半導體組裝流程設備的全球市場規模:封裝技術，各用途，各終端用戶，各地區，範圍及預測

半導體組裝製程設備市場規模及預測

2023年半導體組裝製程設備市場規模為39.8億美元，2024-2030年預測期間複合年增長率為9.1%，到2030年將達到72.8億美元。半導體組裝製程設備市場包括半導體製造組裝和封裝階段所使用的機器、工具和設備。這包括晶片鍵合、引線鍵合、封裝和測試等各種製程。該市場涵蓋前端和後端組裝工藝，滿足全球半導體製造商的多樣化需求。

推動全球半導體組裝製程設備市場的因素

半導體組裝製程設備市場的市場推動因素受到多種因素的影響。

技術開發：

半導體技術的持續發展（包括開發更小、更強大的晶片）推動了對日益複雜的組裝製程設備的需求。

消費性電子產品的需求不斷成長：

隨著智慧型手機、筆記型電腦、平板電腦設備和其他消費性電子設備的需求不斷增加，對半導體組裝設備的需求也不斷增加，以滿足這些生產需求。

物聯網與人工智慧的普及：

人工智慧（AI）和物聯網（IoT）技術在各行業的廣泛使用增加了對半導體的需求，從而推動了組裝製程設備市場。

汽車工業的成長：

汽車產業向ADAS（高級駕駛輔助系統）、電動車（EV）和自動駕駛汽車（AV）的轉變需要提高汽車中安裝的半導體水平，從而導致對裝配工藝設備的需求。

5G技術部署：

隨著 5G 網路在全球範圍內推廣，製造用於通訊設備和基礎設施的專用半導體的需求不斷增加，從而推動了對組裝製程設備的需求。

快速都市化與工業化：

由於製造、基礎設施和醫療保健等各行業對電子產品的需求不斷增長，新興國家的半導體組裝設備市場正在迅速成長。

小型化趨勢：

隨著電子設備的小型化，需要先進的組裝製程設備來處理較小的零件並實現高精度和準確度。

政府投資與計畫：

政府對半導體工廠和基礎設施的投資，以及旨在促進半導體生產和研發（R&D）業務的計劃，都有助於市場擴張。

供應鏈彈性意識：

隨著 COVID-19 大流行凸顯了供應鏈彈性的重要性，半導體公司正在對組裝製程設備進行現代化改造，以提高製造能力並減少對外部供應商的依賴，並開始投資。

環境法規：

隨著環境永續發展法規變得更加嚴格，將採用更節能和環保的半導體組裝製程設備，這將影響市場動態。

限制全球半導體組裝製程設備市場的因素

有幾個因素可能會成為半導體組裝製程設備市場的限製或課題。

初始投資高：

初始投資高：由於購買和安裝半導體製造製程設備所需的初始資本支出較高，中小型半導體製造商難以進入新市場並擴大業務。

相容性與整合複雜性：

將新的組裝製程設備與您目前的生產基礎設施整合需要花費大量的精力和時間。多個軟體平台和設備組件之間的不相容性可能會阻礙新技術的採用。

半導體產業是週期性的，會隨著需求的突然增加而起起落落。市場飽和、地緣政治不穩定和經濟波動都會破壞裝配製程設備的需求並影響市場成長。

龐大的交貨時間和上市時間壓力：

半導體製造商面臨更快發布新產品和縮短產品開發週期的壓力。採購和設置裝配工藝設備的交貨時間過長可能會影響上市時間和製造計劃，從而導致成本和機會的浪費。

世界半導體短缺：

半導體供應鏈的中斷，例如近期因需求增加、生產中斷和地緣政治緊張局勢等因素造成的供應短缺，可能會對組裝製程設備市場帶來不確定性和瓶頸。

技術快速過時：

半導體產業以其快速的技術進步而聞名，這導致設備和技術很快就過時。為了長期保持競爭力和相關性，半導體製造商必須仔細考慮對組裝製程設備的投資。

激烈的競爭：

在半導體組裝製程設備產業，國內外許多競爭對手都在爭奪市場佔有率。激烈的競爭可能導致價格競爭壓力、利潤率下降以及難以根據功能和性能實現產品差異化。

貿易法與智慧財產權保護：

貿易法和專利糾紛等智慧財產權保護問題使半導體製造商陷入法律困境，並使其難以在全球開發和部署裝配線設備。

應對複雜的法規：

開發、生產和銷售半導體組裝製程設備更加困難且昂貴，因為它必須遵守許多監管要求，例如安全標準、環境法和出口法規。

環境問題：

半導體製造使用危險化學品並產生大量廢棄物，增加了採用更清潔、更永續的製造方法的壓力。

目錄

第1章 簡介

• 市場定義
• 市場區隔
• 調查手法

第2章 摘要整理

• 主要調查結果
• 市場概要
• 市場亮點

第3章 市場概要

• 市場規模與成長的可能性
• 市場趨勢
• 推動市場要素
• 阻礙市場要素
• 市場機會
• 波特的五力分析

第4章 半導體組裝流程設備市場:封裝技術

• 通孔技術(THT)
• 表面裝置技術(SMT)
• 先進包裝

第5章 半導體組裝流程設備市場:各用途

• 消費者電子產品
• 汽車
• 產業
• 通訊
• 醫療

第6章 半導體組裝流程設備市場:各終端用戶

• 半導體廠商
• 目的地品牌製造商(OEM)
• 電子設備製造服務(EMS)供應商

第7章 各地區分析

• 北美
• 美國
• 加拿大
• 墨西哥
• 歐洲
• 英國
• 德國
• 法國
• 義大利
• 亞太地區
• 中國
• 日本
• 印度
• 澳洲
• 南美
• 巴西
• 阿根廷
• 智利
• 中東·非洲
• 南非
• 沙烏地阿拉伯
• 阿拉伯聯合大公國

第8章 市場動態

• 推動市場要素
• 阻礙市場要素
• 市場機會
• COVID-19對市場的影響

第9章 競爭情形

• 主要企業
• 市場佔有率分析

第10章 企業簡介

• ASM Pacific Technology
• Kulicke & Soffa Industries
• Besi
• Accrutech
• Shinkawa
• Palomar Technologies
• Hesse Mechatronics
• Toray Engineering
• West Bond
• HYBOND
• DIAS Automation

第11章 市場展望和機會

• 新興技術
• 今後的市場趨勢
• 投資機會

第12章 附錄

• 簡稱清單
• 出處和參考文獻

Semiconductor Assembly Process Equipment Market Size And Forecast

Semiconductor Assembly Process Equipment Market size was valued at USD 3.98 Billion in 2023 and is projected to reach USD 7.28 Billion by 2030, growing at a CAGR of 9.1% during the forecast period 2024-2030. The Semiconductor Assembly Process Equipment Market encompasses the machinery, tools, and equipment utilized in the assembly and packaging stages of semiconductor manufacturing. This includes various processes such as die bonding, wire bonding, encapsulation, and testing, among others. The market covers both front-end and back-end assembly processes, catering to the diverse needs of semiconductor manufacturers worldwide.

Global Semiconductor Assembly Process Equipment Market Drivers

The market drivers for the Semiconductor Assembly Process Equipment Market can be influenced by various factors. These may include:

Technological Developments:

The need for increasingly complex assembly process equipment is driven by ongoing developments in semiconductor technology, such as the creation of smaller and more potent chips.

Growing Demand for Consumer Electronics:

In order to meet the production demands of these items, there is an increasing need for semiconductor assembly equipment due to the growing demand for smartphones, laptops, tablets, and other consumer electronics devices.

Growing Adoption of IoT and AI:

As a result of the widespread use of artificial intelligence (AI) and Internet of Things (IoT) technologies in a variety of industries, there is an increased need for semiconductors, which in turn propels the market for assembly process equipment.

Growth of the Automotive Industry:

The automotive industry's transition to advanced driver-assistance systems (ADAS), electric cars (EVs), and autonomous vehicles (AVs) necessitates a higher level of semiconductor content in vehicles, which increases demand for assembly process equipment.

5G Technology Deployment:

As 5G networks are deployed globally, the need for specialized semiconductors to be produced for telecommunications devices and infrastructure is increasing, which is driving demand for assembly process equipment.

Rapid Urbanization and Industrialization:

As a result of rising demand for electronics across a range of industries, including manufacturing, infrastructure, and healthcare, emerging nations are seeing a surge in the market for semiconductor assembly equipment.

Miniaturization Trend:

As electronic devices get smaller and more compact, there is a need for sophisticated assembly process equipment that can handle smaller components and achieve high precision and accuracy.

Government Investments and Programs:

Government investments in semiconductor fabs and infrastructure, as well as programs targeted at advancing semiconductor production and research and development (R&D) operations, all contribute to the expansion of the market.

Awareness of Supply Chain Resilience:

The COVID-19 pandemic brought attention to the significance of supply chain resilience, which incentivized semiconductor companies to make investments in modernizing assembly process equipment to augment manufacturing capacities and mitigate reliance on outside suppliers.

Environmental rules:

As environmental sustainability rules become more stringent, more energy-efficient and environmentally friendly semiconductor assembly process equipment is adopted, which in turn affects market dynamics.

Global Semiconductor Assembly Process Equipment Market Restraints

Several factors can act as restraints or challenges for the Semiconductor Assembly Process Equipment Market. These may include:

High Initial Expenditure:

Small and medium-sized semiconductor manufacturers find it difficult to enter new markets and expand due to the high initial capital expenditure needed to buy and install equipment for the semiconductor manufacturing process.

Compatibility and Integration Complexity:

It can take a lot of effort and time to integrate new assembly process equipment with the current production infrastructure. New technology adoption may be hampered by incompatibilities between several software platforms and equipment components.

The semiconductor industry is cyclical, experiencing upswings and downswings in response to spikes in demand. Market saturation, geopolitical unrest, and economic swings can all have an impact on market growth by causing demand instability for assembly process equipment.

Extensive Lead Times and Time-to-Market Pressures:

Semiconductor producers are under pressure to accelerate the release of new products and reduce the length of their product development cycles. Long lead times for purchasing and setting up assembly process equipment can affect time-to-market and manufacturing schedules, costing money and opportunities.

Global Semiconductor Shortages:

Uncertainty and bottlenecks in the market for assembly process equipment can result from disruptions in the semiconductor supply chain, such as the shortages that have occurred recently as a result of factors like increased demand, production disruptions, and geopolitical tensions.

Fast technical Obsolescence:

The semiconductor industry is known for its quick technical progress, which causes equipment and technology to become outdated very quickly. In order to maintain their competitiveness and relevance over the long run, semiconductor manufacturers need to carefully consider their investments in assembly process equipment.

Tight Competition:

There are many national and international competitors fighting for market share in the semiconductor assembly process equipment industry. Pricing pressure, dwindling profit margins, and difficulties differentiating products based on features and capabilities can all result from intense competition.

Trade laws and intellectual property protection:

Trade laws and intellectual property protection issues, such as patent disputes, can put semiconductor manufacturers in a legal bind and make it more difficult for them to develop and implement assembly line equipment on a global scale.

Complex Regulatory Compliance:

The development, production, and marketing of semiconductor assembly process equipment are made more difficult and expensive by the need to comply with a number of regulatory requirements, including safety standards, environmental laws, and export controls.

Environmental Concerns:

Because the semiconductor manufacturing process uses hazardous chemicals and produces a lot of waste, there is growing pressure to adopt cleaner, more sustainable manufacturing practices, which could result in higher costs and more work to comply with regulations.

Global Semiconductor Assembly Process Equipment Market Segmentation Analysis

The Global Semiconductor Assembly Process Equipment Market is segmented on the basis of Packaging Technology, Application, End-User, and Geography.

Semiconductor Assembly Process Equipment Market, By Packaging Technology

• Through-Hole Technology (THT)
• : Involves mounting components by inserting leads through holes in the PCB and soldering them on the opposite side.
• Surface Mount Technology (SMT)
• : Involves mounting components directly onto the surface of the PCB.
• Advanced Packaging
• : Includes various techniques such as System-in-Package (SiP), Chip-on-Board (COB), and Wafer Level Packaging (WLP).

Semiconductor Assembly Process Equipment Market, By Application

• Consumer Electronics
• : Includes applications in smartphones, tablets, laptops, and wearables.
• Automotive
• : Involves assembly process equipment used in automotive electronics, including engine control units, infotainment systems, and advanced driver-assistance systems (ADAS).
• Industrial
• : Covers equipment used in industrial automation, robotics, and control systems.
• Telecommunications
• : Encompasses equipment for telecommunications infrastructure, including base stations, routers, and switches.
• Medical
• : Involves assembly equipment used in medical devices and equipment, such as pacemakers, medical imaging devices, and monitoring systems.

Semiconductor Assembly Process Equipment Market, By End-User

• Semiconductor Manufacturers
• : Companies involved in the fabrication of semiconductor chips.
• Original Equipment Manufacturers (OEMs)
• : Companies that integrate semiconductor components into their end products, such as electronics manufacturers.
• Electronic Manufacturing Services (EMS) Providers
• : Contract manufacturers that offer assembly and manufacturing services to OEMs.

Semiconductor Assembly Process Equipment Market, By Geography

• North America:
• Market conditions and demand in the United States, Canada, and Mexico.
• Europe:
• Analysis of the Semiconductor Assembly Process Equipment Market in European countries.
• Asia-Pacific:
• Focusing on countries like China, India, Japan, South Korea, and others.
• Middle East and Africa:
• Examining market dynamics in the Middle East and African regions.
• Latin America:
• Covering market trends and developments in countries across Latin America.

Key Players

• The major players in the Semiconductor Assembly Process Equipment Market are:
• ASM Pacific Technology
• Kulicke & Soffa Industries
• Besi
• Accrutech
• Shinkawa
• Palomar Technologies
• Hesse Mechatronics
• Toray Engineering
• West Bond
• HYBOND
• DIAS Automation

TABLE OF CONTENTS

1. Introduction

• Market Definition
• Market Segmentation
• Research Methodology

2. Executive Summary

• Key Findings
• Market Overview
• Market Highlights

3. Market Overview

• Market Size and Growth Potential
• Market Trends
• Market Drivers
• Market Restraints
• Market Opportunities
• Porter's Five Forces Analysis

4. Semiconductor Assembly Process Equipment Market, By Packaging Technology

• Through-Hole Technology (THT)
• Surface Mount Technology (SMT)
• Advanced Packaging

5. Semiconductor Assembly Process Equipment Market, By Application

• Consumer Electronics
• Automotive
• Industrial
• Telecommunications
• Medical

6. Semiconductor Assembly Process Equipment Market, By End-User

• Semiconductor Manufacturers
• Original Equipment Manufacturers (OEMs)
• Electronic Manufacturing Services (EMS) Providers

7. Regional Analysis

• North America
• United States
• Canada
• Mexico
• Europe
• United Kingdom
• Germany
• France
• Italy
• Asia-Pacific
• China
• Japan
• India
• Australia
• Latin America
• Brazil
• Argentina
• Chile
• Middle East and Africa
• South Africa
• Saudi Arabia
• UAE

8. Market Dynamics

• Market Drivers
• Market Restraints
• Market Opportunities
• Impact of COVID-19 on the Market

9. Competitive Landscape

• Key Players
• Market Share Analysis

10. Company Profiles

• ASM Pacific Technology
• Kulicke & Soffa Industries
• Besi
• Accrutech
• Shinkawa
• Palomar Technologies
• Hesse Mechatronics
• Toray Engineering
• West Bond
• HYBOND
• DIAS Automation

11. Market Outlook and Opportunities

• Emerging Technologies
• Future Market Trends
• Investment Opportunities

12. Appendix

• List of Abbreviations
• Sources and References