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市場調查報告書
商品編碼
1611003

全球微電子封裝市場2024-2031

Global Microelectronics Packaging Market 2024-2031
出版日期: | 出版商: Orion Market Research | 英文 145 Pages | 商品交期: 2-3個工作天內

價格

預計在預測期（2024-2031年）微電子封裝市場將以7.6%的複合年成長率成長。微電子封裝涉及封裝和保護積體電路 (IC) 和半導體等微電子元件免受外部損壞，以確保其在各種應用中的平穩功能和耐用性。它涵蓋了一系列封裝技術，包括板上晶片 (COB)、球柵陣列 (BGA) 和覆晶，這些技術對於智慧型手機、電腦和汽車電子等設備至關重要。此外，由於電子元件日益小型化、微電子封裝在汽車行業的應用不斷擴大、消費性電子行業對封裝解決方案的需求不斷增加以及網際網路的日益普及，預計未來市場將出現顯著成長物聯網(IoT)和穿戴式科技。

市場動態

目錄

第 1 章：報告摘要

  • 目前行業分析及成長潛力展望
  • 研究方法和工具
  • 市場區隔
    • 按細分
    • 按地區

第 2 章：市場概述與見解

  • 報告範圍
  • 分析師見解和當前市場趨勢
    • 主要行業趨勢
    • 建議
    • 結論

第 3 章：競爭格局

  • 主要公司分析
  • ASE Technology Holding Co, Ltd.
    • 概述
    • 財務分析
    • SWOT分析
    • 最新動態
  • Intel Corp.
    • 概述
    • 財務分析
    • SWOT分析
    • 最新動態
  • Materion Corp.
    • 概述
    • 財務分析
    • SWOT分析
    • 最新動態
  • 關鍵策略分析

第 4 章：市場細分

  • 按封裝類型分類的全球微電子封裝市場
    • 球柵陣列 (BGA)
    • 板上晶片 (COB)
    • 表面貼裝技術 (SMT)
    • 通孔技術 (THT
    • 疊層封裝 (PoP)
    • 覆晶
    • 系統級封裝 (SiP)
  • 按技術分類的全球微電子封裝市場
    • 晶圓級封裝 (WLP)
    • 載帶封裝 (TCP)
    • 晶片級封裝
    • 其他（（3D 封裝、扇出晶圓級封裝 (Fowlp) 和系統級封裝 (SiP)）
  • 按材料類型分類的全球微電子封裝市場
    • 有機基材
    • 陶瓷基板
    • 矽基板
    • 金屬基材
  • 全球微電子封裝市場（按應用）
    • 消費性電子產品
    • 汽車
    • 衛生保健
    • 工業的
    • 電信
    • 航太與國防
    • 能源

第 5 章：區域分析

  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 義大利
    • 西班牙
    • 法國
    • 歐洲其他地區
  • 亞太
    • 中國
    • 印度
    • 日本
    • 韓國
    • 亞太其他地區
  • 世界其他地區
    • 拉丁美洲
    • 中東和非洲

第 6 章：公司簡介

  • Amkor Technology
  • ChipMOS Technologies Inc.
  • Deca Technologies Inc.
  • Fujitsu Ltd.
  • iangsu Changdian Technology Co., Ltd.
  • KLA Corp.
  • Micron Technology, Inc.
  • NXP Semiconductors
  • SCHOTT
  • Shinko Electric Industries Co., Ltd.
  • Silicon Connection Pte Ltd.
  • Siliconware Precision Industries Co., Ltd.
  • STI Electronics, Inc.
  • Taiwan Semiconductor Manufacturing Co. Ltd.
  • Texas Instruments Inc.
  • Tongfu Microelectronics Co., Ltd.
  • Xilinx, Inc. (AMD)
Product Code: OMR2028795

Global Microelectronics Packaging Market Size, Share & Trends Analysis Report by Packaging Type (Ball Grid Array (BGA), Chip-on-Board (COB), Surface Mount Technology (SMT), Through-Hole Technology (THT), Package-on-Package (PoP), Flip-Chip, and System-in-Package (SiP)), by Technology (Wafer-Level Packaging (WLP), Tape Carrier Package (TCP), Die-Level Packaging, and Others (3D Packaging, And System-In-Package (SiP)), by Material Type (Organic Substrates, Ceramic Substrates, Silicon Substrates, and Metal Substrates), and by Application (Consumer Electronics, Automotive, Healthcare, Industrial, Telecommunications, Aerospace & Defense, and Energy) Forecast Period (2024-2031)

The Microelectronics packaging market is anticipated to grow at a CAGR of 7.6% during the forecast period (2024-2031). Microelectronics packaging involves encasing and protecting microelectronic components such as Integrated Circuits (ICs) and semiconductors from external damage to ensure their smooth functionality and durability in various applications. It encompasses a range of packaging technologies, including Chip-On-Board (COB), Ball Grid Array (BGA), and flip-chip, which are essential for devices such as smartphones, computers, and automotive electronics. Further, the market is expected to experience significant growth in the future, attributed to the growing miniaturization of electronic components, expanding application of microelectronics packaging in the automotive industry, increasing demand for packaging solutions in the consumer electronics industry, and rising adoption of the Internet of Things (IoT) and wearable technology.

Market Dynamics

Miniaturization of Electronics Components

The demand for microelectronic packaging is being driven by the trend towards developing smaller and lighter electronic devices without sacrificing performance or functionality. Microelectronics packaging plays a crucial role in integrating multiple functionalities into smaller form factors, improving thermal management, and increasing component density. These abilities of the technology to address miniaturization complexities foster technological progress and contribute to growth in the packaging sector to meet the changing needs of consumer electronics, automotive systems, and industrial applications, driving market growth. For instance, in May 2021, IBM introduced the world's first 2 nanometer (nm) chip using nanosheet technology, representing a significant advancement in semiconductor design. This technology is expected to offer 45.0% higher performance, or 75.0% lower energy consumption compared to 7 nm node chips, meeting the rising demand for enhanced performance and energy efficiency in various applications.

Expansion of Automotive Electronics Industry

The automotive industry is increasingly integrating advanced electronics to improve navigation, safety, and infotainment systems in vehicles. This growing demand for sophisticated electronic features has increased the need for reliable and durable microelectronics packaging solutions. Electronic systems such as Advanced Driver Assistance Systems (ADAS), collision avoidance sensors, and high-definition infotainment displays require advanced packaging technologies that ensure high performance, robust thermal management, and long-term reliability under challenging automotive conditions. This increasing need for integrating advanced electronics drives the demand for microelectronic packaging in the automotive sector and is expected to expand the scope for microelectronics packaging beyond the consumer electronics market. For instance, in December 2023, Alpha and Omega Semiconductor Limited (AOS) introduced a new automotive TO-Leadless (TOLL) package for its automotive-grade 80V and 100V MOSFETs. The TOLL package is designed to enhance the company's power semiconductors as essential components in the advancement of e-mobility for 2- and 3-wheel and other light vehicles. This new package helps meet the growing trend of electrifying vehicles with the latest battery technology to achieve clean energy zero-emission goals. AOS's 80V and 100V MOSFETs are well-suited for automotive BLDC motor and battery management applications for e-mobility.

Segmental Outlook

  • Based on packaging type, the market is segmented into Ball Grid Array (BGA), Chip-On-Board (COB), Surface Mount Technology (SMT), Through-Hole Technology (THT), Package-on-Package (PoP), flip-chip, and System-in-Package (SiP).
  • Based on technology, the market is segmented into Wafer-Level Packaging (WLP), Tape Carrier Package (TCP), die-level packaging, and others (3D packaging, and System-in-Package (SiP))
  • Based on material type, the market is segmented into organic substrates, ceramic substrates, silicon substrates, and metal substrates.
  • Based on application, the market is segmented into consumer electronics, automotive, healthcare, industrial, telecommunications, aerospace & defense, and energy.

Ball Grid Array (BGA) is the Preferred Packaging Type

Ball Grid Array (BGA) is the preferred packaging type in the microelectronics packaging market owing to its superior performance in high-density applications and reliable electrical and thermal performance. The segmental growth can be attributed to its ability to support high-speed data transfer and large pin counts, making it ideal for advanced computing and consumer electronics. Additionally, its robust mechanical strength and efficient heat dissipation contribute to its widespread adoption in smartphones, tablets, and high-performance computing systems.

Consumer Electronics is the Biggest Application

Consumer electronics is the biggest application of microelectronics packaging owing to the expanding scope of the consumer electronics market, such as the inclusion of wearable devices, the growing miniaturization of consumer electronics products such as smart rings, the higher requirement for advanced packaging solutions to integrate numerous functions within a limited space while ensuring reliability and efficiency, and the growing adoption of consumer electronics products.

Regional Outlook

The global microelectronics packaging market is further segmented based on geography including North America (the US, and Canada), Europe (the UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia-Pacific), and the Rest of the World (the Middle East & Africa, and Latin America).

North America is Projected to Dominate the Global Microelectronics Packaging Market

North America is projected to deliver the highest growth rate in the future, attributed to the ongoing expansion of advanced electronics markets such as 3D packaging, increasing investments in microelectronics and related product markets, a strong electronics manufacturing and R&D base, growing demand for electronics in the automotive sector, a supportive market ecosystem in the region, and the presence of major microelectronics packaging companies such as Intel, Texas Instruments, and Materion, among others. For instance, in July 2024, as part of President Biden's investing in America agenda, the US Department of Commerce announced its intention to open a competition for new R&D activities aimed at establishing and accelerating domestic capacity for semiconductor advanced packaging. The CHIPS for America program is expected to provide up to $1.6 billion in funding for innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP). The CHIPS for America program would offer several awards of approximately $150.0 million in federal funding for each research area, through potential cooperative agreements. These awards are intended to leverage private sector investments from industry and academia.

Asia-Pacific is the Fastest Growing in Microelectronics Packaging Market

  • Several Asia-Pacific countries, including India, Vietnam, and China, are investing in the semiconductor and electronics industries through government initiatives and incentives, boosting the development and adoption of advanced packaging technologies.
  • Countries such as Taiwan, South Korea, and China are major players in semiconductor manufacturing, fostering a strong demand and market expansion for microelectronics packaging.

The major companies serving the global microelectronics packaging market include ASE Technology Holding Co, Ltd., Intel Corp., and Materion Corp., among others. The market players are focusing on capitalizing on growth by adopting strategies such as collaboration, partnerships, and market expansion among others.

Recent Development

  • In February 2024, Raytheon, an RTX business, secured a $20.0 million contract through the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) consortium. The contract is aimed at developing a next-generation multi-chip package suitable for ground, maritime, and airborne sensors. Raytheon will collaborate with industry partners such as AMD to package state-of-the-art commercial devices, creating a compact microelectronics package. This package will have the ability to convert radio frequency energy to digital information with increased bandwidth and higher data rates. The integration of these devices will result in new system capabilities designed for higher performance, lower power consumption, and reduced weight.

Table of Contents

1. Report Summary

  • Current Industry Analysis and Growth Potential Outlook
  • 1.1. Research Methods and Tools
  • 1.2. Market Breakdown
    • 1.2.1. By Segments
    • 1.2.2. By Region

2. Market Overview and Insights

  • 2.1. Scope of the Report
  • 2.2. Analyst Insight & Current Market Trends
    • 2.2.1. Key Industry Trends
    • 2.2.2. Recommendations
    • 2.2.3. Conclusion

3. Competitive Landscape

  • 3.1. Key Company Analysis
  • 3.2. ASE Technology Holding Co, Ltd.
    • 3.2.1. Overview
    • 3.2.2. Financial Analysis
    • 3.2.3. SWOT Analysis
    • 3.2.4. Recent Developments
  • 3.3. Intel Corp.
    • 3.3.1. Overview
    • 3.3.2. Financial Analysis
    • 3.3.3. SWOT Analysis
    • 3.3.4. Recent Developments
  • 3.4. Materion Corp.
    • 3.4.1. Overview
    • 3.4.2. Financial Analysis
    • 3.4.3. SWOT Analysis
    • 3.4.4. Recent Developments
  • 3.5. Key Strategy Analysis

4. Market Segmentation

  • 4.1. Global Microelectronics Packaging Market by Packaging Type
    • 4.1.1. Ball Grid Array (BGA)
    • 4.1.2. Chip-on-Board (COB)
    • 4.1.3. Surface Mount Technology (SMT)
    • 4.1.4. Through-Hole Technology (THT
    • 4.1.5. Package-on-Package (PoP)
    • 4.1.6. Flip-Chip
    • 4.1.7. System-in-Package (SiP)
  • 4.2. Global Microelectronics Packaging Market by Technology
    • 4.2.1. Wafer-Level Packaging (WLP)
    • 4.2.2. Tape Carrier Package (TCP)
    • 4.2.3. Die-Level Packaging
    • 4.2.4. Others ((3D Packaging, Fan-Out Wafer-Level Packaging (Fowlp), And System-In-Package (SiP))
  • 4.3. Global Microelectronics Packaging Market by Material Type
    • 4.3.1. Organic Substrates
    • 4.3.2. Ceramic Substrates
    • 4.3.3. Silicon Substrates
    • 4.3.4. Metal Substrates
  • 4.4. Global Microelectronics Packaging Market by Application
    • 4.4.1. Consumer Electronics
    • 4.4.2. Automotive
    • 4.4.3. Healthcare
    • 4.4.4. Industrial
    • 4.4.5. Telecommunications
    • 4.4.6. Aerospace & Defense
    • 4.4.7. Energy

5. Regional Analysis

  • 5.1. North America
    • 5.1.1. United States
    • 5.1.2. Canada
  • 5.2. Europe
    • 5.2.1. UK
    • 5.2.2. Germany
    • 5.2.3. Italy
    • 5.2.4. Spain
    • 5.2.5. France
    • 5.2.6. Rest of Europe
  • 5.3. Asia-Pacific
    • 5.3.1. China
    • 5.3.2. India
    • 5.3.3. Japan
    • 5.3.4. South Korea
    • 5.3.5. Rest of Asia-Pacific
  • 5.4. Rest of the World
    • 5.4.1. Latin America
    • 5.4.2. Middle East and Africa

6. Company Profiles

  • 6.1. Amkor Technology
  • 6.2. ChipMOS Technologies Inc.
  • 6.3. Deca Technologies Inc.
  • 6.4. Fujitsu Ltd.
  • 6.5. iangsu Changdian Technology Co., Ltd.
  • 6.6. KLA Corp.
  • 6.7. Micron Technology, Inc.
  • 6.8. NXP Semiconductors
  • 6.9. SCHOTT
  • 6.10. Shinko Electric Industries Co., Ltd.
  • 6.11. Silicon Connection Pte Ltd.
  • 6.12. Siliconware Precision Industries Co., Ltd.
  • 6.13. STI Electronics, Inc.
  • 6.14. Taiwan Semiconductor Manufacturing Co. Ltd.
  • 6.15. Texas Instruments Inc.
  • 6.16. Tongfu Microelectronics Co., Ltd.
  • 6.17. Xilinx, Inc. (AMD)

LIST OF FIGURES

  • 1. Global Microelectronics Packaging Market Share by Packaging Type, 2023 Vs 2031 (%)
  • 2. Global Ball Grid Array Microelectronics Packaging Market Share by Region, 2023 Vs 2031 (%)
  • 3. Global Chip-on-Board Microelectronics Packaging Market Share by Region, 2023 Vs 2031 (%)
  • 4. Global Surface Mount Technology Microelectronics Packaging Market Share by Region, 2023 Vs 2031 (%)
  • 5. Global Through-Hole Technology Microelectronics Packaging Market Share by Region, 2023 Vs 2031 (%)
  • 6. Global Package-on-Package Microelectronics Packaging Market Share by Region, 2023 Vs 2031 (%)
  • 7. Global Flip-Chip Microelectronics Packaging Market Share by Region, 2023 Vs 2031 (%)
  • 8. Global System-in-Package Microelectronics Packaging Market Share by Region, 2023 Vs 2031 (%)
  • 9. Global Microelectronics Packaging Market Share by Technology, 2023 Vs 2031 (%)
  • 10. Global Wafer-Level Microelectronics Packaging Market Share by Region, 2023 Vs 2031 (%)
  • 11. Global Tape Carrier Microelectronics Packaging Market Share by Region, 2023 Vs 2031 (%)
  • 12. Global Die-Level Microelectronics Packaging Market Share by Region, 2023 Vs 2031 (%)
  • 13. Global Other Microelectronics Technology Market Share by Region, 2023 Vs 2031 (%)
  • 14. Global Microelectronics Packaging Market Share by Material Type, 2023 Vs 2031 (%)
  • 15. Global Organic Substrates Based Microelectronics Packaging Market Share by Region, 2023 Vs 2031 (%)
  • 16. Global Ceramic Substrates Microelectronics Packaging Market Share by Region, 2023 Vs 2031 (%)
  • 17. Global Silicon Substrates Microelectronics Packaging Market Share by Region, 2023 Vs 2031 (%)
  • 18. Global Metal Substrates Microelectronics Packaging for Other Material Type Market Share by Region, 2023 Vs 2031 (%)
  • 19. Global Microelectronics Packaging Market Share by Application, 2023 Vs 2031 (%)
  • 20. Global Microelectronics Packaging for Consumer Electronics Market Share by Region, 2023 Vs 2031 (%)
  • 21. Global Microelectronics Packaging in Automotive Market Share by Region, 2023 Vs 2031 (%)
  • 22. Global Microelectronics Packaging in Healthcare Market Share by Region, 2023 Vs 2031 (%)
  • 23. Global Microelectronics Packaging in Industrial Market Share by Region, 2023 Vs 2031 (%)
  • 24. Global Microelectronics Packaging in Telecommunication Market Share by Region, 2023 Vs 2031 (%)
  • 25. Global Microelectronics Packaging in Aerospace & Defense Market Share by Region, 2023 Vs 2031 (%)
  • 26. Global Microelectronics Packaging in Energy Market Share by Region, 2023 Vs 2031 (%)
  • 27. US Microelectronics Packaging Market Size, 2023-2031 ($ Million)
  • 28. Canada Microelectronics Packaging Market Size, 2023-2031 ($ Million)
  • 29. UK Microelectronics Packaging Market Size, 2023-2031 ($ Million)
  • 30. France Microelectronics Packaging Market Size, 2023-2031 ($ Million)
  • 31. Germany Microelectronics Packaging Market Size, 2023-2031 ($ Million)
  • 32. Italy Microelectronics Packaging Market Size, 2023-2031 ($ Million)
  • 33. Spain Microelectronics Packaging Market Size, 2023-2031 ($ Million)
  • 34. Rest of Europe Microelectronics Packaging Market Size, 2023-2031 ($ Million)
  • 35. India Microelectronics Packaging Market Size, 2023-2031 ($ Million)
  • 36. China Microelectronics Packaging Market Size, 2023-2031 ($ Million)
  • 37. Japan Microelectronics Packaging Market Size, 2023-2031 ($ Million)
  • 38. South Korea Microelectronics Packaging Market Size, 2023-2031 ($ Million)
  • 39. Rest of Asia-Pacific Microelectronics Packaging Market Size, 2023-2031 ($ Million)
  • 40. Latin America Microelectronics Packaging Market Size, 2023-2031 ($ Million)
  • 41. Middle East And Africa Microelectronics Packaging Market Size, 2023-2031 ($ Million)