市場調查報告書
商品編碼
1617214
碳化矽細粉的市場至2030年的預測:按等級、應用和地區分類的全球分析Silicon Carbide Fine Powder Market Forecasts to 2030 - Global Analysis By Grade (Metallurgical Grade, Refractory Grade, Abrasive Grade, Black Silicon Carbide and Green Silicon Carbide), Application and By Geography |
根據Stratistics MRC的資料,2024年全球碳化矽細粉市場規模為9,130.3億美元,預計在預測期內年複合成長率為13.1%,到2030年將達到19.1099億美元。
碳化矽(SiC)細粉是一種多功能材料,由於其優異的性能而廣泛應用於各種工業和技術應用。細碳化矽粉末是陶瓷、高級塗料和研磨材料的關鍵成分,以其出色的化學穩定性、高導熱性和優異的硬度而聞名。由於其粒徑小,可以精確地用於拋光和研磨等過程,也可以用作複合材料中的增強材料,以增加機械強度和耐熱性。
根據《應用物理學雜誌》報導,碳化矽獨特的電子特性使其在量子計算和其他先進技術應用中具有潛在用途,全球整體的研究經費已超過 1億美元。
對半導體和電子產品的興趣日益濃厚
碳化矽(SiC)細粉在半導體和電子產業的使用不斷增加也是推動市場擴張的主要因素之一。 SiC 因其可以在高溫、高電壓和高頻的惡劣環境下工作而受到高度重視。這使其成為絕緣柵雙極電晶體、肖特基二極體和金屬氧化物場效電晶體等電力電子元件的重要元件。此外,SiC微粉有助於設備小型化,同時提高效能、穩健性和效率,所有這些對於5G基礎設施和物聯網應用等技術的開發非常重要。
昂貴的製造成本
高製造成本是限制碳化矽(SiC)細粉市場的主要因素之一。 SiC的生產採用化學沉澱和二氧化矽碳熱還原等能源密集型過程,這顯著增加了最終成本。此外,製造高純度SiC粉末需要先進的機械和嚴格的品管,進一步增加了成本。此外,高昂的生產成本導致最終產品價格上漲,使小規模生產商和資源有限的產業難以負擔。
半導體技術開發
半導體技術的不斷改進為細碳化矽粉末提供了一條有前途的發展道路。隨著產業轉向使用更少能源的電子產品,SiC 作為肖特基二極體和 MOSFET 等功率元件的材料變得越來越受歡迎。這些組件擴大用於包括高頻、高電壓和高溫的應用,例如資料中心、再生能源系統和工業自動化。此外,向 5G 網路和物聯網(IoT)的過渡也推動了對 SiC 半導體的需求。
與替代材料的激烈競爭
碳化矽(SiC)微粉市場面臨的主要風險之一是來自替代材料的競爭加劇。例如,氧化鋁(Al2O3)、碳化硼和碳化鎢由於品質、經濟性和可用性相當,通常被認為是各種應用中 SiC 的良好替代品。氧化鋁廣泛用於陶瓷和磨料,對於不需要碳化矽高導電性或導熱性的領域來說,是更實惠的選擇。此外,儘管傳統矽基半導體仍主導電子市場,但矽技術的新發展加劇某些應用中來自 SiC 的競爭。
碳化矽(SiC)微粉市場受到 COVID-19 大流行的嚴重影響,擾亂了全球供應鏈、生產計劃和各行業的需求。疫情初期的封鎖和衛生預防措施迫使許多生產設施關閉或減少營運,導致碳化矽微粉的生產和交付延遲。此外,由於企業削減新技術投資或推遲計劃,電子、汽車和航太等關鍵產業的需求也放緩。
磨料級細分市場預計將在預測期內成為最大的細分市場
碳化矽細粉市場預計將由磨料級碳化矽細分市場主導。由於其耐用性和硬度,磨料級碳化矽主要用於切割工具、砂紙和研磨。該細分市場的優勢在於其廣泛應用於建築、金屬加工和汽車等領域。碳化矽耐高溫和高壓,使其成為精密拋光應用的理想選擇。此外,精密產品的生產需要高性能材料,對磨料級SiC的需求不斷增加,其在表面處理和拋光製程的使用進一步鞏固了其作為行業領導者的地位。
預計電子和半導體在預測期內將經歷最高的年複合成長率
碳化矽細粉市場預計在電子和半導體領域具有最高的年複合成長率。碳化矽因其優異的導電性、高熱穩定性以及在高功率應用中的有效性而對於電子和半導體行業非常重要。 SiC 擴大用於二極體、電晶體和 MOSFET 等功率元件,這對於先進通訊技術、再生能源系統和電動車的進步非常重要。此外,由於對高性能、節能電子元件的需求不斷成長,特別是隨著電動車和再生能源基礎設施的日益普及,電子和半導體市場預計將迅速擴大。
碳化矽細粉市場以亞太地區為主。中國、日本和韓國等國家強大的製造業和工業擴張是主要驅動力。由於碳化矽具有較高的電氣性能、機械強度和導熱性,這些國家是電子、汽車和能源等行業的主要參與者。此外,碳化矽的快速工業化以及對電動車和再生能源系統等節能技術不斷成長的需求得到了中國在該材料生產和消費方面的主導地位的支持。
碳化矽細粉市場預計將以北美地區最高的年複合成長率成長。該成長是由電力電子、電動車和再生能源來源等尖端應用對碳化矽不斷成長的需求所推動的。隨著美國注重提高能源效率和減少碳排放,各行業都在採用碳化矽基零件。此外,該地區強大的技術基礎設施以及半導體和電子產業持續的研發舉措也推動了對碳化矽等高性能材料的需求。
According to Stratistics MRC, the Global Silicon Carbide Fine Powder Market is accounted for $913.03 million in 2024 and is expected to reach $1910.99 billion by 2030 growing at a CAGR of 13.1% during the forecast period. Silicon carbide (SiC) fine powder is a highly versatile material widely used in various industrial and technological applications due to its exceptional properties. A vital component of ceramics, advanced coatings, and abrasive materials, silicon carbide fine powder is well-known for its exceptional chemical stability, high heat conductivity, and superior hardness. Because of its small particle size, it can be used precisely in processes like polishing and lapping and as a reinforcement material in composites to increase their mechanical strength and resistance to heat.
According to the Journal of Applied Physics, silicon carbide is being explored for its potential use in quantum computing and other advanced technological applications due to its unique electronic properties, with research funding exceeding $100 million globally.
Growing interest in semiconductors and electronics
One of the main factors propelling the market's expansion is the growing use of silicon carbide (SiC) fine powder in the semiconductor and electronics industries. Because SiC can function in harsh environments with high temperatures, voltages, and frequencies, it is highly prized. Because of this, it is a necessary component of power electronic devices like insulated-gate bipolar transistors, Schottky diodes, and metal-oxide-semiconductor field-effect transistors. Furthermore, SiC fine powder facilitates device miniaturization while improving performance, robustness, and efficiency, all of which are essential for developing technologies like 5G infrastructure and Internet of Things applications.
Expensive production costs
The high cost of production is one of the main factors limiting the market for silicon carbide (SiC) fine powder. Energy-intensive processes like chemical vapor deposition and carbothermal reduction of silica are used in the production of SiC, and they greatly raise the final cost. High-purity SiC powder production also necessitates sophisticated machinery and exacting quality control, which raises costs even more. Additionally, these high production costs result in higher final product prices, making them unaffordable for smaller producers and sectors with limited resources.
Technological developments in semiconductors
A promising growth path for silicon carbide fine powder is offered by the continuous improvements in semiconductor technology. As industries shift toward electronics that use less energy, SiC is becoming a more popular material for power devices like Schottky diodes and MOSFETs. Applications involving high frequency, high voltage, and high temperature-such as data centers, renewable energy systems, and industrial automation-are using these components more frequently. Furthermore, the need for SiC-based semiconductors is also being driven by the move to 5G networks and the Internet of Things (IoT), since these technologies perform better than conventional silicon.
Vigorous rivalry from alternatives
The growing competition from substitute materials is one of the main risks facing the market for silicon carbide (SiC) fine powder. For instance, because of their comparable qualities, affordability, and accessibility, aluminum oxide (Al2O3), boron carbide, and tungsten carbide are frequently regarded as good substitutes for SiC in a variety of applications. Widely used in ceramics and abrasives, aluminum oxide provides a more affordable option for sectors that don't need SiC's high electrical or thermal conductivity. Moreover, traditional silicon-based semiconductors still rule the electronics market, though new developments in silicon technologies have made them more competitive with SiC in some applications.
The market for silicon carbide (SiC) fine powder was significantly impacted by the COVID-19 pandemic, which caused disruptions in global supply chains, production schedules, and demand across a range of industries. Lockdowns and health precautions during the early stages of the pandemic forced many manufacturing facilities to shut down or scale back operations, which caused delays in the production and delivery of SiC fine powder. Additionally, there were also slowdowns in demand from important industries like electronics, automotive, and aerospace as businesses reduced their investments in new technologies or postponed projects.
The Abrasive Grade segment is expected to be the largest during the forecast period
The market for silicon carbide fine powder is expected to be dominated by the Abrasive Grade Silicon Carbide segment. Because of its durability and hardness, abrasive-grade silicon carbide is mostly used to make cutting tools, sandpaper, and grinding wheels. Its extensive uses in sectors like construction, metalworking, and automotive benefits this segment. It is perfect for precision abrasive applications because of its resistance to high temperatures and pressures. Furthermore, the need for high-performance materials in the production of precision goods fuels the demand for abrasive-grade SiC, and its use in surface preparation and polishing procedures further solidifies its position as the industry leader.
The Electronics and Semiconductors segment is expected to have the highest CAGR during the forecast period
The market for silicon carbide fine powder is anticipated to grow at the highest CAGR in the Electronics and Semiconductors segment. Because of its exceptional electrical conductivity, high thermal stability, and effectiveness in high-power applications, silicon carbide is essential to the electronics and semiconductor industries. SiC is being utilized more and more in power devices such as diodes, transistors, and MOSFETs, which are critical to the advancement of advanced communication technologies, renewable energy systems, and electric vehicles. Moreover, the electronics and semiconductor market is expected to expand quickly due to the growing need for high-performance, energy-efficient electronic components, especially as electric vehicles and renewable energy infrastructure become more popular.
The market for silicon carbide fine powder is dominated by the Asia Pacific region. The robust manufacturing sectors and industrial expansion in nations like China, Japan, and South Korea are the main drivers of this. Because of silicon carbide's high electrical characteristics, mechanical strength, and thermal conductivity, these nations are major players in industries like electronics, automotive, and energy. Additionally, the rapid industrialization of silicon carbide and the rising demand for energy-efficient technologies, such as electric vehicles and renewable energy systems, are supported by China's dominance in both the production and consumption of the material.
The silicon carbide fine powder market is anticipated to grow at the highest CAGR in the North American region. The rising need for silicon carbide in cutting-edge applications like power electronics, electric cars, and renewable energy sources is what is causing this growth. The adoption of SiC-based components in a variety of industries is being driven by the United States' emphasis on improving energy efficiency and lowering carbon emissions. Furthermore, the demand for high-performance materials like silicon carbide is also being fueled by the region's robust technological infrastructure as well as continuous research and development initiatives in the semiconductor and electronics industries.
Key players in the market
Some of the key players in Silicon Carbide Fine Powder market include Wolfspeed, Inc, STMicroelectronics, Advanced Abrasives Corporation, Fuji Electric Co., Ltd., Infineon Technologies AG, Carborundum Universal Limited, US Research Nanomaterials, Inc., Imerys, AGSCO Corp, Fiven ASA, Nanoshel, Coherent, Futong Industry Co. Limited, Entegris and Saint Gobain.
In October 2024, Wolfspeed, Inc. has amended its financial agreement with Renesas Electronics America Inc. The modification, effective as of Monday, allows Wolfspeed to convert accrued interest on loans into principal and secures the right to pledge assets for government grants. The original agreement, signed on July 5, 2023, allowed Renesas America to provide refundable deposits to Wolfspeed.
In April 2024, STMicroelectronics and Centrica Energy Trading A/S announced that they have signed a ten-year Power Purchase Agreement (PPA) for the supply of renewable energy to its operations in Italy, starting January 2025. The agreement is based on the sale by Centrica of approximately 61 GWh of renewable energy per year, produced by a new solar farm in Italy.
In February 2024, Infineon Technologies AG and ASE Technology Holding Co. have announced that definitive agreements were signed under which Infineon will sell two backend manufacturing sites, one in Cavite, Philippines, and one in Cheonan, South Korea, to two fully owned subsidiaries of ASE, a leading provider of independent semiconductor manufacturing services in assembly and test.