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市場調查報告書

商品編碼

1544180

TIM（熱感界面材料）市場規模、佔有率、成長分析：按材料、按應用、按化學物質、按地區 - 產業預測，2024-2031 年

Thermal Interface Materials Market Size, Share, Growth Analysis, By Material, By Application, By Chemistry, By Region - Industry Forecast 2024-2031

出版日期: 2024年08月23日 | 出版商:

SkyQuest | 英文 184 Pages | 商品交期: 3-5個工作天內

價格

簡介目錄

2022年TIM（熱感界面材料）的全球市場規模將為37.5億美元，從2023年的41.3億美元增加至2031年的89.9億美元，在預測期內（2024-2031）預計複合年成長率為10.2億美元，在預測期內（2024-2031）預計複合年成長率為10.2 %。

由於 TIM 在管理電子設備產生的熱量方面發揮著重要作用，其全球市場正在迅速擴大。隨著對更小、更強大、更節能的電子元件的需求不斷增加，對有效溫度控管的需求也不斷成長。 TIM 透過彌合發熱組件和散熱器之間的間隙並降低接觸電阻，對於確保高效傳熱和防止過熱至關重要。汽車、消費性電子、航太和通訊等各個領域擴大採用電子產品，推動了市場的成長，所有這些領域都需要高效的溫度控管解決方案。電子設備小型化和電路複雜性的趨勢進一步增加了對先進溫度控管的需求，以保持最佳性能和壽命。此外，注重能源效率和環境永續性的嚴格法規正在推動製造商採用可增強散熱、減少能源消耗和碳排放的 TIM。儘管存在這些成長機遇，市場也面臨挑戰。先進 TIM 的高成本及其應用和安裝的複雜性可能會阻礙市場擴張。此外，電子產品的不斷發展需要 TIM 的持續創新，以確保與新材料和技術的兼容性。 TIM 市場的主要趨勢包括轉向先進材料，例如相變材料、基於石墨的解決方案和提供卓越導熱性和可靠性的液態金屬 TIM。將 TIM 整合到 5G、物聯網和電動車等新興技術中也帶來了巨大的成長機會。汽車產業的電氣化、對再生能源來源的重視以及奈米技術的進步進一步增加了市場潛力，使其成為一個充滿活力且前景廣闊的領域。

市場概況
北美洲
- 美國
- 加拿大
歐洲
- 德國
- 英國
- 法國
- 義大利
- 西班牙
- 其他歐洲國家地區
亞太地區
- 中國
- 印度
- 日本
- 韓國
- 其他亞太地區
拉丁美洲
- 巴西
- 其他拉丁美洲地區
中東和非洲 (MEA)
- 海灣合作理事會國家
- 南非
- 其他中東/非洲地區

競爭格局

前5名企業對比
主要企業市場定位（2023年）
主要市場參與者所採取的策略
近期市集活動
主要企業市場佔有率（2023年）

主要企業簡介

Henkel AG & Co. KGaA（Germany）
Dow Inc.（US）
3M Company（US）
Parker-Hannifin Corporation（US）
Honeywell International Inc.（US）
Momentive Performance Materials Inc.（US）
Fujipoly（Japan）
Shin-Etsu Chemical Co., Ltd.（Japan）
Indium Corporation（US）
Zalman Tech Co., Ltd.（South Korea）
SEMIKRON International GmbH（Germany）
Avery Dennison Corporation（US）
AOS Thermal Compounds LLC（US）
Enerdyne Solutions（US）
Electrolube（UK）
Polytec PT GmbH（Germany）
Arctic Cooling（Switzerland）
Thermal Grizzly（Germany）
Gelid Solutions Ltd.（Hong Kong）
Nanografi（Turkey）
ProTek Devices（US）
Silicone Solutions（US）

簡介目錄

Product Code: SQMIG15E2273

Global Thermal Interface Materials Market size was valued at USD 3.75 Billion in 2022 and is poised to grow from USD 4.13 Billion in 2023 to USD 8.99 Billion by 2031, at a CAGR of 10.2% during the forecast period (2024-2031).

The Global Thermal Interface Materials (TIM) Market is rapidly expanding, driven by its critical role in managing the heat generated by electronic devices. As the demand for smaller, more powerful, and energy-efficient electronic components grows, the need for effective thermal management becomes increasingly important. TIMs are essential in filling gaps and reducing contact resistance between heat-generating components and heat sinks, ensuring efficient heat transfer and preventing overheating. The market's growth is fueled by the rising adoption of electronic devices across various sectors such as automotive, consumer electronics, aerospace, and telecommunications, all of which require efficient heat management solutions. The trend toward miniaturization and increased circuit complexity in electronics further heightens the need for advanced thermal management to maintain optimal performance and longevity. Additionally, stringent regulations focused on energy efficiency and environmental sustainability are pushing manufacturers to adopt TIMs that enhance heat dissipation, thereby reducing energy consumption and carbon emissions. Despite these growth opportunities, the market faces challenges. The high cost of advanced thermal interface materials and the complexities involved in their application and installation can hinder market expansion. Furthermore, the continuous evolution of electronic devices necessitates ongoing innovation in TIMs to ensure compatibility with new materials and technologies. Key trends in the TIM market include the shift towards advanced materials such as phase change materials, graphite-based solutions, and liquid metal TIMs, which offer superior thermal conductivity and reliability. The integration of TIMs into emerging technologies like 5G, IoT, and electric vehicles also presents significant growth opportunities. The electrification of the automotive industry, the focus on renewable energy sources, and advancements in nanotechnology further contribute to the market's potential, making it a dynamic and promising sector.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Thermal Interface Materials market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Thermal Interface Materials Market Segmental Analysis

Global Thermal Interface Materials Market is segmented on the basis of chemistry, material, application, and region. Based on Chemistry, the market is segmented into silicone, epoxy, polyamide, others. Based on Material, the market is segmented into greases and adhesive, tapes and films, gap fillers, metal-based thermal interface material, phase change material, and others. Based on application, the market is segmented into computer, telecom, medical devices, industrial machinery, consumer durables, automotive electronics, others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America.

Drivers of the Global Thermal Interface Materials Market

The increasing popularity of smartphones, laptops, gaming consoles, and other electronic devices is creating a heightened need for effective thermal management solutions. Thermal Interface Materials (TIMs) play a crucial role in dissipating the heat produced by these devices, preventing overheating, and maintaining optimal performance. For instance, the surge in gaming enthusiasts has significantly boosted the demand for high-performance computers, which rely on advanced thermal management to ensure they operate efficiently and safely.

Restraints in the Global Thermal Interface Materials Market

Although there are numerous types of Thermal Interface Materials (TIMs) with varying thermal conductivity properties, some may fall short in delivering optimal heat transfer. Certain TIMs may not provide high enough thermal conductivity, which can limit their effectiveness in applications with demanding heat dissipation requirements. Ongoing research and development are concentrated on creating new TIM formulations that offer enhanced thermal conductivity to address these limitations and improve performance in critical applications.

Market Trends of the Global Thermal Interface Materials Market

Phase Change Materials (PCMs) are a category of Thermal Interface Materials (TIMs) that undergo phase transitions-such as from solid to liquid or vice versa-when exposed to temperature fluctuations. These materials exhibit high thermal conductivity during these transitions, which makes them highly effective for managing heat. PCMs are increasingly being utilized in applications where efficient heat dissipation is crucial, such as in data centers and electric vehicle batteries. Their ability to absorb and release heat during phase changes enhances their performance in maintaining optimal temperatures in high-demand environments.

Introduction

Objectives of the Study
Definitions
Market Scope

Research Methodology

Information Procurement
Secondary & Primary Data Sources
Market Size Estimation
Market Assumptions & Limitations

Executive Summary

Market Overview Outlook
Supply Demand Trend Analysis
Segmental Opportunity Analysis

Market Dynamics & Outlook

Market Dynamics
- Drivers
- Opportunities
- Restraints
- Challenges
Porters Analysis
- Competitive rivalry
- Threat of Substitute Products
- Bargaining Power of Buyers
- Threat of New Entrants
- Bargaining Power of Suppliers

Key Market Insights

Key Success Factors of The Market
Degree Of Competition
Top Investment Pockets
Market Attractive Index
Ecosystem Mapping
Market demand analysis
Material and Technology Analysis
Cost Benefit Analysis
Competitive Landscape Analysis
Future Outlook Analysis
Market Segmentation and Targeting Analysis

Global Thermal Interface Materials Market by Material

Market Overview
Greases and Adhesive
Tapes and Films
Gap Fillers
Metal-Based Thermal Interface Material
Phase Change Material
Others

Global Thermal Interface Materials Market by Application

Market Overview
Computer
Telecom
Medical Devices
Industrial Machinery
Consumer Durables
Automotive Electronics
Others

Global Thermal Interface Materials Market by Chemistry

Market Overview
Silicone
Epoxy
Polyamide
Others

Global Thermal Interface Materials Market Size by Region

Market Overview
North America
- USA
- Canada
Europe
- Germany
- UK
- France
- Italy
- Spain
- Rest of Europe
Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
Latin America
- Brazil
- Rest of Latin America
Middle East & Africa (MEA)
- GCC Countries
- South Africa
- Rest of MEA

Competitive Landscape

Top 5 Player Comparison
Market Positioning of Key Players, 2023
Strategies Adopted by Key Market Players
Recent Activities in the Market
Key Companies Market Share (%), 2023

Key Company Profiles

Henkel AG & Co. KGaA (Germany)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Dow Inc. (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
3M Company (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Parker-Hannifin Corporation (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Honeywell International Inc. (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Momentive Performance Materials Inc. (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Fujipoly (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Shin-Etsu Chemical Co., Ltd. (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Indium Corporation (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Zalman Tech Co., Ltd. (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
SEMIKRON International GmbH (Germany)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Avery Dennison Corporation (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
AOS Thermal Compounds LLC (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Enerdyne Solutions (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Electrolube (UK)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Polytec PT GmbH (Germany)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Arctic Cooling (Switzerland)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Thermal Grizzly (Germany)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Gelid Solutions Ltd. (Hong Kong)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Nanografi (Turkey)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
ProTek Devices (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Silicone Solutions (US)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments