首頁 > 市場調查報告書 > 電子零件/半導體

半導體生產設備電子設備合同製造

市場調查報告書

商品編碼

1496912

OSAT（半導體組裝和測試外包）市場：趨勢、機會和競爭分析 [2024-2030]

Outsourced Semiconductor Assembly and Testing (OSAT) Market: Trends, Opportunities and Competitive Analysis [2024-2030]

出版日期: 2024年04月22日 | 出版商:

Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

價格

※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

簡介目錄

OSAT（半導體組裝和測試外包）市場趨勢和預測

到 2030 年，全球 OSAT 市場預計將達到 514 億美元，2024 年至 2030 年複合年成長率為 4.5%。該市場的主要驅動力是增加電子產品中的半導體含量以提供更高的功能和性能，對智慧型手機和網際網路連接設備、安全、導航、燃油效率和減少排放的需求不斷成長，以及汽車中電子含量的增加。全球半導體組裝和測試 (OSAT) 外包市場的未來前景廣闊，汽車、通訊、運算和網路、消費性電子和工業領域都蘊藏著機會。

Lucintel 預測，由於全球對通訊基礎設施和電子產品的需求不斷成長，裝配和包裝在預測期內仍將是最大的細分市場。
在該市場中，由於 5G 技術的接受度提高以及智慧電視、平板電腦和智慧型手機的消費增加，消費性電子領域預計將錄得最高成長。
由於物聯網的日益普及、每輛車電子含量的增加以及中國、台灣和印度等國家工業自動化的擴展，預計亞太地區將在預測期內實現最高的成長。

預計亞太地區的成長最快。

1.美國：Amkor Technology, Inc. 和 ASE Technology Holding Co., Ltd. 等公司正在推動美國OSAT 市場的創新。半導體產業協會 (SIA) 等舉措促進了半導體製造領域的合作與研究。美國政府透過國防部 (DoD) 和國家科學基金會 (NSF) 等機構支持半導體研究和發展。

2.台灣：日月光（ASE）和矽品精密工業股份有限公司（SPIL）等台灣公司是全球領先的半導體製造商。 (SPIL) 和其他台灣公司在全球 OSAT 市場上處於領先地位。工業發展委員會 (IDB) 等政府舉措支持半導體產業的成長和競爭力。台灣半導體研究院（TSRI）促進半導體技術的研究與發展。

3.中國：中國OSAT企業如江蘇長電科技有限公司（JCET）和天水華天科技有限公司正快速擴張。「中國製造2025」計畫等政府舉措旨在增強半導體產業的能力。工業和資訊化部 (MIIT) 為半導體製造提供支援。

4. 韓國：Amkor Technology Korea Inc. 和 Powertech Technology Inc. (PTI) 等韓國公司是 OSAT 市場的主要參與者。韓國半導體工業協會 (KSIA) 等政府舉措促進工業成長和創新。產業通商資源部 (MOTIE) 支持半導體開發舉措。

5.新加坡：新加坡的OSAT公司，例如Global Foundries Singapore Pte. Ltd.和UTAC Holdings Ltd.，為全球市場做出了巨大貢獻。新加坡經濟發展局 (EDB) 等政府舉措支持半導體製造領域的投資和人才發展。美國國家研究基金會 (NRF) 資助半導體研發計劃。

OSAT 市場：按細分市場

本研究按服務類型、封裝類型、應用和地區對全球 OSAT 市場進行了預測，如下：

OSAT市場的最新趨勢

對先進封裝解決方案的需求不斷成長：由於對扇出晶圓層次電子構裝(FOWLP) 和 3D 封裝技術等先進封裝解決方案的需求不斷成長，OSAT 市場不斷成長。這些技術可實現半導體裝置的更高性能、更小尺寸和異質整合。
投資產能擴張：OSAT 供應商正在投資產能擴張，以滿足對半導體封裝和檢測服務不斷成長的需求。日月光科技控股有限公司 (ASE Technology Holding Co.) 和 Amkor Technology 等公司正在提高產量並採購先進設備，以滿足行業需求。
檢測設備的技術進步：OSAT公司正在採用先進的檢測設備和方法來提高半導體檢測製程的效率、準確性和可靠性。自動測試處理系統和高速測試解決方案等創新正在增強 OSAT 供應商的能力。
專注於異質整合和系統整合：OSAT供應商擴大參與異質整合和系統級封裝，提供將多個晶片、感測器和被動元件整合到單一封裝中的服務。這一趨勢與汽車、物聯網和人工智慧等應用中對整合解決方案不斷成長的需求相吻合。
採用尖端材料和製程：OSAT 供應商正在採用先進材料和製造流程來滿足 5G、邊緣運算和高效能運算等新興應用的要求。先進基板材料、晶圓級晶片級封裝（WLCSP）和系統級封裝（SiP）等技術在市場上越來越受歡迎。

The future of the global outsourced semiconductor assembly and testing (OSAT) market looks promising with opportunities in the automotive, telecommunication, computing & networking, consumer electronic, and industrial industries. The global outsourced semiconductor assembly and testing market is expected to reach an estimated $51.4 billion by 2030 with a CAGR of 4.5% from 2024 to 2030. The major drivers for this market are increasing semiconductor content within electronics products to provide greater functionality and higher levels of performance, growth in demand for smartphones and internet connected devices, and increasing electronic content in automotive for safety, navigation, fuel efficiency, emission reduction, and entertainment system.

Lucintel forecast that assembly & packaging will remain the largest segment over the forecast period due to growing demand for telecom infrastructure and electronic products across the globe.
Within this market, consumer electronics segment is projected to record the highest growth due to growing acceptance of 5G technologies and increasing consumption of smart televisions, tablets, and smartphones.
Asia Pacific is expected to witness the highest growth during the forecast period due to growing adoption of IoT (internet of things), increasing electronic content per vehicle, and growing industrial automation in countries, such as China, Taiwan, and India.

Asia Pacific is expected to witness the highest growth

1. United States: Companies like Amkor Technology, Inc. and ASE Technology Holding Co., Ltd. drive innovation in the US OSAT market. Initiatives such as the Semiconductor Industry Association (SIA) promote collaboration and research in semiconductor manufacturing. The US government supports semiconductor R&D through agencies like the Department of Defense (DoD) and the National Science Foundation (NSF).

2. Taiwan: Taiwanese companies, including Advanced Semiconductor Engineering, Inc. (ASE) and Siliconware Precision Industries Co., Ltd. (SPIL), lead the global OSAT market. Government initiatives like the Industrial Development Bureau (IDB) support the semiconductor industry's growth and competitiveness. Taiwan Semiconductor Research Institute (TSRI) promotes R&D in semiconductor technologies.

3. China: Chinese OSAT companies like Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) and Tianshui Huatian Technology Co., Ltd. are expanding rapidly. Government initiatives such as the "Made in China 2025" plan aim to strengthen the semiconductor industry's capabilities. The Ministry of Industry and Information Technology (MIIT) provides support for semiconductor manufacturing.

4. South Korea: South Korean companies like Amkor Technology Korea Inc. and Powertech Technology Inc. (PTI) are prominent players in the OSAT market. Government initiatives like the Korea Semiconductor Industry Association (KSIA) promote industry growth and innovation. The Ministry of Trade, Industry and Energy (MOTIE) supports semiconductor development initiatives.

5. Singapore: Singaporean OSAT companies, including GlobalFoundries Singapore Pte. Ltd. and UTAC Holdings Ltd., contribute significantly to the global market. Government initiatives such as the Singapore Economic Development Board (EDB) support semiconductor manufacturing investments and talent development. The National Research Foundation (NRF) funds semiconductor research and development projects.

A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.

Outsourced Semiconductor Assembly and Testing Market (OSAT) by Segment

The study includes a forecast for the global outsourced semiconductor assembly and testing market by service type, packaging type, application, and region, as follows:

OSAT Market by Service Type [Value ($B) Shipment Analysis from 2018 to 2030]:

Assembly & Packaging
Testing

OSAT Market by Packaging Type [Value ($B) Shipment Analysis from 2018 to 2030]:

Wire Bond
Flip Chip
Wafer Level
Others

OSAT Market by Application [Value ($B) Shipment Analysis from 2018 to 2030]:

Automotive
Telecommunications
Computing & Networking
Consumer Electronics
Industrial

OSAT Market by Region [Value ($B) Shipment Analysis from 2018 to 2030]:

North America
Europe
Asia Pacific
The Rest of the World

List of Outsourced Semiconductor Assembly and Testing (OSAT) Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies outsourced semiconductor assembly and testing companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the outsourced semiconductor assembly and testing companies profiled in this report includes.

Advanced Semiconductor
Amkor
Jiangsu Changjiang Electronics Technology
Siliconware Precision Industries
PTI (Powertech Technology Inc.)
United test and assembly center
King Yuan Electronics
ChipMOS

Recent Developments in OSAT Market

Rising Demand for Advanced Packaging Solutions: The OSAT market is experiencing growth driven by increasing demand for advanced packaging solutions such as fan-out wafer-level packaging (FOWLP) and 3D packaging technologies. These technologies enable higher performance, miniaturization, and heterogeneous integration in semiconductor devices.
Investments in Capacity Expansion: OSAT providers are investing in capacity expansion to meet the growing demand for semiconductor packaging and testing services. Companies like ASE Technology Holding Co. and Amkor Technology are ramping up production facilities and acquiring advanced equipment to support the industry's needs.
Technological Advancements in Test Equipment: OSAT companies are adopting advanced test equipment and methodologies to improve efficiency, accuracy, and reliability in semiconductor testing processes. Innovations such as automated test handling systems and high-speed test solutions are enhancing the capabilities of OSAT providers.
Focus on Heterogeneous Integration and System Integration: OSAT vendors are increasingly involved in heterogeneous integration and system-level packaging, offering services that combine multiple chips, sensors, and passive components into a single package. This trend aligns with the growing demand for integrated solutions in applications such as automotive, IoT, and artificial intelligence.
Adoption of Advanced Materials and Processes: OSAT providers are adopting advanced materials and manufacturing processes to address the requirements of emerging applications such as 5G, edge computing, and high-performance computing. Technologies like advanced substrate materials, wafer-level chip-scale packaging (WLCSP), and system-in-package (SiP) are gaining traction in the market.

Features of the OSAT Market

Market Size Estimates:Outsourced semiconductor assembly and testing market size estimation in terms of value ($B)
Trend And Forecast Analysis:Market trends (2018-2023) and forecast (2024-2030) by various segments and regions.
Segmentation Analysis:Outsourced semiconductor assembly and testing market size by various segments, such as by service type, packaging type, application, and region
Regional Analysis:Outsourced semiconductor assembly and testing market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
Growth Opportunities:Analysis on growth opportunities in different by service type, packaging type, application, and regions for the outsourced semiconductor assembly and testing market.
Strategic Analysis:This includes M&A, new product development, and competitive landscape for the outsourced semiconductor assembly and testing market.
Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the outsourced semiconductor assembly and testing (OSAT) market size?

Answer: The global outsourced semiconductor assembly and testing (OSAT) market is expected to reach an estimated $51.4 billion by 2030.

Q2. What is the growth forecast for the OSAT market?

Answer: The global outsourced semiconductor assembly and testing market is expected to grow with a CAGR of 4.5% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the OSAT market?

Answer: The major drivers for this market are increasing semiconductor content within electronics products to provide greater functionality and higher levels of performance, growth in demand for smartphones and internet connected devices, and increasing electronic content in automotive for safety, navigation, fuel efficiency, emission reduction, and entertainment system.

Q4. What are the major segments for OSAT market?

Answer: The future of the outsourced semiconductor assembly and testing market looks promising with opportunities in the automotive, telecommunication, computing & networking, consumer electronic, and industrial application industries.

Q5. Who are the key outsourced semiconductor assembly and testing companies?

Answer: Some of the key outsourced semiconductor assembly and testing companies are as follows:

Advanced Semiconductor
Amkor
Jiangsu Changjiang Electronics Technology
Siliconware Precision Industries
PTI (Powertech Technology Inc.)
United test and assembly center
King Yuan Electronics
ChipMOS

Q6. Which OSAT segment will be the largest in future?

Answer:Lucintel forecast that assembly & packaging will remain the largest segment over the forecast period due to growing demand for telecom infrastructure and electronic products across the globe.

Q7. In outsourced semiconductor assembly and testing market, which region is expected to be the largest in next 5 years?

Answer: Asia Pacific is expected to witness the highest growth during the forecast period due to growing adoption of IoT (internet of things), increasing electronic content per vehicle, and growing industrial automation in countries, such as China, Taiwan, and India.

Q8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

Q.1. What are some of the most promising, high-growth opportunities for the global outsourced semiconductor assembly and testing market by service type (assembly & packaging and testing), packaging type (wire bond, flip chip, wafer level, and others), application (automotive, telecommunications, computing & networking, consumer electronics, and industrial), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

1. Executive Summary

2. Global Outsourced Semiconductor Assembly and Testing Market: Market Dynamics

2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

3.1: Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
3.2: Global Outsourced Semiconductor Assembly and Testing Market Trends (2018-2023) and Forecast (2024-2030)
3.3: Global Outsourced Semiconductor Assembly and Testing Market by Service Type
- 3.3.1: Assembly & Packaging
- 3.3.2: Testing
3.4: Global Outsourced Semiconductor Assembly and Testing Market by Packaging Type
- 3.4.1: Wire Bond
- 3.4.2: Flip Chip
- 3.4.3: Wafer Level
- 3.4.4: Others
3.5: Global Outsourced Semiconductor Assembly and Testing Market by Application
- 3.5.1: Automotive
- 3.5.2: Telecommunications
- 3.5.3: Computing & Networking
- 3.5.4: Consumer Electronics
- 3.5.5: Industrial

4. Market Trends and Forecast Analysis by Region from 2017-2028

4.1: Global Outsourced Semiconductor Assembly and Testing Market by Region
4.2: North American Outsourced Semiconductor Assembly and Testing Market
- 4.2.1: North American Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
- 4.2.2: North American Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial
4.3: European Outsourced Semiconductor Assembly and Testing Market
- 4.3.1: European Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
- 4.3.2: European Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial
4.4: APAC Outsourced Semiconductor Assembly and Testing Market
- 4.4.1: APAC Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
- 4.4.2: APAC Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial
4.5: ROW Outsourced Semiconductor Assembly and Testing Market
- 4.5.1: ROW Outsourced Semiconductor Assembly and Testing Market by Service Type: Assembly & Packaging and Testing
- 4.5.2: ROW Outsourced Semiconductor Assembly and Testing Market by Application: Automotive, Telecommunications, Computing & Networking, Consumer Electronics, and Industrial

5. Competitor Analysis

5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

6.1: Growth Opportunity Analysis
- 6.1.1: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Service Type
- 6.1.2: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Packaging Type
- 6.1.3: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Application
- 6.1.5: Growth Opportunities for the Outsourced Semiconductor Assembly and Testing Market by Region
6.2: Emerging Trends in the Global Outsourced Semiconductor Assembly and Testing Market
6.3: Strategic Analysis
- 6.3.1: New Product Development
- 6.3.2: Capacity Expansion of the Global Outsourced Semiconductor Assembly and Testing Market
- 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Outsourced Semiconductor Assembly and Testing Market
- 6.3.4: Certification and Licensing