外包半導體組裝及檢驗市場:各流程，各包裝類型，各用途，各地區，2024年～2031年

外包半導體組裝與檢測市場評估，2024-2031

外包半導體組裝和測試（OSAT）未來可能會進一步成長，因為它是整個半導體產業的關鍵組成部分。對更快、更強大的設備（例如智慧型手機和人工智慧）的需求正在推動更複雜的處理器的開發。此外，製造這些先進電路需要高度專業化的設備和經驗，促使晶片設計人員將組裝和測試外包。這一趨勢，加上電子產業的整體成長，正在推動 OSAT 市場的擴張。對經濟高效的外包半導體封裝和測試的需求不斷增長，將推動市場從2024年到2031年以4.65%的複合年增長率增長，到2023年將超過321.0557億美元，使其估值達到46184.29百萬美元。

半導體封裝與測試外包市場定義/概述

外包半導體組裝和測試（OSAT）是將半導體晶片組裝、測試和封裝外包給專門從事這些任務的第三方組織。 OSAT 公司在半導體產業的製造供應鏈中發揮關鍵作用，提供從晶圓探測和封裝到最終測試以及向消費者分銷積體電路 (IC) 的廣泛服務。

這種外包方式可以讓半導體公司專注於自己的核心優勢，例如晶片設計和製造，同時利用OSAT供應商的經驗和資源進行組裝和測試，提高效率並可以實現成本降低。

OSAT 公司通常使用配備專業設備的現代化設施，將半導體晶片組裝到基板上，將其封裝在保護性封裝中，並進行嚴格的測試以確保品質和性能。這些公司採用引線鍵合、倒裝晶片和矽通孔（TSV）封裝等各種封裝技術來滿足各種半導體應用的多樣化需求。

此外，OSAT 供應商通常提供供應鏈管理、庫存管理和物流等增值服務，使半導體公司能夠優化營運並更快地將產品推向市場。總體而言，將組裝和測試業務外包給 OSAT 營運商已成為半導體產業生產生態系統的重要組成部分，從而促進各種電子設備和系統的創新並推動技術改進。

5G網路部署會推動外包半導體組裝和偵測市場嗎？

在外包半導體組裝和測試 (OSAT) 市場中，5G 網路的引入正在推動對高效能半導體的需求不斷增長。由於 5G 技術承諾更高的數據傳輸速度和更低的延遲，半導體製造商面臨著生產滿足這些高性能標準的晶片的壓力。因此，隨著半導體製造商尋求建造和測試這些先進晶片的專業知識，OSAT 服務的需求量很大。

隨著 5G 網路成為下一代連接的基礎，對尖端半導體解決方案的需求從未如此之大。 OSAT 供應商透過提供針對 5G 晶片特定要求客製化的增強組裝和測試能力，在滿足這一需求方面發揮關鍵作用。無論是將複雜的元件整合到微型封裝中，還是透過嚴格的測試流程確保最佳效能，OSAT 公司都處於推動 5G 革命的最前線。

此外，電信、汽車和物聯網等各行業支援 5G 的設備的發展顯示了 OSAT 服務的長期成長潛力。隨著公司利用 5G 技術的革命性力量來推動創新和連接，OSAT 供應商已做好充分準備，透過提供可擴展且高效的半導體組裝和檢測解決方案來從這一趨勢中受益。綜上所述，5G網路的部署將成為半導體組裝和檢測外包市場成長和演變的強大催化劑。

技術複雜性會阻礙半導體封裝和測試外包市場的成長嗎？

由於半導體封裝技術，特別是系統級封裝 (SiP) 和 3D 整合的複雜性日益增加，外包半導體組裝和測試 (OSAT) 市場正在面臨巨大的挑戰。這些新的封裝技術需要對專用設備和基礎設施進行大量投資，從而使 OSAT 公司的資源緊張。

此外，為這些精緻的包裝技術開發製造程序需要對細節的一絲不苟和不斷改進，從而增加了操作的複雜性。此外，缺乏合格的工人來處理這些複雜的程序給 OSAT 組織帶來了額外的挑戰，需要不斷的培訓和人才開發工作來滿足行業不斷增長的需求。

目錄

第1章 全球外包半導體組裝及檢驗(OSAT)市場:簡介

• 市場定義
• 市場區隔
• 調查計劃
• 前提條件
• 限制事項

第2章 VERIFIED MARKET RESEARCH的調查手法

• 資料探勘
• 資料的三角測量
• Bottom-Up(由下而上)方法
• Top-Down(由上而下)方法
• 調查的流程
• 產業專家的主要洞察
• 資料來源

第3章 摘要整理

• 市場概要
• 生態學的製圖
• 絕對的商機
• 市場魅力
• 外包半導體組裝及檢驗(OSAT)的全球市場:各地區分析
• 外包半導體組裝及檢驗(OSAT)的全球市場:各類型
• 外包半導體組裝及檢驗(OSAT)的全球市場:各用途
• 今後的市場機會
• 全球市場明細
• 產品life line

第4章 外包半導體組裝及檢驗(OSAT)的全球市場展望

• 外包半導體組裝及檢驗(OSAT)的世界展開
• 促進因素
• 阻礙因素
• 機會
• 波特的五力分析
• 價值鏈分析
• 價格分析
• 宏觀經濟分析

第5章 外包半導體組裝及檢驗(OSAT)的全球市場:各類型

• 概要
• 組裝
• 試驗
• sewing
• sorting

第6章 外包半導體組裝及檢驗(OSAT)的全球市場:各用途

• 概要
• 通訊
• 消費者·電子產品
• 汽車
• 產業用
• 航太·防衛
• 醫療·醫療保健
• 物流·運輸

第7章 外包半導體組裝及檢驗(OSAT)的全球市場:各地區

• 概要
• 北美
• 歐洲
• 亞太地區
• 南美
• 中東·非洲

第8章 外包半導體組裝及檢驗(OSAT)的全球市場:競爭情形

• 概要
• 各公司的市場排行榜
• 主要的發展
• 企業的各地區足跡
• 企業的產業足跡
• ACE矩陣

第9章 企業簡介

• ASE Technology Holding Co., Ltd
• UNISEM GROUP
• Powertech Technology
• Sigurd Microelectronics Corporation
• Global Unichip Corp.
• Siliconware Precision Industries Co., Ltd.
• King Yuan ELECTRONICS CO., LTD
• Hana Micron
• East China Technology Co., Ltd.
• Signetics

第10章 VERIFIED MARKET INTELLIGENCE

• VERIFIED MARKET 關於INTELLIGENCE
• 動態的資料的視覺化

Outsourced Semiconductor Assembly And Test Market Valuation - 2024-2031

As outsourced semiconductor assembly and test (OSAT) is a substantial element of the entire semiconductor industry, it is likely to grow further. The demand for more rapid and powerful devices, such as smartphones and artificial intelligence, is driving the development of progressively more complicated processors. Also, the making of these advanced circuits needs highly specialized facilities and experience, thereby encouraging the chip designers in outsourcing assembly and testing. This tendency, combined with the overall growth of the electronics industry, is driving the expansion of the OSAT market. The rising demand for cost-effective and efficient outsourced semiconductor assembly and test is enabling the market grow at a CAGR of 4.65% from 2024 to 2031,as well as enabling the revenue surpass USD 32105.57 Million valued in 2023 to reach a valuation of aroundUSD 46184.29 Million by 2031.

Outsourced Semiconductor Assembly And Test Market: Definition/ Overview

Outsourced Semiconductor Assembly and Test (OSAT) is the process of outsourcing the assembly, testing, and packaging of semiconductor chips to third-party organizations that specialize in these activities. OSAT firms play an important role in the semiconductor industry's manufacturing supply chain, providing services ranging from wafer probing and packaging to final testing and distribution of integrated circuits (ICs) to consumers.

This outsourcing approach enables semiconductor businesses to concentrate on their core strengths, such as chip design and manufacturing, while leveraging the experience and resources of OSAT providers for assembly and testing, resulting in increased efficiency and lower costs.

OSAT companies often operate modern facilities that are outfitted with specialized equipment for assembling semiconductor chips onto substrates, enclosing them in protective packages, and undergoing rigorous testing to assure quality and performance. These firms use a variety of packaging technologies, such as wire bonding, flip-chip, and through-silicon via (TSV) packaging, to fulfill the varying needs of various semiconductor applications.

Furthermore, OSAT providers frequently provide value-added services such as supply chain management, inventory management, and logistics, allowing semiconductor companies to optimize their operations and get goods to market quickly. Overall, outsourcing assembly and test operations to OSAT businesses has become an essential component of the semiconductor industry's production ecosystem, enabling innovation and pushing technological improvements across a wide range of electronic devices and systems.

What's inside a VMR industry report?

Our reports include actionable data and forward-looking analysis that help you craft pitches, create business plans, build presentations and write proposals.

Will 5G Networks Deployments Drive the Outsourced Semiconductor Assembly And Test Market?

In the Outsourced Semiconductor Assembly and Testing (OSAT) market, the implementation of 5G networks is driving an increase in demand for high-performance semiconductors. As 5G technology promises higher data rates and low latency, semiconductor makers are under pressure to build chips that match these high-performance standards. As a result, OSAT services are in high demand as semiconductor companies seek specialized knowledge in building and testing these advanced chips.

With 5G networks becoming the foundation of next-generation connectivity, the demand for cutting-edge semiconductor solutions is greater than ever. OSAT suppliers play a critical role in meeting this demand by providing enhanced assembly and testing capabilities that are tailored to the specific requirements of 5G-compatible chips. Whether it's integrating complex components into small packaging or assuring optimal performance through rigorous testing processes, OSAT companies are at the forefront of enabling the 5G revolution.

Furthermore, the development of 5G-enabled devices in a variety of industries, including telecoms, automotive, and IoT, indicates the long-term growth potential for OSAT services. As businesses harness the revolutionary power of 5G technology to drive innovation and connectivity, OSAT suppliers are well-positioned to benefit from this trend by providing scalable and efficient semiconductor assembly and testing solutions. In summary, the deployment of 5G networks acts as a potent catalyst for the growth and evolution of the Outsourced Semiconductor Assembly and Testing market.

Will Technological Complexity Hamper the Growth of Outsourced Semiconductor Assembly And Test Market?

The outsourced semiconductor assembly and test (OSAT) market is a considerable challenge due to the increasing complexity of semiconductor packaging technologies, particularly System-in-Package (SiP) and 3D integration. These new packaging technologies demand significant investments in specialized equipment and infrastructure, which put pressure on OSAT firms' resources.

Furthermore, developing manufacturing procedures for these delicate packaging technologies requires extreme care for detail and constant refinement, adding complexity to operations. Furthermore, the lack of qualified workers capable of handling these complicated procedures creates an additional challenge for OSAT organizations, demanding constant training and talent development activities to meet the industry's increasing demands.

Category-Wise Acumens

How wWill Assembly Segment Drive the Demand in the Growth of Outsourced Semiconductor Assembly And Test Market?

In the outsourced semiconductor assembly and test (OSAT) market, the assembly segment is the key revenue generator owing to the constant development in demand for consumer electronics and telecommunications infrastructure. The global demand for smartphones, laptops, and advanced networking equipment has risen dramatically, as has the demand for efficient chip assembly.

OSAT businesses are at the forefront of satisfying this demand by precisely attaching chips to protective packages that allow for smooth interaction with other components on circuit boards. This crucial position ensures the proper operation of electronic equipment required for modern lives and commercial activities.

As consumer demands for quicker, smaller, and more feature-rich devices grow, the role of OSAT firms in the semiconductor supply chain becomes increasingly important. These companies not only handle intricate assembly procedures, but they also help to innovate packaging methods to satisfy changing market demands. By delivering efficient and dependable assembly services, OSAT companies let semiconductor manufacturers concentrate on key capabilities such as design and innovation, driving overall industry growth. The beneficial interaction between OSAT providers and the booming consumer electronics and telecommunications sectors highlights their critical role in defining the future of semiconductor technology.

Will Increasing Demand for Electrical Device Propel the Outsourced Semiconductor Assembly And Test Market?

Consumer electronics is a competitive area of the outsourced semiconductor assembly and test (OSAT) market, driven by the constant spike in demand for smartphones, laptops, tablets, and other electronic devices. These devices require significantly complicated miniaturized chips, for which OSAT businesses provide essential assembly and testing services. By methodically assembling and testing these chips, OSAT companies ensure the seamless performance of the electronic components that power our everyday electronics, hence improving the user experience.

The dynamic environment of consumer electronics, marked by ongoing innovation and refresh cycles, increases the need for efficient and high-volume OSAT services. As consumers desire more advanced features, improved performance, and sleeker designs in their electronic products, semiconductor makers must keep up with these changing expectations. OSAT firms play an essential role in this ecosystem by providing flexible and scalable assembly and testing solutions, allowing semiconductor makers to quickly react to changing market trends and deliver cutting-edge products to consumers throughout the world.

Country/Region Wise Acumens

Will the Asia Pacific Region Emerge the Outsourced Semiconductor Assembly And Test Market?

Asia Pacific emerges as the market leader in Outsourced Semiconductor Assembly and Test (OSAT) services, accounting for a significant 60.2% of total revenue in 2022. This supremacy is partly due to the region's strong presence of leading companies and significant innovators, like ASE Technology Holding Co., ChipMOS Technologies Inc., and HANA Micron Inc. Furthermore, the fast adoption of robotic processes in different industries, particularly automotive and consumer electronics, in nations such as Japan, South Korea, India, and China boosted the growth trajectory.

Notably, China, India, and Taiwan are key regions in Asia Pacific, with exponential growth in the semiconductor market. These regions are expected to dramatically increase their market share in the coming years, encouraged by favorable government initiatives and rising demand for semiconductor-related services.

In an effort to strengthen its semiconductor ecosystem, the Indian government announced a change to its current strategy for creating semiconductor-related facilities. Under the revamped policy, qualifying applicants would get a significant increase in financial aid, with the government agreeing to cover 50% of capital expenditure (CAPEX), up from 30% previously.

Similarly, Taiwan made significant steps to strengthen its semiconductor industry, announcing a detailed five-year plan in 2020. Taiwan plans to invest USD 54.15 million in the semiconductor business to build a qualified workforce for research and development. These strategic initiatives highlight governments' collaborative efforts in Asia Pacific to nurture and accelerate the expansion of the semiconductor sector, consequently increasing demand for outsourced assembly and testing services in the area.

How Will Increasing Adoption of the Smart Device Drive Growth in North America for the Outsourced Semiconductor Assembly And Test Market?

North America is expected to develop at the quickest CAGR of 8.5% over the forecast period. Increased adoption of the Internet of Things (IoT), artificial intelligence, and smart devices in industries such as healthcare, transportation, and manufacturing is one of the factors driving growth. For example, during and after the COVID-19 pandemic, there was an increase in demand for semiconductors, which drove demand for OSAT services.

In 2021, the United States overtook the North American OSAT market, accounting for more than 78%. Leading businesses, including Amkor Technology Inc. and Aehr Test Systems, account for the majority of revenue in the United States. Increased demand for OSAT services from end users, including EV, defense, and aerospace industries including Tesla, Rivian, Boeing, Lockheed Martin, and GE Aviation, is driving market expansion. Furthermore, the growing demand for semiconductor testing services across computer and data storage devices in the United States and Canada is helping to drive growth.

Competitive Landscape

The outsourced semiconductor assembly and test market is a dynamic and competitive space, characterized by a diverse range of players vying for market share. These players are on the run for solidifying their presence through the adoption of strategic plans such as collaborations, mergers, acquisitions, and political support.

The organizations are focusing on innovating their product line to serve the vast population in diverse regions. Some of the prominent players operating in the outsourced semiconductor assembly and test market include:

• Amkor Technology, ASE Technology, SPIL, TSMC, Advanced Semiconductor Engineering, Huamao Microelectronics, Jiangsu Changjiang Electronics Technology, Powertech Technology, Sigurd Microelectronics, Global Unichip Corporation, Greate Wall Technology, Tessera Technology, Teradyne, Advantest, Cohu, ASE Hong Kong, Foxconn Interconnect Technology.

Latest Developments

• In December 2023, Sahasra Electronics, a Noida-based company, announced plans to invest around INR 350 crore (USD 42.2 million) over three years. The investment will be used to create a semiconductor packaging plant and expand manufacturing operations as part of the 'Make in India' initiative. The company intends to acquire electronic assembly machines, resulting in an investment of more than INR 150 crore (USD 18.1 million) for the plant, with an additional INR 50 crore (USD 6 million) allocated to the interior of the building. Such expenditures to improve semiconductor packaging and assembly services are likely to strengthen the market's potential.
• In November 2023, JCET Automotive Electronics (Shanghai) Co. Ltd is set to receive a capital injection of RMB 4.4 billion (USD 0.61 billion), bringing the total registered capital to RMB 4.8 billion (USD 0.67 billion). This investment will accelerate the development of an advanced packaging factory for automotive chip products in Shanghai's Lingang Special Area.

TABLE OF CONTENTS

1 INTRODUCTION OF GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET

• 1.1 Market Definition
• 1.2 Market Segmentation
• 1.3 Research Timelines
• 1.4 Assumptions
• 1.5 Limitations

2 RESEARCH METHODOLOGY OF VERIFIED MARKET RESEARCH

• 2.1 Data Mining
• 2.2 Data Triangulation
• 2.3 Bottom-Up Approach
• 2.4 Top-Down Approach
• 2.5 Research Flow
• 2.6 Key Insights from Industry Experts
• 2.7 Data Sources

3 EXECUTIVE SUMMARY

• 3.1 Market Overview
• 3.2 Ecology Mapping
• 3.3 Absolute Market Opportunity
• 3.4 Market Attractiveness
• 3.5 Global Outsourced Semiconductor Assembly And Test (OSAT) Market Geographical Analysis (CAGR %)
• 3.6 Global Outsourced Semiconductor Assembly And Test (OSAT) Market, By Type (USD Million)
• 3.7 Global Outsourced Semiconductor Assembly And Test (OSAT) Market, By Application (USD Million)
• 3.8 Future Market Opportunities
• 3.9 Global Market Split
• 3.10 Product Life Line

4 GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET OUTLOOK

• 4.1 Global Outsourced Semiconductor Assembly And Test (OSAT) Evolution
• 4.2 Drivers
  • 4.2.1 Driver 1
  • 4.2.2 Driver 2
• 4.3 Restraints
  • 4.3.1 Restraint 1
  • 4.3.2 Restraint 2
• 4.4 Opportunities
  • 4.4.1 Opportunity 1
  • 4.4.2 Opportunity 2
• 4.5 Porters Five Force Model
• 4.6 Value Chain Analysis
• 4.7 Pricing Analysis
• 4.8 Macroeconomic Analysis

5 GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY TYPE

• 5.1 Overview '
• 5.2 Assembly
• 5.3 Testing
• 5.4 Sawing
• 5.5 Sorting

6 GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY APPLICATION

• 6.1 Overview
• 6.2 Telecommunication
• 6.3 Consumer Electronics,
• 6.4 Automative
• 6.5 Industrial
• 6.6 Aerospace and Defense
• 6.7 Medical and Healthcare
• 6.8 Logistics and Transportation

7 GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY GEOGRAPHY

• 7.1 Overview
• 7.2 North America
• 7.3 Europe
• 7.4 Asia Pacific
• 7.5 Latin America
• 7.6 Middle-East and Africa

8 GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET COMPETITIVE LANDSCAPE

• 8.1 Overview
• 8.2 Company Market Ranking
• 8.3 Key Developments
• 8.4 Company Regional Footprint
• 8.5 Company Industry Footprint
• 8.6 ACE Matrix

9 COMPANY PROFILES

• 9.1 ASE Technology Holding Co., Ltd
  • 9.1.1 Company Overview
  • 9.1.2 Company Insights
  • 9.1.3 Product Benchmarking
  • 9.1.4 Key Developments
  • 9.1.5 Winning Imperatives
  • 9.1.6 Current Focus & Strategies
  • 9.1.7 Threat from Competition
  • 9.1.8 SWOT Analysis
• 9.2 UNISEM GROUP
• 9.3 Powertech Technology
• 9.4 Sigurd Microelectronics Corporation
• 9.5 Global Unichip Corp.
• 9.6 Siliconware Precision Industries Co., Ltd.
• 9.7 King Yuan ELECTRONICS CO., LTD
• 9.8 Hana Micron
• 9.9 East China Technology Co., Ltd.
• 9.10 Signetics

10 VERIFIED MARKET INTELLIGENCE

• 10.1 About Verified Market Intelligence
• 10.2 Dynamic Data Visualization