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市場調查報告書
商品編碼
1603297

半導體資本設備市場規模、佔有率、成長分析,按類型、製程類型、產業、地區分類 - 產業預測,2024-2031 年

Semiconductor Capital Equipment Market Size, Share, Growth Analysis, By Type, By Process Type, By Industry Vertical, By Region - Industry Forecast 2024-2031

出版日期: | 出版商: SkyQuest | 英文 192 Pages | 商品交期: 3-5個工作天內

價格
簡介目錄

2022年全球半導體資本設備市場規模為758億美元,從2023年的812.6億美元成長到2031年的1417.2億美元,在預測期內(2024-2031年)預計將以複合年成長率成長。 。

由於智慧型手機使用量的快速增加、先進電子設備的擴張以及汽車行業的發展,全球半導體行業正在經歷顯著成長。 5G 和人工智慧等技術創新正在推動這一轉變,特別是 5G 技術可提高無線效能並促進擴增實境和物聯網 (IoT) 等新應用。對高性能且具有成本效益的半導體的持續需求正在推動短期、中期和長期的市場動態。此外,智慧型設備和行動裝置的興起,加上各行業數位化的進步,大大促進了採用半導體元件的數位電子產品的普及。智慧型穿戴裝置在消費和工業應用中的出現需要更高水準的半導體整合度。這一趨勢強調了對尖端加工技術的需求,包括蝕刻和晶圓研磨,以及半導體製造專業知識。人工智慧、機器學習和物聯網技術以及先進機器人技術的整合正在重塑製造格局,尤其是半導體組件。技術進步不斷發展,推動全球半導體資本設備市場向前發展,並凸顯該產業在支援次世代應用程式和服務方面的關鍵作用。

目錄

介紹

  • 研究目的
  • 調查範圍
  • 定義

調查方法

  • 資訊採購
  • 二手資料和主要資料方法
  • 市場規模預測
  • 市場假設與限制

執行摘要

  • 全球市場展望
  • 供需趨勢分析
  • 按細分市場的機會分析

市場動態及展望

  • 市場概況
  • 市場規模
  • 市場動態
    • 促進因素和機遇
    • 限制因素和挑戰
  • 波特分析及影響
    • 競爭公司之間的敵對關係
    • 替代品的威脅
    • 買方議價能力
    • 新進入者的威脅
    • 供應商的議價能力

主要市場考察

  • 關鍵成功因素
  • 競爭程度
  • 主要投資機會
  • 市場生態系統
  • 技術進步
  • 監管環境
  • 專利分析
  • 價值鏈分析
  • 案例研究分析
  • 客戶和購買標準分析
  • PESTEL分析
  • 總體經濟指標
  • 市場吸引力指數
  • 價格分析

半導體資本設備市場規模:按類型和複合年成長率(2024-2031)

  • 市場概況
  • 晶圓級製造設備
    • 光刻設備
    • 蝕刻設備
    • 沉積裝置
    • 化學機械平坦化(CMP)設備
    • 清潔工具
  • 組裝/包裝設備
    • 固晶機
    • 焊接線機
    • 覆晶鍵合機
    • 封裝裝置
  • 自動測試設備(ATE)
    • 記憶體測試系統
    • 非記憶體測試系統
    • 單獨測試系統

以製程類型和複合年成長率分類的半導體資本設備市場規模(2024-2031)

  • 市場概況
    • 晶圓加工
    • 表面處理
    • 化學機械平坦化 (CMP)
    • 化學沉澱(CVD)
    • 物理氣相澱積氣相沉積 (PVD)
    • 離子布植
  • 組裝和包裝
    • 晶圓鍵合技術
    • 晶片貼裝
    • 引線接合法
    • 封裝
  • 測試
    • 電氣測試
    • 功能測試
    • 老化測試

半導體資本設備市場規模:依產業及複合年成長率(2024-2031)

  • 市場概況
  • 家電
    • 智慧型手機
    • 藥片
    • 筆記型電腦
    • 穿戴式的
    • ADAS(進階駕駛輔助系統)(ADAS)
    • 資訊娛樂系統
    • 電動車(EV)
    • 自動駕駛汽車
  • 衛生保健
    • 醫療設備
    • 診斷設備
    • 穿戴式健康監測器
  • 資訊科技/通訊
    • 資料中心
    • 網路裝置
    • 5G基礎設施

半導體資本設備市場規模:依地區及複合年成長率(2024-2031)

  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 西班牙
    • 法國
    • 義大利
    • 其他歐洲國家地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 其他亞太地區
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲地區
  • 中東和非洲
    • 海灣合作理事會國家
    • 南非
    • 其他中東/非洲

競爭資訊

  • 前5名企業對比
  • 主要企業市場定位(2023年)
  • 主要市場參與者所採取的策略
  • 近期市場趨勢
  • 公司市場佔有率分析(2023)
  • 主要企業簡介
    • 公司簡介
    • 產品系列分析
    • 按細分市場分類的佔有率分析
    • 收益與前一年同期比較(2021-2023)

主要企業簡介

  • Applied Materials, Inc.
  • ASML Holding NV
  • Tokyo Electron Limited
  • Lam Research Corporation
  • KLA Corporation
  • Advantest Corporation
  • Teradyne Inc.
  • Screen Holdings Co., Ltd.
  • Hitachi High-Technologies Corporation
  • ASM International NV
  • Kulicke & Soffa Industries, Inc.
  • Nikon Corporation
  • Canon Inc.
  • Plasma-Therm LLC
  • Veeco Instruments Inc.
  • Nova Measuring Instruments Ltd.
  • Ontoo Innovation
  • Camtek Ltd.
  • ACCRETECH-Tokyo Seimitsu Co., Ltd.
  • Ultratech, Inc.

結論和建議

簡介目錄
Product Code: SQMIG15A2433

Global Semiconductor Capital Equipment Market size was valued at USD 75.8 billion in 2022 and is poised to grow from USD 81.26 billion in 2023 to USD 141.72 billion by 2031, growing at a CAGR of 7.2% during the forecast period (2024-2031).

The global semiconductor industry is witnessing significant growth driven by the surge in smartphone usage and the expansion of advanced electronic devices, alongside the automotive sector's evolution. Innovations like 5G and artificial intelligence are catalyzing this transformation, particularly with 5G technology enhancing wireless performance and facilitating new applications, such as augmented reality and the Internet of Things (IoT). The sustained demand for high-performance yet cost-effective semiconductors is propelling market dynamics across short, medium, and long-term scenarios. Furthermore, the rise of smart and portable devices, coupled with increased digitization across various industries, is significantly contributing to the proliferation of digital electronics that incorporate semiconductor elements. The emergence of smart wearables in both consumer and industrial settings further necessitates advanced semiconductor integration. This trend underscores the need for cutting-edge processing techniques, including etching and wafer back grinding, while also requiring expertise in semiconductor manufacturing. The integration of AI, machine learning, and IoT technologies, along with advanced robotics, is reshaping the manufacturing landscape, particularly for semiconductor components. As technological advancements continue to evolve, they are set to drive the global semiconductor capital equipment market forward, highlighting the industry's pivotal role in supporting next-generation applications and services.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Semiconductor Capital Equipment market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Semiconductor Capital Equipment Market Segmental Analysis

Global Semiconductor Capital Equipment Market is segmented by type, process type, industry vertical and region. Based on type, the market is segmented into wafer-level manufacturing equipment (lithography equipment, etching equipment, deposition equipment, chemical mechanical planarization (CMP) equipment, cleaning equipment), assembly and packaging equipment (die bonders, wire bonders, flip chip bonders, encapsulation equipment) and automated test equipment (ATE) (memory test systems, non-memory test systems, discrete test systems). Based on process type, the market is segmented into wafer processing (surface conditioning, chemical mechanical planarization (CMP), chemical vapor deposition (CVD), physical vapor deposition (PVD), ion implantation), assembly and packaging (wafer bonding, die attach, wire bonding, encapsulation) and testing (electrical testing, functional testing, burn-in testing). Based on industrial vertical, the market is segmented into consumer electronics (smartphones, tablets, laptops, wearables), automotive (advanced driver assistance systems (ADAS), infotainment systems, electric vehicles (EVs), autonomous vehicles), healthcare (medical devices, diagnostic equipment, wearable health monitors) and IT and telecommunication (data centers, networking equipment, 5g infrastructure). Based on end user, the market is segmented into automotive, consumer electronics, healthcare, agriculture, manufacturing, and others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & and Africa.

Driver of the Global Semiconductor Capital Equipment Market

The Global Semiconductor Capital Equipment market is primarily driven by the rising demand for electrical appliances, particularly in the consumer electronics sector, which is experiencing rapid growth. This surge is largely fueled by the increasing popularity of smartphones amidst a rising global population, serving as a key catalyst for market expansion. The heightened consumption of electronic devices such as tablets, laptops, and wearable technology propels industry growth. Moreover, as semiconductor technology advances, innovative market segments, including machine learning devices, are swiftly incorporated, further elevating the demand for semiconductor capital equipment and shaping the future landscape of the industry.

Restraints in the Global Semiconductor Capital Equipment Market

Restraints in the Global Semiconductor Capital Equipment market include significant premature expenditures, which pose challenges for stakeholders. The dynamics of the copper and semiconductor segments contribute to this issue, as their operational frameworks are influenced by market conditions and external factors. These conditions, compounded by the influx of skilled labor, have a pronounced impact on investment strategies and project timelines. As a result, the interplay of these elements may lead to financial strain and inefficiencies, ultimately affecting the overall growth and stability of the semiconductor capital equipment sector in a competitive global landscape.

Market Trends of the Global Semiconductor Capital Equipment Market

The Global Semiconductor Capital Equipment market is poised for significant expansion between 2024 and 2031, largely driven by the emergence of 5G technology. This transformative period is expected to see the market size double, fueled by escalating demand for advanced applications, including autonomous vehicles and virtual reality solutions. As industries innovate and integrate high-speed connectivity into their platforms, the need for sophisticated semiconductor manufacturing equipment will surge. Consequently, players in the semiconductor capital equipment space are likely to capitalize on this trend, investing in research, development, and production capacities to meet the burgeoning requirements of next-generation technologies.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Driver & Opportunities
    • Restraints & Challenges
  • Porters Analysis & Impact
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Technological Advancement
  • Regulatory Landscape
  • Patent Analysis
  • Value Chain Analysis
  • Case Study Analysis
  • Customer & Buying Criteria Analysis
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Market Attractiveness Index
  • Pricing Analysis

Semiconductor Capital Equipment Market Size by Type & CAGR (2024-2031)

  • Market Overview
  • Wafer-Level Manufacturing Equipment
    • Lithography Equipment
    • Etching Equipment
    • Deposition Equipment
    • Chemical Mechanical Planarization (CMP) Equipment
    • Cleaning Equipment
  • Assembly and Packaging Equipment
    • Die Bonders
    • Wire Bonders
    • Flip Chip Bonders
    • Encapsulation Equipment
  • Automated Test Equipment (ATE)
    • Memory Test Systems
    • Non-Memory Test Systems
    • Discrete Test Systems

Semiconductor Capital Equipment Market Size by Process Type & CAGR (2024-2031)

  • Market Overview
    • Wafer Processing
    • Surface Conditioning
    • Chemical Mechanical Planarization (CMP)
    • Chemical Vapor Deposition (CVD)
    • Physical Vapor Deposition (PVD)
    • Ion Implantation
  • Assembly and Packaging
    • Wafer Bonding
    • Die Attach
    • Wire Bonding
    • Encapsulation
  • Testing
    • Electrical Testing
    • Functional Testing
    • Burn-In Testing

Semiconductor Capital Equipment Market Size by Industry Vertical & CAGR (2024-2031)

  • Market Overview
  • Consumer Electronics
    • Smartphones
    • Tablets
    • Laptops
    • Wearables
  • Automotive
    • Advanced Driver Assistance Systems (ADAS)
    • Infotainment Systems
    • Electric Vehicles (EVs)
    • Autonomous Vehicles
  • Healthcare
    • Medical Devices
    • Diagnostic Equipment
    • Wearable Health Monitors
  • IT and Telecommunication
    • Data Centers
    • Networking Equipment
    • 5G Infrastructure

Semiconductor Capital Equipment Market Size & CAGR (2024-2031)

  • North America, (Type, Process Type, Industry Vertical)
    • US
    • Canada
  • Europe, (Type, Process Type, Industry Vertical)
    • UK
    • Germany
    • Spain
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific, (Type, Process Type, Industry Vertical)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia Pacific
  • Latin America, (Type, Process Type, Industry Vertical)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa, (Type, Process Type, Industry Vertical)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2023
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2023
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2021-2023)

Key Company Profiles

  • Applied Materials, Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ASML Holding N.V.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Tokyo Electron Limited
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Lam Research Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • KLA Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Advantest Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Teradyne Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Screen Holdings Co., Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Hitachi High-Technologies Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ASM International N.V.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Kulicke & Soffa Industries, Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Nikon Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Canon Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Plasma-Therm LLC
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Veeco Instruments Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Nova Measuring Instruments Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Ontoo Innovation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Camtek Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ACCRETECH - Tokyo Seimitsu Co., Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Ultratech, Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendation