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市場調查報告書
商品編碼
1530860

到 2030 年印刷電路基板(PCB) 市場預測：按產品類型、層壓板和材料、製造流程、技術、最終用戶和地區進行的全球分析

Printed Circuit Boards Market Forecasts to 2030 - Global Analysis By Product Type, Laminates and Materials, Manufacturing Processes, Technology, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據Stratistics MRC的數據，2024年全球印刷電路基板（PCB）市場規模為924億美元，預計到2030年將達到1356億美元，預測期內複合年成長率為6.6%。

印刷電路基板（PCB）是電子設備的基本元件，是非導電基板，其上蝕刻或印刷有導電途徑、墊片等。 PCB 是連接和支撐各種電子元件的基礎。 PCB 市場涵蓋各種應用的基板設計、製造和分銷，包括家用電子電器、汽車、通訊和工業領域。

根據IPC（電子工業連接協會）資料，中國仍是最大的PCB生產國，2021年佔全球產量的52%。

提高車輛電氣化和自動化程度

汽車電氣化和自動化趨勢是汽車產業PCB需求的主要驅動力。現代汽車需要越來越複雜的電子系統來實現 ADAS（高級駕駛員輔助系統）、資訊娛樂和動力傳動系統控制等功能。特別是，電動和自動駕駛汽車嚴重依賴複雜的 PCB 來管理其複雜的電氣和計算系統。這一趨勢鼓勵汽車製造商在每輛車上使用更多的 PCB，從而刺激市場成長。

原物料價格波動

PCB行業對原料價格波動非常敏感，尤其是銅，它是PCB製造的關鍵組成部分。銅等原料價格的波動影響PCB製造商的製造成本和利潤率。這種波動可能導致定價不確定性並影響市場成長。製造商可能需要調整其定價策略或尋找替代材料，這可能既困難又耗時，而且市場擴張緩慢。

新技術開發

PCB產業將受惠於5G、物聯網(IoT)、人工智慧和先進製造技術等新技術。這些技術正在推動對更複雜、高效能 PCB 的需求。例如，高密度互連（HDI）PCB和軟性PCB的開發在穿戴式裝置和小型電子產品中開啟了新的應用。此外，3D 列印等 PCB 製造流程的進步為更高效和可客製化的生產提供了機會。

貿易限制

主要經濟體（尤其是美國和中國）之間的關稅和貿易爭端可能會擾亂供應鏈並增加 PCB 製造商及其客戶的成本。這些限制可能會導致採購挑戰、價格上漲和市場不確定性。公司可能需要實現供應鏈多元化或搬遷生產設施，這既昂貴又耗時，並可能影響市場成長和穩定。

COVID-19 的影響：

COVID-19 大流行最初擾亂了 PCB 供應鏈和製造營運，導致生產延遲和短缺。然而，對支援遠端工作和數位服務的電子設備的需求增加部分抵消了這些挑戰。這場危機加速了數位轉型趨勢，為PCB市場創造了長期成長機會，特別是在醫療保健和通訊等領域。

剛性 PCB 領域預計將在預測期內成為最大的領域

剛性 PCB 預計將主導市場，因為它們廣泛應用於家用電子電器、汽車和工業應用等各個行業。與軟性 PCB 相比，具有卓越的耐用性、可靠性和溫度控管。剛性 PCB 對於高性能電子設備至關重要，它允許將複雜的電路安裝在緊湊的空間中。其在大規模生產中的多功能性和成本效益帶來了很大的市場佔有率，是許多應用的首選。

汽車業預計在預測期內複合年成長率最高

在汽車領域，由於車輛電氣化和自動化程度不斷提高，對 PCB 的需求預計將快速成長。現代車輛整合了眾多電子系統，用於實現資訊娛樂、ADAS 和動力傳動系統控制等功能，所有這些都需要複雜的 PCB。向電動和自動駕駛汽車的轉變進一步加速了這一趨勢，因為這些車輛嚴重依賴複雜的電子系統。汽車電子產品整合度的不斷提高正在推動對 PCB 的巨大需求，從而帶動該領域的成長。

佔比最大的地區：

預計亞太地區在預測期內將佔據最大的市場佔有率。亞太地區在 PCB 市場的主導地位歸因於中國、台灣、日本和韓國等國家主要電子製造地的存在。該地區擁有強大的供應鏈、熟練的勞動力和先進的製造能力。此外，該地區消費電子、汽車和通訊行業高度集中，推動了 PCB 需求。政府支持電子製造的措施進一步促進了該地區的市場吸引力。

複合年成長率最高的地區：

預計亞太地區在預測期內將出現良好的成長。亞太地區PCB市場的快速成長得益於多種因素。該地區對 5G、物聯網和人工智慧等新興技術的投資不斷增加，這推動了對先進 PCB 的需求。印度、東南亞等國家家電、汽車產品國內市場不斷拓展，創造了新的商機。此外，全球電子製造業向亞洲的轉移以及政府對電子產業的支持政策正在加速該地區的市場成長。

免費客製化服務：

訂閱此報告的客戶可以存取以下免費自訂選項之一：

  • 公司簡介
    • 其他市場參與者的綜合分析（最多 3 家公司）
    • 主要企業SWOT分析（最多3家企業）
  • 區域分割
    • 根據客戶興趣對主要國家的市場估計、預測和複合年成長率（註：基於可行性檢查）
  • 競爭基準化分析
    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 研究資訊來源
    • 主要研究資訊來源
    • 二次研究資訊來源
    • 先決條件

第3章市場趨勢分析

  • 促進因素
  • 抑制因素
  • 機會
  • 威脅
  • 產品分析
  • 技術分析
  • 最終用戶分析
  • 新興市場
  • COVID-19 的影響

第4章波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭公司之間的敵對關係

第5章全球印刷基板（PCB）市場：依產品類型

  • 剛性PCB
    • 一邊
    • 雙方
    • 多層
  • 軟性線路板
  • 軟硬複合板
  • 高密度互連 (HDI) PCB
  • 其他產品類型
    • 金屬芯PCB
    • 鋁基板

第6章全球印刷基板(PCB) 市場：依層壓板和材料分類

  • 層壓型
    • 剛性層壓板
    • FR-4標準
    • FR-4高Tg
    • FR-4 無鹵
    • 其他硬質層壓板
    • 軟性層壓板
      • 聚醯亞胺 (PI)
      • 聚四氟乙烯
      • 其他軟性層壓板
    • 紙基層壓板
    • 複合材料層壓板
  • 基材
    • 銅箔
    • 介電材料
    • 黏合層

第7章全球印刷基板（PCB）市場：依製造流程分類

  • 製造過程
    • 內層生產
    • 層壓
    • 穿孔
    • 金屬化
    • 圖案電鍍
    • 蝕刻
    • 應用阻焊層
    • 零件的放置與焊接
    • 期末考和檢查
  • 組裝過程
    • 準備組件
    • 元件放置
    • 塗布焊膏
    • 回流焊接
    • 波峰焊
    • 打掃
    • 檢查和測試

第8章全球印刷基板(PCB) 市場：依技術分類

  • 表面黏著技術
  • 3D列印PCB技術
  • 通孔技術
  • 微波和射頻技術
  • 嵌入式組件技術
  • 軟性和軟硬複合技術
  • 高密度互連（HDI）技術
  • 光化學加工技術
  • 雷射直接成像 (LDI)
  • 其他技術

第9章全球印刷基板(PCB) 市場：依最終用戶分類

  • 家電
  • 車
  • 通訊
  • 醫療設備
  • 航太和國防
  • 工業電子
  • 其他最終用戶

第10章全球印刷基板（PCB）市場：按地區

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東/非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲

第11章 主要進展

  • 合約、夥伴關係、協作和合資企業
  • 收購和合併
  • 新產品發布
  • 業務拓展
  • 其他關鍵策略

第12章 公司概況

  • TTM Technologies Inc.
  • AT&S
  • Unimicron Technology Corporation
  • Zhen Ding Tech
  • Compeq Manufacturing Co., Ltd.
  • Tripod Technology Corporation
  • Sanmina Corporation
  • Jabil Inc.
  • Wurth Elektronik Group
  • Becker & Muller Schaltungsdruck GmbH
  • RayMing Technology Co.Ltd
  • Plexus Corporation
  • Benchmark Electronics
  • Lenthor Engineering
  • Samsung Electro-Mechanics
  • Daeduck Electronics Co. Ltd.
  • Nan Ya PCB Corporation
  • Ibiden Co., Ltd.
Product Code: SMRC26972

According to Stratistics MRC, the Global Printed Circuit Boards (PCBs) Market is accounted for $92.4 billion in 2024 and is expected to reach $135.6 billion by 2030, growing at a CAGR of 6.6% during the forecast period. Printed Circuit Boards (PCBs) are fundamental components in electronic devices, consisting of a non-conductive substrate with conductive pathways, pads, and other features etched or printed onto it. They serve as the foundation for connecting and supporting various electronic components. The PCB market encompasses the design, manufacturing, and distribution of these boards for diverse applications, including consumer electronics, automotive, telecommunications, and industrial sectors.

According to data from the IPC (Association Connecting Electronics Industries), China remained the largest PCB producer, accounting for 52% of global production in 2021.

Market Dynamics:

Driver:

Increasing electrification and automation of vehicles

The growing trend of vehicle electrification and automation is driving significant demand for PCBs in the automotive industry. Modern vehicles require increasingly complex electronic systems for functions like advanced driver assistance systems (ADAS), infotainment, and powertrain control. Electric and autonomous vehicles, in particular, rely heavily on sophisticated PCBs to manage their intricate electrical and computational systems. This trend is pushing automakers to incorporate more PCBs per vehicle, thereby fueling market growth.

Restraint:

Fluctuating raw material prices

The PCB industry is sensitive to fluctuations in raw material prices, particularly copper, which is a key component in PCB manufacturing. Volatile prices of copper and other materials can impact production costs and profit margins for PCB manufacturers. This instability can lead to pricing uncertainties, potentially affecting market growth. Manufacturers may need to adjust their pricing strategies or seek alternative materials, which can be challenging and time-consuming, potentially slowing down market expansion.

Opportunity:

Development of new technologies

The PCB industry is poised to benefit from emerging technologies such as 5G, Internet of Things (IoT), artificial intelligence, and advanced manufacturing techniques. These technologies are driving demand for more sophisticated and high-performance PCBs. For instance, the developments of high-density interconnect (HDI) PCBs and flexible PCBs opens up new applications in wearable devices and compact electronics. Additionally, advancements in PCB manufacturing processes, such as 3D printing, offer opportunities for more efficient and customizable production.

Threat:

Trade restrictions

Tariffs and trade disputes between major economies, particularly the US and China, can disrupt supply chains and increase costs for PCB manufacturers and their customers. These restrictions can lead to sourcing challenges, price increases, and market uncertainties. Companies may need to diversify their supply chains or relocate production facilities, which can be costly, and time-consuming, potentially impacting market growth and stability.

Covid-19 Impact:

The COVID-19 pandemic initially disrupted PCB supply chains and manufacturing operations, causing production delays and shortages. However, increased demand for electronics supporting remote work and digital services partially offset these challenges. The crisis accelerated digital transformation trends, creating long-term growth opportunities for the PCB market, particularly in sectors like healthcare and telecommunications.

The rigid PCBs segment is expected to be the largest during the forecast period

Rigid PCBs are expected to dominate the market due to their widespread use across various industries, including consumer electronics, automotive, and industrial applications. They offer superior durability, reliability, and thermal management compared to flexible PCBs. Rigid PCBs are essential in high-performance electronic devices and can accommodate complex circuitry in a compact space. Their versatility and cost-effectiveness for mass production contribute to their large market share, making them the preferred choice for many applications.

The automotive segment is expected to have the highest CAGR during the forecast period

The automotive sector is expected to register rapid growth in PCB demand due to increasing vehicle electrification and automation. Modern vehicles incorporate numerous electronic systems for functions like infotainment, ADAS, and powertrain control, all requiring sophisticated PCBs. The shift towards electric and autonomous vehicles is further accelerating this trend, as these vehicles rely heavily on complex electronic systems. This growing integration of electronics in automobiles is driving significant demand for PCBs, resulting in segment growth.

Region with largest share:

This Asia Pacific region is estimated to command the largest market share over the prediction period. Asia Pacific's dominance in the PCB market is driven by the presence of major electronics manufacturing hubs in countries like China, Taiwan, Japan, and South Korea. The region boasts a robust supply chain, a skilled workforce, and advanced manufacturing capabilities. Additionally, the high concentration of consumer electronics, automotive, and telecommunications industries in this region fuels the demand for PCBs. Government initiatives supporting electronics manufacturing further contribute to the region's market leadership.

Region with highest CAGR:

This Asia Pacific region is anticipated to witness lucrative growth during the forecast period. Asia Pacific's rapid growth in the PCB market is attributed to several factors. The region is experiencing increasing investments in emerging technologies like 5G, IoT, and AI, which drive demand for advanced PCBs. Growing domestic markets for consumer electronics and automotive products in countries like India and Southeast Asian nations are creating new opportunities. Additionally, the shift of global electronics manufacturing towards Asia and supportive government policies for the electronics industry are accelerating market growth in this region.

Key players in the market

Some of the key players in Printed Circuit Boards (PCBs) market include TTM Technologies Inc., AT&S, Unimicron Technology Corporation, Zhen Ding Tech, Compeq Manufacturing Co., Ltd., Tripod Technology Corporation, Sanmina Corporation, Jabil Inc., Wurth Elektronik Group, Becker & Muller Schaltungsdruck GmbH, RayMing Technology Co., Ltd., Plexus Corporation, Benchmark Electronics, Lenthor Engineering, Samsung Electro-Mechanics, Daeduck Electronics Co. Ltd., Nan Ya PCB Corporation, and Ibiden Co., Ltd.

Key Developments:

In May 2023, TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency ("RF") components and RF microwave/microelectronic assemblies and printed circuit boards ("PCB"s) has announced the launch of its 5mm x 3.2mm X-Band 8-12 GHz 3dB hybrid coupler and 20dB directional coupler. These state-of-the-art components are designed to meet the demanding requirements of broadband use in medium power X-Band (8-12GHz) commercial-off-the-shelf (COTS) military and aerospace (Mil-Aero) applications.

In January 2024, AT&S opens its first plant in Malaysia. The Austrian company's new plant in Kulim will produce IC substrates for the next generation of microchips for high-performance computing, data centres and AI applications from manufacturers such as AMD.

In June 2023, HDI PCB maker Compeq Manufacturing is scheduled to kick off production at its new plant in Thailand in the second half of 2024, according to the Taiwan-based company.

Product Types Covered:

  • Rigid PCBs
  • Flexible PCBs
  • Rigid-Flex PCBs
  • High Density Interconnect (HDI) PCBs
  • Other Product Types

Laminates and Materials Covered:

  • Laminate Types
  • Base Materials

Manufacturing Processes Covered:

  • Fabrication Process
  • Assembly Process

Technologies Covered:

  • Surface Mount Technology
  • 3D Printed PCB Technology
  • Through-Hole Technology
  • Microwave and RF Technology
  • Embedded Component Technology
  • Flexible and rigid-flex technology
  • High-Density Interconnect (HDI) Technology
  • Photochemical Machining Technology
  • Laser Direct Imaging (LDI)
  • Other Technologies

End Users Covered:

  • Consumer Electronics
  • Automotive
  • Telecommunications
  • Medical Devices
  • Aerospace and Defense
  • Industrial Electronics
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Technology Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Printed Circuit Boards (PCBs) Market, By Product Type

  • 5.1 Introduction
  • 5.2 Rigid PCBs
    • 5.2.1 Single-sided
    • 5.2.2 Double-sided
    • 5.2.3 Multi-layer
  • 5.3 Flexible PCBs
  • 5.4 Rigid-Flex PCBs
  • 5.5 High Density Interconnect (HDI) PCBs
  • 5.6 Other Product Types
    • 5.6.1 Metal Core PCBs
    • 5.6.2 Aluminum PCBs

6 Global Printed Circuit Boards (PCBs) Market, By Laminates and Materials

  • 6.1 Introduction
  • 6.2 Laminate Types
    • 6.2.1 Rigid Laminates
    • 6.2.1 FR-4 Standard
    • 6.2.2 FR-4 High Tg
    • 6.2.3 FR-4 Halogen-Free
    • 6.2.4 Other Rigid Laminates
    • 6.2.2 Flexible Laminates
      • 6.2.2.1 Polyimide (PI)
      • 6.2.2.2 Teflon
      • 6.2.2.3 Other Flexible Laminates
    • 6.2.3 Paper-Based Laminates
    • 6.2.4 Composite Laminates
  • 6.3 Base Materials
    • 6.3.1 Copper Foil
    • 6.3.2 Dielectric Materials
    • 6.3.3 Adhesive Layers

7 Global Printed Circuit Boards (PCBs) Market, By Manufacturing Processes

  • 7.1 Introduction
  • 7.2 Fabrication Process
    • 7.2.1 Inner Layer Production
    • 7.2.2 Lamination
    • 7.2.3 Drilling
    • 7.2.4 Metallization
    • 7.2.5 Pattern Plating
    • 7.2.6 Etching
    • 7.2.7 Solder Mask Application
    • 7.2.8 Component Placement and Soldering
    • 7.2.9 Final Testing and Inspection
  • 7.3 Assembly Process
    • 7.3.1 Component Preparation
    • 7.3.2 Component Placement
    • 7.3.3 Solder Paste Application
    • 7.3.4 Reflow Soldering
    • 7.3.5 Wave Soldering
    • 7.3.6 Cleaning
    • 7.3.7 Inspection and Testing

8 Global Printed Circuit Boards (PCBs) Market, By Technology

  • 8.1 Introduction
  • 8.2 Surface Mount Technology
  • 8.3 3D Printed PCB Technology
  • 8.4 Through-Hole Technology
  • 8.5 Microwave and RF Technology
  • 8.6 Embedded Component Technology
  • 8.7 Flexible and rigid-flex technology
  • 8.8 High-Density Interconnect (HDI) Technology
  • 8.9 Photochemical Machining Technology
  • 8.10 Laser Direct Imaging (LDI)
  • 8.11 Other Technologies

9 Global Printed Circuit Boards (PCBs) Market, By End User

  • 9.1 Introduction
  • 9.2 Consumer Electronics
  • 9.3 Automotive
  • 9.4 Telecommunications
  • 9.5 Medical Devices
  • 9.6 Aerospace and Defense
  • 9.7 Industrial Electronics
  • 9.8 Other End Users

10 Global Printed Circuit Boards (PCBs) Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 TTM Technologies Inc.
  • 12.2 AT&S
  • 12.3 Unimicron Technology Corporation
  • 12.4 Zhen Ding Tech
  • 12.5 Compeq Manufacturing Co., Ltd.
  • 12.6 Tripod Technology Corporation
  • 12.7 Sanmina Corporation
  • 12.8 Jabil Inc.
  • 12.9 Wurth Elektronik Group
  • 12.10 Becker & Muller Schaltungsdruck GmbH
  • 12.11 RayMing Technology Co.Ltd
  • 12.12 Plexus Corporation
  • 12.13 Benchmark Electronics
  • 12.14 Lenthor Engineering
  • 12.15 Samsung Electro-Mechanics
  • 12.16 Daeduck Electronics Co. Ltd.
  • 12.17 Nan Ya PCB Corporation
  • 12.18 Ibiden Co., Ltd.

List of Tables

  • Table 1 Global Printed Circuit Boards (PCBs) Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Printed Circuit Boards (PCBs) Market Outlook, By Product Type (2022-2030) ($MN)
  • Table 3 Global Printed Circuit Boards (PCBs) Market Outlook, By Rigid PCBs (2022-2030) ($MN)
  • Table 4 Global Printed Circuit Boards (PCBs) Market Outlook, By Single-sided (2022-2030) ($MN)
  • Table 5 Global Printed Circuit Boards (PCBs) Market Outlook, By Double-sided (2022-2030) ($MN)
  • Table 6 Global Printed Circuit Boards (PCBs) Market Outlook, By Multi-layer (2022-2030) ($MN)
  • Table 7 Global Printed Circuit Boards (PCBs) Market Outlook, By Flexible PCBs (2022-2030) ($MN)
  • Table 8 Global Printed Circuit Boards (PCBs) Market Outlook, By Rigid-Flex PCBs (2022-2030) ($MN)
  • Table 9 Global Printed Circuit Boards (PCBs) Market Outlook, By High Density Interconnect (HDI) PCBs (2022-2030) ($MN)
  • Table 10 Global Printed Circuit Boards (PCBs) Market Outlook, By Other Product Types (2022-2030) ($MN)
  • Table 11 Global Printed Circuit Boards (PCBs) Market Outlook, By Metal Core PCBs (2022-2030) ($MN)
  • Table 12 Global Printed Circuit Boards (PCBs) Market Outlook, By Aluminum PCBs (2022-2030) ($MN)
  • Table 13 Global Printed Circuit Boards (PCBs) Market Outlook, By Laminates and Materials (2022-2030) ($MN)
  • Table 14 Global Printed Circuit Boards (PCBs) Market Outlook, By Laminate Types (2022-2030) ($MN)
  • Table 15 Global Printed Circuit Boards (PCBs) Market Outlook, By Rigid Laminates (2022-2030) ($MN)
  • Table 16 Global Printed Circuit Boards (PCBs) Market Outlook, By Flexible Laminates (2022-2030) ($MN)
  • Table 17 Global Printed Circuit Boards (PCBs) Market Outlook, By Paper-Based Laminates (2022-2030) ($MN)
  • Table 18 Global Printed Circuit Boards (PCBs) Market Outlook, By Composite Laminates (2022-2030) ($MN)
  • Table 19 Global Printed Circuit Boards (PCBs) Market Outlook, By Base Materials (2022-2030) ($MN)
  • Table 20 Global Printed Circuit Boards (PCBs) Market Outlook, By Copper Foil (2022-2030) ($MN)
  • Table 21 Global Printed Circuit Boards (PCBs) Market Outlook, By Dielectric Materials (2022-2030) ($MN)
  • Table 22 Global Printed Circuit Boards (PCBs) Market Outlook, By Adhesive Layers (2022-2030) ($MN)
  • Table 23 Global Printed Circuit Boards (PCBs) Market Outlook, By Manufacturing Processes (2022-2030) ($MN)
  • Table 24 Global Printed Circuit Boards (PCBs) Market Outlook, By Fabrication Process (2022-2030) ($MN)
  • Table 25 Global Printed Circuit Boards (PCBs) Market Outlook, By Inner Layer Production (2022-2030) ($MN)
  • Table 26 Global Printed Circuit Boards (PCBs) Market Outlook, By Lamination (2022-2030) ($MN)
  • Table 27 Global Printed Circuit Boards (PCBs) Market Outlook, By Drilling (2022-2030) ($MN)
  • Table 28 Global Printed Circuit Boards (PCBs) Market Outlook, By Metallization (2022-2030) ($MN)
  • Table 29 Global Printed Circuit Boards (PCBs) Market Outlook, By Pattern Plating (2022-2030) ($MN)
  • Table 30 Global Printed Circuit Boards (PCBs) Market Outlook, By Etching (2022-2030) ($MN)
  • Table 31 Global Printed Circuit Boards (PCBs) Market Outlook, By Solder Mask Application (2022-2030) ($MN)
  • Table 32 Global Printed Circuit Boards (PCBs) Market Outlook, By Component Placement and Soldering (2022-2030) ($MN)
  • Table 33 Global Printed Circuit Boards (PCBs) Market Outlook, By Final Testing and Inspection (2022-2030) ($MN)
  • Table 34 Global Printed Circuit Boards (PCBs) Market Outlook, By Assembly Process (2022-2030) ($MN)
  • Table 35 Global Printed Circuit Boards (PCBs) Market Outlook, By Component Preparation (2022-2030) ($MN)
  • Table 36 Global Printed Circuit Boards (PCBs) Market Outlook, By Component Placement (2022-2030) ($MN)
  • Table 37 Global Printed Circuit Boards (PCBs) Market Outlook, By Solder Paste Application (2022-2030) ($MN)
  • Table 38 Global Printed Circuit Boards (PCBs) Market Outlook, By Reflow Soldering (2022-2030) ($MN)
  • Table 39 Global Printed Circuit Boards (PCBs) Market Outlook, By Wave Soldering (2022-2030) ($MN)
  • Table 40 Global Printed Circuit Boards (PCBs) Market Outlook, By Cleaning (2022-2030) ($MN)
  • Table 41 Global Printed Circuit Boards (PCBs) Market Outlook, By Inspection and Testing (2022-2030) ($MN)
  • Table 42 Global Printed Circuit Boards (PCBs) Market Outlook, By Technology (2022-2030) ($MN)
  • Table 43 Global Printed Circuit Boards (PCBs) Market Outlook, By Surface Mount Technology (2022-2030) ($MN)
  • Table 44 Global Printed Circuit Boards (PCBs) Market Outlook, By 3D Printed PCB Technology (2022-2030) ($MN)
  • Table 45 Global Printed Circuit Boards (PCBs) Market Outlook, By Through-Hole Technology (2022-2030) ($MN)
  • Table 46 Global Printed Circuit Boards (PCBs) Market Outlook, By Microwave and RF Technology (2022-2030) ($MN)
  • Table 47 Global Printed Circuit Boards (PCBs) Market Outlook, By Embedded Component Technology (2022-2030) ($MN)
  • Table 48 Global Printed Circuit Boards (PCBs) Market Outlook, By Flexible and rigid-flex technology (2022-2030) ($MN)
  • Table 49 Global Printed Circuit Boards (PCBs) Market Outlook, By High-Density Interconnect (HDI) Technology (2022-2030) ($MN)
  • Table 50 Global Printed Circuit Boards (PCBs) Market Outlook, By Photochemical Machining Technology (2022-2030) ($MN)
  • Table 51 Global Printed Circuit Boards (PCBs) Market Outlook, By Laser Direct Imaging (LDI) (2022-2030) ($MN)
  • Table 52 Global Printed Circuit Boards (PCBs) Market Outlook, By Other Technologies (2022-2030) ($MN)
  • Table 53 Global Printed Circuit Boards (PCBs) Market Outlook, By End User (2022-2030) ($MN)
  • Table 54 Global Printed Circuit Boards (PCBs) Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 55 Global Printed Circuit Boards (PCBs) Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 56 Global Printed Circuit Boards (PCBs) Market Outlook, By Telecommunications (2022-2030) ($MN)
  • Table 57 Global Printed Circuit Boards (PCBs) Market Outlook, By Medical Devices (2022-2030) ($MN)
  • Table 58 Global Printed Circuit Boards (PCBs) Market Outlook, By Aerospace and Defense (2022-2030) ($MN)
  • Table 59 Global Printed Circuit Boards (PCBs) Market Outlook, By Industrial Electronics (2022-2030) ($MN)
  • Table 60 Global Printed Circuit Boards (PCBs) Market Outlook, By Other End Users (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.