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用於國防和航太應用的HDI（高密度互連）PCB：市場和技術預測（~2032年）
市場調查報告書
商品編碼
1573258

用於國防和航太應用的HDI（高密度互連）PCB：市場和技術預測（~2032年）

High-density Interconnect PCB for Defence and Space Applications - Market and Technology Forecast to 2032
出版日期: | 出版商: Market Forecast | 英文 145 Pages | 商品交期: 最快1-2個工作天內

價格
簡介目錄

高密度互連（HDI）PCB 現在是下一代國防和太空有效載荷和設備的關鍵技術。從商業應用到軍事和航太應用的轉變體現了其多功能性和先進功能，滿足關鍵任務環境中對小型化、提高性能和耐用性日益成長的需求。

HDI PCB 的主要貢獻之一是它們能夠支援現代國防和航太電子產品所需的更高速度和性能。隨著高速處理晶片的普及以及對高速資料傳輸的需求不斷增加，HDI PCB 具有獨特的優勢來促進這些進步。其多層設計和先進材料的使用可提供卓越的訊號完整性，即使在雷達、導航和電子戰系統等高頻應用中也能減少干擾和訊號損失。這使得 HDI PCB 成為先進軍事平台的理想選擇，例如無人機、戰鬥機和其他速度和精度非常重要的下一代防禦系統。

在國防和航太領域，HDI PCB 越來越受到重視，因為其緊湊的外形適合複雜的設計，可顯著減小組件尺寸和重量，同時保持高水準的功能。 HDI PCB 具有獨特的優勢，因為國防系統和太空任務需要電子設備不僅體積小、重量輕，而且能夠承受惡劣的條件。 HDI PCB 可以增加電路密度，在不增加整體設備尺寸的情況下整合多層功能。

從戰略角度來看，國防和航太應用的HDI PCB 市場預計到2032年將大幅成長。隨著全球國防現代化計畫的形勢增強以及太空領域的快速商業化和探索活動，對先進和高性能電子元件的需求預計將激增。

本報告調查了用於國防和航太應用的HDI（高密度互連）PCB 的市場和技術，提供技術概述、最新趨勢，市場成長的各種影響因素分析，市場規模推移和預測，各種區分、地區/主要國家的細分，競爭格局、主要公司簡介等。

目錄

第1章 執行摘要

第2章 簡介

第3章 科技與發展

  • 技術概述
    • HDI PCB 的演變
  • HDI PCB 所採用的關鍵技術
    • 雷射鑽孔技術
    • 雷射直接成像
    • 雷射可鑽孔層壓板和預浸料
  • 微孔和高密度連接器
    • 微孔
    • 高密度 PCB 連接器
  • 連續層壓與層壓技術
  • 顯著的技術發展
    • 超 HDI PCB

第4章 市場概述

  • HDI PCB 市場分佈：依地區
  • 主要公司概覽
    • HDI PCB材料公司
    • HDI PCB機械公司
    • HDI PCB 製造與組裝
  • 近期合約摘要
  • 主要客戶：概覽
  • 近期產品介紹摘要
  • 供應鏈概覽
  • 重要原料

第5章 市場動態與預測因子

  • 市場區隔
    • 主要區域細分市場
    • 依用途細分
  • 促進因素
  • 趨勢
  • 機會
  • 課題

第6章 國家分析

  • 摘要
  • 美國
  • 加拿大
  • 墨西哥
  • 歐盟
  • ESA
  • 中國
  • 台灣

第7章 全球與區域市場預測

  • HDI PCB 市場概覽：依地區
  • HDI PCB 市場：依地區和技術劃分
    • 北美
    • 歐洲：歐盟27國
    • 歐洲：非歐盟27國
    • 亞太地區
    • 中東、非洲
    • 拉丁美洲
  • 機會分析
    • 依地區

第8章 市場預測：依應用

  • HDI PCB 市場概覽：依應用分類
  • HDI PCB 市場：依地區和應用劃分
    • 航空
    • 陸上
    • 海洋/船舶
    • 宇宙
  • 機會分析
    • 依用途

第9章 影響分析

  • 預測因子與市場影響
    • "晶片到系統" 方法的重要性與日俱增
    • 原物料供應狀況與採購障礙
    • 情境分析

第10章 主要公司

  • ACB Group
  • AGC Multi Materials
  • Amphenol Invotec
  • Austria Technologie & Systemtechnik AG (AT&S)
  • Introduction
  • DuPont (Electrical & Industrial)
  • Firan Technology Group (FTG)
  • Isola Group
  • NCAB Group
  • Sierra Circuits Inc.
  • 雷射直接成像（LDI）領域的主要公司
    • Orbotech (a KLA Company)
    • LPKF Laser & Electronics
    • Mitsubishi Electric
    • SCREEN Holdings Co., Ltd.
    • Manz AG
    • First EIE SA
    • Limata GmbH
    • Miva Technologies GmbH

第11章 結果/概述

第12章 關於市場預測

附錄A：上市公司

附錄B：縮寫

簡介目錄
Product Code: MF242240

Market forecasts by Regions and Applications. Market and Technologies Overview, Critical Raw Materials, Country Analysis, Opportunity and Impact Analysis, , and Leading Companies.

High-Density Interconnect (HDI) PCBs have now become a crucial technology in next-generation defence and space payloads and devices. Their transition from commercial to military and aerospace applications highlights their versatility and advanced capabilities, meeting the growing demands for miniaturization, enhanced performance, and durability in mission-critical environments.

One of the key contributions of HDI PCBs is their ability to support the increasing speed and performance demands of modern defence and space electronics. With the proliferation of high-speed processing chips and the growing need for rapid data transfer, HDI PCBs are uniquely positioned to facilitate these advancements. Their multi-layer designs and use of advanced materials enable superior signal integrity, reducing interference and signal loss even in high-frequency applications such as radar, navigation, and electronic warfare systems. This makes HDI PCBs ideal for advanced military platforms, including UAVs, fighter jets, and other next-generation defence systems, where both speed and precision are paramount.

Our study "High-Density Interconnect PCB Technology - Market and Technology Forecast to 2032" covers the market demand potential for HDI PCBs in the defence and space sectors.

In the defence and space sectors, HDI PCBs are increasingly valued for their ability to handle complex designs within a compact form factor, significantly reducing the size and weight of components while maintaining high levels of functionality. As defence systems and space missions require electronics that are not only smaller and lighter but also capable of withstanding extreme conditions, HDI PCBs offer a unique advantage. They allow for increased circuit density, enabling the integration of multiple layers of functionality without increasing the overall size of the device.

From a strategic perspective, the market for HDI PCBs in defence and space applications is poised for significant growth through 2032. As global defence modernization programs gain momentum and the space sector witnesses rapid commercialization and exploration activities, the demand for advanced, high-performance electronic components is expected to soar. This study highlights key market trends, including the increasing collaboration between defence contractors, aerospace companies, and HDI PCB manufacturers, as well as the emergence of new manufacturing techniques that further drive innovation in this sector.

Additionally, regional insights are provided to outline the adoption trends across key markets worldwide. The study examines how different regions are responding to the technological shift towards HDI PCBs, with a focus on defence investments, space exploration initiatives, and the evolving regulatory landscape. Moreover, the competitive analysis section profiles leading HDI PCB manufacturers, offering insights into their technological advancements, market positioning, and product portfolios.

The study particularly addresses the recent developments and emphasis on reshoring PCB production by North American and European governments. The shifting landscape of global electronics production is driving developed countries to reevaluate their reliance on Asian manufacturers, especially in the context of critical raw materials and the growing emphasis on local production of Printed Circuit Boards (PCBs). This transformation is significantly impacting the dynamics of the HDI PCB value chain, as governments and industries in the West increasingly prioritize supply chain security and technological sovereignty.

Critical raw materials, such as rare earth elements and high-performance substrates essential for HDI PCBs, have become central to this strategic shift. Supply chain disruptions and geopolitical tensions have highlighted the vulnerability of relying on a concentrated pool of suppliers, particularly from Asia. In response, developed nations are ramping up efforts to secure these materials through domestic production, recycling initiatives, and strategic partnerships, aiming to reduce their dependence on imports from key Asian markets.

This move towards restoring local manufacturing capabilities is driven by the need for greater control over the production of advanced electronics, particularly in defence, aerospace, and other high-tech industries where HDI PCBs are critical. As the demand for HDI PCBs in these sectors grows, ensuring a steady, reliable supply of components is essential for national security and technological competitiveness. Countries like the United States and those within the European Union are investing heavily in PCB fabrication infrastructure, incentivizing local manufacturers, and encouraging innovation in PCB technology to meet these evolving demands.

This study has many such insights that will unveil the market demand and potential challenges the technology might face through 2032.

Covered in this study:

  • Overview: Snapshot of the HDI PCB technology in the defence and space market during 2024-2032, including highlights of the demand drivers, trends, and challenges. It also provides a snapshot of the spending with respect to regions as well as segments and sheds light on the emergence of new technologies.
  • Market Dynamics: Insights into the technological developments in the HDI PCB market and a detailed analysis of the changing preferences of governments around the world. It also analyses changing industry structure trends and the challenges faced by the industry participants.
  • Segment Analysis:Insights into the various HDI PCB markets from a segmental perspective and a detailed analysis of factors influencing the market for each segment.
  • Regional Review: Insights into modernization patterns and budgetary allocation for top countries within a region.
  • Regional Analysis: Insights into the HDI PCB market from a regional perspective and a detailed analysis of factors influencing the market for each region.
  • Impact Analysis: Analysis of how certain events will impact the HDI PCBs market. This will give you an indication of which factors are important for the forecast.
  • Key Program Analysis: Details of the top programmes in each segment expected to be executed during the forecast period.
  • Competitive landscape Analysis: Analysis of the competitive landscape of this industry. It provides an overview of key companies, together with insights such as key alliances, strategic initiatives, and a SWOT analysis.

Segmentation

The market has is segmented by Region and Application:

Region

  • EU-27
  • Non-EU 27
  • North America
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Applications

  • Ground
  • Air
  • Marine
  • Space

Reasons to buy:

  • To address the procurement and market analysis needs for HDI PCBs in defence and space applications over the next eight years.
  • Conduct a comprehensive analysis of prospective procurement areas based on market trends and government programs. Identify specific areas of demand growth for HDI PCBs in defence and space applications, such as communication systems, command and control systems, radars,weapon systems, next-generation avionics and countermeasures.
  • Develop a procurement plan that aligns with technological advancements and industry dynamics.
  • Gain insights into the factors driving demand for HDI PCBs in leading countries and emerging markets. Identify opportunities presented by each market segment based on defence spending, technological advancements, and geopolitical factors. Analyze market potential in terms of applications like space-based internet, inter-satellite communication, and deep space missions.
  • Strengthen understanding of market demand drivers, industry trends, regulatory landscapes, and technological developments influencing the adoption of HDI PCBs in defence and space applications. Monitor advancements in HDI PCB technology.
  • Identify key channels driving the global HDI PCBs market for defence and space applications. Evaluate opportunities in government procurement programs, defence contracts, research collaborations, and commercial partnerships. Explore avenues for revenue expansion through market penetration and diversification.
  • Conduct a comprehensive analysis of the competitive landscape in the HDI PCBs market. Profile leading providers of HDI PCbs for defence and space applications worldwide, including their product offerings, market presence, research capabilities, and strategic initiatives. Assess competitive positioning to make informed business decisions and identify potential partnership opportunities.

Companies Listed:

  • Advanced Circuits
  • AGC Multi Material America, Inc. (AMMA)
  • Austria Technologie & Systemtechnik AG
  • Cicor Group
  • DuPont
  • Electro Scientific Industries, Inc.
  • Elvia PCB Group
  • Eurocircuits
  • Hitachi High-Tech Corporation
  • ICAPE Group
  • Isola Group
  • LPKF Laser & Electronics AG
  • Manz AG
  • Mitsubishi Electric Corporation
  • NCAB Group
  • Oerlikon Balzers
  • Ohmega Technologies
  • Panasonic
  • Rogers Corporation
  • Sanmina Corporation
  • Schmid Group
  • Schweizer Electronic AG
  • Sierra Circuits
  • Suss MicroTec:
  • Ticer Technologies
  • TTM Technologies
  • Ventec International Group

Table of Contents

1. Executive Summary

  • 1.1. Trends and Insights
  • 1.2. Main Findings
  • 1.3. Key Conclusions

2. Introduction

  • 2.1. Scope
  • 2.2. Definitions
  • 2.3. Methodology
  • 2.4. Who will benefit from this study?

3. Technologies and Developments

  • 3.1. Technology Overview
    • 3.1.1. Evolution of HDI PCBs
  • 3.2. Critical Technologies used in HDI PCBs
    • 3.2.1. Laser Drilling Technology
    • 3.2.2. Laser Direct Imaging
    • 3.2.3. Laser Drillable Laminates and Prepregs
  • 3.3. Microvias and High-density Connectors
    • 3.3.1. Microvias
    • 3.3.2. High-density PCB Connectors
  • 3.4. Sequential Lamination and Layering Technologies
  • 3.5. Notable Technology Developments
    • 3.5.1. Ultra HDI PCBs

4. Market Overview

  • 4.1. Introduction
  • 4.2. HDI PCB market volume distribution over the forecast period by Region
  • 4.3. Main market players overview
    • 4.3.1. HDI PCB Material Companies
    • 4.3.2. HDI PCB Machinery Companies
    • 4.3.3. HDI PCB Fabrication and Assembly
  • 4.4. Recent contracts overview
    • 4.4.1. Calumet Electronics and Green Source Awarded Major Contracts to Boost Advanced PCB Production
    • 4.4.2. Micross Components Awarded Major Contract to Develop Advanced Packaging Capabilities for Department of Defence
  • 4.5. Main customers overview
  • 4.6. Recent product introductions Overview
    • 4.6.1. ESA Approves VT-901 as the First Qualified HDI Material
    • 4.6.2. Atotech Demonstrated Printoganth T1 and InPro
  • 4.7. Supply Chain Overview
  • 4.8. Critical Raw Materials
    • 4.8.1. Laser Drillable (LD) Prepregs
    • 4.8.2. Substrate Material

5. Market Dynamics and Forecast Factors

  • 5.1. Market Segmentation
    • 5.1.1. Segments by Key Regions
    • 5.1.2. Segmentation by Application
  • 5.2. Drivers
  • 5.3. Trends
  • 5.4. Opportunities
  • 5.5. Challenges

6. Country Analysis

  • 6.1. Overview
  • 6.2. USA
    • 6.2.1. Section 841 of the FY 2021 NDAA
    • 6.2.2. NDS and NDIS
    • 6.2.3. The CHIPS and Science Act of 2022
    • 6.2.4. The Defence Production Act (DPA) Title III program
    • 6.2.5. Defence Production Act Investment (DPAI) Program
    • 6.2.6. Supporting PCB Act 2022 and PCBS Act 2023
    • 6.2.7. Relevant contracts
  • 6.3. Canada
  • 6.4. Mexico
  • 6.5. European Union
    • 6.5.1. Europe Chips Act
    • 6.5.2. Horizon Focusing
    • 6.5.3. JTF-2021/23-15 - High Challenges for PCBs and SMT (Surface Mount Technologies)
  • 6.6. ESA
    • 6.6.1. General Support Technology Programme (GSTP)
    • 6.6.2. G61A-017QT
    • 6.6.3. ESA HDI PCB Technology Roadmap
    • 6.6.4. ESA Qualified HDI PCB Suppliers
  • 6.7. China
  • 6.8. Taiwan

7. Global and Regional Market Forecast to 2032

  • 7.1. Introduction
  • 7.2. HDI PCB market by Region overview
  • 7.3. HDI PCB Market Regions by Technology
    • 7.3.1. North America HDI PCB Market by Technology
    • 7.3.2. EU-27 HDI PCB Market by Technology
    • 7.3.3. Non EU-27 HDI PCB Market by Technology
    • 7.3.4. APAC HDI PCB Market by Technology
    • 7.3.5. MEA HDI PCB Market by Technology
    • 7.3.6. LATAM HDI PCB Market by Technology
  • 7.4. Opportunity Analysis
    • 7.4.1. By Region

8. Market Forecast to 2032 by Application

  • 8.1. Introduction
  • 8.2. HDI PCB market by Application overview
  • 8.3. HDI PCB Applications Market by Region
    • 8.3.1. Airborne HDI PCB Market by Region
    • 8.3.2. Ground-based HDI PCB market by Region
    • 8.3.3. Naval-based HDI PCB market by Region
    • 8.3.4. Space-based HDI PCB market by Region
  • 8.4. Opportunity Analysis
    • 8.4.1. By Application

9. Impact Analysis

  • 9.1. Introduction
  • 9.2. Forecast Factors and Market Impact
    • 9.2.1. Growing Emphasis on"Silicon to System" approach
    • 9.2.2. Challenges in Raw Material Availability and Procurement Hurdles
    • 9.2.3. Scenario Analysis

10. Leading Companies

  • 10.1. ACB Group
    • 10.1.1. Introduction
    • 10.1.2. Related Products and Services
    • 10.1.3. Recent Developments and Contracts
    • 10.1.4. SWOT Analysis
  • 10.2. AGC Multi Materials
    • 10.2.1. Introduction
    • 10.2.2. Related Products and Services
    • 10.2.3. Recent Developments and Contracts
    • 10.2.4. SWOT Analysis
  • 10.3. Amphenol Invotec
    • 10.3.1. Introduction
    • 10.3.2. Related Products and Services
    • 10.3.3. Recent Developments and Contracts
    • 10.3.4. SWOT Analysis
  • 10.4. Austria Technologie & Systemtechnik AG (AT&S)
    • 10.4.1. Introduction
    • 10.4.2. Related Products and Services
    • 10.4.3. SWOT Analysis
  • 10.5. Calumet Electronics Corporation
    • 10.5.1. Introduction
    • 10.5.2. Related Products and Services
    • 10.5.3. Recent Developments and Contracts
    • 10.5.4. SWOT Analysis
  • 10.6. DuPont (Electrical & Industrial)
    • 10.6.1. Introduction
    • 10.6.2. Related Products and Services
    • 10.6.3. SWOT Analysis
  • 10.7. Firan Technology Group (FTG)
    • 10.7.1. Introduction
    • 10.7.2. Related Products and Services
    • 10.7.3. Recent Developments and Contracts
    • 10.7.4. SWOT Analysis
  • 10.8. Isola Group
    • 10.8.1. Introduction
    • 10.8.2. Related Products and Services
    • 10.8.3. Recent Developments and Contracts
    • 10.8.4. SWOT Analysis
  • 10.9. NCAB Group
    • 10.9.1. Introduction
    • 10.9.2. Related Products and Services
    • 10.9.3. Recent Developments and Contracts
    • 10.9.4. SWOT Analysis
  • 10.10. Sierra Circuits Inc.
    • 10.10.1. Introduction
    • 10.10.2. Related Products and Services
    • 10.10.3. Recent Developments and Contracts
    • 10.10.4. SWOT Analysis
  • 10.11. Leading Companies in Laser Direct Imaging (LDI)
    • 10.11.1. Orbotech (a KLA Company)
    • 10.11.2. LPKF Laser & Electronics
    • 10.11.3. Mitsubishi Electric
    • 10.11.4. SCREEN Holdings Co., Ltd.
    • 10.11.5. Manz AG
    • 10.11.6. First EIE SA
    • 10.11.7. Limata GmbH
    • 10.11.8. Miva Technologies GmbH

11. Results and Conclusions

12. About Market Forecast

  • 12.1. General
  • 12.2. Contact us
  • 12.3. Disclaimer
  • 12.4. License

Appendix A: Companies Mentioned

Appendix B: Abbreviations

List of figures

  • Figure 1: HDI PCB Market Summary by Region
  • Figure 2: Market volumes over the forecast period per region
  • Figure 3: Market Segmentation and Sub-Segmentation HDI PCB Market
  • Figure 4: Global and Regional HDI PCB Defence and Space Market 2024 - 2032 [US$ million]
  • Figure 5: Global HDI PCB Market Forecast to 2032 by Region [%]
  • Figure 6: North America HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
  • Figure 7: EU-27 HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
  • Figure 8: Non EU-27 HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
  • Figure 9: APAC HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
  • Figure 10: MEA HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
  • Figure 11: LATAM HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
  • Figure 12: HDI PCB market size, 2024-2032 (US$ million) by region
  • Figure 13: HDI PCB market CAGR, 2024-2032 by region
  • Figure 14: Global HDI PCB Market Forecast to 2032 by Application [US$ million]
  • Figure 14: Airborne HDI PCB Market Forecast to 2032 by Region [US$ million]
  • Figure 15: Ground-based HDI PCB Market Forecast to 2032 by Region [US$ million]
  • Figure 16: Naval-based HDI PCB Market Forecast to 2032 by Region [US$ million]
  • Figure 17: HDI PCB for Space Applications Market Forecast to 2032 by Region [US$ million]
  • Figure 18: HDI PCB market size, 2024-2034 (US$ million) by Application
  • Figure 19: HDI PCB market CAGR, 2024-2034 by Application
  • Figure 20: HDI PCB Market Forecast to 2031 Scenario I Vs. Scenario II

List of tables

  • Table 1: HDI PCB Market Summary by Region [US$ million]
  • Table 2: HDI PCB Technology Characteristics
  • Table 3: Microvias and High-density Connectors
  • Table 4: HDI PCB Material Companies
  • Table 5: HDI PCB Machinery Companies
  • Table 6: HDI PCB Machinery Companies
  • Table 7: HDI PCB Supply Chain
  • Table 8: HDI PCB Market Defence and Space Forecast to 2032 by Region [US$ million]
  • Table 9: North America HDI PCB Market Forecast to 2032 by Technology [US$ million]
  • Table 10: EU-27 HDI PCB Market Forecast to 2032 by Technology [US$ million]
  • Table 11: Non EU-27 HDI PCB Market Forecast to 2032 by Technology [US$ million]
  • Table 12: APAC HDI PCB Market Forecast to 2032 by Technology [US$ million]
  • Table 13: MEA HDI PCB Market Forecast to 2032 by Technology [US$ million]
  • Table 14: LATAM HDI PCB Market Forecast to 2032 by Technology [US$ million]
  • Table 15: Global HDI PCB Market Forecast to 2032 by Application [US$ million]
  • Table 15: Airborne HDI PCB Market Forecast to 2032 by Region [US$ million]
  • Table 17: Ground-based HDI PCB Market Forecast to 2032 by Region [US$ million]
  • Table 18: Naval-based HDI PCB Market Forecast to 2032 by Region [US$ million]
  • Table 19: HDI PCB for Space Applications Market Forecast to 2032 by Region [US$ million]
  • Table 20: HDI PCB Market Forecast to 2032 Scenario I Vs. Scenario II [US$ million]
  • Table 21: ACB Group Company SWOT Analysis
  • Table 22: AGC Group Company SWOT Analysis
  • Table 23: Amphenol Invotec Company SWOT Analysis
  • Table 24: AT&S Company SWOT Analysis
  • Table 25: Calumet Company SWOT Analysis
  • Table 26: DuPont Company SWOT Analysis
  • Table 27: Firan Technology Company SWOT Analysis
  • Table 28: Isola Group Company SWOT Analysis
  • Table 29: NCAB Group Company SWOT Analysis
  • Table 30: Sierra Circuits Company SWOT Analysis