半導體後端設備：市場佔有率分析、產業趨勢與統計、成長預測（2025-2030 年）

Semiconductor Back-End Equipment - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)

出版日期: 2025年03月18日 | 出版商:

Mordor Intelligence | 英文 137 Pages | 商品交期: 2-3個工作天內

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簡介目錄

半導體後端設備市場預計在 2025 年達到 204.8 億美元，在 2030 年達到 311.5 億美元，預測期內（2025-2030 年）的複合年成長率為 8.75%。

主要亮點

能源轉型、電氣化和人工智慧等技術的採用是再形成全球市場半導體需求的前沿。例如，人工智慧（AI）融入半導體產業預示著創新、效率和機會的新時代的到來。過去，半導體產業主要擔任其他高科技產業的推動者。
但人工智慧正在使半導體成為改變技術發展和重塑產業經濟格局的前沿。例如，人工智慧晶片被用於自動駕駛汽車。這使得它能夠根據周圍環境做出即時決策。人工智慧晶片也用於醫療保健行業，用於即時監控患者和檢測健康問題。這些創新正在改變我們的生活和工作方式，使生活變得更輕鬆、更有效率。
此外，世界正日益轉向再生能源來源，以減少對不再生燃料的依賴並應對氣候變遷。電氣化是實現這一轉變的關鍵策略，半導體在改變能源的產生、儲存和消耗方式方面發揮核心作用。
半導體，尤其是類比產品和嵌入式處理產品，可以透過更智慧、更可靠、更易於存取的太陽能能源儲存系統和電動車充電系統實現電氣化。因此，透過專注於高壓功率、電流和電壓感測、邊緣處理和連接產品四個關鍵領域，每家公司都在應對各個終端用戶市場中半導體不斷變化的動態以及推動後端設備在先進半導體晶圓、封裝和組裝製程中的作用方面發揮著關鍵作用。
半導體產業正在迅速擴張，對半導體製造設備的需求也隨之激增。然而，半導體製造設備的價格對於半導體產業來說是一個非常重要的因素。設備成本對半導體的生產成本有很大影響，進而影響最終產品的價格。預計這將抑制市場成長。
預計宏觀經濟不確定性、消費者支出下降和全球經濟波動等因素將阻礙晶片需求。通常，在景氣衰退時期，消費支出會下降，從而減少對嚴重依賴半導體的智慧型手機、平板電腦和筆記型電腦等消費性電子產品的需求。假設全球經濟持續惡化，消費需求進一步減弱。如果是這樣，預計這些因素將在未來幾年對半導體市場產生負面影響。

半導體後端設備市場趨勢

組裝和包裝部門預計將顯著成長

預計該領域的成長將受到扇出型晶圓級封裝（FOWLP）、晶圓級封裝（WLP）和系統級封裝（SiP）等尖端封裝技術日益普及的推動。此外，封裝技術的最新進展導致了堆疊 WLCSP 等封裝技術的出現，這種技術允許將多個積體電路整合到單一封裝中。這些進步包括邏輯和記憶體晶片的結合，以及記憶體晶片的堆疊。因此，預計先進封裝的需求將會激增，從而需要購買相應的設備。
半導體積體電路在各個領域的應用迅速增加，導致對半導體封裝和組裝設備的需求增加。電子產業就是一個例子，由於電子設備及其應用的激增，對此類設備的需求正在成長。預計這將大大促進需求的成長。同樣，對更小、更快、更有效率的半導體的需求不斷成長，推動了對先進封裝技術的需求，從而增加了對半導體封裝設備的需求。
全球各產業對半導體的需求不斷成長，導致半導體產能擴大，進而推動半導體後端設備市場的成長。 2023年8月，知名半導體代工廠台積電開始向多家尖端封裝設備供應商新訂單。與該公司密切合作的供應商包括Gudeng Precision Industrial、Apic Yamada、Disco 和 Scientech。台積電決定與設備供應商合作，體現了該公司不斷努力加強其先進封裝能力。
半導體晶片利用率和產量的大幅成長是半導體封裝和組裝設備產業擴張的主要驅動力。此外，SIA 支持的 WSTS 最近發布的行業預測顯示，2023 年全球銷售額將下降 9.4%，然後在 2024 年成長 13.1%。該預測預計 2023 年全球銷售額將達到 5,200 億美元，低於 2022 年的 5,741 億美元。到 2024 年，全球銷售額預計將成長到 5,884 億美元。這些積極的行業趨勢可能會使包裝設備供應商抓住市場機會。
預計市場將受到美光、台積電和日月光等知名供應商對封裝技術的投資以及其他供應商利用這些技術的優勢的推動。蘋果、三星、英特爾等公司使用先進晶片封裝 (ACP) 將多個組件整合到單一基板，從而提高設備性能和效率。僱用這樣的公司可能會推動 ATP 設備的成長。

亞太地區預計將出現顯著的市場成長

中國正在推動雄心勃勃的半導體計劃，並投入 1500 億美元的資金。該國的目標是加強國內積體電路產業並提高晶片產量。正在進行的美國貿易戰加劇了這一關鍵尖端製程技術領域的緊張局勢，導致許多中國公司投資半導體代工廠。中國已宣布多項舉措以促進其半導體產業發展，包括在代工、氮化鎵（GaN）和碳化矽（SiC）市場進行大規模宣傳活動。
該地區不斷成長的半導體業務和不斷提高的晶片生產能力預計將推動對後端設備的需求。中國高科技產業正利用其在通訊、可再生能源和電動車領域的強大影響力，力爭提升其在全球技術價值鏈中的地位。
除了這些領域之外，該行業現在還將重點放在先進的半導體上。這種轉變主要得益於先進節點製造技術的進步、記憶體市場的擴張、積極參與碳化矽 (SiC) 競賽以及對先進封裝和製造設備的策略性投資。預計中國各地代工業務的擴張和晶圓廠的投資將重振市場。
近年來，韓國半導體產業成長顯著，產量和出貨量均大幅增加。這種快速成長標誌著技術進步的復甦，對韓國經濟和全球科技產業來說是個好兆頭。三星、SK海力士等韓國領先的半導體公司已成為全球半導體產業的主要企業。該地區晶片產能的擴大預計將進一步提振後端設備市場。
該地區各個市場晶片需求的激增引起了人們對後端半導體業務的關注。預計專門從事下游加工的公司將在未來幾年繼續大力投資和技術進步。

半導體後端設備產業概況

半導體後端設備市場半固體，既有全球參與者，也有中小型企業。市場的主要企業包括 ASML Holding NV、應用材料公司 (Applied Materials Inc.)、LAM Research Corporation、東京電子有限公司 (Tokyo Electron Limited) 和 KLA Corporation。市場參與者正在採取夥伴關係、擴張和收購等策略來加強其產品供應並獲得永續的競爭優勢。

2023 年 12 月，應用材料公司和 CEA-Leti 擴大了合作，建立了一個聯合實驗室，專注於為 ICAPS 市場（物聯網、通訊、汽車、電力和感測器）提供專用半導體應用的材料工程解決方案。該實驗室旨在透過滿足物聯網、電動車和智慧電網基礎設施的需求來加速下一代設備的創新。計劃將解決材料工程難題，以提高效能、降低功耗並縮短時間。
2023 年 11 月，三星電子與 ASML 控股簽署初步協議，將在韓國投資 1 兆韓元（7.6 億美元）建立聯合研發機構。此次合作概述於 ASML 總部簽署的合作備忘錄中列出，將專注於使用 ASML 尖端的極紫外線 (EUV) 工具開發記憶體晶片。作為全球唯一的 EUV 掃描儀製造商，ASML 的技術對於複雜的半導體圖形化、簡化製造流程和提高生產產量比率至關重要。該研發中心是ASML共同設立的首個海外設施，將專注於開發基於下一代EUV技術的超精細半導體製造流程。

其他福利

Excel 格式的市場預測 (ME) 表
3 個月的分析師支持

Key Highlights

Incorporating technologies such as energy transition, electrification, and AI has been at the forefront of reshaping the demand for semiconductors in the global market. For instance, integrating artificial intelligence (AI) into the semiconductor industry signals a new era of innovation, efficiency, and opportunity. In the past, the industry primarily served as an enabler for other high-tech sectors.
However, with AI, semiconductors are at the forefront of transforming technology development, reshaping the industry's economic landscape. For instance, AI-powered chips are used in self-driving cars. This enables them to make real-time decisions based on their surroundings. AI-powered chips are also used in the healthcare industry for real-time monitoring of patients and detecting health issues. These innovations can transform the way of living and working, making lives more accessible and efficient.
Furthermore, the world is increasingly shifting toward renewable energy sources to reduce reliance on non-renewable fuels and combat climate change. Electrification is a key strategy for achieving this transition, and semiconductors are playing a central role in revolutionizing how energy is generated, stored, and consumed.
Semiconductors, particularly analog and embedded processing products, are well positioned to enable electrification through smarter, more reliable, and accessible solar-energy storage and electric-vehicle charging systems. Thus, companies are playing a significant role in addressing the changing dynamics of semiconductors in various end-user markets by focusing on four critical areas, namely high-voltage power, current and voltage sensing, edge processing, and connectivity products, thus driving the role of back-end equipment for advanced semiconductor wafers, packaging, and assembly process.
The semiconductor industry has been expanding rapidly, and the demand for semiconductor manufacturing equipment has also surged. However, the price of these machines has turned out to be a crucial factor in the industry. The equipment cost can have a noteworthy impact on the production cost of semiconductors, affecting the final product's price. This is expected to restrain the market's growth.
Factors such as macroeconomic uncertainty, decreased consumer spending, and fluctuations in the global economy are expected to hamper chip demand. Consumer spending typically decreases during an economic downturn, reducing demand for consumer electronics like smartphones, tablets, and laptops, which rely heavily on semiconductors. Suppose the global economy continues to deteriorate and consumer demand weakens further. In that case, these factors are anticipated to have a detrimental effect on the semiconductor market in the upcoming years.

Semiconductor Back-End Equipment Market Trends

Assembly and Packaging Segment is Expected to Witness Significant Growth

The segment's growth is expected to be driven by the increasing acceptance of cutting-edge packaging techniques such as fan-out wafer-level packaging (FOWLP), wafer-level packaging (WLP), and system-in-package (SiP). Furthermore, recent advancements have led to the emergence of packaging technologies like stacked WLCSPs, which enable the integration of multiple integrated circuits in a single package. These advancements encompass a combination of logic and memory chips, as well as stacked memory chips. As a result, the demand for advanced packaging is anticipated to surge, necessitating the acquisition of corresponding equipment.
The surge in the utilization of semiconductor ICs in various sectors has led to a rise in the requirement for semiconductor packaging and assembly equipment. An example is the electronics industry's expanding necessity for such equipment, driven by the widespread use of electronic devices and their applications. This is anticipated to be a significant factor contributing to the increased demand. Likewise, the growing need for smaller, faster, and more efficient semiconductors is propelling the demand for advanced packaging technologies, fueling the demand for semiconductor packaging equipment.
The increasing global need for semiconductors in different industries has led to an expansion in their production capacity, consequently fueling the growth of the semiconductor back-end equipment market. In August 2023, TSMC, a prominent semiconductor foundry, initiated new orders with multiple suppliers of state-of-the-art packaging equipment. Gudeng Precision Industrial, Apic Yamada, Disco, and Scientech are among the suppliers working closely with the company. TSMC's decision to engage with equipment suppliers reflects its ongoing commitment to enhancing its advanced packaging capabilities.
The significant growth in the utilization and production of semiconductor chips is a key driver behind the expansion of the semiconductor packaging and assembly equipment sector. Moreover, a recent industry forecast by WSTS, supported by SIA, predicts a 9.4% decline in global sales for 2023, followed by a 13.1% increase in 2024. The forecast anticipates that global sales will amount to USD 520 billion in 2023, a decrease from the USD 574.1 billion recorded in 2022. By 2024, global sales are expected to rise to USD 588.4 billion. These positive industry trends will enable packaging equipment vendors to capitalize on market opportunities.
The market is anticipated to be driven by the investments made by prominent vendors such as Micron, TSMC, and ASE in packaging technologies, along with other vendors capitalizing on the advantages offered by these technologies. Apple, Samsung, and Intel are among the companies that utilize advanced chip packaging (ACP) to enhance device performance and efficiency by consolidating multiple components onto a single substrate. Such adoption by the companies will enhance the growth of ATP equipment.

Asia-Pacific Expected to Witness Significant Growth in the Market

China is pursuing an ambitious semiconductor agenda with the support of USD 150 billion in funding. The country aims to enhance its domestic IC industry and increase its chip production. The ongoing US-China trade war has intensified tensions in this crucial sector, where the most advanced process technology is concentrated, leading many Chinese companies to invest in semiconductor foundries. China has unveiled various initiatives to strengthen its semiconductor sector, such as a substantial expansion campaign in the foundry, gallium-nitride (GaN), and silicon carbide (SiC) markets.
The growing semiconductor business and increasing chip production capabilities in the region are expected to drive the demand for back-end equipment. China's tech industry aims to ascend the global technology value chain by capitalizing on its strong presence in telecommunications, renewables, and electric vehicles (EVs).
In addition to these sectors, the industry is now focusing on advanced semiconductors. This transition is primarily driven by advancements in advanced node manufacturing, the expansion of the memory market, active involvement in the silicon carbide (SiC) race, and strategic investments in advanced packaging and manufacturing equipment. The growing foundry business and investments in fabs throughout China are anticipated to stimulate the market.
South Korea has seen notable growth in its semiconductor industry over the past few years, with a substantial increase in both production and shipments. This surge indicates a resurgence in technological advancement, which bodes well for the country's economy and the global tech sector. Leading South Korean semiconductor companies like Samsung and SK Hynix have established themselves as key players in the global semiconductor industry. The expanding chip production capabilities in the region will further boost the market for back-end equipment.
The surge in chip demand across various markets in the region has brought attention to the back-end semiconductor business. Companies specializing in back-end processes are anticipated to persist in making aggressive investments and technological advancements in the upcoming years.

Semiconductor Back-End Equipment Industry Overview

The semiconductor back-end equipment market is semi-consolidated due to the presence of both global players and small and medium-sized enterprises. Some of the major players in the market are ASML Holding NV, Applied Materials Inc., LAM Research Corporation, Tokyo Electron Limited, and KLA Corporation. Players in the market are adopting strategies such as partnerships, expansions, and acquisitions to enhance their product offerings and gain sustainable competitive advantage.

December 2023: Applied Materials and CEA-Leti have expanded their collaboration with a joint lab focusing on materials engineering solutions for specialty semiconductor applications, catering to ICAPS markets (IoT, communications, automotive, power, and sensors). The lab aims to accelerate innovation for next-gen devices by addressing demands from IoT, electric vehicles, and smart grid infrastructure. Projects will tackle materials engineering challenges to enhance ICAPS device performance, reduce power consumption, and achieve faster time to market.
November 2023: Samsung Electronics and ASML Holding have inked a preliminary agreement to invest 1 trillion WON (USD 760 million) in a joint research and development facility in South Korea. The collaboration, outlined in a memorandum of understanding signed at ASML's headquarters, focuses on advancing memory chips using ASML's cutting-edge extreme ultraviolet (EUV) equipment. As the exclusive EUV scanner manufacturer globally, ASML's technology is pivotal for intricate semiconductor patterning, streamlining manufacturing, and enhancing production yields. The R&D center, the first overseas facility jointly established by ASML, will concentrate on developing ultra-fine semiconductor manufacturing processes based on next-generation EUV technology.

Additional Benefits:

The market estimate (ME) sheet in Excel format
3 months of analyst support

1 INTRODUCTION

1.1 Study Assumptions and Market Definition
1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

4.1 Market Overview
4.2 Industry Attractiveness - Porter's Five Forces Analysis
- 4.2.1 Bargaining Power of Suppliers
- 4.2.2 Bargaining Power of Buyers
- 4.2.3 Threat of New Entrants
- 4.2.4 Threat of Substitute Products
- 4.2.5 Intensity of Competitive Rivalry
4.3 Value Chain / Supply Chain Analysis
4.4 Impact of COVID-19, Macro Economic Trends, and Geopolitical Scenarios

5 MARKET DYNAMICS

5.1 Market Drivers
- 5.1.1 Increasing Demand for Semiconductors in Electric and Hybrid Vehicles
- 5.1.2 Demand for Setting Up New Foundries (International Chip Shortage)
5.2 Market Restraints
- 5.2.1 High Setup Costs
- 5.2.2 Constant Evolution of Products Influencing Demand

6 MARKET SEGMENTATION

6.1 By Type
- 6.1.1 Metrology and Inspection
- 6.1.2 Dicing
- 6.1.3 Bonding
- 6.1.4 Assembly and Packaging
6.2 By Geography
- 6.2.1 United States
- 6.2.2 Europe
- 6.2.3 China
- 6.2.4 South Korea
- 6.2.5 Taiwan
- 6.2.6 Japan
- 6.2.7 Rest of the Asia-Pacific
- 6.2.8 Rest of the World

7 COMPETITIVE LANDSCAPE

7.1 Company Profiles
- 7.1.1 ASML Holding N.V
- 7.1.2 Applied Materials Inc.
- 7.1.3 LAM Research Corporation
- 7.1.4 Tokyo Electron Limited
- 7.1.5 KLA Corporation
- 7.1.6 Advantest Corporation
- 7.1.7 Onto Innovation Inc.
- 7.1.8 Screen Holdings Co., Ltd.
- 7.1.9 Teradyne Inc.
- 7.1.10 Nordson Corporation