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半導體生產設備半導體製造設備

市場調查報告書

商品編碼

1616041

半導體鍵合設備市場機會、成長動力、產業趨勢分析與預測 2024 - 2032

Semiconductor Bonding Equipment Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2024 - 2032

出版日期: 2024年09月11日 | 出版商:

Global Market Insights Inc. | 英文 168 Pages | 商品交期: 2-3個工作天內

價格

簡介目錄

2023 年全球半導體鍵合設備市場價值為 5.304 億美元，預計 2024 年至 2032 年複合年成長率為 10%。這種需求激增主要是由人工智慧 (AI)、5G、電動車 (EV) 和物聯網 (IoT) 等技術推動的，所有這些技術都依賴先進的半導體元件。這種上升趨勢將進一步提振半導體產業。例如，2024年2月，半導體產業協會預測到2030年半導體市場將達到1兆美元。

根據設備類型分類的市場包括晶片鍵合設備、引線鍵合設備、晶圓鍵合設備和覆晶鍵合設備。 2023 年，引線鍵合設備佔據市場主導地位，佔超過 39% 的收入佔有率。引線鍵合設備領域因其在半導體封裝領域的牢固地位而引領市場。引線鍵合是一種經過時間考驗的技術，廣泛應用於積體電路組裝，因其可靠性和成本效益而備受讚譽。

它在處理各種半導體裝置方面的多功能性以及對各種封裝類型的適應性進一步鞏固了其市場領導地位。市場按黏合類型細分，包括永久黏合、臨時黏合和混合黏合。值得注意的是，混合黏合正在成為成長最快的領域，預計在預測期內複合年成長率將超過 12%。混合鍵合設備的激增可歸因於其融合多種鍵合技術的能力，從而提高了半導體封裝性能和靈活性。

市場範圍
開始年份	2023年
預測年份	2024-2032
起始值	5.304 億美元
預測值	13億美元
複合年成長率	10%

這種方法有利於多種材料和工藝的整合，滿足先進應用的嚴格要求。 2023 年，亞太地區佔據了超過 55% 的主導佔有率，預計在整個預測期內將保持這一領先地位。亞太地區的霸主地位很大程度上歸功於其在半導體製造和電子產品生產方面的領先地位。中國、韓國、台灣和日本等國家擁有著名的半導體代工廠和電子巨頭，推動了對先進鍵合設備的強勁需求。的地位電子元件生產中心鞏固了其在半導體鍵合設備市場的關鍵作用。

產業生態系統分析
供應商矩陣
技術與創新格局
專利分析
重要新聞和舉措
監管環境
衝擊力
- 成長動力
  - 半導體產業的成長
  - 技術進步
  - 5G網路的擴展
  - 電動車 (EV) 的日益普及
  - 加大研發投入
- 產業陷阱與挑戰
  - 初始成本高
  - 供應鏈中斷
成長潛力分析
波特的分析
PESTEL分析

第 4 章：競爭格局

公司市佔率分析
競爭定位矩陣
戰略展望矩陣

第 5 章：市場估計與預測：按黏合類型，2021 - 2032 年

主要趨勢
永久黏合
臨時黏接
混合鍵合

第 6 章：市場估計與預測：按設備類型，2021 - 2032 年

主要趨勢
焊接線設備
固晶設備
覆晶邦定設備
晶圓鍵合設備

第 7 章：市場估計與預測：依應用分類，2021 - 2032

主要趨勢
先進封裝
功率IC和功率分立元件
光子裝置
MEMS 感測器和執行器
工程基材
CMOS影像感測器
射頻設備
其他

第 8 章：市場估計與預測：依最終用途產業，2021 - 2032 年

主要趨勢
消費性電子產品
汽車
電信
衛生保健
航太與國防
工業的
其他

第 9 章：市場估計與預測：按地區，2021 - 2032

主要趨勢
北美洲
- 美國
- 加拿大
歐洲
- 英國
- 德國
- 法國
- 義大利
- 西班牙
- 歐洲其他地區
亞太地區
- 中國
- 印度
- 日本
- 韓國
- 澳新銀行
- 亞太地區其他地區
拉丁美洲
- 巴西
- 墨西哥
- 拉丁美洲其他地區
MEA
- 阿拉伯聯合大公國
- 沙烏地阿拉伯
- 南非
- MEA 的其餘部分

第 10 章：公司簡介

Applied Materials, Inc.
Applied Microengineering Ltd.
ASMPT Ltd (ASM Pacific Technology)
BE Semiconductor Industries NV (Besi)
Canon Inc.
DIAS Automation
Dr. Tresky AG
EV Group (EVG)
Fasford Technology Co., Ltd.
Hesse GmbH
Kaijo Shibuya Europe GmbH
Kulicke and Soffa Industries, Inc.
MRSI Systems
Mycronic
Nidec Corporation
Palomar Technologies
Panasonic Connect Co., Ltd.
Shibaura Mechatronics Corp
SUSS MicroTec SE
Tokyo Electron Limited
TORAY ENGINEERING Co.,Ltd
TPT Wire Bonder GmbH & Co KG
Ultrasonic Engineering Co., Ltd.
WestBond, Inc.

簡介目錄

Product Code: 11349

The Global Semiconductor Bonding Equipment Market was valued at USD 530.4 million in 2023 and is projected to indicate a CAGR of 10% from 2024 to 2032. The semiconductor industry is witnessing robust growth, spurred by rising chip demands across sectors like consumer electronics, automotive, telecommunications, and industrial applications. This demand surge is largely driven by technologies such as artificial intelligence (AI), 5G, electric vehicles (EVs), and the Internet of Things (IoT), all of which rely on advanced semiconductor components. This upward trend is set to further bolster the semiconductor industry. For example, in February 2024, the Semiconductor Industry Association projected the semiconductor market would reach USD 1 trillion by 2030. The overall semiconductor bonding equipment industry is classified based on bonding type, equipment type, application, end-use, and region.

The market segments based on equipment type include die-bonding equipment, wire-bonding equipment, wafer-bonding equipment, and flip-chip bonding equipment. In 2023, wire bonding equipment dominated the market, capturing over 39% of the revenue share. The wire bonding equipment segment led the market due to its entrenched position in semiconductor packaging. Wire bonding, a time-tested technology, is widely employed in integrated circuit assembly, prized for its reliability and cost-efficiency.

Its versatility in handling diverse semiconductor devices and adaptability to various packaging types further cement its market leadership. The market, segmented by bonding type, includes permanent bonding, temporary bonding, and hybrid bonding. Notably, hybrid bonding is emerging as the fastest-growing segment, projected to expand at a CAGR exceeding 12% during the forecast period. The surge in hybrid bonding equipment can be attributed to its capability of amalgamating multiple bonding technologies, thereby boosting semiconductor packaging performance and flexibility.

Market Scope
Start Year	2023
Forecast Year	2024-2032
Start Value	$530.4 Million
Forecast Value	$1.3 Billion
CAGR	10%

This approach facilitates the integration of diverse materials and processes, catering to the stringent demands of advanced applications. In 2023, the Asia Pacific region commanded a dominant share of over 55%, with expectations to maintain this lead throughout the forecast period. The Asia Pacific's supremacy is largely due to its leadership in semiconductor manufacturing and electronics production. Nations such as China, South Korea, Taiwan, and Japan host prominent semiconductor foundries and electronics powerhouses, driving a robust demand for advanced bonding equipment.Coupled with a strong industrial foundation and a concentration of semiconductor manufacturing facilities, the Asia Pacific's status as a global electronic device production hub cements its pivotal role in the semiconductor bonding equipment market.

Chapter 1 Scope & Methodology

1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast parameters
1.4 Data sources
- 1.4.1 Primary
- 1.4.2 Secondary
  - 1.4.2.1 Paid sources
  - 1.4.2.2 Public sources

Chapter 2 Executive Summary

2.1 Industry 360° synopsis, 2021 - 2032

Chapter 3 Industry Insights

3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Technology & innovation landscape
3.4 Patent analysis
3.5 Key news and initiatives
3.6 Regulatory landscape
3.7 Impact forces
- 3.7.1 Growth drivers
  - 3.7.1.1 Growth in semiconductor industry
  - 3.7.1.2 Advancements in technology
  - 3.7.1.3 Expansion of 5G networks
  - 3.7.1.4 The growing adoption of electric vehicles (EVs)
  - 3.7.1.5 Increased Investment in R&D
- 3.7.2 Industry pitfalls & challenges
  - 3.7.2.1 High initial costs
  - 3.7.2.2 Supply chain disruptions
3.8 Growth potential analysis
3.9 Porter's analysis
- 3.9.1 Supplier power
- 3.9.2 Buyer power
- 3.9.3 Threat of new entrants
- 3.9.4 Threat of substitutes
- 3.9.5 Industry rivalry
3.10 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

4.1 Company market share analysis
4.2 Competitive positioning matrix
4.3 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Bonding Type, 2021 - 2032 (USD Million)

5.1 Key trends
5.2 Permanent bonding
5.3 Temporary bonding
5.4 Hybrid bonding

Chapter 6 Market Estimates & Forecast, By Equipment Type, 2021 - 2032 (USD Million)

6.1 Key trends
6.2 Wire bonding equipment
6.3 Die bonding equipment
6.4 Flip chip Bonding equipment
6.5 Wafer bonding equipment

Chapter 7 Market Estimates & Forecast, By Application, 2021 - 2032 (USD Million)

7.1 Key trends
7.2 Advanced packaging
7.3 Power IC and power discrete
7.4 Photonic devices
7.5 MEMS Sensors and Actuators
7.6 Engineered substrates
7.7 CMOS image sensors
7.8 RF devices
7.9 Others

Chapter 8 Market Estimates & Forecast, By End Use Industry, 2021 - 2032 (USD Million)

8.1 Key trends
8.2 Consumer electronics
8.3 Automotive
8.4 Telecommunications
8.5 Healthcare
8.6 Aerospace & defense
8.7 Industrial
8.8 Others

Chapter 9 Market Estimates & Forecast, By Region, 2021 - 2032 (USD Million)

9.1 Key trends
9.2 North America
- 9.2.1 U.S.
- 9.2.2 Canada
9.3 Europe
- 9.3.1 UK
- 9.3.2 Germany
- 9.3.3 France
- 9.3.4 Italy
- 9.3.5 Spain
- 9.3.6 Rest of Europe
9.4 Asia Pacific
- 9.4.1 China
- 9.4.2 India
- 9.4.3 Japan
- 9.4.4 South Korea
- 9.4.5 ANZ
- 9.4.6 Rest of Asia Pacific
9.5 Latin America
- 9.5.1 Brazil
- 9.5.2 Mexico
- 9.5.3 Rest of Latin America
9.6 MEA
- 9.6.1 UAE
- 9.6.2 Saudi Arabia
- 9.6.3 South Africa
- 9.6.4 Rest of MEA