印刷電路板 (PCB) 組裝市場規模、按 PCB 類型、按組件、按技術、按焊接工藝、按數量、按組裝、按垂直行業、預測 2024 - 2032 年

在電子製造全球化的推動下，2024 年至 2032 年全球印刷電路板 PCB 組裝市場的複合年成長率將超過 5%。製造商擴大將生產轉移到亞太地區等地區，以利用具有成本效益的生產中心。這一趨勢是由較低的勞動力成本、支持性的監管環境以及靠近主要市場等因素所推動的。

工信部數據顯示，2023年，我國電子資訊製造業固定資產投資年增9.3%，快於產業整體成長0.3個百分點。工業增加價值成長3.4%，12月份較2022年12月成長9.6%。

這種轉變不僅提高了製造效率，而且有利於獲得熟練的勞動力和先進技術。 PCB 組裝市場受益於生產能力的擴大和供應鏈的簡化，支持了全球各行業對電子產品不斷成長的需求。

整個印刷電路板 PCB 組裝市場根據 PCB 類型、元件、技術、焊接流程、數量、組裝、垂直和區域進行細分。

球柵陣列細分市場在 2024 年至 2032 年期間將實現顯著的複合年成長率。由於其在增強電子設備性能和可靠性方面的優勢，球柵陣列 BGA 組裝領域對印刷電路板 PCB 組裝的需求正在顯著成長。隨著電子設備變得緊湊且功能強大，對能夠滿足這些要求而不影響功能或耐用性的 PCB 組件的需求不斷成長。這一趨勢是由球柵陣列技術的創新所推動的，使其成為跨行業廣泛應用的首選。

到 203 年，軟性 PCB 產業將佔據顯著的印刷電路板 PCB 組裝市場佔有率，因為它能夠滿足現代電子設備對靈活性、輕量級設計和節省空間解決方案的需求。與剛性 PCB 相比，軟性 PCB 具有可彎曲性、減輕重量和增強耐用性等優點。它們對於穿戴式科技、可折疊智慧型手機和汽車電子應用至關重要，而緊湊和適應性強的設計對於這些應用至關重要。這種趨勢隨著材料和製造流程的進步而不斷升級，這些進步使得能夠生產適合不同行業需求的高性能軟性 PCB 組件。

北美印刷電路板 PCB 組裝市場的複合年成長率在 2024 年至 2032 年期間將充滿希望。其中包括航空航太、國防、汽車和醫療保健等產業的強勁擴張，所有這些產業都嚴重依賴先進的電子產品。此外，增加研發投資促進 PCB 技術創新，擴大需求。電子產品可靠性和安全性的嚴格監管標準有助於採用高品質 PCB 組件。這些因素的結合使北美成為一個重要的市場，推動其持續成長並適應不斷變化的行業需求。

目錄

第 1 章：方法與範圍

第 2 章：執行摘要

第 3 章：印刷電路板 (PCB) 組裝產業洞察

• 產業生態系統分析
• 供應商矩陣
• 利潤率分析
• 技術與創新格局
• 專利分析
• 重要新聞和舉措
  • 夥伴關係/協作
  • 併購
  • 投資
  • 產品發布與創新
• 監管環境
• 衝擊力
  • 成長動力
    • 電子設備的需求增加
    • 物聯網 (IoT) 的興起
    • 擴大在汽車電子設備中使用 PCB，以實現安全性、連接性和自動化
    • 對智慧型手機、平板電腦、穿戴式裝置和智慧家居設備的需求不斷成長
    • 航空航太和國防工業的擴張
  • 產業陷阱與挑戰
    • PCB 的複雜性不斷增加
    • 品質控制和測試
• 成長潛力分析
• 波特的分析
• PESTEL分析

第 4 章：競爭格局

• 介紹
• 公司市佔率
• 主要市場參與者的競爭分析
  • Benchmark Electronics, Inc
  • Eurocircuits
  • PCBWay
  • Seeed Technology Co., Ltd.
  • Tempo
  • Vexos
  • WellPCB Technology Co., Ltd.
• 競爭定位矩陣
• 戰略展望矩陣

第 5 章：印刷電路板 (PCB) 組裝市場估計與預測：按 PCB 類型

• 主要動向：依PCB類型
• 剛性PCB
• 軟性線路板
• 金屬芯PCB

第 6 章：印刷電路板 (PCB) 組裝市場估計與預測：按組件

• 主要動向：按組件
  • 積極的
    • 電阻器
    • 電容器
    • 電感器
  • 被動的
    • 積體電路（ICS）
    • 微處理器
    • 微控制器

第 7 章：印刷電路板 (PCB) 組裝市場估計與預測：按技術

• 主要動力向：靠技術
• 表面貼裝組裝 (SMT)
• 電鍍通孔技術（PTH）
• 機電組裝
• 混合技術（SMT/通孔）

第 8 章：印刷電路板 (PCB) 組裝市場估計與預測：依焊接工藝

• 主動向：透過焊接工藝
• 波峰焊
• 手工焊接
• 回流焊

第 9 章：印刷電路板 (PCB) 組裝市場估計與預測：按數量

• 主要動向：依PCB類型
• 低（1-100 單位）
• 中型（100-10,000 單位）
• 高（超過 10,000 單位）

第 10 章：印刷電路板 (PCB) 組裝市場估計與預測：依組裝

• 主動向：透過裝配
• 內部
• 外包/合約

第 11 章：印刷電路板 (PCB) 組裝市場估計與預測：依垂直領域

• 主要動向：垂直
• 消費性電子產品
• 汽車
• 衛生保健
• 資訊科技與電信
• 工業的
• 其他

第 12 章：印刷電路板 (PCB) 組裝市場估計與預測：按地區

• 主要動向：按地區
• 北美洲
  • 美國
  • 加拿大
• 歐洲
  • 英國
  • 德國
  • 法國
  • 義大利
  • 俄羅斯
  • 歐洲其他地區
• 亞太地區
  • 中國
  • 印度
  • 日本
  • 韓國
  • 台灣
  • 泰國
  • 亞太地區其他地區
• 拉丁美洲
  • 巴西
  • 墨西哥
  • 海灣合作理事會
  • 拉丁美洲其他地區
• MEA
  • 沙烏地阿拉伯
  • 阿拉伯聯合大公國
  • 南非
  • MEA 的其餘部分

第 13 章：公司簡介

• Alfa Electronics
• ALLPCB.com
• Altek Electronics, Inc.
• Benchmark Electronics, Inc
• Bittele Electronics Inc.
• Clarydon Electronic Services Limited
• Eurocircuits
• Jayshree Instruments Pvt. Ltd
• Miracle Electronics Devices Pvt Ltd
• PCB Assembly Express, INC
• PCB Power Market
• PCB Unlimited.
• PCBGOGO.
• PCBWay
• Podrain Electronics
• RAYMING TECHNOLOGY
• Seeed Technology Co.,Ltd.
• Tempo
• Vexos
• Visual Communications Company, LLC
• WellPCB Technology Co., Ltd.

Global Printed Circuit Board PCB Assembly Market will depict over 5% CAGR from 2024 to 2032, catapulted by the globalization of electronics manufacturing. Manufacturers are increasingly moving production to regions like Asia-Pacific to capitalize on cost-effective production hubs. This trend is driven by factors such as lower labor costs, supportive regulatory environments, and proximity to key markets.

In 2023, fixed-asset investment in China's electronic information manufacturing industry increased by 9.3% year on year, surpassing the overall industry growth by 0.3 percentage points, according to the Ministry of Industry and Information Technology. The industrial added value rose by 3.4%, with a December increase of 9.6% compared to December 2022. Mobile phone production grew by 6.9% to 1.57 billion units, including a 1.9% rise in smartphone output to 1.14 billion units.

This shift not only enhances manufacturing efficiency but also facilitates access to a skilled workforce and advanced technologies. The PCB assembly market benefits from expanded production capacities and streamlined supply chains, supporting the growing demand for electronics across various industries worldwide.

The overall printed circuit board PCB assembly market is segmented based on the type of PCB, component, technology, soldering process, volume, assembly, vertical, and region.

The ball grid array segment will register a remarkable CAGR during 2024-2032. The demand for Printed Circuit Board PCB Assembly is rising significantly within the ball grid array BGA assembly segment due to its advantages in enhancing electronic device performance and reliability. As electronic devices become compact and powerful, there is a growing demand for PCB assemblies that can accommodate these requirements without compromising on functionality or durability. This trend is propelled by innovations in ball grid array technology, making it a preferred choice for a wide range of applications across industries.

The flexible PCB sector will garner a noticeable printed circuit board PCB assembly market share by 203, owing to its ability to meet the needs of modern electronic devices that require flexibility, lightweight design, and space-saving solutions. Flexible PCBs offer advantages such as bendability, reduced weight, and enhanced durability compared to rigid PCBs. They are essential for applications in wearable technology, foldable smartphones, and automotive electronics where compact and adaptable designs are crucial. This trend is escalated by advancements in materials and manufacturing processes that enable the production of high-performance flexible PCB assemblies tailored to diverse industry demands.

The CAGR for the North America printed circuit board PCB assembly market will be promising during the 2024 to 2032 timeframe. These include a robust expansion in industries such as aerospace, defense, automotive, and healthcare, all of which heavily rely on advanced electronics. In addition, increasing investments in research and development foster innovation in PCB technologies, amplifying demand. Strict regulatory standards for electronics reliability and safety contribute to the adoption of high-quality PCB assemblies. This combination of factors positions North America as a significant market, thrusting its continued growth and adaptation to evolving industry needs.

Table of Contents

Chapter 1 Methodology & Scope

• 1.1 Market scope & definition
• 1.2 Base estimates & calculations
• 1.3 Forecast calculation
• 1.4 Data sources
  • 1.4.1 Primary
  • 1.4.2 Secondary
    • 1.4.2.1 Paid sources
    • 1.4.2.2 Public sources

Chapter 2 Executive Summary

• 2.1 Printed circuit board (PCB) assembly market 360° synopsis, 2018 - 2032
• 2.2 Business trends
• 2.3 Regional trends
• 2.4 Type of PCB trends
• 2.5 Component trends
• 2.6 Technology trends
• 2.7 Soldering process trends
• 2.8 Volume trends
• 2.9 Assembly trends
• 2.10 Vertical trends

Chapter 3 Printed Circuit Board (PCB) Assembly Industry Insights

• 3.1 Industry ecosystem analysis
• 3.2 Vendor matrix
• 3.3 Profit margin analysis
• 3.4 Technology & innovation landscape
• 3.5 Patent analysis
• 3.6 Key news and initiatives
  • 3.6.1 Partnership/Collaboration
  • 3.6.2 Merger/Acquisition
  • 3.6.3 Investment
  • 3.6.4 Product launch & innovation
• 3.7 Regulatory landscape
• 3.8 Impact forces
  • 3.8.1 Growth drivers
    • 3.8.1.1 Increased demand for electronic devices
    • 3.8.1.2 Rise of the Internet of Things (IoT)
    • 3.8.1.3 Increasing use of PCBs in vehicle electronics for safety, connectivity, and automation
    • 3.8.1.4 Rising demand for smartphones, tablets, wearables, and smart home devices
    • 3.8.1.5 Expansion of the aerospace and defense industry
  • 3.8.2 Industry pitfalls & challenges
    • 3.8.2.1 Increasing complexity of PCBs
    • 3.8.2.2 Quality Control and Testing
• 3.9 Growth potential analysis
• 3.10 Porter's analysis
• 3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2022

• 4.1 Introduction
• 4.2 Company market share, 2022
• 4.3 Competitive analysis of major market players, 2022
  • 4.3.1 Benchmark Electronics, Inc
  • 4.3.2 Eurocircuits
  • 4.3.3 PCBWay
  • 4.3.4 Seeed Technology Co., Ltd.
  • 4.3.5 Tempo
  • 4.3.6 Vexos
  • 4.3.7 WellPCB Technology Co., Ltd.
• 4.4 Competitive positioning matrix, 2022
• 4.5 Strategic outlook matrix, 2022

Chapter 5 Printed Circuit Board (PCB) Assembly Market Estimates & Forecast, By Type of PCB (USD Million)

• 5.1 Key trends, by type of PCB
• 5.2 Rigid PCB
• 5.3 Flexible PCB
• 5.4 Metal core PCB

Chapter 6 Printed Circuit Board (PCB) Assembly Market Estimates & Forecast, By Component (USD Million)

• 6.1 Key trends, by component
  • 6.1.1 Active
    • 6.1.1.1 Resistors
    • 6.1.1.2 Capacitors
    • 6.1.1.3 Inductors
  • 6.1.2 Passive
    • 6.1.2.1 Integrated Circuits (ICS)
    • 6.1.2.2 Microprocessors
    • 6.1.2.3 Microcontrollers

Chapter 7 Printed Circuit Board (PCB) Assembly Market Estimates & Forecast, By Technology (USD Million)

• 7.1 Key trends, by technology
• 7.2 Surface mount assembly (SMT)
• 7.3 Plated through-hole technology (PTH)
• 7.4 Electro-mechanical assembly
• 7.5 Mixed technology (SMT / Through hole)

Chapter 8 Printed Circuit Board (PCB) Assembly Market Estimates & Forecast, By Soldering Process (USD Million)

• 8.1 Key trends, by soldering process
• 8.2 Wave soldering
• 8.3 Manual soldering
• 8.4 Reflow soldering

Chapter 9 Printed Circuit Board (PCB) Assembly Market Estimates & Forecast, By Volume (USD Million)

• 9.1 Key trends, by type of PCB
• 9.2 Low (1-100 units)
• 9.3 Medium (100-10,000 Units)
• 9.4 High (More than 10,000 Units)

Chapter 10 Printed Circuit Board (PCB) Assembly Market Estimates & Forecast, By Assembly (USD Million)

• 10.1 Key trends, by assembly
• 10.2 In-House
• 10.3 Outsourced/ Contract

Chapter 11 Printed Circuit Board (PCB) Assembly Market Estimates & Forecast, By Vertical (USD Million)

• 11.1 Key trends, by vertical
• 11.2 Consumer electronics
• 11.3 Automotive
• 11.4 Healthcare
• 11.5 IT & telecom
• 11.6 Industrial
• 11.7 Others

Chapter 12 Printed Circuit Board (PCB) Assembly Market Estimates & Forecast, By Region (USD Million)

• 12.1 Key trends, by region
• 12.2 North America
  • 12.2.1 U.S.
  • 12.2.2 Canada
• 12.3 Europe
  • 12.3.1 UK
  • 12.3.2 Germany
  • 12.3.3 France
  • 12.3.4 Italy
  • 12.3.5 Russia
  • 12.3.6 Rest of Europe
• 12.4 Asia Pacific
  • 12.4.1 China
  • 12.4.2 India
  • 12.4.3 Japan
  • 12.4.4 South Korea
  • 12.4.5 Taiwan
  • 12.4.6 Thailand
  • 12.4.7 Rest of Asia Pacific
• 12.5 Latin America
  • 12.5.1 Brazil
  • 12.5.2 Mexico
  • 12.5.3 GCC
  • 12.5.4 Rest of Latin America
• 12.6 MEA
  • 12.6.1 Saudi Arabia
  • 12.6.2 UAE
  • 12.6.3 South Africa
  • 12.6.4 Rest of MEA

Chapter 13 Company Profiles

• 13.1 Alfa Electronics
• 13.2 ALLPCB.com
• 13.3 Altek Electronics, Inc.
• 13.4 Benchmark Electronics, Inc
• 13.5 Bittele Electronics Inc.
• 13.6 Clarydon Electronic Services Limited
• 13.7 Eurocircuits
• 13.8 Jayshree Instruments Pvt. Ltd
• 13.9 Miracle Electronics Devices Pvt Ltd
• 13.10 PCB Assembly Express, INC
• 13.11 PCB Power Market
• 13.12 PCB Unlimited.
• 13.13 PCBGOGO.
• 13.14 PCBWay
• 13.15 Podrain Electronics
• 13.16 RAYMING TECHNOLOGY
• 13.17 Seeed Technology Co.,Ltd.
• 13.18 Tempo
• 13.19 Vexos
• 13.20 Visual Communications Company, LLC
• 13.21 WellPCB Technology Co., Ltd.