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熱界面材料(TIM)的全球市場(2025年～2035年)
市場調查報告書
商品編碼
1657667

熱界面材料(TIM)的全球市場(2025年～2035年)

The Global Thermal Interface Materials (TIMs) Market 2025-2035
出版日期: | 出版商: Future Markets, Inc. | 英文 272 Pages, 75 Tables, 84 Figures | 訂單完成後即時交付

價格

隨著電子設備和系統變得越來越小、更快、更強大，有效的熱界面材料在各個行業變得越來越重要。從電動車中的電力電子和再生能源中的逆變器到先進的半導體和資料中心伺服器，有效管理熱界面對於實現最佳性能、設備可靠性和延長系統壽命至關重要。公司面臨採用尖端熱界面解決方案的壓力，這些解決方案旨在解決增加熱阻的課題，同時平衡熱導率、成本效益和環境永續性。作為回應，材料科學家和製造商正在致力於開發先進的熱界面材料，包括新的相變配方、結合碳奈米管和石墨烯的下一代複合材料、導熱陶瓷和液態金屬介面。這些創新旨在突破熱導率的界限，同時保持相容性、可靠性和易用性等關鍵特性。重點是開發能夠處理更高熱通量、降低熱阻並在長運行週期內保持性能的 TIM。

一些關鍵趨勢正在推動對增強熱界面材料的需求，包括電力電子領域向寬頻隙半導體的轉變、計算應用中處理器密度的增加以及電動車的日益普及。這些應用需要能夠管理更高工作溫度的 TIM，同時在惡劣的環境條件下提供穩定的效能。隨著設備的不斷發展，熱界面材料在下一代電子和電力系統中發揮越來越重要的作用。

由於電子、汽車、醫療設備和工業應用等各領域的需求不斷增加，熱界面材料 (TIM) 市場呈現強勁成長。傳統材料繼續佔據市場主導地位，導熱油脂和間隙填充物目前約佔應用的 45-50%。然而，包括相變化合物、石墨烯增強產品和新型複合材料在內的先進材料正在獲得相當大的市場佔有率，尤其是在高性能應用領域。液態金屬市場雖然規模較小，但在熱性能至關重要的高端應用中卻經歷了快速成長。

本報告分析了全球熱界面材料 (TIM) 市場，並深入了解了 2025 年至 2035 年的市場趨勢、技術發展和成長機會。

目錄

第1章 簡介

  • 熱管理－主動與被動
  • 什麼是熱界面材料 (TIM)？
  • TIM 的比較特性
  • 導熱墊和導熱矽脂的區別
  • 按類型劃分的 TIM 優點和缺點
  • 效能
  • 價格
  • TIM 中的新技術
  • TIM 的供應鏈
  • 原料分析與定價
  • 環境法規與永續性

第2章 材料

  • 先進的多功能TIM
  • TIM填充物
  • 熱傳導潤滑脂，粘貼
  • 熱感差距墊片
  • 熱感差距填充物
  • 灌封化合物/封裝材料
  • 粘著膠帶
  • 相變材料
  • 金屬為基礎的TIM
  • 碳為基礎的TIM
  • 超材料
  • 自我修復型熱界面材料
  • TIM點膠

第3章 熱界面材料(TIM)的市場

  • 消費者電子產品
  • 電動車(EV)
  • 資料中心
  • ADAS感測器
  • EMI屏蔽
  • 5G
  • 航太·防衛
  • 工業用電子設備
  • 再生能源
  • 醫療用電子設備

第4章 企業簡介(企業11公司的簡介)

第5章 調查手法

第6章 參考文獻

Effective thermal interface materials are becoming increasingly critical across industries as electronic devices and systems grow smaller, faster, and more power-dense. From electric vehicle power electronics and renewable energy inverters to advanced semiconductors and data center servers, managing thermal interfaces efficiently is essential for optimal performance, device reliability, and system longevity. Companies are facing rising pressure to adopt cutting-edge thermal interface solutions that address growing thermal resistance challenges while balancing thermal conductivity, cost-effectiveness, and environmental sustainability. In response, materials scientists and manufacturers are developing advanced thermal interface materials - including novel phase-change formulations, next-generation composite materials incorporating carbon nanotubes and graphene, thermally conductive ceramics, and liquid metal interfaces. These innovations aim to push the boundaries of thermal conductivity while maintaining critical properties like conformability, reliability, and ease of application. The focus is on developing TIMs that can handle higher heat fluxes, reduce thermal resistance, and maintain performance over extended operating cycles.

The demand for enhanced thermal interface materials is being driven by several key trends: the transition to wide bandgap semiconductors in power electronics, increasing processor densities in computing applications, and the growing adoption of electric vehicles. These applications require TIMs capable of managing higher operating temperatures while providing consistent performance under challenging environmental conditions. As devices continue to evolve, thermal interface materials play an increasingly vital role in enabling next-generation electronics and power systems.

The thermal interface materials (TIM) market demonstrates robust growth driven by increasing demands across multiple sectors including electronics, automotive, medical devices, and industrial applications. Traditional materials continue to dominate the market, with thermal greases and gap fillers representing approximately 45-50% of current applications. However, advanced materials including phase change compounds, graphene-enhanced products, and novel composites are gaining significant market share, particularly in high-performance applications. The liquid metal segment, while smaller, shows rapid growth in premium applications where thermal performance is critical.

"The Global Thermal Interface Materials Market 2025-2035" analyzes the global thermal interface materials (TIMs) industry, providing detailed insights into market trends, technological developments, and growth opportunities from 2025 to 2035. The report examines the crucial role of thermal interface materials in managing heat dissipation across various industries, including consumer electronics, electric vehicles, data centers, aerospace & defense, and emerging technology sectors. The study provides in-depth analysis of various TIM types, including thermal greases, gap fillers, phase change materials, metal-based TIMs, and emerging technologies such as graphene-enhanced compounds and carbon nanotubes. A detailed examination of material properties, performance characteristics, and application-specific requirements offers valuable insights for industry stakeholders.

Report contents include:

  • Key market segments covered include consumer electronics, where increasing device miniaturization drives demand for advanced thermal management solutions; electric vehicles, where battery thermal management and power electronics create new opportunities; and data centers, where growing computing demands necessitate improved cooling solutions.
  • Emerging applications in 5G infrastructure, ADAS sensors, and medical electronics.
  • Carbon-based TIMs, metamaterials, and self-healing compounds.
  • Supply chain analysis
  • Price analysis of both raw materials and finished products.
  • Market forecasts for all major segments, with detailed breakdowns by material type, application, and geographic region. The analysis includes market size projections, growth rates, and emerging opportunities across different end-use sectors.
  • Detailed profiles of 111 companies active in the thermal interface materials market, from established global manufacturers to innovative technology startups. Each profile includes company overview, product portfolio, technological capabilities, and strategic developments. Companies profiled include 3M, ADA Technologies, AI Technology Inc., Aismalibar S.A., Alpha Assembly, AOK Technologies, AOS Thermal Compounds LLC, Arkema, Arieca Inc., ATP Adhesive Systems AG, Aztrong Inc., Bando Chemical Industries Ltd., BestGraphene, BNNano, BNNT LLC, Boyd Corporation, BYK, Cambridge Nanotherm, Carbice Corp., Carbon Waters, Carbodeon Ltd. Oy, CondAlign AS, Denka Company Limited, Detakta Isolier- und Messtechnik GmbH & Co. KG, Dexerials Corporation, Deyang Carbonene Technology, Dow Corning, Dupont (Laird Performance Materials), Dymax Corporation, Dynex Semiconductor (CRRC), ELANTAS Europe GmbH, Elkem Silcones, Enerdyne Thermal Solutions Inc., Epoxies Etc., First Graphene Ltd, Fujipoly, Fujitsu Laboratories, GCS Thermal, GLPOLY, Global Graphene Group, Goodfellow Corporation, Graphmatech AB, GuangDong KingBali New Material Co. Ltd., HALA Contec GmbH & Co. KG, Hamamatsu Carbonics Corporation, H.B. Fuller Company, Henkel AG & Co. KGAA, Hitek Electronic Materials, Honeywell, Hongfucheng New Materials, Huber Martinswerk, HyMet Thermal Interfaces SIA, Indium Corporation, Inkron, KB Element, Kerafol Keramische Folien GmbH & Co. KG, Kitagawa, KULR Technology Group Inc., Kyocera, Leader Tech Inc., LiSAT, LiquidCool Solutions, Liquid Wire Inc., MacDermid Alpha, MG Chemicals Ltd, Minoru Co. Ltd., Mithras Technology AG, Molecular Rebar Design LLC, Momentive Performance Materials, Morion NanoTech, Nanoramic Laboratories, Nano Tim, NeoGraf Solutions LLC, Nitronix, Nolato Silikonteknik, NovoLinc and more.
  • Technical specifications and performance metrics for various TIM types, enabling comparison of different solutions for specific applications.

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Thermal management-active and passive
  • 1.2. What are thermal interface materials (TIMs)?
    • 1.2.1. Types
    • 1.2.2. Thermal conductivity
  • 1.3. Comparative properties of TIMs
  • 1.4. Differences between thermal pads and grease
  • 1.5. Advantages and disadvantages of TIMs, by type
  • 1.6. Performance
  • 1.7. Prices
  • 1.8. Emerging Technologies in TIMs
  • 1.9. Supply Chain for TIMs
  • 1.10. Raw Material Analysis and Pricing
  • 1.11. Environmental Regulations and Sustainability

2. MATERIALS

  • 2.1. Advanced and Multi-Functional TIMs
  • 2.2. TIM fillers
    • 2.2.1. Trends
    • 2.2.2. Pros and Cons
    • 2.2.3. Thermal Conductivity
    • 2.2.4. Spherical Alumina
    • 2.2.5. Alumina Fillers
    • 2.2.6. Boron nitride (BN)
    • 2.2.7. Filler and polymer TIMs
    • 2.2.8. Filler Sizes
  • 2.3. Thermal greases and pastes
    • 2.3.1. Overview and properties
    • 2.3.2. SWOT analysis
  • 2.4. Thermal gap pads
    • 2.4.1. Overview and properties
    • 2.4.2. SWOT analysis
  • 2.5. Thermal gap fillers
    • 2.5.1. Overview and properties
    • 2.5.2. SWOT analysis
  • 2.6. Potting compounds/encapsulants
    • 2.6.1. Overview and properties
    • 2.6.2. SWOT analysis
  • 2.7. Adhesive Tapes
    • 2.7.1. Overview and properties
    • 2.7.2. SWOT analysis
  • 2.8. Phase Change Materials
    • 2.8.1. Overview and properties
    • 2.8.2. Types
      • 2.8.2.1. Organic/biobased phase change materials
        • 2.8.2.1.1. Advantages and disadvantages
        • 2.8.2.1.2. Paraffin wax
        • 2.8.2.1.3. Non-Paraffins/Bio-based
      • 2.8.2.2. Inorganic phase change materials
        • 2.8.2.2.1. Salt hydrates
          • 2.8.2.2.1.1. Advantages and disadvantages
        • 2.8.2.2.2. Metal and metal alloy PCMs (High-temperature)
      • 2.8.2.3. Eutectic mixtures
      • 2.8.2.4. Encapsulation of PCMs
        • 2.8.2.4.1. Macroencapsulation
        • 2.8.2.4.2. Micro/nanoencapsulation
      • 2.8.2.5. Nanomaterial phase change materials
    • 2.8.3. Thermal energy storage (TES)
      • 2.8.3.1. Sensible heat storage
      • 2.8.3.2. Latent heat storage
    • 2.8.4. Application in TIMs
      • 2.8.4.1. Thermal pads
      • 2.8.4.2. Low Melting Alloys (LMAs)
    • 2.8.5. SWOT analysis
  • 2.9. Metal-based TIMs
    • 2.9.1. Overview
    • 2.9.2. Solders and low melting temperature alloy TIMs
      • 2.9.2.1. Solder TIM1
      • 2.9.2.2. Sintering
    • 2.9.3. Liquid metals
    • 2.9.4. Solid liquid hybrid (SLH) metals
      • 2.9.4.1. Hybrid liquid metal pastes
      • 2.9.4.2. SLH created during chip assembly (m2TIMs)
      • 2.9.4.3. Die-attach materials
        • 2.9.4.3.1. Solder Alloys and Conductive Adhesives
        • 2.9.4.3.2. Silver-Sintered Paste
        • 2.9.4.3.3. Copper (Cu) sintered TIMs
          • 2.9.4.3.3.1. TIM1 - Sintered Copper
          • 2.9.4.3.3.2. Cu Sinter Materials
        • 2.9.4.3.4. Sintered Copper Die-Bonding Paste
        • 2.9.4.3.5. Graphene Enhanced Sintered Copper TIMs
    • 2.9.5. SWOT analysis
  • 2.10. Carbon-based TIMs
    • 2.10.1. Carbon nanotube (CNT) TIM Fabrication
    • 2.10.2. Multi-walled nanotubes (MWCNT)
      • 2.10.2.1. Properties
      • 2.10.2.2. Application as thermal interface materials
    • 2.10.3. Single-walled carbon nanotubes (SWCNTs)
      • 2.10.3.1. Properties
      • 2.10.3.2. Application as thermal interface materials
    • 2.10.4. Vertically aligned CNTs (VACNTs)
      • 2.10.4.1. Properties
      • 2.10.4.2. Applications
      • 2.10.4.3. Application as thermal interface materials
    • 2.10.5. BN nanotubes (BNNT) and nanosheets (BNNS)
      • 2.10.5.1. Properties
      • 2.10.5.2. Application as thermal interface materials
    • 2.10.6. Graphene
      • 2.10.6.1. Properties
      • 2.10.6.2. Application as thermal interface materials
        • 2.10.6.2.1. Graphene fillers
        • 2.10.6.2.2. Graphene foam
        • 2.10.6.2.3. Graphene aerogel
        • 2.10.6.2.4. Graphene Heat Spreaders
        • 2.10.6.2.5. Graphene in Thermal Interface Pads
    • 2.10.7. Nanodiamonds
      • 2.10.7.1. Properties
      • 2.10.7.2. Application as thermal interface materials
    • 2.10.8. Graphite
      • 2.10.8.1. Properties
      • 2.10.8.2. Natural graphite
        • 2.10.8.2.1. Classification
        • 2.10.8.2.2. Processing
        • 2.10.8.2.3. Flake
          • 2.10.8.2.3.1. Grades
          • 2.10.8.2.3.2. Applications
      • 2.10.8.3. Synthetic graphite
        • 2.10.8.3.1. Classification
          • 2.10.8.3.1.1. Primary synthetic graphite
          • 2.10.8.3.1.2. Secondary synthetic graphite
          • 2.10.8.3.1.3. Processing
      • 2.10.8.4. Applications as thermal interface materials
        • 2.10.8.4.1. Graphite Sheets
        • 2.10.8.4.2. Vertical graphite
        • 2.10.8.4.3. Graphite pastes
    • 2.10.9. Hexagonal Boron Nitride
      • 2.10.9.1. Properties
      • 2.10.9.2. Application as thermal interface materials
    • 2.10.10. SWOT analysis
  • 2.11. Metamaterials
    • 2.11.1. Types and properties
      • 2.11.1.1. Electromagnetic metamaterials
        • 2.11.1.1.1. Double negative (DNG) metamaterials
        • 2.11.1.1.2. Single negative metamaterials
        • 2.11.1.1.3. Electromagnetic bandgap metamaterials (EBG)
        • 2.11.1.1.4. Bi-isotropic and bianisotropic metamaterials
        • 2.11.1.1.5. Chiral metamaterials
        • 2.11.1.1.6. Electromagnetic "Invisibility" cloak
      • 2.11.1.2. Terahertz metamaterials
      • 2.11.1.3. Photonic metamaterials
      • 2.11.1.4. Tunable metamaterials
      • 2.11.1.5. Frequency selective surface (FSS) based metamaterials
      • 2.11.1.6. Nonlinear metamaterials
      • 2.11.1.7. Acoustic metamaterials
    • 2.11.2. Application as thermal interface materials
  • 2.12. Self-healing thermal interface materials
    • 2.12.1. Extrinsic self-healing
    • 2.12.2. Capsule-based
    • 2.12.3. Vascular self-healing
    • 2.12.4. Intrinsic self-healing
    • 2.12.5. Healing volume
    • 2.12.6. Types of self-healing materials, polymers and coatings
    • 2.12.7. Applications in thermal interface materials
  • 2.13. TIM Dispensing
    • 2.13.1. Low-volume Dispensing Methods
    • 2.13.2. High-volume Dispensing Methods
    • 2.13.3. Meter, Mix, Dispense (MMD) Systems
    • 2.13.4. TIM Dispensing Equipment Suppliers

3. MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs)

  • 3.1. Consumer electronics
    • 3.1.1. Market overview
      • 3.1.1.1. Market drivers
      • 3.1.1.2. Applications
        • 3.1.1.2.1. Smartphones and tablets
        • 3.1.1.2.2. Wearable electronics
    • 3.1.2. Global market 2022-2035, by TIM type
  • 3.2. Electric Vehicles (EV)
    • 3.2.1. Market overview
      • 3.2.1.1. Market drivers
      • 3.2.1.2. Applications
        • 3.2.1.2.1. Lithium-ion batteries
          • 3.2.1.2.1.1. Cell-to-pack designs
          • 3.2.1.2.1.2. Cell-to-chassis/body
        • 3.2.1.2.2. Power electronics
          • 3.2.1.2.2.1. Types
          • 3.2.1.2.2.2. Properties for EV power electronics
          • 3.2.1.2.2.3. TIM2 in SiC MOSFET
        • 3.2.1.2.3. Charging stations
    • 3.2.2. Global market 2022-2035, by TIM type
  • 3.3. Data Centers
    • 3.3.1. Market overview
      • 3.3.1.1. Market drivers
      • 3.3.1.2. Applications
        • 3.3.1.2.1. Router, switches and line cards
          • 3.3.1.2.1.1. Transceivers
          • 3.3.1.2.1.2. Server Boards
          • 3.3.1.2.1.3. Switches and Routers
        • 3.3.1.2.2. Servers
        • 3.3.1.2.3. Power supply converters
    • 3.3.2. Global market 2022-2035, by TIM type
  • 3.4. ADAS Sensors
    • 3.4.1. Market overview
      • 3.4.1.1. Market drivers
      • 3.4.1.2. Applications
        • 3.4.1.2.1. ADAS Cameras
          • 3.4.1.2.1.1. Commercial examples
        • 3.4.1.2.2. ADAS Radar
          • 3.4.1.2.2.1. Radar technology
          • 3.4.1.2.2.2. Radar boards
          • 3.4.1.2.2.3. Commercial examples
        • 3.4.1.2.3. ADAS LiDAR
          • 3.4.1.2.3.1. Role of TIMs
          • 3.4.1.2.3.2. Commercial examples
        • 3.4.1.2.4. Electronic control units (ECUs) and computers
          • 3.4.1.2.4.1. Commercial examples
        • 3.4.1.2.5. Die attach materials
        • 3.4.1.2.6. Commercial examples
    • 3.4.2. Global market 2022-2035, by TIM type
  • 3.5. EMI shielding
    • 3.5.1. Market overview
      • 3.5.1.1. Market drivers
      • 3.5.1.2. Applications
        • 3.5.1.2.1. Dielectric Constant
        • 3.5.1.2.2. ADAS
          • 3.5.1.2.2.1. Radar
          • 3.5.1.2.2.2. 5G
        • 3.5.1.2.3. Commercial examples
  • 3.6. 5G
    • 3.6.1. Market overview
      • 3.6.1.1. Market drivers
      • 3.6.1.2. Applications
        • 3.6.1.2.1. EMI shielding and EMI gaskets
        • 3.6.1.2.2. Antenna
        • 3.6.1.2.3. Base Band Unit (BBU)
        • 3.6.1.2.4. Liquid TIMs
        • 3.6.1.2.5. Power supplies
          • 3.6.1.2.5.1. Increased power consumption in 5G
    • 3.6.2. Market players
    • 3.6.3. Global market 2022-2035, by TIM type
  • 3.7. Aerospace & Defense
    • 3.7.1. Market overview
      • 3.7.1.1. Market drivers
      • 3.7.1.2. Applications
        • 3.7.1.2.1. Satellite thermal management
        • 3.7.1.2.2. Avionics cooling
        • 3.7.1.2.3. Military electronics
      • 3.7.1.3. Global market 2022-2035, by TIM type
  • 3.8. Industrial Electronics
    • 3.8.1. Market overview
      • 3.8.1.1. Market drivers
      • 3.8.1.2. Applications
        • 3.8.1.2.1. Industrial automation
        • 3.8.1.2.2. Power supplies
        • 3.8.1.2.3. Motor drives
        • 3.8.1.2.4. LED lighting
    • 3.8.2. Global market 2022-2035, by TIM type
  • 3.9. Renewable Energy
    • 3.9.1. Market overview
      • 3.9.1.1. Market drivers
      • 3.9.1.2. Applications
        • 3.9.1.2.1. Solar inverters
        • 3.9.1.2.2. Wind power electronics
        • 3.9.1.2.3. Energy storage systems
    • 3.9.2. Global market 2022-2035, by TIM type
  • 3.10. Medical Electronics
    • 3.10.1. Market overview
      • 3.10.1.1. Market drivers
      • 3.10.1.2. Applications
        • 3.10.1.2.1. Diagnostic equipment
        • 3.10.1.2.2. Medical imaging systems
        • 3.10.1.2.3. Patient monitoring devices
    • 3.10.2. Global market 2022-2035, by TIM type

4. COMPANY PROFILES (11 company profiles)

5. RESEARCH METHODOLOGY

6. REFERENCES

List of Tables

  • Table 1. Thermal conductivities (K) of common metallic, carbon, and ceramic fillers employed in TIMs
  • Table 2. Commercial TIMs and their properties
  • Table 3. Advantages and disadvantages of TIMs, by type
  • Table 4. Key Factors in System Level Performance for TIMs
  • Table 5. Thermal interface materials prices
  • Table 6. Comparisons of Price and Thermal Conductivity for TIMs
  • Table 7. Price Comparison of TIM Fillers
  • Table 8. Raw Material Analysis and Pricing
  • Table 9. Characteristics of some typical TIMs
  • Table 10. Trends on TIM Fillers
  • Table 11. Pros and Cons of TIM Fillers
  • Table 12. Commercial thermal paste products
  • Table 13.Commercial thermal gap pads (thermal interface materials)
  • Table 14. Commercial thermal gap fillers products
  • Table 15. Types of Potting Compounds/Encapsulants
  • Table 16. TIM adhesives tapes
  • Table 17. Commercial phase change materials (PCM) thermal interface materials (TIMs) products
  • Table 18. Properties of PCMs
  • Table 19. PCM Types and properties
  • Table 20. Advantages and disadvantages of organic PCMs
  • Table 21. Advantages and disadvantages of organic PCM Fatty Acids
  • Table 22. Advantages and disadvantages of salt hydrates
  • Table 23. Advantages and disadvantages of low melting point metals
  • Table 24. Advantages and disadvantages of eutectics
  • Table 25. Benefits and drawbacks of PCMs in TIMs
  • Table 26. Comparison of Carbon-based TIMs
  • Table 27. Properties of CNTs and comparable materials
  • Table 28. Typical properties of SWCNT and MWCNT
  • Table 29. Comparison of carbon-based additives in terms of the main parameters influencing their value proposition as a conductive additive
  • Table 30. Thermal conductivity of CNT-based polymer composites
  • Table 31. Comparative properties of BNNTs and CNTs
  • Table 32. Properties of graphene, properties of competing materials, applications thereof
  • Table 33. Properties of nanodiamonds
  • Table 34. Comparison between Natural and Synthetic Graphite
  • Table 35. Classification of natural graphite with its characteristics
  • Table 36. Characteristics of synthetic graphite
  • Table 37. Thermal Conductivity Comparison of Graphite TIMs
  • Table 38. Properties of hexagonal boron nitride (h-BN)
  • Table 39. Comparison of self-healing systems
  • Table 40. Types of self-healing coatings and materials
  • Table 41. Comparative properties of self-healing materials
  • Table 42. Challenges for Dispensing TIM
  • Table 43. Thermal Management Application Areas in Consumer Electronics
  • Table 44. Trends in Smartphone Thermal Materials
  • Table 45. Thermal Management approaches in commercial Smartphones
  • Table 46. Global market in consumer electronics 2022-2035, by TIM type (millions USD)
  • Table 47. Global market in electric vehicles 2022-2035, by TIM type (millions USD)
  • Table 48. TIM Trends in Data Centers
  • Table 49. TIM Area Forecast in Server Boards: 2022-2035 (m2)
  • Table 50. Global market in data centers 2022-2035, by TIM type (millions USD)
  • Table 51. TIM Players in ADAS
  • Table 52. Die Attach for ADAS Sensors
  • Table 53. Die Attach Area Forecast for Key Components Within ADAS Sensors: 2022-2035 (m2)
  • Table 54. Global market in ADAS sensors 2022-2035, by TIM type (millions USD)
  • Table 55. TIM Area Forecast for 5G Antennas by Station Size: 2022-2035 (m2)
  • Table 56. TIM Area Forecast for 5G Antennas by Station Frequency: 2022-2035 (m2)
  • Table 57. TIMS in BBU
  • Table 58. 5G BBY models
  • Table 59. TIM Area Forecast for 5G BBU: 2022-2035 (m2)
  • Table 60. Power Consumption Forecast for 5G: 2022-2035 (GW)
  • Table 61. TIM Area Forecast for Power Supplies: 2022-2035 (m2)
  • Table 62. TIM market players in 5G
  • Table 63. Global market in 5G 2022-2035, by TIM type (millions USD)
  • Table 64. Market Drivers for TIMS in aerospace and defense
  • Table 65. Applications for TIMS in aerospace and defense
  • Table 66. Global Market for TIMs in aerospace and defense 2022-2035, by TIM Type (Millions USD)
  • Table 67. Market Drivers for TIMs in industrial electronics
  • Table 68. Applications for TIMs in industrial electronics
  • Table 69. Global Market 2022-2035, by TIM Type in Industrial Electronics (Millions USD)
  • Table 70. Market Drivers for TIMs in renewable energy
  • Table 71. Applications for TIMs in renewable energy
  • Table 72. Global Market for TIMs in Renewable Energy 2022-2035 (Millions USD)
  • Table 73. Market Drivers for TIMs in medical electronics
  • Table 74. Applications for TIMs in medical electronics
  • Table 75. Global Market 2022-2035 for TIMs in Medical Electronics (Millions USD)

List of Figures

  • Figure 1. (L-R) Surface of a commercial heatsink surface at progressively higher magnifications, showing tool marks that create a rough surface and a need for a thermal interface material
  • Figure 2. Schematic of thermal interface materials used in a flip chip package
  • Figure 3. Thermal grease
  • Figure 4. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module
  • Figure 5. Supply Chain for TIMs
  • Figure 6. Commercial thermal paste products
  • Figure 7. Application of thermal silicone grease
  • Figure 8. A range of thermal grease products
  • Figure 9. SWOT analysis for thermal greases and pastes
  • Figure 10. Thermal Pad
  • Figure 11. SWOT analysis for thermal gap pads
  • Figure 12. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module
  • Figure 13. SWOT analysis for thermal gap fillers
  • Figure 14. SWOT analysis for Potting compounds/encapsulants
  • Figure 15. Thermal adhesive products
  • Figure 16. SWOT analysis for TIM adhesives tapes
  • Figure 17. Phase-change TIM products
  • Figure 18. PCM mode of operation
  • Figure 19. Classification of PCMs
  • Figure 20. Phase-change materials in their original states
  • Figure 21. Thermal energy storage materials
  • Figure 22. Phase Change Material transient behaviour
  • Figure 23. PCM TIMs
  • Figure 24. Phase Change Material - die cut pads ready for assembly
  • Figure 25. SWOT analysis for phase change materials
  • Figure 26. Typical IC package construction identifying TIM1 and TIM2
  • Figure 27. Liquid metal TIM product
  • Figure 28. Pre-mixed SLH
  • Figure 29. HLM paste and Liquid Metal Before and After Thermal Cycling
  • Figure 30. SLH with Solid Solder Preform
  • Figure 31. Automated process for SLH with solid solder preforms and liquid metal
  • Figure 32. SWOT analysis for metal-based TIMs
  • Figure 33. Schematic diagram of a multi-walled carbon nanotube (MWCNT)
  • Figure 34. Schematic of single-walled carbon nanotube
  • Figure 35. Types of single-walled carbon nanotubes
  • Figure 36. Schematic of a vertically aligned carbon nanotube (VACNT) membrane used for water treatment
  • Figure 37. Schematic of Boron Nitride nanotubes (BNNTs). Alternating B and N atoms are shown in blue and red
  • Figure 38. Graphene layer structure schematic
  • Figure 39. Illustrative procedure of the Scotch-tape based micromechanical cleavage of HOPG
  • Figure 40. Graphene and its descendants: top right: graphene; top left: graphite = stacked graphene; bottom right: nanotube=rolled graphene; bottom left: fullerene=wrapped graphene
  • Figure 41. Flake graphite
  • Figure 42. Applications of flake graphite
  • Figure 43. Graphite-based TIM products
  • Figure 44. Structure of hexagonal boron nitride
  • Figure 45. SWOT analysis for carbon-based TIMs
  • Figure 46. Classification of metamaterials based on functionalities
  • Figure 47. Electromagnetic metamaterial
  • Figure 48. Schematic of Electromagnetic Band Gap (EBG) structure
  • Figure 49. Schematic of chiral metamaterials
  • Figure 50. Nonlinear metamaterials- 400-nm thick nonlinear mirror that reflects frequency-doubled output using input light intensity as small as that of a laser pointer
  • Figure 51. Schematic of self-healing polymers. Capsule based (a), vascular (b), and intrinsic (c) schemes for self-healing materials. Red and blue colours indicate chemical species which react (purple) to heal damage
  • Figure 52. Stages of self-healing mechanism
  • Figure 53. Self-healing mechanism in vascular self-healing systems
  • Figure 54. Schematic of TIM operation in electronic devices
  • Figure 55. Schematic of Thermal Management Materials in smartphone
  • Figure 56. Wearable technology inventions
  • Figure 57. Global market in consumer electronics 2022-2035, by TIM type (millions USD)
  • Figure 58. Application of thermal interface materials in automobiles
  • Figure 59. EV battery components including TIMs
  • Figure 60. Battery pack with a cell-to-pack design and prismatic cells
  • Figure 61. Cell-to-chassis battery pack
  • Figure 62. TIMS in EV charging station
  • Figure 63. Global market in electric vehicles 2022-2035, by TIM type (millions USD)
  • Figure 64. Image of data center layout
  • Figure 65. Application of TIMs in line card
  • Figure 66. Global market in data centers 2022-2035, by TIM type (millions USD)
  • Figure 67. ADAS radar unit incorporating TIMs
  • Figure 68. Global market in ADAS sensors 2022-2035, by TIM type (millions USD)
  • Figure 69. Coolzorb 5G
  • Figure 70. TIMs in Base Band Unit (BBU)
  • Figure 71. Global market in 5G 2022-2035, by TIM type (millions USD)
  • Figure 72. Boron Nitride Nanotubes products
  • Figure 73. Transtherm-R PCMs
  • Figure 74. Carbice carbon nanotubes
  • Figure 75. Internal structure of carbon nanotube adhesive sheet
  • Figure 76. Carbon nanotube adhesive sheet
  • Figure 77. HI-FLOW Phase Change Materials
  • Figure 78. Thermoelectric foil, consists of a sequence of semiconductor elements connected with conductive metal. At the top (in red) is the thermal interface
  • Figure 79. Parker Chomerics THERM-A-GAP GEL
  • Figure 80. Metamaterial structure used to control thermal emission
  • Figure 81. Shinko Carbon Nanotube TIM product
  • Figure 82. The Sixth Element graphene products
  • Figure 83. Thermal conductive graphene film
  • Figure 84. VB Series of TIMS from Zeon