Middle East, Africa Wafer Bonding Equipment Revenue YoY (2020-2031) & (US$ Million)
  • Figure 19. Global Wafer Bonding Equipment Sales Market Share by Type 2024
  • Figure 20. Global Wafer Bonding Equipment Revenue Market Share by Type 2024
  • Figure 21. Global Wafer Bonding Equipment Sales Market Share by Application 2024
  • Figure 22. Global Wafer Bonding Equipment Revenue Market Share by Application 2024
  • Figure 23. North America Wafer Bonding Equipment Sales Market Share by Type 2024
  • Figure 24. North America Wafer Bonding Equipment Revenue Market Share by Type 2024
  • Figure 25. North America Wafer Bonding Equipment Sales Market Share by Application 2024
  • Figure 26. North America Wafer Bonding Equipment Revenue Market Share by Application 2024
  • Figure 27. North America Wafer Bonding Equipment Revenue Share by Country 2024
  • Figure 28. North America Wafer Bonding Equipment Sales Share by Country 2024
  • Figure 29. US Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)
  • Figure 30. Canada Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)
  • Figure 31. Mexico Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)
  • Figure 32. Europe Wafer Bonding Equipment Sales Market Share by Type 2024
  • Figure 33. Europe Wafer Bonding Equipment Revenue Market Share by Type 2024
  • Figure 34. Europe Wafer Bonding Equipment Sales Market Share by Application 2024
  • Figure 35. Europe Wafer Bonding Equipment Revenue Market Share by Application 2024
  • Figure 36. Europe Wafer Bonding Equipment Revenue Share by Country 2024
  • Figure 37. Europe Wafer Bonding Equipment Sales Share by Country 2024
  • Figure 38. Germany Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)
  • Figure 39. France Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)
  • Figure 40. U.K. Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)
  • Figure 41. Italy Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)
  • Figure 42. Russia Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)
  • Figure 43. Asia Pacific Wafer Bonding Equipment Sales Market Share by Type 2024
  • Figure 44. Asia Pacific Wafer Bonding Equipment Revenue Market Share by Type 2024
  • Figure 45. Asia Pacific Wafer Bonding Equipment Sales Market Share by Application 2024
  • Figure 46. Asia Pacific Wafer Bonding Equipment Revenue Market Share by Application 2024
  • Figure 47. Asia Pacific Wafer Bonding Equipment Revenue Share by Region 2024
  • Figure 48. Asia Pacific Wafer Bonding Equipment Sales Share by Region 2024
  • Figure 49. China Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)
  • Figure 50. Japan Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)
  • Figure 51. South Korea Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)
  • Figure 52. India Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)
  • Figure 53. Southeast Asia Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)
  • Figure 54. South America Wafer Bonding Equipment Sales Market Share by Type 2024
  • Figure 55. South America Wafer Bonding Equipment Revenue Market Share by Type 2024
  • Figure 56. South America Wafer Bonding Equipment Sales Market Share by Application 2024
  • Figure 57. South America Wafer Bonding Equipment Revenue Market Share by Application 2024
  • Figure 58. South America Wafer Bonding Equipment Revenue Share by Country 2024
  • Figure 59. South America Wafer Bonding Equipment Sales Share by Country 2024
  • Figure 60. Brazil Wafer Bonding Equipment Revenue (2020-2031) & (US$ Million)
  • Figure 61. Middle East and Africa Wafer Bonding Equipment Sales Market Share by Type 2024
  • Figure 62. Middle East and Africa Wafer Bonding Equipment Revenue Market Share by Type 2024
  • Figure 63. Middle East and Africa Wafer Bonding Equipment Sales Market Share by Application 2024
  • Figure 64. Middle East and Africa Wafer Bonding Equipment Revenue Market Share by Application 2024
  • Figure 65. Figure Manufacturing Cost Structure of Wafer Bonding Equipment
  • Figure 66. Sales Channel: Direct Channel vs Indirect Channel
  • Figure 67. Direct Channel Pros & Cons
  • Figure 68. Indirect Channel Pros & Cons
  • Figure 69. Marketing Channels of Wafer Bonding Equipment by Method
  • Figure 70. Porter's Five Forces Analysis
  • Figure 71. Bottom-up and Top-down Approaches for This Report
  • Figure 72. Data Triangulation
  • Figure 73. Key Executives Interviewed