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1577239

2030 年半導體鍵結市場預測：按類型、材料、製程、技術、應用、最終用戶和地區進行的全球分析

Semiconductor Bonding Market Forecasts to 2030 - Global Analysis By Type (Wire Bonding, Flip Chip Bonding, Bump Bonding, Interposer Bonding and Other Types), Material, Process, Technology, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據，2024 年全球半導體鍵結市場規模為 10.445 億美元，預計到 2030 年將達到 14.484 億美元，預測期內複合年成長率為 5.6%。

半導體鍵結是電子裝置組裝中的重要工藝，將不同的半導體材料互連以形成功能電路和組件。該工藝涉及多種技術，包括引線接合法、覆晶鍵合和黏劑鍵合，每種技術都經過專門設計，以確保牢固的電氣和機械連接。有效的鍵結對於半導體裝置的性能、可靠性和壽命至關重要，並影響溫度控管、訊號完整性和整體裝置效率。

各行業需求增加

該市場的需求正在各個行業不斷擴大，包括家電、汽車和通訊。在 5G、物聯網和電動車等趨勢的推動下，對先進電子產品的需求不斷增加，對高效、可靠的半導體連接的需求也不斷增加。這種擴散正在推動鍵合技術的創新，使製造商能夠滿足性能要求並增加越來越小、越來越強大的電子系統的功能。

缺乏技術純熟勞工

市場上缺乏技術純熟勞工構成了阻礙生產效率和創新的重大挑戰。由於缺乏訓練有素的技術人員和工程師，主要企業難以維持品質標準，這可能導致半導體設備的缺陷率增加。這些勞動力差異減緩了先進技術的開發，推遲了計劃進度，並最終影響了競爭力以及滿足各行業對先進電子產品不斷成長的需求的能力。

轉向電動車 (EV)

向電動車 (EV) 的轉變正在推動市場的顯著成長。這些車輛需要複雜的電子系統來進行電池管理、配電和資訊娛樂。這種轉變增加了對確保安全、效率和性能的可靠半導體連接的需求。因此，製造商正在投資創新的黏合技術，以滿足電動車應用的特定需求，推動進步，提高電動車組件的功能和可靠性。

生產成本高

市場上不斷上升的生產成本會對製造商的盈利和競爭力產生重大影響。這些增加的成本可歸因於先進的材料和複雜的連接技術。因此，公司可能難以維持其產品的實惠價格，這可能會限制市場准入並減少整體需求。這些財務負擔也會阻礙研發投資，並阻礙對未來成長至關重要的鍵合技術的創新和進步。

COVID-19 的影響：

COVID-19 大流行對市場產生了重大影響，擾亂了供應鏈並導致生產延誤。停工和勞動力短缺降低了製造能力，而遠距工作和醫療保健應用中對電子產品的需求增加則導致資源緊張。此外，半導體供不應求出現，影響了依賴黏合元件的各個產業。這些挑戰凸顯了提高半導體製造流程和供應鏈管理的彈性和靈活性的必要性。

預計覆晶鍵合領域在預測期內將是最大的

預計覆晶接合領域在預測期內將佔據最大的市場佔有率。該技術增強了電氣性能和溫度控管，從而實現智慧型手機、電腦和汽車電子等高性能應用的緊湊設計。隨著小型化和效率要求的提高，覆晶接合不斷受到關注並推動創新，以支援現代電子設備不斷變化的需求。

汽車業預計在預測期內複合年成長率最高

預計汽車業在預測期內複合年成長率最高。隨著汽車製造商整合駕駛輔助、資訊娛樂和電動動力傳動系統等技術，可靠的半導體接合已成為性能和安全性的關鍵。這一趨勢正在加速創新黏合技術的採用，使製造商能夠生產更小、更有效率的組件，以滿足現代汽車應用和電動車所需的嚴格標準。

比最大的地區

在技​​術進步的推動下，預計北美地區將在預測期內佔據最大的市場佔有率。主要促進因素包括 5G、汽車電子產品和物聯網應用的日益普及。主要企業正在投資創新的黏合技術，以提高性能和效率。作為額外的好處，該地區受益於強大的研發生態系統，促進半導體產業內的協作和創新，以滿足不斷變化的市場需求。

複合年成長率最高的地區：

預計亞太地區在預測期內將實現最高成長率。物聯網、人工智慧和 5G 等技術的日益普及極大地推動了對先進半導體鍵合技術的需求。這些技術需要依賴高效接合製程的高性能晶片。電動車產量的增加是一個主要促進因素，因為這些汽車需要複雜的半導體元件來實現電源管理和效率。

免費客製化服務：

訂閱此報告的客戶可以存取以下免費自訂選項之一：

  • 公司簡介
    • 其他市場參與者的綜合分析（最多 3 家公司）
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  • 區域分割
    • 根據客戶興趣對主要國家的市場估計、預測和複合年成長率（註：基於可行性檢查）
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    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 研究資訊來源
    • 主要研究資訊來源
    • 二次研究資訊來源
    • 先決條件

第3章市場趨勢分析

  • 促進因素
  • 抑制因素
  • 機會
  • 威脅
  • 技術分析
  • 應用分析
  • 最終用戶分析
  • 新興市場
  • COVID-19 的影響

第4章波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭公司之間的敵對關係

第5章全球半導體鍵結市場：按類型

  • 引線接合法
  • 覆晶接合
  • 凸塊接合
  • 中介層鍵合
  • 其他類型

第6章 全球半導體鍵結市場：依材料分類

  • 金子
  • 鋁
  • 焊接
  • 黏劑
  • 其他材料

第7章全球半導體鍵結市場：按流程

  • 晶粒到晶粒接合
  • 晶粒/晶圓鍵合
  • 晶圓間鍵合
  • 其他工藝

第8章全球半導體鍵結市場：依技術分類

  • 熱壓黏合
  • 用黏劑黏合
  • 焊點
  • 混合鍵合
  • 其他技術

第9章 全球半導體鍵結市場：依應用分類

  • 儲存裝置
  • 射頻裝置
  • CMOS影像感測器
  • 引導的
  • 微機電系統元件
  • 單獨的組件
  • 積體電路（IC）
  • 其他用途

第10章全球半導體鍵結市場：依最終用戶分類

  • 半導體製造商
  • 醫療設備製造商
  • 車
  • 航太和國防
  • 通訊設備
  • 研究所
  • 其他最終用戶

第11章全球半導體鍵結市場：按地區

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東/非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲

第12章 主要進展

  • 合約、夥伴關係、合作和合資企業
  • 收購和合併
  • 新產品發布
  • 業務拓展
  • 其他關鍵策略

第13章 公司概況

  • EV Group
  • ASMPT Semiconductor Solutions
  • MRSI Systems.
  • WestBond Inc.
  • Panasonic Holding Corporation
  • Palomar Technologies
  • Dr. Tresky AG
  • BE Semiconductor Industries NV
  • Fasford Technology Co.Ltd
  • Kulicke and Soffa Industries Inc.
  • DIAS Automation
  • Shibaura Mechatronics Corporation
  • SUSS MicroTec SE
  • Tokyo Electron Limited
  • Intel Corporation
  • Kulicke and Soffa Industries, Inc.
  • TDK Corporation
Product Code: SMRC27559

According to Stratistics MRC, the Global Semiconductor Bonding Market is accounted for $1044.5 million in 2024 and is expected to reach $1448.4 million by 2030 growing at a CAGR of 5.6% during the forecast period. Semiconductor bonding is a crucial process in the assembly of electronic devices, where different semiconductor materials are interconnected to form functional circuits and components. This process encompasses various techniques, including wire bonding, flip-chip bonding, and adhesive bonding, each tailored to ensure robust electrical and mechanical connections. Effective bonding is essential for the performance, reliability, and longevity of semiconductor devices, influencing thermal management, signal integrity, and overall device efficiency.

Market Dynamics:

Driver:

Increasing demand from various industries

The market is experiencing growing demand across various industries, including consumer electronics, automotive, and telecommunications. As the need for advanced electronic devices rises, driven by trends like 5G, IoT, and electric vehicles, the demand for efficient and reliable semiconductor connections intensifies. This surge propels innovations in bonding technologies, enabling manufacturers to meet performance requirements and enhance the functionality of increasingly compact and powerful electronic systems.

Restraint:

Shortage of skilled labor

The shortage of skilled labor in the market poses significant challenges, hindering production efficiency and innovation. With a lack of trained technicians and engineers, companies may struggle to maintain quality standards, leading to increased defect rates in semiconductor devices. This workforce gap can slow down the development of advanced technologies and delay project timelines, ultimately impacting competitiveness and the ability to meet the rising demand for sophisticated electronic products in various industries.

Opportunity:

Shift towards electric vehicles (EVs)

The shift towards electric vehicles (EVs) is driving substantial growth in the market, as these vehicles require advanced electronic systems for battery management, power distribution, and infotainment. This transition increases the demand for reliable semiconductor connections that ensure safety, efficiency, and performance. Consequently, manufacturers are investing in innovative bonding technologies to meet the specific needs of EV applications, fostering advancements that enhance the functionality and reliability of electric vehicle components.

Threat:

High production costs

High production costs in the market can significantly impact profitability and competitiveness for manufacturers. These elevated expenses may stem from advanced materials, intricate bonding techniques. As a result, companies may struggle to maintain affordable pricing for their products, limiting market accessibility and reducing overall demand. This financial strain can also hinder investment in research and development, stalling innovation and advancements in bonding technologies critical for future growth.

Covid-19 Impact:

The COVID-19 pandemic had a profound impact on the market, disrupting supply chains and causing delays in production. Lockdowns and labor shortages led to reduced manufacturing capacity, while increased demand for electronics in remote work and healthcare applications strained resources. Additionally, semiconductor shortages emerged, affecting various industries reliant on bonded components. These challenges highlighted the need for greater resilience and flexibility in semiconductor manufacturing processes and supply chain management.

The flip chip bonding segment is projected to be the largest during the forecast period

The flip chip bonding segment is projected to account for the largest market share during the projection period. This method enhances electrical performance and thermal management, enabling compact designs in high-performance applications such as smartphones, computers, and automotive electronics. As demand for miniaturization and efficiency grows, flip chip bonding continues to gain prominence, driving innovations that support the evolving needs of modern electronic devices.

The automotives segment is expected to have the highest CAGR during the forecast period

The automotives segment is expected to have the highest CAGR during the extrapolated period. As automakers integrate technologies like driver assistance, infotainment, and electric powertrains, reliable semiconductor bonding becomes essential for performance and safety. This trend is accelerating the adoption of innovative bonding techniques, enabling manufacturers to produce smaller, more efficient components that meet the rigorous standards required for modern automotive applications and electric vehicles.

Region with largest share:

North America region is projected to account for the largest market share during the forecast period fueled by advancements in technology. Key drivers include the rising adoption of 5G, automotive electronics, and IoT applications. Major companies are investing in innovative bonding techniques to enhance performance and efficiency. Additionally, the region benefits from a strong research and development ecosystem, fostering collaboration and innovation within the semiconductor industry to address evolving market needs.

Region with highest CAGR:

Asia Pacific is expected to register the highest growth rate over the forecast period. The increasing adoption of technologies such as IoT, AI, and 5G is significantly boosting demand for advanced semiconductor bonding techniques. These technologies require high-performance chips that depend on efficient bonding processes. The rise in electric vehicle production is a major driver, as these vehicles require sophisticated semiconductor components for power management and efficiency.

Key players in the market

Some of the key players in Semiconductor Bonding market include EV Group, ASMPT Semiconductor Solutions, MRSI Systems., WestBond Inc., Panasonic Holding Corporation, Palomar Technologies, Dr. Tresky AG, BE Semiconductor Industries NV, Fasford Technology Co.Ltd , Kulicke and Soffa Industries Inc., DIAS Automation, Shibaura Mechatronics Corporation, SUSS MicroTec SE, Tokyo Electron Limited, Intel Corporation, Kulicke and Soffa Industries, Inc. and TDK Corporation.

Key Developments:

In March 2024, TANAKA Kikinzoku Kogyo K.K., a leading company in the precious metals industry, recently pioneered the semiconductor bonding field by developing a gold particle bonding technology. This innovative method utilizes AuRoFUSE, a specialized low-temperature fired paste, to facilitate gold-to-gold bonding in high-density semiconductor mounting applications.

In December 2023, Tokyo Electron Kyushu developed an Extreme Laser Lift Off (XLO) technology. This cutting-edge approach is set to revolutionize the field of 3D integration for advanced semiconductor devices that utilize permanent wafer bonding.

Types Covered:

  • Wire Bonding
  • Flip Chip Bonding
  • Bump Bonding
  • Interposer Bonding
  • Other Types

Materials Covered:

  • Gold
  • Aluminum
  • Solder
  • Conductive Adhesives
  • Other Materials

Processes Covered:

  • Die-to-Die Bonding
  • Die-to-Wafer Bonding
  • Wafer-to-Wafer Bonding
  • Other Processes

Technologies Covered:

  • Thermo-Compression Bonding
  • Adhesive Bonding
  • Solder Bonding
  • Hybrid Bonding
  • Other Technologies

Applications Covered:

  • Memory Devices
  • RF Devices
  • CMOS Image Sensors
  • LED
  • MEMS Devices
  • Discrete Components
  • Integrated Circuits (ICs)
  • Other Applications

End Users Covered:

  • Semiconductor Manufacturers
  • Medical Device Manufacturers
  • Automotives
  • Aerospace & Defense
  • Telecommunications Equipments
  • Research Institutions
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 Application Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Semiconductor Bonding Market, By Type

  • 5.1 Introduction
  • 5.2 Wire Bonding
  • 5.3 Flip Chip Bonding
  • 5.4 Bump Bonding
  • 5.5 Interposer Bonding
  • 5.6 Other Types

6 Global Semiconductor Bonding Market, By Material

  • 6.1 Introduction
  • 6.2 Gold
  • 6.3 Aluminum
  • 6.4 Solder
  • 6.5 Conductive Adhesives
  • 6.6 Other Materials

7 Global Semiconductor Bonding Market, By Process

  • 7.1 Introduction
  • 7.2 Die-to-Die Bonding
  • 7.3 Die-to-Wafer Bonding
  • 7.4 Wafer-to-Wafer Bonding
  • 7.5 Other Processes

8 Global Semiconductor Bonding Market, By Technology

  • 8.1 Introduction
  • 8.2 Thermo-Compression Bonding
  • 8.3 Adhesive Bonding
  • 8.4 Solder Bonding
  • 8.5 Hybrid Bonding
  • 8.6 Other Technologies

9 Global Semiconductor Bonding Market, By Application

  • 9.1 Introduction
  • 9.2 Memory Devices
  • 9.3 RF Devices
  • 9.4 CMOS Image Sensors
  • 9.5 LED
  • 9.6 MEMS Devices
  • 9.7 Discrete Components
  • 9.8 Integrated Circuits (ICs)
  • 9.9 Other Applications

10 Global Semiconductor Bonding Market, By End User

  • 10.1 Introduction
  • 10.2 Semiconductor Manufacturers
  • 10.3 Medical Device Manufacturers
  • 10.4 Automotives
  • 10.5 Aerospace & Defense
  • 10.6 Telecommunications Equipments
  • 10.7 Research Institutions
  • 10.8 Other End Users

11 Global Semiconductor Bonding Market, By Geography

  • 11.1 Introduction
  • 11.2 North America
    • 11.2.1 US
    • 11.2.2 Canada
    • 11.2.3 Mexico
  • 11.3 Europe
    • 11.3.1 Germany
    • 11.3.2 UK
    • 11.3.3 Italy
    • 11.3.4 France
    • 11.3.5 Spain
    • 11.3.6 Rest of Europe
  • 11.4 Asia Pacific
    • 11.4.1 Japan
    • 11.4.2 China
    • 11.4.3 India
    • 11.4.4 Australia
    • 11.4.5 New Zealand
    • 11.4.6 South Korea
    • 11.4.7 Rest of Asia Pacific
  • 11.5 South America
    • 11.5.1 Argentina
    • 11.5.2 Brazil
    • 11.5.3 Chile
    • 11.5.4 Rest of South America
  • 11.6 Middle East & Africa
    • 11.6.1 Saudi Arabia
    • 11.6.2 UAE
    • 11.6.3 Qatar
    • 11.6.4 South Africa
    • 11.6.5 Rest of Middle East & Africa

12 Key Developments

  • 12.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 12.2 Acquisitions & Mergers
  • 12.3 New Product Launch
  • 12.4 Expansions
  • 12.5 Other Key Strategies

13 Company Profiling

  • 13.1 EV Group
  • 13.2 ASMPT Semiconductor Solutions
  • 13.3 MRSI Systems.
  • 13.4 WestBond Inc.
  • 13.5 Panasonic Holding Corporation
  • 13.6 Palomar Technologies
  • 13.7 Dr. Tresky AG
  • 13.8 BE Semiconductor Industries NV
  • 13.9 Fasford Technology Co.Ltd
  • 13.10 Kulicke and Soffa Industries Inc.
  • 13.11 DIAS Automation
  • 13.12 Shibaura Mechatronics Corporation
  • 13.13 SUSS MicroTec SE
  • 13.14 Tokyo Electron Limited
  • 13.15 Intel Corporation
  • 13.16 Kulicke and Soffa Industries, Inc.
  • 13.17 TDK Corporation

List of Tables

  • Table 1 Global Semiconductor Bonding Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Semiconductor Bonding Market Outlook, By Type (2022-2030) ($MN)
  • Table 3 Global Semiconductor Bonding Market Outlook, By Wire Bonding (2022-2030) ($MN)
  • Table 4 Global Semiconductor Bonding Market Outlook, By Flip Chip Bonding (2022-2030) ($MN)
  • Table 5 Global Semiconductor Bonding Market Outlook, By Bump Bonding (2022-2030) ($MN)
  • Table 6 Global Semiconductor Bonding Market Outlook, By Interposer Bonding (2022-2030) ($MN)
  • Table 7 Global Semiconductor Bonding Market Outlook, By Other Types (2022-2030) ($MN)
  • Table 8 Global Semiconductor Bonding Market Outlook, By Material (2022-2030) ($MN)
  • Table 9 Global Semiconductor Bonding Market Outlook, By Gold (2022-2030) ($MN)
  • Table 10 Global Semiconductor Bonding Market Outlook, By Aluminum (2022-2030) ($MN)
  • Table 11 Global Semiconductor Bonding Market Outlook, By Solder (2022-2030) ($MN)
  • Table 12 Global Semiconductor Bonding Market Outlook, By Conductive Adhesives (2022-2030) ($MN)
  • Table 13 Global Semiconductor Bonding Market Outlook, By Other Materials (2022-2030) ($MN)
  • Table 14 Global Semiconductor Bonding Market Outlook, By Process (2022-2030) ($MN)
  • Table 15 Global Semiconductor Bonding Market Outlook, By Die-to-Die Bonding (2022-2030) ($MN)
  • Table 16 Global Semiconductor Bonding Market Outlook, By Die-to-Wafer Bonding (2022-2030) ($MN)
  • Table 17 Global Semiconductor Bonding Market Outlook, By Wafer-to-Wafer Bonding (2022-2030) ($MN)
  • Table 18 Global Semiconductor Bonding Market Outlook, By Other Processes (2022-2030) ($MN)
  • Table 19 Global Semiconductor Bonding Market Outlook, By Technology (2022-2030) ($MN)
  • Table 20 Global Semiconductor Bonding Market Outlook, By Thermo-Compression Bonding (2022-2030) ($MN)
  • Table 21 Global Semiconductor Bonding Market Outlook, By Adhesive Bonding (2022-2030) ($MN)
  • Table 22 Global Semiconductor Bonding Market Outlook, By Solder Bonding (2022-2030) ($MN)
  • Table 23 Global Semiconductor Bonding Market Outlook, By Hybrid Bonding (2022-2030) ($MN)
  • Table 24 Global Semiconductor Bonding Market Outlook, By Other Technologies (2022-2030) ($MN)
  • Table 25 Global Semiconductor Bonding Market Outlook, By Application (2022-2030) ($MN)
  • Table 26 Global Semiconductor Bonding Market Outlook, By Memory Devices (2022-2030) ($MN)
  • Table 27 Global Semiconductor Bonding Market Outlook, By RF Devices (2022-2030) ($MN)
  • Table 28 Global Semiconductor Bonding Market Outlook, By CMOS Image Sensors (2022-2030) ($MN)
  • Table 29 Global Semiconductor Bonding Market Outlook, By LED (2022-2030) ($MN)
  • Table 30 Global Semiconductor Bonding Market Outlook, By MEMS Devices (2022-2030) ($MN)
  • Table 31 Global Semiconductor Bonding Market Outlook, By Discrete Components (2022-2030) ($MN)
  • Table 32 Global Semiconductor Bonding Market Outlook, By Integrated Circuits (ICs) (2022-2030) ($MN)
  • Table 33 Global Semiconductor Bonding Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 34 Global Semiconductor Bonding Market Outlook, By End User (2022-2030) ($MN)
  • Table 35 Global Semiconductor Bonding Market Outlook, By Semiconductor Manufacturers (2022-2030) ($MN)
  • Table 36 Global Semiconductor Bonding Market Outlook, By Medical Device Manufacturers (2022-2030) ($MN)
  • Table 37 Global Semiconductor Bonding Market Outlook, By Automotives (2022-2030) ($MN)
  • Table 38 Global Semiconductor Bonding Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 39 Global Semiconductor Bonding Market Outlook, By Telecommunications Equipments (2022-2030) ($MN)
  • Table 40 Global Semiconductor Bonding Market Outlook, By Research Institutions (2022-2030) ($MN)
  • Table 41 Global Semiconductor Bonding Market Outlook, By Other End Users (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.