市場調查報告書
商品編碼
1541192
2024-2032 年熱界面材料市場報告(按產品類型、應用和地區)Thermal Interface Materials Market Report by Product Type, Application, and Region 2024-2032 |
IMARC Group年全球熱界面材料市場規模達35億美元。該市場的主要促進因素包括消費性電子產業的顯著成長、再生能源投資的增加、汽車技術的不斷進步、5G技術的不斷採用、航空航太和國防領域的快速擴張以及對醫療設備創新的日益關注。
主要市場促進因素:由於電子元件的小型化以及對強大運算設備的需求不斷增加,對高效散熱的需求不斷成長,正在推動全球熱界面材料(TIM)市場的發展。此外,電動車 (EV) 和再生能源系統的日益普及需要先進的熱管理解決方案來提高電池性能和可靠性。
主要市場趨勢:由於電信基礎設施的擴展需要 TIM 等先進的熱管理解決方案,因此 5G 技術的普及是市場的重要趨勢。穿戴式科技和物聯網 (IoT) 裝置的長足發展需要緊湊且高效的熱管理解決方案,這是另一個主要市場趨勢。
地理趨勢:在快速工業化、不斷擴大的電子產業以及中國、日本和韓國等國家主要製造中心的推動下,亞太地區引領市場。該地區的主導地位得益於有利的政府政策和對技術進步的大量投資,這刺激了各種應用對 TIM 的需求。熱界面材料市場概況凸顯了亞太地區在塑造全球市場格局中的關鍵作用。
競爭格局:市場競爭格局包括3M、陶氏、漢高股份公司、霍尼韋爾國際公司、銦泰公司、北川工業美國公司、萊爾德科技公司、邁圖高性能材料公司等領導公司.、Parker-Hannifin Corporation 和Zalman Tech Co. Ltd。他們的努力旨在佔領更大的市場佔有率並滿足對高效熱管理解決方案不斷成長的需求。這些活動為熱界面材料市場創造了許多近期成長和進步的機會,展示了該行業的動態和競爭本質。
挑戰與機會:市場面臨多重挑戰,例如根據新興技術創新材料的需求不斷增加,以及製造環保產品的壓力越來越大。然而,這些挑戰也帶來了巨大的成長機會。再生能源和電動車 (EV) 等新興應用的成長需要更複雜的熱技術。隨著 TIM 在尋求更高效和永續技術的行業中迅速採用,市場在多個領域呈現出巨大的成長和機會。這些動態凸顯了市場近期的創新和成長機會,使該產業在不斷發展的技術和環境景觀中擁有光明的未來。
消費性電子領域顯著成長
大眾對高性能電子設備不斷成長的需求正在推動市場的發展。隨著電子設備變得更加緊湊和強大,有效的散熱對於維持其性能和壽命至關重要。 TIM 是透過提高組件和散熱器之間的導熱性來管理熱量的重要元素。這種需求在消費性電子、汽車和電信產業尤其明顯,現代 TIM 可確保更高的可靠性和效率。除了高效能運算設備和遊戲之外,所有這些趨勢都增強了對先進熱管理解決方案的需求。因此,熱界面材料市場預測仍然樂觀,不斷進步推動其擴張。
再生能源投資不斷增加
對再生能源開發的不斷成長的投資正在支持市場的成長。向太陽能和風能等再生能源的過渡涉及部署需要高效熱管理的複雜電子系統。太陽能逆變器、風力發電機控制器和其他相關設備等電力電子設備在運作過程中會產生大量熱量,因此需要使用高性能TIM來滿足性能要求。這是由於人們對永續能源的持續關注以及利用再生能源減少碳足跡的全球趨勢,從而刺激了熱界面材料在再生能源專案中的使用。隨著再生能源產業的成長,對高科技熱管理解決方案的需求不斷增加,從而顯著推動熱界面材料的需求。
汽車技術的不斷進步
新車開發的新興創新是推動全球市場的重要因素。電動車和自動駕駛汽車的日益普及導致對有效熱管理解決方案的需求不斷增加。熱管理對於電動車尤其重要,因為電池和 ECU 需要嚴格的溫度控制。 TIM 的使用對於調節這些組件的熱設計以及提高電動車的效率和安全性至關重要。此外,現代車輛還整合了 ADAS 和資訊娛樂等功能,在運行時需要良好的熱管理。這一趨勢進一步促進了熱界面材料市場的成長。
IMARC Group提供了每個細分市場的主要趨勢分析,以及 2024-2032 年全球、區域和國家層面的預測。我們的報告根據產品類型和應用對市場進行了分類。
膠帶和薄膜
彈性墊
潤滑脂和黏合劑
相變材料
金屬基材料
其他
潤滑脂和黏合劑佔據大部分市場佔有率
該報告根據產品類型對市場進行了詳細的細分和分析。這包括膠帶和薄膜、彈性墊、潤滑脂和黏合劑、相變材料、金屬基材料等。根據該報告,潤滑脂和黏合劑代表了最大的部分。
潤滑脂和黏合劑因其高導熱性和易於塗抹的特性而在市場上佔據主導地位。潤滑脂具有較高的熱性能,可以填充表面之間的小間隙,以確保有效的熱傳遞。相較之下,黏合劑兼具導熱性和機械黏合能力,使其適用於不同的應用。因此,這些產品因其性能和多功能性而在 TIM 市場中佔有主要市場佔有率。由於各行業對高性能設備的需求不斷成長,潤滑脂和黏合劑預計將繼續產生高熱界面材料市場收入。
電信
電腦
醫療器材
工業機械
耐久性消費品
汽車電子
其他
電腦業佔有率第一
報告還提供了基於應用程式的詳細市場細分和分析。這包括電信、電腦、醫療設備、工業機械、耐用消費品、汽車電子等。報告稱,電腦佔據了最大的市場佔有率。
電腦領域佔有最大的市場佔有率。對高效能運算 (HPC) 和電子模組小型化不斷成長的需求推動了散熱創新。隨著電腦處理器的不斷進步,包括更快的處理器和更強大的顯示卡的開發,對有效熱管理解決方案的需求不斷增加。此外,遊戲 PC、工作站和資料中心的使用不斷成長,進一步加速了對高效能 TIM 的需求。由於這些技術進步和電腦系統日益複雜,熱界面材料的市場前景仍然看好。
北美洲
美國
加拿大
亞太地區
中國
日本
印度
韓國
澳洲
印尼
其他
歐洲
德國
法國
英國
義大利
西班牙
俄羅斯
其他
拉丁美洲
巴西
墨西哥
其他
中東和非洲
亞太地區引領市場,佔據最大的熱界面材料市場佔有率
該報告還對所有主要區域市場進行了全面分析,其中包括北美(美國和加拿大);亞太地區(中國、日本、印度、韓國、澳洲、印尼等);歐洲(德國、法國、英國、義大利、西班牙、俄羅斯等);拉丁美洲(巴西、墨西哥等);以及中東和非洲。報告稱,亞太地區是熱界面材料最大的區域市場。
由於亞太地區工業化的快速發展、電子產業的顯著成長以及中國、日本和韓國等主要製造中心的擴張,亞太地區佔據了最大的市場佔有率。該地區消費性電子產品、汽車電子產品和其他先進技術產量的不斷增加也推動了對該產品的需求。此外,主要參與者對電動車生產和技術創新的持續投資在增強熱界面材料市場方面進一步發揮重要作用。
市場研究報告也對市場競爭格局進行了全面分析。也提供了所有主要公司的詳細資料。熱界面材料產業的一些主要市場參與者包括3M 公司、陶氏公司、漢高股份公司、霍尼韋爾國際公司、Indium 公司、北川工業美國公司、萊爾德科技公司、邁圖高性能材料公司。
(請注意,這只是關鍵參與者的部分列表,報告中提供了完整列表。)
領先的熱界面材料公司正在分配大量資源用於研發,尋求開發更新、更好的熱界面材料,其特點是具有更好的導熱性、可靠性和安裝性。這包括製備具有改進特性的基材、黏合劑和保護塗層,例如降低熱阻和提高耐熱性,以滿足不同行業不斷成長的市場需求。此外,一些公司正在促進業務、併購,以擴大其全球影響力,因為這些合作有助於企業了解各自業務合作夥伴的實力,甚至幫助他們將尖端技術精確地引入熱管理解決方案中。參考熱界面材料市場的最新發展,一些市場參與者正在推出環保且永續的熱界面材料。他們也特別關注生產線的數位化和工業進步,以實現最大的投資回報。此外,奈米技術等先進材料和技術的不斷結合也被認為正在增加,這正在擴大市場。
2023 年2 月21 日,Indium Corporation 宣布將於3 月5 日至8 日在美國亞利桑那州梅薩舉行的TestConX 上展示其高性能金屬熱界面材料(TIM),進行老化和測試。卓越的熱性能純金屬銦的電導率超過非金屬,達到 86W/mK。其含銦TIM有純銦、銦銀合金和銦錫三種形式。
2024年3月29日,Resonac公司宣布決定將其高性能半導體晶片材料的生產能力提高到目前水準的3.5至5倍,這些晶片主要用作人工智慧(AI)的CPU。該公司的目標是擴大非導電薄膜(NCF)和熱界面材料(TIM)的生產。它計劃投資 150 億日元用於生產這些材料的設施,並將於 2024 年及之後開始營運擴建後的設施。
The global thermal interface materials market size reached US$ 3.5 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 7.3 Billion by 2032, exhibiting a growth rate (CAGR) of 8.3% during 2024-2032. The market is majorly driven by significant growth in the consumer electronics sector, rising investments in renewable energy, continual advancements in automotive technology, increasing adoption of 5G technology, rapid expansion in aerospace and defense sectors, and an enhanced focus on medical device innovations.
Major Market Drivers: The rising need for efficient heat dissipation due to the miniaturization of electronic components and the augmenting demand for powerful computing devices is driving the global market for thermal interface materials (TIMs). Additionally, the increasing adoption of electric vehicles (EVs) and renewable energy systems requires advanced thermal management solutions to enhance battery performance and reliability.
Key Market Trends: The proliferation of 5G technology due to the expansion of telecommunications infrastructure that demand advanced thermal management solutions such as TIMs is a significant trend in the market. Considerable developments in wearable technologies and the Internet of Things (IoT) devices, which require compact and efficient thermal management solutions, is another major market trend.
Geographical Trends: The Asia Pacific region leads the market, driven by rapid industrialization, expanding electronics sector, and the presence of major manufacturing hubs in countries, such as China, Japan, and South Korea. The region's dominance is bolstered by favorable government policies and significant investments in technological advancements, which fuel the demand for TIMs in various applications. The thermal interface materials market overview highlights the critical role of Asia Pacific in shaping the global market landscape.
Competitive Landscape: The competitive landscape of the market includes leading companies such as 3M Company, Dow Inc., Henkel AG & Co. KGaA, Honeywell International Inc., Indium Corporation, Kitagawa Industries America Inc., Laird Technologies Inc. Momentive Performance Materials Inc., Parker-Hannifin Corporation, and Zalman Tech Co. Ltd. These key players are heavily investing in research and development to innovate and expand their product portfolios. Their efforts aim to capture a larger market share and address the growing demand for efficient thermal management solutions. These activities result in the creation of numerous thermal interface materials market recent opportunities for growth and advancement, showcasing the industry's dynamic and competitive nature.
Challenges and Opportunities: The market faces multiple challenges, such as the augmenting need to innovate materials in line with emerging technologies and the increasing pressure to manufacture environmentally friendly products. However, these challenges also present significant growth opportunities. The growth in emerging applications, such as renewable energy and electric vehicles (EVs), requires more sophisticated thermal technologies. With TIMs being rapidly adopted across industries seeking more efficient and sustainable technologies, the market presents numerous growth and opportunities in multiple sectors. These dynamics highlight the market recent opportunities for innovation and growth, positioning the industry for a promising future amid evolving technological and environmental landscapes.
Significant growth in the consumer electronics sector
The rising demand for high-performance electronic devices among the masses is driving the market. As electronic devices become more compact and powerful, effective heat dissipation is crucial to maintain their performance and longevity. TIMs are essential elements in managing heat by improving thermal conductivity between the components and heatsinks. This need is especially noticeable in the consumer electronics, automotive, and telecom industries where modern-day TIMs ensure greater reliability and efficiency. All of these trends are empowering the demand for advanced thermal management solutions, in addition to high-performance computing devices and gaming. As a result, the thermal interface materials market forecast remains positive, with continuous advancements driving its expansion.
Rising Investments in Renewable Energy
The growing investments made for the development of renewable energy sources are supporting the market growth. The transition towards renewable energy, such as solar and wind power, involves the deployment of sophisticated electronic systems that require efficient thermal management. The power electronics equipment such as solar inverters, wind turbine controllers and other associated devices produce considerable amount of heat in course of operation and hence, require the usage of high-performance TIMs to meet the performance requirement. This is due to the continuing interest for sustainable energy and the global trend towards utilizing renewable energy to reduce carbon footprint, thus stimulating the usage of thermal interface materials for renewable energy projects. With the growth of renewable energy sectors, demand for high-tech thermal management solutions is continuously increasing and consequently propelling the thermal interface materials demand significantly.
Continual advancements in automotive technology
Emerging innovations in the development of new vehicles are a significant factor impelling the global market. The rising popularity of electric vehicles and self-driving vehicles has led to the augmenting demand for effective thermal management solutions. Thermal management is particularly crucial for electric vehicles as batteries and ECUs need stringent control of temperature. The use of TIMs is vital in regulating the thermal design of these components and increasing the efficiency and safety of EVs. Also, modern vehicles incorporate features such as ADAS and infotainment that require good thermal management in their operation. This trend is further contributing to the thermal interface materials market growth.
IMARC Group provides an analysis of the key trends in each segment of the market, along with forecasts at the global, regional, and country levels for 2024-2032. Our report has categorized the market based on product type and application.
Tapes and Films
Elastomeric Pads
Greases and Adhesives
Phase Change Materials
Metal Based Materials
Others
Greases and adhesives accounts for the majority of the market share
The report has provided a detailed breakup and analysis of the market based on the product type. This includes tapes and films, elastomeric pads, greases and adhesives, phase change materials, metal-based materials, and others. According to the report, greases and adhesives represented the largest segment.
Greases and adhesives dominate the market due to their high thermal conductivity and easy-to-apply properties. Greases offer high thermal performance and can fill small gaps between surfaces to ensure efficient heat transfer. Adhesives, in contrast, have a combination of thermal conductivity and mechanical bonding capacity, making them suitable for different applications. As a result, these products have a major market share in the TIMs market due to their performance and versatility. On account of the increasing demand for high-performance devices in various industries, greases and adhesives are expected to continue generating high thermal interface materials market revenue.
Telecom
Computer
Medical Devices
Industrial Machinery
Consumer Durables
Automotive Electronics
Others
Computer holds the largest share of the industry
A detailed breakup and analysis of the market based on the application have also been provided in the report. This includes telecom, computer, medical devices, industrial machinery, consumer durables, automotive electronics, and others. According to the report, computer accounted for the largest market share.
The computer segment holds the largest share of the market. Growing demand for high-performance computing (HPC) and the miniaturization of electronic modules drive heat removal innovations. With ongoing advancements in computer processors, including the development of faster processors and more powerful graphics cards, the demand for effective thermal management solutions is rising. Furthermore, the growing usage of gaming PCs, workstations, and data centers further accelerates the demand for high-performance TIMs. The thermal interface materials market outlook remains favorable due to these technological advancements and the increasing complexity of computer systems.
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
Asia Pacific leads the market, accounting for the largest thermal interface materials market share
The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific represents the largest regional market for thermal interface materials.
Asia Pacific holds the largest segment in the market due to the region's rapid industrialization, significant growth of the electronics industries, and the expansion of major manufacturing hubs such as China, Japan, and South Korea. The increasing production of consumer electronics, automotive electronics, and other advanced technologies in this region also drives the demand for the product. Furthermore, continual investments by key players in the production of EVs and technological innovations are further playing a significant role in enhancing the thermal interface materials market.
The market research report has also provided a comprehensive analysis of the competitive landscape in the market. Detailed profiles of all major companies have also been provided. Some of the major market players in the thermal interface materials industry include 3M Company, Dow Inc., Henkel AG & Co. KGaA, Honeywell International Inc., Indium Corporation, Kitagawa Industries America Inc., Laird Technologies Inc. Momentive Performance Materials Inc., Parker-Hannifin Corporation, and Zalman Tech Co. Ltd.
(Please note that this is only a partial list of the key players, and the complete list is provided in the report.)
Leading thermal interface materials companies are allocating significant amounts of resources towards research and development as they seek to develop newer and better TIMs characterized by better thermal conductivity, reliability, and installation. This comprises of preparing substrates, adhesives, and protective coatings with improved characteristics like reduced thermal resistance and increased thermal endurance to accommodate the increasing market requirements of different industries. Moreover, several companies are promoting businesses, mergers, and acquisitions to promote their global reach as these collaborations assist businesses in understanding the strength of the respective business partners, thus even helping them in bringing cutting-edge technology to thermal management solutions precisely. With reference to thermal interface materials market recent developments, some of the market players are launching environmentally friendly and sustainable TIMs. They are also paying special attention to digital and industrial advancement in production lines to achieve maximum returns on their investments. Additionally, the constant incorporation of advanced materials and technologies such as nanotechnology is also perceived to be on the rise, which is augmenting the market.
On 21st February 2023, Indium Corporation announced that it will feature its high-performance metal thermal interface materials (TIMs) for burn-in and test at TestConX during March 5th to 8th in Mesa, Arizona, U.S. The indium-containing TIMs offer superior thermal conductivity over non-metals with pure indium metal delivering 86W/mK. Its indium-containing TIMs are available as pure indium, indium-silver alloys, and indium-tin.
On 29th March 2024, Resonac Corporation announced the decision to increase its capacity to produce materials for high-performance semiconductor chips, which are to be used mainly as CPUs for artificial intelligence (AI), to 3.5 to 5 times of the current level. The company aims to escalate the production of non-conductive film (NCF) and thermal interface material (TIM). It plans to invest 15 billion yen in facilities to produce these materials and will commence operation of the expanded facilities in and after 2024.