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1496245

晶圓製造市場 - 全球產業規模、佔有率、趨勢、機會和預測，按規模、製造流程、最終用戶、地區、競爭細分，2019-2029F

Wafer Fabrication Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Size, By Fabrication Process, By End-User, By Region, By Competition, 2019-2029F
出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2023 年全球晶圓製造市場估值為708.1 億美元，預計在預測期內將強勁成長，到2029 年複合年成長率為6.20%。製程服務於半導體晶圓製造。該市場在半導體行業供應鏈中發揮關鍵作用，是透過一系列複雜的製造流程在矽晶圓上製造半導體裝置的初始階段。

市場概況
預測期 2025-2029
2023 年市場規模 708.1億美元
2029 年市場規模 1025億美元
2024-2029 年複合年成長率 6.20%
成長最快的細分市場 65奈米
最大的市場 亞太

晶圓製造，也稱為晶圓製造或晶圓加工，涉及多個步驟，旨在將原始矽晶圓轉變為功能性半導體裝置。這個過程通常從矽錠的製備開始，矽錠被切成薄片，稱為晶圓。這些晶圓經過各種製造程序，包括光刻、蝕刻、摻雜、沉積和金屬化，以形成複雜的圖案和結構，構成積體電路的基礎。光刻是晶圓製造中的關鍵步驟，其中使用光敏光阻材料將光掩模定義的圖案轉移到晶圓表面上。此製程能夠精確描繪晶圓上的電路特徵和互連，為後續製造步驟奠定基礎。

主要市場促進因素

半導體製造製程的技術進步：

新興應用對先進半導體元件的需求：

電子產業和消費性電子市場的成長：

主要市場挑戰

先進製造技術的成本和複雜性：

智慧財產權保護的技術和監管障礙：

主要市場趨勢

採用先進製程節點及製造技術：

異質整合和系統級解決方案的出現：

細分市場洞察

尺寸洞察

區域洞察

目錄

第 1 章：產品概述

第 2 章：研究方法

第 3 章：執行摘要

第 4 章：客戶之聲

第 5 章：全球晶圓製造市場概述

第 6 章：全球晶圓製造市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 依尺寸（65 nm、45 nm、32 nm、22 nm、14 nm、10 nm、7nm）
    • 依製造流程分類（產線後端加工、產線前端加工）
    • 按最終用戶（整合設備製造商、代工廠、記憶體）
    • 按地區（北美、歐洲、南美、中東和非洲、亞太地區）
  • 按公司分類 (2023)
  • 市場地圖

第 7 章：北美晶圓製造市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按尺寸
    • 按製造程序
    • 按最終用戶
    • 按國家/地區
  • 北美：國家分析
    • 美國
    • 加拿大
    • 墨西哥

第 8 章：歐洲晶圓製造市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按尺寸
    • 按製造程序
    • 按最終用戶
    • 按國家/地區
  • 歐洲：國家分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙
    • 比利時

第 9 章：南美洲晶圓製造市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按尺寸
    • 按製造程序
    • 按最終用戶
    • 按國家/地區
  • 南美洲：國家分析
    • 巴西
    • 哥倫比亞
    • 阿根廷
    • 智利
    • 秘魯

第 10 章：中東和非洲晶圓製造市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按尺寸
    • 按製造程序
    • 按最終用戶
    • 按國家/地區
  • 中東和非洲：國家分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非
    • 土耳其
    • 以色列

第 11 章：亞太地區晶圓製造市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 按尺寸
    • 按製造程序
    • 按最終用戶
    • 按國家/地區
  • 亞太地區：國家分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲
    • 印尼
    • 越南

第 12 章：市場動態

  • 促進要素
  • 挑戰

第 13 章：市場趨勢與發展

第 14 章：公司簡介

  • Taiwan Semiconductor Manufacturing Company Limited
  • Samsung Electronics Co., Ltd.
  • Intel Corporation
  • GlobalFoundries Inc.
  • United Microelectronics Corporation
  • SK Hynix Inc.
  • Micron Technology, Inc.
  • Semiconductor Manufacturing International Corporation
  • STMicroelectronics International NV
  • NXP Semiconductors NV

第 15 章：策略建議

第16章調查會社について,免責事項

簡介目錄
Product Code: 22164

Global Wafer Fabrication Market was valued at USD 70.81 Billion in 2023 and is anticipated to project robust growth in the forecast period with a CAGR of 6.20% through 2029. The global wafer fabrication market encompasses the processes involved in the production of semiconductor wafers, which serve as the foundational substrates for manufacturing integrated circuits (ICs) and other microelectronic components. This market plays a pivotal role in the semiconductor industry supply chain, serving as the initial stage where semiconductor devices are manufactured on silicon wafers through a series of intricate fabrication processes.

Market Overview
Forecast Period2025-2029
Market Size 2023USD 70.81 Billion
Market Size 2029USD 102.50 Billion
CAGR 2024-20296.20%
Fastest Growing Segment65 nm
Largest MarketAsia-Pacific

Wafer fabrication, also known as wafer manufacturing or wafer processing, involves a multitude of steps aimed at transforming raw silicon wafers into functional semiconductor devices. The process typically begins with the preparation of silicon ingots, which are sliced into thin, circular discs known as wafers. These wafers undergo various manufacturing processes, including photolithography, etching, doping, deposition, and metallization, to create intricate patterns and structures that form the basis of integrated circuits. Photolithography is a critical step in wafer fabrication, wherein a pattern defined by a photomask is transferred onto the wafer's surface using light-sensitive photoresist materials. This process enables the precise delineation of circuit features and interconnections on the wafer, laying the groundwork for subsequent manufacturing steps.

Key Market Drivers

Technological Advancements in Semiconductor Manufacturing Processes:

Technological advancements play a pivotal role in driving growth and innovation within the global wafer fabrication market. Semiconductor manufacturers continuously strive to enhance the performance, power efficiency, and integration density of semiconductor devices by advancing the underlying fabrication processes. This relentless pursuit of technological excellence has led to the development of increasingly sophisticated manufacturing techniques, such as immersion lithography, extreme ultraviolet (EUV) lithography, and multiple patterning, enabling the production of semiconductor devices with smaller feature sizes and higher transistor densities.

One of the primary drivers behind technological advancements in semiconductor manufacturing is the industry's adherence to Moore's Law, which postulates that the number of transistors on an integrated circuit doubles approximately every two years. To maintain pace with Moore's Law and meet the escalating demands for higher performance and increased functionality in semiconductor devices, wafer fabrication facilities invest heavily in research and development (R&D) initiatives aimed at pushing the boundaries of semiconductor manufacturing technology.

For instance, the migration to advanced process nodes, such as 7nm, 5nm, and beyond, enables the fabrication of ultra-small transistors with improved performance characteristics, paving the way for the development of next-generation microprocessors, memory chips, and system-on-chip (SoC) solutions. Additionally, the integration of new materials, such as high-k dielectrics and III-V compound semiconductors, further enhances device performance and energy efficiency, driving demand for advanced wafer fabrication technologies.

The adoption of innovative packaging technologies, such as 3D integration and fan-out wafer-level packaging (FOWLP), complements wafer fabrication advancements by enabling higher levels of device integration and improved system-level performance. These packaging innovations facilitate the stacking of multiple semiconductor dies vertically, reducing footprint and enhancing signal integrity, while also enabling the integration of heterogeneous components within a single package.

Technological advancements in semiconductor manufacturing processes serve as a foundational market driver for the global wafer fabrication market, fueling innovation, capacity expansion, and competitiveness within the semiconductor industry. As semiconductor manufacturers continue to push the boundaries of Moore's Law and explore novel materials and packaging solutions, the wafer fabrication market is poised to witness sustained growth and evolution, driving the development of next-generation semiconductor devices.

Demand for Advanced Semiconductor Devices in Emerging Applications:

The increasing demand for advanced semiconductor devices in emerging applications is a key market driver propelling growth within the global wafer fabrication market. Semiconductor technology plays a critical role in enabling a wide range of innovative products and services across various industries, including artificial intelligence (AI), machine learning, autonomous vehicles, Internet of Things (IoT), and 5G wireless communications.

Emerging applications such as AI and machine learning rely heavily on high-performance computing solutions, necessitating the development of advanced semiconductor devices capable of processing vast amounts of data with unprecedented speed and efficiency. Wafer fabrication technologies that enable the production of high-speed, energy-efficient microprocessors, graphics processing units (GPUs), and neural network accelerators are in high demand to support the proliferation of AI-driven applications in fields such as healthcare, finance, automotive, and consumer electronics.

The advent of autonomous vehicles is driving demand for sophisticated semiconductor solutions that power the complex sensor arrays, processing units, and communication systems required for autonomous driving functionality. Wafer fabrication technologies capable of delivering high-performance, reliable semiconductor components such as LiDAR sensors, radar modules, and automotive-grade microcontrollers are essential to enable the widespread adoption of autonomous vehicle technology.

In the IoT domain, the proliferation of connected devices and smart sensors necessitates the development of low-power, cost-effective semiconductor solutions capable of meeting the stringent requirements of IoT applications. Wafer fabrication technologies that enable the production of ultra-low-power microcontrollers, wireless connectivity chips, and sensor interfaces are instrumental in enabling the seamless integration of IoT devices into diverse environments, spanning smart homes, industrial automation, healthcare, and agriculture.

The rollout of 5G wireless networks is driving demand for advanced semiconductor devices that support the increased data throughput, low latency, and network reliability requirements of 5G-enabled applications. Wafer fabrication technologies that enable the production of RF front-end modules, mmWave transceivers, and baseband processors are essential to enable the deployment of 5G infrastructure and devices, paving the way for transformative applications such as augmented reality (AR), virtual reality (VR), and real-time video streaming.

The demand for advanced semiconductor devices in emerging applications such as AI, autonomous vehicles, IoT, and 5G wireless communications serves as a significant market driver for the global wafer fabrication market. As industries continue to innovate and embrace digital transformation, the need for cutting-edge semiconductor solutions will continue to drive growth and investment in wafer fabrication technologies, propelling the semiconductor industry into a new era of innovation and opportunity.

Growth of the Electronics Industry and Consumer Electronics Market:

The growth of the electronics industry and the consumer electronics market is a fundamental market driver influencing the demand for wafer fabrication services worldwide. The electronics industry encompasses a broad spectrum of sectors, including telecommunications, computing, automotive, healthcare, aerospace, and consumer electronics, all of which rely heavily on semiconductor technology for product innovation and functionality.

One of the primary drivers behind the growth of the electronics industry is the increasing digitization and connectivity of modern society, driven by advancements in communication technologies, computing capabilities, and sensor integration. The proliferation of smartphones, tablets, laptops, and wearable devices has fueled demand for high-performance semiconductor solutions capable of delivering enhanced processing power, connectivity, and energy efficiency.

The automotive industry is undergoing a paradigm shift towards electrification, autonomy, and connectivity, driving demand for semiconductor solutions that power electric vehicles (EVs), advanced driver-assistance systems (ADAS), in-vehicle infotainment (IVI) systems, and vehicle-to-everything (V2X) communication platforms. Wafer fabrication technologies capable of producing automotive-grade semiconductors with high reliability, durability, and safety features are essential to support the automotive industry's transformation and meet the stringent requirements of next-generation vehicles.

In the healthcare sector, the proliferation of medical devices, diagnostic equipment, and telemedicine solutions is driving demand for semiconductor solutions that enable advanced imaging, patient monitoring, and data analytics capabilities. Wafer fabrication technologies that enable the production of high-resolution image sensors, bio-sensors, and signal processing chips are essential to support the development of innovative medical devices and improve patient outcomes.

The aerospace and defense industry relies heavily on semiconductor technology for mission-critical applications such as avionics, radar systems, navigation equipment, and satellite communication platforms. Wafer fabrication technologies that deliver high-reliability, radiation-hardened semiconductors capable of withstanding harsh operating environments are essential to support the aerospace and defense sector's stringent requirements for performance, reliability, and longevity.

The growth of the electronics industry and the consumer electronics market serves as a significant market driver for the global wafer fabrication market, stimulating demand for advanced semiconductor solutions across various sectors. As industries continue to innovate and develop next-generation products and services, the need for cutting-edge semiconductor technology will continue to drive growth and investment in wafer fabrication technologies, fueling the expansion of the semiconductor industry and enabling transformative advancements in technology and society.

Key Market Challenges

Cost and Complexity of Advanced Manufacturing Technologies:

One of the primary challenges confronting the global wafer fabrication market is the escalating cost and complexity associated with advanced manufacturing technologies. As semiconductor manufacturers transition to smaller process nodes (e.g., 7nm, 5nm, and beyond) to meet the demands for higher performance and increased integration density, the investment required for capital equipment, materials, and R&D initiatives rises significantly.

The development and deployment of advanced lithography techniques, such as extreme ultraviolet (EUV) lithography, entail substantial capital expenditures and technological expertise, posing barriers to entry for smaller players and emerging markets. Additionally, the complexity of advanced manufacturing processes increases the risk of defects, yield losses, and production delays, further exacerbating cost pressures and operational challenges for wafer fabrication facilities.

The adoption of novel materials (e.g., high-k dielectrics, III-V compound semiconductors) and packaging technologies (e.g., 3D integration, fan-out wafer-level packaging) introduces additional complexities and cost considerations into the semiconductor manufacturing ecosystem. Semiconductor manufacturers must navigate the trade-offs between performance, cost, and time-to-market when selecting and implementing advanced manufacturing technologies, balancing the need for innovation with the realities of economic viability and operational efficiency.

Addressing the cost and complexity of advanced manufacturing technologies requires collaborative efforts across the semiconductor industry value chain, including equipment suppliers, materials providers, foundries, and design houses. Collaborative R&D initiatives, technology partnerships, and consortia can facilitate knowledge sharing, resource pooling, and risk mitigation, enabling semiconductor manufacturers to overcome the challenges associated with advancing wafer fabrication capabilities while maintaining cost-effectiveness and competitiveness in the global marketplace.

Technological and Regulatory Barriers to Intellectual Property Protection:

Another significant challenge facing the global wafer fabrication market is the proliferation of technological and regulatory barriers to intellectual property (IP) protection. Semiconductor manufacturers invest heavily in R&D initiatives to develop proprietary processes, designs, and technologies that differentiate their products and drive competitive advantage in the marketplace.

However, safeguarding intellectual property from unauthorized access, infringement, and theft poses formidable challenges in an era of globalized supply chains, cross-border collaborations, and rapid technology transfer. The complexity of semiconductor manufacturing processes, coupled with the interconnected nature of the semiconductor industry ecosystem, makes it increasingly difficult to protect valuable IP assets from exploitation by competitors, counterfeiters, and malicious actors.

Regulatory frameworks governing intellectual property rights vary widely across different jurisdictions, posing legal and compliance challenges for semiconductor manufacturers operating in multiple markets. The enforcement of IP rights, including patents, trademarks, and trade secrets, requires robust legal strategies, litigation readiness, and cross-border coordination to deter infringement and safeguard innovation.

Addressing technological and regulatory barriers to intellectual property protection necessitates a multifaceted approach that combines legal, technological, and organizational measures. Semiconductor manufacturers must implement robust cybersecurity protocols, access controls, and encryption mechanisms to protect sensitive IP assets from unauthorized access and cyber threats.

Engaging in proactive IP management strategies, such as patent portfolio optimization, licensing agreements, and technology transfer protocols, can help semiconductor manufacturers monetize their IP assets while mitigating the risks of infringement and litigation. Collaborating with industry associations, government agencies, and international organizations can also foster the development of common standards, best practices, and enforcement mechanisms to enhance IP protection and promote innovation in the global wafer fabrication market..

Key Market Trends

Adoption of Advanced Process Nodes and Manufacturing Technologies:

One of the prominent trends driving the global wafer fabrication market is the widespread adoption of advanced process nodes and manufacturing technologies. Semiconductor manufacturers are continuously pushing the boundaries of Moore's Law by transitioning to smaller process nodes, such as 7nm, 5nm, and beyond, to meet the escalating demands for higher performance, increased integration density, and energy efficiency in semiconductor devices.

The migration to advanced process nodes enables semiconductor manufacturers to fabricate transistors and interconnects with smaller feature sizes, allowing for the integration of more components on a single semiconductor die. This trend facilitates the development of next-generation microprocessors, memory chips, and system-on-chip (SoC) solutions with enhanced computing power, reduced power consumption, and improved functionality.

The adoption of novel manufacturing technologies, such as extreme ultraviolet (EUV) lithography, multiple patterning, and advanced packaging techniques, further enhances the capabilities and competitiveness of wafer fabrication facilities. EUV lithography, in particular, enables semiconductor manufacturers to achieve finer feature sizes and tighter design tolerances, paving the way for the development of cutting-edge semiconductor devices with superior performance and manufacturability.

The integration of new materials, such as high-k dielectrics, III-V compound semiconductors, and 2D materials like graphene and transition metal dichalcogenides, enhances device performance and functionality, enabling semiconductor manufacturers to address emerging market requirements and application demands.

The adoption of advanced process nodes and manufacturing technologies is driven by the need to maintain technological leadership, accelerate time-to-market, and capitalize on emerging opportunities in key growth segments such as artificial intelligence (AI), machine learning, autonomous vehicles, Internet of Things (IoT), and 5G wireless communications. As semiconductor manufacturers continue to invest in R&D initiatives and capacity expansion to support the development of advanced semiconductor devices, the adoption of advanced process nodes and manufacturing technologies will remain a prominent trend shaping the global wafer fabrication market.

Emergence of Heterogeneous Integration and System-Level Solutions:

Another notable trend in the global wafer fabrication market is the emergence of heterogeneous integration and system-level solutions, driven by the increasing demand for complex, multifunctional semiconductor devices with integrated functionalities and heterogeneous components.

Traditionally, semiconductor devices were fabricated using a monolithic approach, wherein all components and circuitry were integrated onto a single semiconductor die using a homogeneous process. However, with the growing complexity and diversity of semiconductor applications, there is a growing need for heterogeneous integration techniques that enable the integration of diverse components, materials, and technologies onto a single semiconductor package or system.

Heterogeneous integration enables semiconductor manufacturers to combine different semiconductor materials, such as silicon, III-V compound semiconductors, and silicon carbide, to leverage their unique properties and functionalities in a single device. Moreover, it allows for the integration of diverse components, such as processors, memory, sensors, and RF modules, onto a single semiconductor package, enabling the development of highly integrated system-on-chip (SoC) solutions with enhanced performance, functionality, and miniaturization.

Heterogeneous integration enables the integration of advanced packaging technologies, such as 3D integration, fan-out wafer-level packaging (FOWLP), and system-in-package (SiP) solutions, which offer higher levels of integration, performance, and flexibility compared to traditional packaging approaches. These advanced packaging techniques enable semiconductor manufacturers to address the challenges of Moore's Law scaling, such as interconnect scaling and power dissipation, while also enabling the development of more compact and energy-efficient semiconductor devices.

The emergence of heterogeneous integration and system-level solutions is driven by the need to address the growing complexity and diversity of semiconductor applications, including AI, IoT, automotive electronics, and telecommunications. As semiconductor manufacturers continue to invest in R&D initiatives and technology development to support the adoption of heterogeneous integration techniques, the trend towards integrated, multifunctional semiconductor devices will accelerate, shaping the future of the global wafer fabrication market.

Segmental Insights

Size Insights

The 14 nm wafer fabrication market segment held the largest Market share in 2023. The market for wafer fabrication, particularly in the 14nm segment, is driven by a confluence of technological advancements, increasing demand for high-performance computing, and the burgeoning applications of semiconductor chips across various industries. At the forefront of this market driver is the relentless pursuit of innovation within the semiconductor industry, pushing the boundaries of miniaturization and efficiency. The transition to the 14nm node represents a significant milestone in semiconductor manufacturing, enabling the production of chips with higher transistor densities, improved performance, and lower power consumption. This technological advancement is fueled by years of research and development, as semiconductor manufacturers invest heavily in cutting-edge fabrication processes, materials, and equipment to achieve ever-shrinking transistor sizes.

The demand for high-performance computing solutions is another key driver propelling the growth of the 14nm wafer fabrication market. In today's digital age, there is a growing need for faster, more powerful processors to support a wide range of applications, including artificial intelligence, machine learning, data analytics, cloud computing, and 5G communication networks. These advanced computing technologies require semiconductor chips with greater processing power and efficiency, driving the demand for smaller transistor sizes and higher transistor counts achievable through 14nm fabrication processes. As industries across the board continue to embrace digital transformation and adopt more sophisticated technologies, the demand for 14nm chips is expected to surge, further driving market growth.

The proliferation of semiconductor chips in various industries, including consumer electronics, automotive, healthcare, aerospace, and telecommunications, is fueling the demand for 14nm wafer fabrication. Semiconductor chips have become ubiquitous in modern society, powering a wide range of devices and systems essential for daily life and business operations. From smartphones and tablets to smart appliances and autonomous vehicles, semiconductor chips play a crucial role in enabling connectivity, automation, and intelligence across diverse applications. As these industries continue to innovate and develop new products and services, the demand for advanced semiconductor chips manufactured using 14nm fabrication technology is poised to grow exponentially.

Regional Insights

Asia-Pacific held the largest Market share in 2023. The wafer fabrication market in the Asia-Pacific region is propelled by a convergence of factors that underscore the region's pivotal role in the global semiconductor industry. One of the primary drivers is the robust growth of the electronics manufacturing sector in Asia-Pacific, driven by rising consumer demand for electronic devices, the proliferation of connected technologies, and the rapid digital transformation across industries. As the world's largest consumer electronics market, Asia-Pacific is a key hub for semiconductor chip consumption, creating a substantial demand for wafer fabrication services to meet the production needs of electronics manufacturers.

The Asia-Pacific region is home to a significant portion of the world's semiconductor manufacturing capacity, with countries like Taiwan, South Korea, China, and Japan emerging as major players in wafer fabrication. These countries have invested heavily in developing advanced semiconductor manufacturing facilities, leveraging state-of-the-art technologies and expertise to produce chips with increasingly smaller feature sizes and higher performance. The presence of leading semiconductor foundries and integrated device manufacturers (IDMs) in the region further drives the growth of the wafer fabrication market, as companies seek to capitalize on Asia-Pacific's manufacturing capabilities and supply chain efficiencies.

The Asia-Pacific region benefits from favorable government policies and initiatives aimed at promoting semiconductor industry growth and innovation. Many countries in the region offer incentives such as tax breaks, grants, and subsidies to attract semiconductor companies and encourage investment in wafer fabrication facilities. These government-led initiatives create a conducive environment for semiconductor manufacturers to establish or expand their presence in Asia-Pacific, driving the growth of the wafer fabrication market.

The Asia-Pacific region is a hotbed of research and development (R&D) activities in the semiconductor industry, with universities, research institutions, and technology companies collaborating to drive innovation and develop cutting-edge fabrication technologies. The presence of leading semiconductor equipment and materials suppliers in the region further facilitates technological advancements in wafer fabrication processes, enabling companies to stay at the forefront of semiconductor manufacturing.

Key Market Players

Taiwan Semiconductor Manufacturing Company Limited

Samsung Electronics Co., Ltd.

Intel Corporation

GlobalFoundries Inc.

United Microelectronics Corporation

SK Hynix Inc.

Micron Technology, Inc.

Semiconductor Manufacturing International Corporation

STMicroelectronics International N.V.

NXP Semiconductors N.V.

Report Scope:

In this report, the Global Wafer Fabrication Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Wafer Fabrication Market, By Size:

    65 nm 45 nm 32nm 22 nm 14 nm 10 nm 7nm

Wafer Fabrication Market, By Fabrication Proces:

    The Back End of Line Processing The Front End of Line Processing

Wafer Fabrication Market, By End-User:

    Integrated Device Manufacturer Foundry Memory

Wafer Fabrication Market, By Region:

    North America

United States

Canada

Mexico

    Europe

France

United Kingdom

Italy

Germany

Spain

Belgium

    Asia-Pacific

China

India

Japan

Australia

South Korea

Indonesia

Vietnam

    South America

Brazil

Argentina

Colombia

Chile

Peru

    Middle East & Africa

South Africa

Saudi Arabia

UAE

Turkey

Israel

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Wafer Fabrication Market.

Available Customizations:

Global Wafer Fabrication market report with the given market data, Tech Sci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Formulation of the Scope
  • 2.4. Assumptions and Limitations
  • 2.5. Sources of Research
    • 2.5.1. Secondary Research
    • 2.5.2. Primary Research
  • 2.6. Approach for the Market Study
    • 2.6.1. The Bottom-Up Approach
    • 2.6.2. The Top-Down Approach
  • 2.7. Methodology Followed for Calculation of Market Size & Market Shares
  • 2.8. Forecasting Methodology
    • 2.8.1. Data Triangulation & Validation

3. Executive Summary

4. Voice of Customer

5. Global Wafer Fabrication Market Overview

6. Global Wafer Fabrication Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Size (65 nm, 45 nm, 32nm, 22 nm, 14 nm, 10 nm, 7nm)
    • 6.2.2. By Fabrication Process (The Back End of Line Processing, The Front End of Line Processing)
    • 6.2.3. By End-User (Integrated Device Manufacturer, Foundry, Memory)
    • 6.2.4. By Region (North America, Europe, South America, Middle East & Africa, Asia Pacific)
  • 6.3. By Company (2023)
  • 6.4. Market Map

7. North America Wafer Fabrication Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Size
    • 7.2.2. By Fabrication Process
    • 7.2.3. By End-User
    • 7.2.4. By Country
  • 7.3. North America: Country Analysis
    • 7.3.1. United States Wafer Fabrication Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Size
        • 7.3.1.2.2. By Fabrication Process
        • 7.3.1.2.3. By End-User
    • 7.3.2. Canada Wafer Fabrication Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Size
        • 7.3.2.2.2. By Fabrication Process
        • 7.3.2.2.3. By End-User
    • 7.3.3. Mexico Wafer Fabrication Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Size
        • 7.3.3.2.2. By Fabrication Process
        • 7.3.3.2.3. By End-User

8. Europe Wafer Fabrication Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Size
    • 8.2.2. By Fabrication Process
    • 8.2.3. By End-User
    • 8.2.4. By Country
  • 8.3. Europe: Country Analysis
    • 8.3.1. Germany Wafer Fabrication Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Size
        • 8.3.1.2.2. By Fabrication Process
        • 8.3.1.2.3. By End-User
    • 8.3.2. France Wafer Fabrication Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Size
        • 8.3.2.2.2. By Fabrication Process
        • 8.3.2.2.3. By End-User
    • 8.3.3. United Kingdom Wafer Fabrication Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Size
        • 8.3.3.2.2. By Fabrication Process
        • 8.3.3.2.3. By End-User
    • 8.3.4. Italy Wafer Fabrication Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Size
        • 8.3.4.2.2. By Fabrication Process
        • 8.3.4.2.3. By End-User
    • 8.3.5. Spain Wafer Fabrication Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Size
        • 8.3.5.2.2. By Fabrication Process
        • 8.3.5.2.3. By End-User
    • 8.3.6. Belgium Wafer Fabrication Market Outlook
      • 8.3.6.1. Market Size & Forecast
        • 8.3.6.1.1. By Value
      • 8.3.6.2. Market Share & Forecast
        • 8.3.6.2.1. By Size
        • 8.3.6.2.2. By Fabrication Process
        • 8.3.6.2.3. By End-User

9. South America Wafer Fabrication Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Size
    • 9.2.2. By Fabrication Process
    • 9.2.3. By End-User
    • 9.2.4. By Country
  • 9.3. South America: Country Analysis
    • 9.3.1. Brazil Wafer Fabrication Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Size
        • 9.3.1.2.2. By Fabrication Process
        • 9.3.1.2.3. By End-User
    • 9.3.2. Colombia Wafer Fabrication Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Size
        • 9.3.2.2.2. By Fabrication Process
        • 9.3.2.2.3. By End-User
    • 9.3.3. Argentina Wafer Fabrication Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Size
        • 9.3.3.2.2. By Fabrication Process
        • 9.3.3.2.3. By End-User
    • 9.3.4. Chile Wafer Fabrication Market Outlook
      • 9.3.4.1. Market Size & Forecast
        • 9.3.4.1.1. By Value
      • 9.3.4.2. Market Share & Forecast
        • 9.3.4.2.1. By Size
        • 9.3.4.2.2. By Fabrication Process
        • 9.3.4.2.3. By End-User
    • 9.3.5. Peru Wafer Fabrication Market Outlook
      • 9.3.5.1. Market Size & Forecast
        • 9.3.5.1.1. By Value
      • 9.3.5.2. Market Share & Forecast
        • 9.3.5.2.1. By Size
        • 9.3.5.2.2. By Fabrication Process
        • 9.3.5.2.3. By End-User

10. Middle East & Africa Wafer Fabrication Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Size
    • 10.2.2. By Fabrication Process
    • 10.2.3. By End-User
    • 10.2.4. By Country
  • 10.3. Middle East & Africa: Country Analysis
    • 10.3.1. Saudi Arabia Wafer Fabrication Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Size
        • 10.3.1.2.2. By Fabrication Process
        • 10.3.1.2.3. By End-User
    • 10.3.2. UAE Wafer Fabrication Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Size
        • 10.3.2.2.2. By Fabrication Process
        • 10.3.2.2.3. By End-User
    • 10.3.3. South Africa Wafer Fabrication Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Size
        • 10.3.3.2.2. By Fabrication Process
        • 10.3.3.2.3. By End-User
    • 10.3.4. Turkey Wafer Fabrication Market Outlook
      • 10.3.4.1. Market Size & Forecast
        • 10.3.4.1.1. By Value
      • 10.3.4.2. Market Share & Forecast
        • 10.3.4.2.1. By Size
        • 10.3.4.2.2. By Fabrication Process
        • 10.3.4.2.3. By End-User
    • 10.3.5. Israel Wafer Fabrication Market Outlook
      • 10.3.5.1. Market Size & Forecast
        • 10.3.5.1.1. By Value
      • 10.3.5.2. Market Share & Forecast
        • 10.3.5.2.1. By Size
        • 10.3.5.2.2. By Fabrication Process
        • 10.3.5.2.3. By End-User

11. Asia Pacific Wafer Fabrication Market Outlook

  • 11.1. Market Size & Forecast
    • 11.1.1. By Value
  • 11.2. Market Share & Forecast
    • 11.2.1. By Size
    • 11.2.2. By Fabrication Process
    • 11.2.3. By End-User
    • 11.2.4. By Country
  • 11.3. Asia-Pacific: Country Analysis
    • 11.3.1. China Wafer Fabrication Market Outlook
      • 11.3.1.1. Market Size & Forecast
        • 11.3.1.1.1. By Value
      • 11.3.1.2. Market Share & Forecast
        • 11.3.1.2.1. By Size
        • 11.3.1.2.2. By Fabrication Process
        • 11.3.1.2.3. By End-User
    • 11.3.2. India Wafer Fabrication Market Outlook
      • 11.3.2.1. Market Size & Forecast
        • 11.3.2.1.1. By Value
      • 11.3.2.2. Market Share & Forecast
        • 11.3.2.2.1. By Size
        • 11.3.2.2.2. By Fabrication Process
        • 11.3.2.2.3. By End-User
    • 11.3.3. Japan Wafer Fabrication Market Outlook
      • 11.3.3.1. Market Size & Forecast
        • 11.3.3.1.1. By Value
      • 11.3.3.2. Market Share & Forecast
        • 11.3.3.2.1. By Size
        • 11.3.3.2.2. By Fabrication Process
        • 11.3.3.2.3. By End-User
    • 11.3.4. South Korea Wafer Fabrication Market Outlook
      • 11.3.4.1. Market Size & Forecast
        • 11.3.4.1.1. By Value
      • 11.3.4.2. Market Share & Forecast
        • 11.3.4.2.1. By Size
        • 11.3.4.2.2. By Fabrication Process
        • 11.3.4.2.3. By End-User
    • 11.3.5. Australia Wafer Fabrication Market Outlook
      • 11.3.5.1. Market Size & Forecast
        • 11.3.5.1.1. By Value
      • 11.3.5.2. Market Share & Forecast
        • 11.3.5.2.1. By Size
        • 11.3.5.2.2. By Fabrication Process
        • 11.3.5.2.3. By End-User
    • 11.3.6. Indonesia Wafer Fabrication Market Outlook
      • 11.3.6.1. Market Size & Forecast
        • 11.3.6.1.1. By Value
      • 11.3.6.2. Market Share & Forecast
        • 11.3.6.2.1. By Size
        • 11.3.6.2.2. By Fabrication Process
        • 11.3.6.2.3. By End-User
    • 11.3.7. Vietnam Wafer Fabrication Market Outlook
      • 11.3.7.1. Market Size & Forecast
        • 11.3.7.1.1. By Value
      • 11.3.7.2. Market Share & Forecast
        • 11.3.7.2.1. By Size
        • 11.3.7.2.2. By Fabrication Process
        • 11.3.7.2.3. By End-User

12. Market Dynamics

  • 12.1. Drivers
  • 12.2. Challenges

13. Market Trends and Developments

14. Company Profiles

  • 14.1. Taiwan Semiconductor Manufacturing Company Limited
    • 14.1.1. Business Overview
    • 14.1.2. Key Revenue and Financials
    • 14.1.3. Recent Developments
    • 14.1.4. Key Personnel/Key Contact Person
    • 14.1.5. Key Product/Services Offered
  • 14.2. Samsung Electronics Co., Ltd.
    • 14.2.1. Business Overview
    • 14.2.2. Key Revenue and Financials
    • 14.2.3. Recent Developments
    • 14.2.4. Key Personnel/Key Contact Person
    • 14.2.5. Key Product/Services Offered
  • 14.3. Intel Corporation
    • 14.3.1. Business Overview
    • 14.3.2. Key Revenue and Financials
    • 14.3.3. Recent Developments
    • 14.3.4. Key Personnel/Key Contact Person
    • 14.3.5. Key Product/Services Offered
  • 14.4. GlobalFoundries Inc.
    • 14.4.1. Business Overview
    • 14.4.2. Key Revenue and Financials
    • 14.4.3. Recent Developments
    • 14.4.4. Key Personnel/Key Contact Person
    • 14.4.5. Key Product/Services Offered
  • 14.5. United Microelectronics Corporation
    • 14.5.1. Business Overview
    • 14.5.2. Key Revenue and Financials
    • 14.5.3. Recent Developments
    • 14.5.4. Key Personnel/Key Contact Person
    • 14.5.5. Key Product/Services Offered
  • 14.6. SK Hynix Inc.
    • 14.6.1. Business Overview
    • 14.6.2. Key Revenue and Financials
    • 14.6.3. Recent Developments
    • 14.6.4. Key Personnel/Key Contact Person
    • 14.6.5. Key Product/Services Offered
  • 14.7. Micron Technology, Inc.
    • 14.7.1. Business Overview
    • 14.7.2. Key Revenue and Financials
    • 14.7.3. Recent Developments
    • 14.7.4. Key Personnel/Key Contact Person
    • 14.7.5. Key Product/Services Offered
  • 14.8. Semiconductor Manufacturing International Corporation
    • 14.8.1. Business Overview
    • 14.8.2. Key Revenue and Financials
    • 14.8.3. Recent Developments
    • 14.8.4. Key Personnel/Key Contact Person
    • 14.8.5. Key Product/Services Offered
  • 14.9. STMicroelectronics International N.V.
    • 14.9.1. Business Overview
    • 14.9.2. Key Revenue and Financials
    • 14.9.3. Recent Developments
    • 14.9.4. Key Personnel/Key Contact Person
    • 14.9.5. Key Product/Services Offered
  • 14.10. NXP Semiconductors N.V.
    • 14.10.1. Business Overview
    • 14.10.2. Key Revenue and Financials
    • 14.10.3. Recent Developments
    • 14.10.4. Key Personnel/Key Contact Person
    • 14.10.5. Key Product/Services Offered

15. Strategic Recommendations

16. About Us & Disclaimer