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半導體生產設備半導體製造設備

市場調查報告書

商品編碼

1518505

半導體鍵合市場- 按類型（晶片鍵合機、晶圓鍵合機、覆晶鍵合機）、按製程（晶片到晶片鍵合、晶片到晶圓鍵合、晶圓到晶圓鍵合）、按應用和預測，2024 - 2032 年

Semiconductor Bonding Market - By Type (Die Bonder, Wafer Bonder, Flip Chip Bonder), By Process (Die To Die Bonding, Die To Wafer Bonding, Wafer To Wafer Bonding), By Application & Forecast, 2024 - 2032

出版日期: 2024年04月26日 | 出版商:

Global Market Insights Inc. | 英文 250 Pages | 商品交期: 2-3個工作天內

價格

簡介目錄

在高性能設備需求不斷成長以及物聯網和 5G 技術擴展的推動下，全球半導體鍵合市場從 2024 年到 2032 年將實現 3% 的複合年成長率。隨著消費者尋求更快、更有效率的電子產品和工業採用互連設備，對先進半導體鍵合解決方案的需求不斷增加。這些技術促進了緊湊而強大的電子元件的生產，這些電子元件對於電信、汽車電子和智慧型設備的下一代應用至關重要。這一趨勢凸顯了半導體鍵合在跨行業實現創新且可靠的連接解決方案方面的關鍵作用。

例如，2024 年 3 月，Tanaka Kikinzoku Kogyo 開發了一種使用 AuRoFUSE 漿料的金顆粒鍵合技術，可在低溫下實現高密度半導體安裝，並推進工業貴金屬應用。它顯示了一種更高效的半導體製造流程的趨勢，有可能推動全球先進鍵合技術的採用。這項發展突顯了業界在提高半導體製造性能和成本效益方面的持續發展，使田中貴金屬工業成為推動半導體鍵合技術的關鍵參與者。

半導體鍵合產業根據類型、製程、應用和地區進行分類。

由於對先進半導體裝置的需求不斷增加，到 2032 年，晶圓鍵合機將顯著改善。這些鍵合機有助於半導體晶圓的精確鍵合，這對於製造積體電路和微機電系統 (MEMS) 至關重要。隨著電子、電信和汽車領域的應用不斷增加，晶圓鍵結機可提供高產量和可靠性。它們能夠實現複雜的鍵合工藝，例如熔合和粘合鍵合，使其成為半導體製造中的重要工具。該領域的成長對於滿足產業對更小、更快、更有效率的電子元件的需求至關重要。

在無線通訊技術需求不斷成長的推動下，射頻設備領域將在 2024 年至 2032 年間顯著成長。射頻設備對於行動裝置、物聯網應用和電信基礎架構中發射和接收射頻訊號至關重要，需要精確的接合技術才能達到最佳效能。隨著 5G 技術和物聯網連接的進步推動市場成長，射頻元件領域在半導體鍵結中的關鍵作用將會擴大。這一趨勢凸顯了其對全球實現可靠、高效的無線通訊解決方案的重大貢獻。

北美半導體鍵合市場佔有率從 2024 年到 2032 年將實現適度的複合年成長率，這要歸功於其強大的半導體產業基礎設施和在研發方面的大量投資。該地區先進的技術能力和主要市場參與者的強大影響力奠定了其領先地位。此外，對高性能電子設備的需求不斷成長以及半導體製造流程的創新進一步增強了北美作為半導體鍵合產業成長和創新主要貢獻者的地位。

產業生態系統分析
供應商矩陣
利潤率分析
技術與創新格局
專利分析
重要新聞和舉措
監管環境
衝擊力
- 成長動力
  - 電子設備的小型化
  - 對穿戴式科技的高需求
  - 擴大電信基礎設施
  - 物聯網 (IoT) 的普及
  - 政府和產業投資
- 產業陷阱與挑戰
  - 設備成本高
  - 技術複雜性
成長潛力分析
波特的分析
PESTEL分析

第 4 章：競爭格局

介紹
公司市佔率分析
競爭定位矩陣
戰略展望矩陣

第 5 章：市場估計與預測：按類型，2021-2032 年

主要趨勢
固晶機
晶圓鍵合機
覆晶鍵合機

第 6 章：市場估計與預測：依流程分類，2021-2032 年

主要趨勢
晶片到晶片接合
晶片到晶圓鍵合
晶圓到晶圓鍵合

第 7 章：市場估計與預測：按應用分類，2021-2032 年

主要趨勢
射頻設備
MEMS 和感測器
CMOS影像感測器
引領
3D快閃記憶體
先進封裝
功率IC和功率分立元件
其他

第 8 章：市場估計與預測：按地區，2021-2032 年

主要趨勢
北美洲
- 美國
- 加拿大
歐洲
- 英國
- 德國
- 法國
- 義大利
- 西班牙
- 歐洲其他地區
亞太地區
- 中國
- 印度
- 日本
- 韓國
- 澳新銀行
- 亞太地區其他地區
拉丁美洲
- 巴西
- 墨西哥
- 拉丁美洲其他地區
MEA
- 阿拉伯聯合大公國
- 南非
- 沙烏地阿拉伯
- MEA 的其餘部分

第 9 章：公司簡介

ASM Pacific Technology Ltd.
BE Semiconductor Industries N.V.
EV Group
Fasford Technology Co., Ltd.
Intel Corporation
Kulicke & Soffa Industries, Inc.
Mitsuibishi Heavy Industries, Ltd.
Mycronic Group
Palomar Technologies
Panasonic Corporation
Shibaura Mechatronics
Shinkawa Ltd.
SUSS Microtech SE
TDK Corporation
Tokyo Electron Ltd.

簡介目錄

Product Code: 9233

Global Semiconductor Bonding Market will garner a 3% CAGR from 2024 to 2032, fueled by increasing demand for high-performance devices and the expansion of IoT and 5G technologies. As consumers seek faster, more efficient electronics and industries adopt interconnected devices, there's a heightened need for advanced semiconductor bonding solutions. These technologies facilitate the production of compact and powerful electronic components essential for next-generation applications in telecommunications, automotive electronics, and smart devices. This trend underscores the pivotal role of semiconductor bonding in enabling innovative and reliable connectivity solutions across diverse sectors.

For instance, in March 2024, Tanaka Kikinzoku Kogyo developed a gold particle bonding technology using AuRoFUSE paste, enabling high-density semiconductor mounting at low temperatures and advancing industrial precious metal applications. It suggests a trend towards more efficient semiconductor manufacturing processes, potentially driving the adoption of advanced bonding techniques globally. This development underscores the industry's ongoing evolution towards improved performance and cost-effectiveness in semiconductor fabrication, positioning Tanaka Kikinzoku Kogyo as a key player in advancing semiconductor bonding technologies.

The semiconductor bonding industry is classified based on type, process, application, and region.

The wafer bonder will encounter a marked upturn through 2032 due to increasing demand for advanced semiconductor devices. These bonders facilitate precise bonding of semiconductor wafers, which are crucial for manufacturing integrated circuits and microelectromechanical systems (MEMS). With rising applications in the electronics, telecommunications, and automotive sectors, wafer bonders offer high throughput and reliability. Their ability to achieve intricate bonding processes, such as fusion and adhesive bonding, positions them as essential tools in semiconductor fabrication. This segment's growth is pivotal in meeting industry demands for smaller, faster, and more efficient electronic components.

The RF devices segment will observe a noteworthy surge between 2024 and 2032, driven by growing demand for wireless communication technologies. RF devices, essential for transmitting and receiving radio frequency signals in mobile devices, IoT applications, and telecommunications infrastructure, require precise bonding techniques for optimal performance. As advancements in 5G technology and IoT connectivity drive market growth, the RF devices segment's critical role in semiconductor bonding will expand. This trend underscores its significant contribution to enabling reliable and efficient wireless communication solutions globally.

North America semiconductor bonding market share will achieve a modest CAGR from 2024 to 2032, attributed to its robust semiconductor industry infrastructure and significant investments in research and development. The region's advanced technological capabilities and strong presence of key market players contribute to its leading position. Moreover, increasing demand for high-performance electronic devices and innovations in semiconductor manufacturing processes further bolster North America's role as a major contributor to the semiconductor bonding industry's growth and innovation.

Chapter 1 Methodology & Scope

1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Industry 360 degree synopsis, 2021 - 2032
2.2 Business trends
- 2.2.1 Total addressable market (TAM), 2024-2032

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Profit margin analysis
3.4 Technology & innovation landscape
3.5 Patent analysis
3.6 Key news and initiatives
3.7 Regulatory landscape
3.8 Impact forces
- 3.8.1 Growth drivers
  - 3.8.1.1 Miniaturization of electronic devices
  - 3.8.1.2 High demand for wearable technology
  - 3.8.1.3 Expansion of telecommunications infrastructure
  - 3.8.1.4 The proliferation of the internet of things (IoT)
  - 3.8.1.5 Government and industry investments
- 3.8.2 Industry pitfalls & challenges
  - 3.8.2.1 High equipment costs
  - 3.8.2.2 Technological complexity
3.9 Growth potential analysis
3.10 Porter's analysis
- 3.10.1 Supplier power
- 3.10.2 Buyer power
- 3.10.3 Threat of new entrants
- 3.10.4 Threat of substitutes
- 3.10.5 Industry rivalry
3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Type, 2021-2032 (USD Million)

5.1 Key trends
5.2 Die bonder
5.3 Wafer bonder
5.4 Flip chip bonder

Chapter 6 Market Estimates & Forecast, By Process, 2021-2032 (USD Million)

6.1 Key trends
6.2 Die to die bonding
6.3 Die to wafer bonding
6.4 Wafer to wafer bonding

Chapter 7 Market Estimates & Forecast, By Application, 2021-2032 (USD Million)

7.1 Key trends
7.2 RF devices
7.3 MEMS and sensors
7.4 CMOS image sensors
7.5 LED
7.6 3D NAND
7.7 Advanced packaging
7.8 Power IC and power discrete
7.9 Others

Chapter 8 Market Estimates & Forecast, By Region, 2021-2032 (USD Million)

8.1 Key trends
8.2 North America
- 8.2.1 U.S.
- 8.2.2 Canada
8.3 Europe
- 8.3.1 UK
- 8.3.2 Germany
- 8.3.3 France
- 8.3.4 Italy
- 8.3.5 Spain
- 8.3.6 Rest of Europe
8.4 Asia Pacific
- 8.4.1 China
- 8.4.2 India
- 8.4.3 Japan
- 8.4.4 South Korea
- 8.4.5 ANZ
- 8.4.6 Rest of Asia Pacific
8.5 Latin America
- 8.5.1 Brazil
- 8.5.2 Mexico
- 8.5.3 Rest of Latin America
8.6 MEA
- 8.6.1 UAE
- 8.6.2 South Africa
- 8.6.3 Saudi Arabia
- 8.6.4 Rest of MEA