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市場調查報告書
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1601151

半導體組裝和測試合約服務市場：按服務類型、封裝類型和最終用戶分類的全球預測 - 2025-2030

Outsourced Semiconductor Assembly & Test Services Market by Service Type (Assembly & Packaging, Testing), Packaging Type (Flip Chip, Wafer Level, Wire Bond), End-User - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 192 Pages | 商品交期: 最快1-2個工作天內

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2023年半導體組裝測試合約服務市場規模為333.4億美元，預計2024年將達到356.2億美元，複合年成長率為7.62%，2030年將達到557.5億美元。

半導體組裝和測試外包服務（OSAT）是半導體產業的重要服務，提供半導體裝置的封裝、測試和組裝等專業服務。該服務區彌合了晶片製造廠和電子設備製造商之間的差距，簡化了家電、汽車、醫療保健和通訊等多個行業的生產。隨著半導體設備變得越來越複雜、越來越小，對 OSAT 的需求顯而易見，需要許多晶片製造商內部不具備的專業知識和基礎設施。最終用途多種多樣，高效能運算、物聯網設備和先進半導體節點等領域的需求量很高。市場開拓的主要驅動力是數位設備的普及、5G技術的演進以及人工智慧應用開發的進步導致對半導體的需求不斷擴大。晶圓級封裝和 2.5/3D IC 等先進封裝技術的日益普及，為滿足對更小、更快、更有效率設備不斷成長的需求提供了重要機會。然而，該市場面臨供應鏈限制、初始基礎設施成本高昂以及由少數大型企業主導的競爭格局等挑戰，這些都可能成為新進業者的障礙。隨著半導體設計複雜性的增加，環保包裝材料和技術的開發以及檢測服務的自動化和準確性的提高的創新機會已經成熟。當前 OSAT 市場的本質是動態且快節奏的，通常需要策略夥伴關係和研發投資才能有效利用新趨勢。公司可以透過專注於擴展其服務能力（包括先進的分析和測試服務）來滿足不斷變化的客戶需求，從而實現顯著成長。策略性地理擴張，特別是在電子產業蓬勃發展的亞太地區，可以提供顯著的競爭優勢。

主要市場統計
基準年[2023] 333.4億美元
預測年份 [2024] 356.2億美元
預測年份 [2030] 557.5億美元
複合年成長率（%） 7.62%

市場動態：快速發展的半導體組裝和測試合約服務市場的關鍵市場洞察

由於供需的動態互動，半導體組裝和測試合約服務市場正在經歷轉型。透過了解這些不斷變化的市場動態，公司可以準備好做出明智的投資決策、完善策略決策並抓住新的商機。全面了解這些趨勢可以幫助企業降低政治、地理、技術、社會和經濟領域的風險，同時消費行為及其對製造成本的影響以及對採購趨勢的影響。

  • 市場促進因素
    • 半導體製造的公私舉措和獎勵
    • 擴大工業電子設備和醫療設備的生產
    • 更傾向於具成本效益的外包服務
  • 市場限制因素
    • 出現意外成本且業務彈性有限
  • 市場機會
    • OSAT服務中智慧型系統的部署
    • 增加先進封裝和測試的投資和技術
  • 市場挑戰
    • 營運管理限制和資料安全問題

波特的五力：駕馭半導體組裝和測試合約服務市場的策略工具

波特的五力框架是理解市場競爭格局的重要工具。波特的五力框架為評估公司的競爭地位和探索策略機會提供了清晰的方法。該框架可幫助公司評估市場動態並確定新業務的盈利。這些見解使公司能夠利用自己的優勢、解決弱點並避免潛在的挑戰，以確保更強大的市場地位。

PESTLE分析：了解半導體組裝和測試合約服務市場的外部影響

外部宏觀環境因素在塑造半導體組裝和測試合約服務市場的績效動態方面發揮著至關重要的作用。對政治、經濟、社會、技術、法律和環境因素的分析提供了應對這些影響所需的資訊。透過調查 PESTLE 因素，公司可以更了解潛在的風險和機會。這種分析可以幫助公司預測法規、消費者偏好和經濟趨勢的變化，並為他們做出積極主動的決策做好準備。

市場佔有率分析 了解半導體組裝和測試合約服務市場的競爭狀況

對半導體組裝和測試合約服務市場的詳細市場佔有率分析提供了對供應商績效的全面評估。公司可以透過比較收益、客戶群和成長率等關鍵指標來揭示其競爭地位。該分析揭示了市場集中、分散和整合的趨勢，為供應商提供了製定策略決策所需的洞察力，使他們能夠在日益激烈的競爭中佔有一席之地。

FPNV定位矩陣半導體組裝與測試合約服務市場供應商的績效評估

FPNV定位矩陣是評估半導體組裝和測試合約服務市場供應商的重要工具。此矩陣允許業務組織根據供應商的商務策略和產品滿意度評估供應商，從而做出符合其目標的明智決策。四個象限清楚且準確地分類供應商，幫助使用者辨識最能滿足其策略目標的合作夥伴和解決方案。

本報告提供了涵蓋關鍵重點領域的全面市場分析：

1. 市場滲透率：對當前市場環境的詳細回顧，包括行業主要企業的大量資料。

2. 市場開拓：辨識新興市場的成長機會，評估現有領域的擴張潛力，並提供未來成長的策略藍圖。

3. 市場多元化：分析近期產品發布、開拓地區、關鍵產業進展、塑造市場的策略投資。

4. 競爭評估與情報：徹底分析競爭格局，檢驗市場佔有率、業務策略、產品系列、認證、監理核准、專利趨勢、主要企業的技術進步等。

5. 產品開發與創新：重點在於有望推動未來市場成長的最尖端科技、研發活動和產品創新。

我們也回答重要問題，以幫助相關人員做出明智的決策：

1.目前的市場規模和未來的成長預測是多少？

2. 哪些產品、區隔市場和地區提供最佳投資機會？

3.塑造市場的主要技術趨勢和監管影響是什麼？

4.主要廠商的市場佔有率和競爭地位如何？

5. 推動供應商市場進入和退出策略的收益來源和策略機會是什麼？

目錄

第1章 前言

第2章調查方法

第3章執行摘要

第4章市場概況

第5章市場洞察

  • 市場動態
    • 促進因素
      • 半導體製造領域的公私合營措施和獎勵
      • 工業電子和醫療設備產量增加
      • 具成本效益外包服務的大趨勢
    • 抑制因素
      • 意外的隱性成本和有限的營運彈性
    • 機會
      • OSAT服務中引進智慧型系統
      • 增加先進封裝和測試的投資和技術
    • 任務
      • 操作控制限制和資料安全問題
  • 市場區隔分析
    • 服務類型：組裝和包裝服務的新興需求，以提高產品的耐用性和性能
    • 最終用戶：智慧型手機和穿戴式裝置等家用電器的擁有量增加
  • 波特五力分析
  • PESTEL分析
    • 政治的
    • 經濟
    • 社群
    • 技術的
    • 合法地
    • 環境
  • 客戶客製化

第6章半導體組裝/測試合約服務市場：依服務類型

  • 組裝和包裝
  • 測試

第7章 半導體組裝與測試合約服務市場：依封裝類型

  • 覆晶
  • 晶圓級
  • 焊接線

第8章 半導體組裝與測試合約服務市場：依最終使用者分類

  • 電腦和網路
  • 家電
  • 工業電子
  • 通訊

第9章 北美、南美半導體組裝測試代工服務市場

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美國

第10章 亞太地區半導體組裝測試代工服務市場

  • 澳洲
  • 中國
  • 印度
  • 印尼
  • 日本
  • 馬來西亞
  • 菲律賓
  • 新加坡
  • 韓國
  • 台灣
  • 泰國
  • 越南

第11章 歐洲、中東、非洲半導體組裝測試代工服務市場

  • 丹麥
  • 埃及
  • 芬蘭
  • 法國
  • 德國
  • 以色列
  • 義大利
  • 荷蘭
  • 奈及利亞
  • 挪威
  • 波蘭
  • 卡達
  • 俄羅斯
  • 沙烏地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公國
  • 英國

第12章競爭格局

  • 2023 年市場佔有率分析
  • FPNV 定位矩陣，2023
  • 競爭情境分析
    • 西門子與 SPIL 合作，為扇出晶圓級封裝提供 3D檢驗工作流程
    • 塔塔集團電子和半導體業務的擴張
    • 世芯科技宣布3DFabric聯盟支持計劃
    • 印度距離興建 10 億美元的美光科技半導體工廠又近了一步
    • Amkor 擴展車輛電氣化電源解決方案
    • Amkor 擴展車輛電氣化電源解決方案
    • Amkor 和 GlobalFoundries 在歐洲提供大規模半導體測試和組裝服務
    • TÜV Nord 集團收購 HTV 多數股權
    • Integra Technologies 選擇堪薩斯州作為 OSAT 最大的半導體計劃
    • 台積電成立OIP 3DFabric聯盟，塑造半導體與系統創新的未來
    • 三星電子在 2022 年三星代工論壇上宣布 1.4 奈米製程技術與產能投資計劃
    • 全球半導體組裝和測試設施資料庫追蹤 475 個整合裝置製造商設施

公司名單

  • EV Group
  • GEM Electronics（Shanghai）Co., Ltd.
  • Chipbond Technology Corporation
  • Carsem（M）Sdn Bhd
  • Unisem Group
  • Integra Technologies
  • King Yuan ELECTRONICS CO., LTD.
  • yieldwerx
  • Sanmina Corporation
  • Integrated Micro-electronics Inc.
  • Jiangsu Changdian Technology Co., Ltd.
  • ASE Technology Holding Co, Ltd.
  • Formosa Advanced Technologies Co., Ltd.
  • Inari Amertron Berhad
  • LB Semicon
  • HANA Micron Inc.
  • Natronix Semiconductor Technology Pte Ltd.
  • Walton Advanced Engineering, Inc.
  • AT Semicon Co., Ltd.
  • Greatek Electronics Inc.
  • Amkor Technology, Inc.
  • Samsung Electronics Co., Ltd.
  • LIPAC Co., Ltd.
  • Lingsen Precision Industries , LTD.
  • Nepes Corporation
  • ORIENT SEMICONDUCTOR ELECTRONICS LIMITED
  • Bluetest Testservice GmbH
  • Tongfu Microelectronics Co., Ltd.
  • UTAC Holdings Ltd.
  • Chipmos Technologies Inc.
  • Powertech Technology Inc.
  • Doosan Corporation
Product Code: MRR-742BD5182FC0

The Outsourced Semiconductor Assembly & Test Services Market was valued at USD 33.34 billion in 2023, expected to reach USD 35.62 billion in 2024, and is projected to grow at a CAGR of 7.62%, to USD 55.75 billion by 2030.

Outsourced Semiconductor Assembly and Test Services (OSAT) are integral to the semiconductor industry, providing specialized services such as packaging, testing, and assembly of semiconductor devices. This service segment bridges the gap between chip fabrication plants and electronic device manufacturers, streamlining production for various industries, including consumer electronics, automotive, healthcare, and telecommunications. The necessity of OSAT is underscored by the ever-increasing complexity and miniaturization of semiconductor devices, which demand specialized expertise and infrastructure that many chip companies lack in-house. End-use applications span a broad spectrum, with significant demand from sectors emphasizing high-performance computing, IoT devices, and advanced semiconductor nodes. Market growth is primarily driven by escalating demand for semiconductors due to the proliferation of digital devices, the evolution of 5G technology, and the ongoing development of AI applications. A significant opportunity lies in the increasing adoption of advanced packaging technologies like wafer-level packaging and 2.5/3D ICs, which can cater to the rising demand for smaller, faster, and more efficient devices. However, the market faces challenges such as supply chain constraints, high initial infrastructure costs, and a competitive landscape dominated by a few large players that could create barriers for new entrants. Innovation opportunities are ripe in developing eco-friendly packaging materials and techniques, as well as in enhancing the automation and precision of testing services to accommodate growing complexities in semiconductor designs. The current nature of the OSAT market is dynamic and fast-paced, often necessitating strategic partnerships and investments in R&D to effectively capitalise on emerging trends. Companies could see substantial growth by focusing on expanding service capabilities to include advanced analytical and testing services to meet evolving client needs. Strategic geographical expansions, especially in regions like Asia-Pacific with booming electronics industries, could provide a significant competitive edge.

KEY MARKET STATISTICS
Base Year [2023] USD 33.34 billion
Estimated Year [2024] USD 35.62 billion
Forecast Year [2030] USD 55.75 billion
CAGR (%) 7.62%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Outsourced Semiconductor Assembly & Test Services Market

The Outsourced Semiconductor Assembly & Test Services Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Public-private initiatives and incentives for semiconductor manufacturing
    • Growth in production of industrial electronics and medical devices
    • Significant inclination toward cost effective outsourced services
  • Market Restraints
    • Hidden unforeseen cost and limited flexibility in operations
  • Market Opportunities
    • Deployment of intelligent system in OSAT services
    • Rising investments and technologies for advanced packaging and testing
  • Market Challenges
    • Limited control over operations and data security concerns

Porter's Five Forces: A Strategic Tool for Navigating the Outsourced Semiconductor Assembly & Test Services Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Outsourced Semiconductor Assembly & Test Services Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Outsourced Semiconductor Assembly & Test Services Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Outsourced Semiconductor Assembly & Test Services Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Outsourced Semiconductor Assembly & Test Services Market

A detailed market share analysis in the Outsourced Semiconductor Assembly & Test Services Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Outsourced Semiconductor Assembly & Test Services Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Outsourced Semiconductor Assembly & Test Services Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Key Company Profiles

The report delves into recent significant developments in the Outsourced Semiconductor Assembly & Test Services Market, highlighting leading vendors and their innovative profiles. These include EV Group, GEM Electronics (Shanghai) Co., Ltd., Chipbond Technology Corporation, Carsem (M) Sdn Bhd, Unisem Group, Integra Technologies, King Yuan ELECTRONICS CO., LTD., yieldwerx, Sanmina Corporation, Integrated Micro-electronics Inc., Jiangsu Changdian Technology Co., Ltd., ASE Technology Holding Co, Ltd., Formosa Advanced Technologies Co., Ltd., Inari Amertron Berhad, LB Semicon, HANA Micron Inc., Natronix Semiconductor Technology Pte Ltd., Walton Advanced Engineering, Inc., AT Semicon Co., Ltd., Greatek Electronics Inc., Amkor Technology, Inc., Samsung Electronics Co., Ltd., LIPAC Co., Ltd., Lingsen Precision Industries , LTD., Nepes Corporation, ORIENT SEMICONDUCTOR ELECTRONICS LIMITED, Bluetest Testservice GmbH, Tongfu Microelectronics Co., Ltd., UTAC Holdings Ltd., Chipmos Technologies Inc., Powertech Technology Inc., and Doosan Corporation.

Market Segmentation & Coverage

This research report categorizes the Outsourced Semiconductor Assembly & Test Services Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Service Type, market is studied across Assembly & Packaging and Testing.
  • Based on Packaging Type, market is studied across Flip Chip, Wafer Level, and Wire Bond.
  • Based on End-User, market is studied across Computer & Networking, Consumer Electronics, Industrial Electronics, and Telecommunication.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Public-private initiatives and incentives for semiconductor manufacturing
      • 5.1.1.2. Growth in production of industrial electronics and medical devices
      • 5.1.1.3. Significant inclination toward cost effective outsourced services
    • 5.1.2. Restraints
      • 5.1.2.1. Hidden unforeseen cost and limited flexibility in operations
    • 5.1.3. Opportunities
      • 5.1.3.1. Deployment of intelligent system in OSAT services
      • 5.1.3.2. Rising investments and technologies for advanced packaging and testing
    • 5.1.4. Challenges
      • 5.1.4.1. Limited control over operations and data security concerns
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Service Type: Emerging need for assembly & packaging services for improving product durability and performance
    • 5.2.2. End-User: Expanding ownership of consumer electronics such as smartphones and wearable devices
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental
  • 5.5. Client Customization

6. Outsourced Semiconductor Assembly & Test Services Market, by Service Type

  • 6.1. Introduction
  • 6.2. Assembly & Packaging
  • 6.3. Testing

7. Outsourced Semiconductor Assembly & Test Services Market, by Packaging Type

  • 7.1. Introduction
  • 7.2. Flip Chip
  • 7.3. Wafer Level
  • 7.4. Wire Bond

8. Outsourced Semiconductor Assembly & Test Services Market, by End-User

  • 8.1. Introduction
  • 8.2. Computer & Networking
  • 8.3. Consumer Electronics
  • 8.4. Industrial Electronics
  • 8.5. Telecommunication

9. Americas Outsourced Semiconductor Assembly & Test Services Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific Outsourced Semiconductor Assembly & Test Services Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa Outsourced Semiconductor Assembly & Test Services Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
    • 12.3.1. Siemens Collaborates with SPIL to Deliver a 3D Verification Workflow for Fan-out Wafer-level Packaging
    • 12.3.2. Tata Group's Expansion in Electronics and Semiconductor Business
    • 12.3.3. Alchip Technologies Announces 3DFabric Alliance Support Plans
    • 12.3.4. India Close to Getting a USD 1 Billion Micron Technology Semiconductor Plant
    • 12.3.5. Amkor Expands Power Solutions for Automotive Electrification
    • 12.3.6. Amkor Expands Power Solutions for Automotive Electrification
    • 12.3.7. Amkor and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe
    • 12.3.8. Tuv Nord Group Acquires Majority Stake in HTV
    • 12.3.9. Integra Technologies Selects Kansas for Largest OSAT Semiconductor Project
    • 12.3.10. TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations
    • 12.3.11. Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
    • 12.3.12. Worldwide Semiconductor Assembly And Test Facility Database Now Tracks Integrated Device Manufacturers, 475 Facilities

Companies Mentioned

  • 1. EV Group
  • 2. GEM Electronics (Shanghai) Co., Ltd.
  • 3. Chipbond Technology Corporation
  • 4. Carsem (M) Sdn Bhd
  • 5. Unisem Group
  • 6. Integra Technologies
  • 7. King Yuan ELECTRONICS CO., LTD.
  • 8. yieldwerx
  • 9. Sanmina Corporation
  • 10. Integrated Micro-electronics Inc.
  • 11. Jiangsu Changdian Technology Co., Ltd.
  • 12. ASE Technology Holding Co, Ltd.
  • 13. Formosa Advanced Technologies Co., Ltd.
  • 14. Inari Amertron Berhad
  • 15. LB Semicon
  • 16. HANA Micron Inc.
  • 17. Natronix Semiconductor Technology Pte Ltd.
  • 18. Walton Advanced Engineering, Inc.
  • 19. AT Semicon Co., Ltd.
  • 20. Greatek Electronics Inc.
  • 21. Amkor Technology, Inc.
  • 22. Samsung Electronics Co., Ltd.
  • 23. LIPAC Co., Ltd.
  • 24. Lingsen Precision Industries , LTD.
  • 25. Nepes Corporation
  • 26. ORIENT SEMICONDUCTOR ELECTRONICS LIMITED
  • 27. Bluetest Testservice GmbH
  • 28. Tongfu Microelectronics Co., Ltd.
  • 29. UTAC Holdings Ltd.
  • 30. Chipmos Technologies Inc.
  • 31. Powertech Technology Inc.
  • 32. Doosan Corporation

LIST OF FIGURES

  • FIGURE 1. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET RESEARCH PROCESS
  • FIGURE 2. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2023 VS 2030 (%)
  • FIGURE 11. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 13. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 15. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 19. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 20. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 21. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET DYNAMICS
  • TABLE 7. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY ASSEMBLY & PACKAGING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY TESTING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY FLIP CHIP, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY WAFER LEVEL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY WIRE BOND, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COMPUTER & NETWORKING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY INDUSTRIAL ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY TELECOMMUNICATION, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 20. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 21. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 22. AMERICAS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 23. ARGENTINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 24. ARGENTINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 25. ARGENTINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 26. BRAZIL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 27. BRAZIL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 28. BRAZIL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 29. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 30. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 31. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 32. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 33. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 34. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 35. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 36. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 37. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 38. UNITED STATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 39. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 40. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 41. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 42. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 43. AUSTRALIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 44. AUSTRALIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 45. AUSTRALIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 46. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 47. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 48. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 49. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 50. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 51. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 52. INDONESIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 53. INDONESIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 54. INDONESIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 55. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 56. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 57. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 58. MALAYSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 59. MALAYSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 60. MALAYSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 61. PHILIPPINES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 62. PHILIPPINES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 63. PHILIPPINES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 64. SINGAPORE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 65. SINGAPORE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 66. SINGAPORE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 67. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 68. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 69. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 70. TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 71. TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 72. TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 73. THAILAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 74. THAILAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 75. THAILAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 76. VIETNAM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 77. VIETNAM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 78. VIETNAM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 79. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 80. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 81. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 82. EUROPE, MIDDLE EAST & AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 83. DENMARK OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 84. DENMARK OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 85. DENMARK OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 86. EGYPT OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 87. EGYPT OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 88. EGYPT OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 89. FINLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 90. FINLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 91. FINLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 92. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 93. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 94. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 95. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 96. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 97. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 98. ISRAEL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 99. ISRAEL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 100. ISRAEL OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 101. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 102. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 103. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 104. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 105. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 106. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 107. NIGERIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 108. NIGERIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 109. NIGERIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 110. NORWAY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 111. NORWAY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 112. NORWAY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 113. POLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 114. POLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 115. POLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 116. QATAR OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 117. QATAR OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 118. QATAR OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 119. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 120. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 121. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 122. SAUDI ARABIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 123. SAUDI ARABIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 124. SAUDI ARABIA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 125. SOUTH AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 126. SOUTH AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 127. SOUTH AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 128. SPAIN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 129. SPAIN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 130. SPAIN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 131. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 132. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 133. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 134. SWITZERLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 135. SWITZERLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 136. SWITZERLAND OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 137. TURKEY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 138. TURKEY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 139. TURKEY OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 140. UNITED ARAB EMIRATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 141. UNITED ARAB EMIRATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 142. UNITED ARAB EMIRATES OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 143. UNITED KINGDOM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY SERVICE TYPE, 2018-2030 (USD MILLION)
  • TABLE 144. UNITED KINGDOM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY PACKAGING TYPE, 2018-2030 (USD MILLION)
  • TABLE 145. UNITED KINGDOM OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SIZE, BY END-USER, 2018-2030 (USD MILLION)
  • TABLE 146. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 147. OUTSOURCED SEMICONDUCTOR ASSEMBLY & TEST SERVICES MARKET, FPNV POSITIONING MATRIX, 2023