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市場調查報告書
商品編碼
1698459

半導體鍵結材料市場：未來預測（2025-2030）

Semiconductor Bonding Material Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 145 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計 2025-2030 年預測期內半導體黏合材料市場將以 5.25% 的複合年成長率成長。

半導體是具有固有電學特性的材料，可用於製造電腦和電子設備。此外，它是一種化學上固體的物質，在一定條件下可以導電。國防設備、通訊系統、交通運輸、計算、醫療保健和可再生能源是一些利潤豐厚的半導體應用。原子以半導體結構結合在一起，形成大量積體電路和製造工具。半導體結模型具有均勻、恆定的半導體材料結構。

市場趨勢：

  • 微電子需求的不斷成長推動著市場成長：受人們對電動車和 MEMS 系統興趣日益濃厚的推動，半導體鍵合材料市場正在迅速擴張。使用堆疊晶粒系統的連網型設備的激增將擴大全球半導體鍵合產業。 5G 網路的推出和 6G 技術的持續研究正在推動該市場的全球成長。智慧型手機和穿戴式裝置的普及正在加速全球市場趨勢。此外，受半導體在互聯物流、智慧建築、家庭自動化和智慧交通系統等領域廣泛應用的支持，預計未來幾年市場將持續成長。
  • 全球半導體鍵結材料市場細分：半導體鍵結材料市場分為五大區域：美洲、歐洲、中東和非洲、亞太地區。預計亞太地區將在預測期內佔據主導市場佔有率，得益於主要本地供應商的策略投資和成熟的半導體產業，亞太地區將成為該產業的關鍵力量。該地區是全球一些最大半導體公司的所在地，中國、印度和越南等國家對加強工業基礎設施的投資正在增加。此外，國內主要供應商和政府機構正在對混合連接等先進技術投入大量資源，預計這將在整個預測期內推動市場成長。

報告中介紹的主要企業包括 Kulicke & Soffa、Shibaura Mechatronics、 Yamaha 馬達 Robotics、 FUJIFILM、 Panasonic Corporation和 SUSS MicroTech SE。

本報告的主要優點

  • 深刻分析：獲得涵蓋主要地區和新興地區的深入市場洞察，重點關注客戶群、政府政策和社會經濟因素、消費者偏好、垂直行業和其他子區隔。
  • 競爭格局：了解全球主要企業所採用的策略策略，並了解正確策略帶來的潛在市場滲透。
  • 市場促進因素和未來趨勢：探索動態因素和關鍵市場趨勢以及它們將如何影響市場的未來發展。
  • 可行的建議：利用洞察力進行策略決策，在動態環境中開闢新的業務流和收益。
  • 適用範圍廣：對於新興企業、研究機構、顧問公司、中小企業和大型企業來說，它都是實用且具有成本效益的。

它有什麼用途？

產業與市場洞察、商業機會評估、產品需求預測、打入市場策略、地理擴張、資本支出決策、法律規範與影響、新產品開發、競爭影響

分析範圍

  • 歷史資料（2022-2024）和預測資料（2025-2030）
  • 成長機會、挑戰、供應鏈前景、法規結構、顧客行為、趨勢分析
  • 競爭對手定位、策略和市場佔有率分析
  • 按部門和地區（國家）分類的收益成長和預測分析
  • 公司概況（策略、產品、財務資訊、主要趨勢等）

半導體黏合材料市場分析涵蓋以下幾個部分：

按類型

  • 晶片焊接機
  • 晶圓鍵合機
  • 覆晶合機

按接頭類型

  • 晶粒間鍵合
  • 晶圓對晶圓鍵合
  • 晶粒/晶圓鍵合

按應用

  • 射頻設備
  • 3D NAND
  • CMOS影像感測器
  • LED
  • MEMS/感測器

按地區

  • 美國
  • 美國
  • 歐洲、中東和非洲
  • 德國
  • 荷蘭
  • 其他
  • 亞太地區
  • 中國
  • 日本
  • 台灣
  • 韓國
  • 其他

目錄

第1章 引言

  • 市場概覽
  • 市場定義
  • 分析範圍
  • 市場區隔
  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要利益

第2章分析方法

  • 分析設計
  • 分析過程

第3章執行摘要

  • 主要發現
  • 分析師觀點

第4章 市場動態

  • 市場促進因素
  • 市場限制
  • 波特五力分析
  • 產業價值鏈分析

第5章半導體鍵結材料市場（按類型）

  • 介紹
  • 晶片焊接機
  • 晶圓鍵合機
  • 覆晶合機

第6章半導體鍵結材料市場（按鍵結類型）

  • 介紹
  • 晶粒間鍵合
  • 晶圓對晶圓鍵合
  • 晶粒/晶圓鍵合

第7章半導體鍵結材料市場（按應用）

  • 介紹
  • 射頻設備
  • 3D NAND
  • CMOS影像感測器
  • LED
  • MEMS/感測器

第8章半導體鍵結材料市場（按區域）

  • 世界概況
  • 美洲
    • 美國
  • 歐洲、中東和非洲
    • 德國
    • 荷蘭
    • 其他
  • 亞太地區
    • 中國
    • 日本
    • 台灣
    • 韓國
    • 其他

第9章競爭格局及分析

  • 主要企業和策略分析
  • 市場佔有率分析
  • 企業合併、協議、商業合作
  • 競爭儀錶板

第10章 公司簡介

  • Kulicke & Soffa
  • Shibaura Mechatronics
  • Yamaha Motor Robotics Corporation Co.
  • Fuji Corporation
  • Panasonic Corporation
  • SUSS MicroTech SE
  • ASM Pacific Technology Ltd.
  • Fasford Technology
  • DuPont
簡介目錄
Product Code: KSI061615492

The semiconductor bonding material market is projected to increase at a CAGR of 5.25% over the forecast period between 2025 and 2030.

The semiconductor is a material with essential electric properties that make it useful for manufacturing computers and electronic equipment. Additionally, it is a chemically solid substance that, under certain circumstances, conducts electricity. Defense equipment, communication systems, transportation, computing, healthcare, and renewable energy are a few of the lucrative semiconductor applications. Atoms are bonded together in semiconductor arrangements to create a huge number of integrated circuits and production tools. The semiconductor bonding model's uniform and constant semiconductor material structure.

Market Trends:

  • Growing Demand for Microelectronics Fuels Market Growth: The semiconductor bonding material market is expanding rapidly, driven by increasing interest in electric vehicles and micro-electromechanical systems. The proliferation of connected devices utilizing stacked die systems is set to enlarge the global semiconductor bonding industry. The rollout of 5G networks, coupled with ongoing research into 6G technology, is accelerating this market's worldwide growth. Rising adoption of smartphones and wearable devices is further amplifying global market trends. Additionally, the market is expected to see continued growth in the coming years, supported by the wide-ranging applications of semiconductors in areas such as connected logistics, smart architecture, home automation, and intelligent transportation systems.
  • Global Segmentation of the Semiconductor Bonding Material Market: The semiconductor bonding material market is categorized into five key regions: the Americas, Europe, the Middle East and Africa, and Asia-Pacific. The Asia-Pacific region is projected to dominate the market share during the forecast period, bolstered by strategic investments from major local suppliers and its well-established semiconductor industry, a significant force in the sector. Home to some of the world's largest semiconductor firms, the region is seeing growing investments to strengthen industry infrastructure in countries like China, India, and Vietnam. Furthermore, leading domestic vendors and government bodies are channeling substantial resources into advanced technologies, such as hybrid bonding, which is expected to drive market growth throughout the forecast period.

Some of the major players covered in this report include Kulicke & Soffa, Shibaura Mechatronics, Yamaha Motor Robotics Corporation Co., Fuji Corporation, Panasonic Corporation, SUSS MicroTech SE, among others.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

The Semiconductor Bonding Material Market is analyzed into the following segments:

By Type

  • Die Bonder
  • Wafer Bonder
  • Flip Chip Bonder

By Bonding Type

  • Die-to-Die Bonding,
  • Wafer-to-Wafer Bonding
  • Die-to-Wafer Bonding

By Application

  • RF Devices
  • 3D NAND
  • CMOS Image Sensors
  • LED
  • MEMS & Sensors

By Geography

  • Americas
  • US
  • Europe, the Middle East, and Africa
  • Germany
  • Netherlands
  • Others
  • Asia Pacific
  • China
  • Japan
  • Taiwan
  • South Korea
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study

1.4. Market Segmentation

  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base and Forecast Years Timeline
  • 1.8. Key benefits for the stakeholders

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. The Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis

5. SEMICONDUCTOR BONDING MATERIAL MARKET BY TYPE

  • 5.1. Introduction
  • 5.2. Die Bonder
  • 5.3. Wafer Bonder
  • 5.4. Flip Chip Bonder

6. SEMICONDUCTOR BONDING MATERIAL MARKET BY BONDING TYPE

  • 6.1. Introduction
  • 6.2. Die-to-Die Bonding,
  • 6.3. Wafer-to-Wafer Bonding
  • 6.4. Die-to-Wafer Bonding

7. SEMICONDUCTOR BONDING MATERIAL MARKET BY APPLICATION

  • 7.1. Introduction
  • 7.2. RF Devices
  • 7.3. 3D NAND
  • 7.4. CMOS Image Sensors
  • 7.5. LED
  • 7.6. MEMS & Sensors

8. SEMICONDUCTOR BONDING MATERIAL MARKET BY GEOGRAPHY

  • 8.1. Global Overview
  • 8.2. Americas
    • 8.2.1. US
  • 8.3. Europe, Middle East, and Africa
    • 8.3.1. Germany
    • 8.3.2. Netherlands
    • 8.3.3. Others
  • 8.4. Asia-Pacific
    • 8.4.1. China
    • 8.4.2. Japan
    • 8.4.3. Taiwan
    • 8.4.4. South Korea
    • 8.4.5. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. Kulicke & Soffa
  • 10.2. Shibaura Mechatronics
  • 10.3. Yamaha Motor Robotics Corporation Co.
  • 10.4. Fuji Corporation
  • 10.5. Panasonic Corporation
  • 10.6. SUSS MicroTech SE
  • 10.7. ASM Pacific Technology Ltd.
  • 10.8. Fasford Technology
  • 10.9. DuPont