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市場調查報告書
商品編碼
1535798

半導體記憶體市場,按類型(隨機存取記憶體(RAM、唯讀記憶體(ROM)))、按應用(航太與國防、汽車、消費性電子、工業、醫療、電信)和預測,2024 - 2032 年

Semiconductor Memory Market, By Type (Random Access Memory (RAM, Read Only Memory (ROM))), By Application (Aerospace & Defense, Automotive, Consumer Electronics, Industrial, Medical, Telecommunications) & Forecast, 2024 - 2032

出版日期: | 出版商: Global Market Insights Inc. | 英文 250 Pages | 商品交期: 2-3個工作天內

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簡介目錄

在該領域廣泛研究和開發的推動下,2024 年至 2032 年間,全球半導體記憶體市場的複合年成長率將超過 10%。記憶體技術的進步,例如高密度 DRAM、NAND 快閃記憶體和新興非揮發性記憶體解決方案的開發,正在推動市場向前發展。隨著工業和消費性電子產品越來越需要更快、更有效率和更高容量的記憶體解決方案,研發工作的重點是提高效能、降低功耗和提高儲存密度。例如,2024年3月,研究人員創造了一種新的製造技術,可以在低溫下生產高品質的氧化膜和精確的圖案,從而促進了非揮發性電阻式隨機存取記憶體的發展。

記憶體架構和材料的創新,以及記憶體與處理單元的整合,正在滿足從行動裝置到資料中心和人工智慧等應用的需求。此外,3D 堆疊和神經形態運算等更先進儲存技術的發展正在推動進一步成長。隨著研究不斷發展並解決新出現的挑戰,半導體記憶體市場必將擴大,支援廣泛的高科技應用和產業。

整個半導體記憶體產業根據類型、應用和地區進行分類。

根據類型,ROM 領域的半導體記憶體市場收入從 2024 年到 2032 年將實現令人稱讚的複合年成長率。隨著技術的進步,由於連接設備的激增以及對安全、持久性儲存解決方案的需求,對可靠和大容量 ROM 的需求不斷成長。 ROM 技術的創新(例如改進的快閃記憶體和 EEPROM)正在提高效能和儲存密度。對 ROM 的需求增加,加上不斷的進步,大大促進了半導體記憶體市場的擴張。

在應用方面,消費性電子領域將在2024年至2032年顯著成長。加劇。 DRAM 和 NAND 快閃記憶體等半導體記憶體對於提高裝置速度、容量和整體功能至關重要。這些記憶體類型的創新支援現代應用程式不斷成長的資料需求,包括遊戲、串流媒體和多任務處理。此外,物聯網設備和穿戴式技術的激增進一步刺激了市場需求。隨著消費性電子產品不斷發展,半導體記憶體市場正在不斷擴大以滿足這些動態需求。

2024年至2032年,歐洲半導體記憶體市場將呈現顯著的複合年成長率。設備等創新。這些領域對資料儲存和處理能力的需求不斷成長,推動了對先進半導體記憶體(包括 DRAM 和 NAND 快閃記憶體)的需求。此外,歐洲對研發的重視以及對半導體製造基礎設施的投資進一步推動了市場成長,使該地區成為全球半導體儲存領域的關鍵參與者。

目錄

第 1 章:方法與範圍

第 2 章:執行摘要

第 3 章:產業洞察

  • 產業生態系統分析
  • 供應商矩陣
  • 利潤率分析
  • 技術與創新格局
  • 專利分析
  • 重要新聞和舉措
  • 監管環境
  • 衝擊力
    • 成長動力
      • 資料中心和雲端運算的擴展
      • 遊戲和娛樂應用中不斷成長的記憶體需求
      • 5G 和物聯網設備的滲透率不斷上升
      • 先進汽車應用對半導體記憶體的需求不斷成長
      • 消費性電子產品的需求不斷增加
    • 產業陷阱與挑戰
      • 生產成本高
      • 環境問題
  • 成長潛力分析
  • 波特的分析
  • PESTEL分析

第 4 章:競爭格局

  • 介紹
  • 公司市佔率分析
  • 競爭定位矩陣
  • 戰略展望矩陣

第 5 章:市場估計與預測:按類型,2021-2032 年

  • 主要趨勢
  • 隨機存取記憶體 (RAM)
    • 靜態隨機存取記憶體(SRAM)
    • 同步動態隨機存取記憶體 (SDRAM)
    • 磁阻隨機存取記憶體 (MRAM)
    • 動態隨機存取記憶體 (DRAM)
  • 唯讀記憶體(ROM)
    • 電可擦除可程式唯讀記憶體 (EEROM)
    • 可擦除可程式唯讀記憶體 (EPROM)
    • 可程式唯讀記憶體 (PROM)
    • 快閃記憶體

第 6 章:市場估計與預測:按應用分類,2021-2032 年

  • 主要趨勢
  • 航太與國防
  • 汽車
  • 消費性電子產品
  • 工業的
  • 醫療的
  • 電信
  • 其他

第 7 章:市場估計與預測:按地區,2021-2032 年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 歐洲其他地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳新銀行
    • 亞太地區其他地區
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 拉丁美洲其他地區
  • MEA
    • 阿拉伯聯合大公國
    • 南非
    • 沙烏地阿拉伯
    • MEA 的其餘部分

第 8 章:公司簡介

  • Ever spin Technologies, Inc.
  • Fujitsu Limited
  • GlobalFoundries
  • Infineon Technologies AG
  • Integrated Silicon Solution Inc.
  • Intel Corporation
  • KIOXIA Corporation
  • Macronix International Co., Ltd
  • Microchip Technology, Inc.
  • Micron Technology, Inc.
  • Nanya Technology Corporation
  • NXP Semiconductors N.V.
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • SK HYNIX INC
  • Taiwan Semiconductor Manufacturing Company
  • Texas Instruments Incorporated
  • TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
  • Western Digital Corporation
  • Winbond Electronics Corporation
簡介目錄
Product Code: 2548

Global Semiconductor Memory Market will witness over 10% CAGR between 2024 and 2032, driven by extensive research and development in the field. Advances in memory technology, such as the development of high-density DRAM, NAND flash, and emerging non-volatile memory solutions, are propelling the market forward. As industries and consumer electronics increasingly demand faster, more efficient, and higher-capacity memory solutions, R&D efforts are focused on enhancing performance, reducing power consumption, and increasing storage density. For instance, in March 2024, researchers created a new manufacturing technology that allowed for the production of high-quality oxide films and precise patterning at low temperatures, leading to the development of non-volatile resistive random access memory.

Innovations in memory architecture and materials, alongside the integration of memory with processing units, are meeting the needs of applications ranging from mobile devices to data centers and artificial intelligence. Additionally, the push towards more advanced memory technologies, like 3D stacking and neuromorphic computing, is driving further growth. As research continues to evolve and address emerging challenges, the semiconductor memory market is set to expand, supporting a wide range of high-tech applications and industries.

The overall Semiconductor Memory Industry is classified based on the type, application, and region.

Based on type, the semiconductor memory market revenue from the ROM segment will register a commendable CAGR from 2024 to 2032. ROM is essential for storing firmware and system software in consumer electronics, automotive systems, and industrial equipment. As technology advances, the need for reliable and high-capacity ROM is growing, driven by the proliferation of connected devices and the requirement for secure, persistent storage solutions. Innovations in ROM technology, such as improved flash memory and EEPROM, are enhancing performance and storage density. This heightened demand for ROM, coupled with ongoing advancements, is significantly contributing to the expansion of the semiconductor memory market.

In terms of application, the consumer electronics segment will witness a noteworthy growth from 2024 to 2032. As devices such as smartphones, tablets, laptops, and smart home appliances become increasingly sophisticated, the need for high-performance memory solutions intensifies. Semiconductor memories like DRAM and NAND flash are crucial for enhancing device speed, capacity, and overall functionality. Innovations in these memory types support the growing data needs of modern applications, including gaming, streaming, and multitasking. Additionally, the proliferation of IoT devices and wearable technology further fuels market demand. As consumer electronics continue to evolve, the semiconductor memory market is expanding to meet these dynamic requirements.

Europe semiconductor memory market will exhibit a notable CAGR from 2024 to 2032. European industries, including automotive, telecommunications, and consumer electronics, are driving demand for high-performance memory solutions to support innovations such as autonomous vehicles, 5G networks, and smart devices. The increasing need for data storage and processing capabilities in these sectors is boosting the demand for advanced semiconductor memory, including DRAM and NAND flash. Additionally, Europe's focus on research and development, alongside investments in semiconductor manufacturing infrastructure, further fuels market growth, positioning the region as a key player in the global semiconductor memory landscape.

Table of Contents

Chapter 1 Methodology & Scope

  • 1.1 Market scope & definition
  • 1.2 Base estimates & calculations
  • 1.3 Forecast calculation
  • 1.4 Data sources
    • 1.4.1 Primary
    • 1.4.2 Secondary
      • 1.4.2.1 Paid sources
      • 1.4.2.2 Public sources

Chapter 2 Executive Summary

  • 2.1 Industry 360° synopsis, 2021 - 2032
  • 2.2 Business trends
    • 2.2.1 Total addressable market (TAM), 2024-2032

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
  • 3.2 Vendor matrix
  • 3.3 Profit margin analysis
  • 3.4 Technology & innovation landscape
  • 3.5 Patent analysis
  • 3.6 Key news and initiatives
  • 3.7 Regulatory landscape
  • 3.8 Impact forces
    • 3.8.1 Growth drivers
      • 3.8.1.1 Expansion of data centers and cloud computing
      • 3.8.1.2 Growing memory requirements in gaming & entertainment applications
      • 3.8.1.3 Rising penetration of 5G and IoT devices
      • 3.8.1.4 Growing demand for semiconductor memory in advanced automotive applications
      • 3.8.1.5 Increasing demand from consumer electronics products
    • 3.8.2 Industry pitfalls & challenges
      • 3.8.2.1 High production costs
      • 3.8.2.2 Environmental Concerns
  • 3.9 Growth potential analysis
  • 3.10 Porter's analysis
    • 3.10.1 Supplier power
    • 3.10.2 Buyer power
    • 3.10.3 Threat of new entrants
    • 3.10.4 Threat of substitutes
    • 3.10.5 Industry rivalry
  • 3.11 PESTEL analysis

Chapter 4 Competitive Landscape, 2023

  • 4.1 Introduction
  • 4.2 Company market share analysis
  • 4.3 Competitive positioning matrix
  • 4.4 Strategic outlook matrix

Chapter 5 Market Estimates & Forecast, By Type, 2021-2032 (USD Million and Units)

  • 5.1 Key trends
  • 5.2 Random access memory (RAM)
    • 5.2.1 Static random access memory (SRAM)
    • 5.2.2 Synchronous dynamic random access memory (SDRAM)
    • 5.2.3 Magneto-resistive random access memory (MRAM)
    • 5.2.4 Dynamic random access memory (DRAM)
  • 5.3 Read only memory (ROM)
    • 5.3.1 Electrically erasable programmable read only memory (EEROM)
    • 5.3.2 Erasable programmable read only memory (EPROM)
    • 5.3.3 Programmable read only memory (PROM)
    • 5.3.4 Flash memory

Chapter 6 Market Estimates & Forecast, By Application, 2021-2032 (USD Million and Units)

  • 6.1 Key trends
  • 6.2 Aerospace & defense
  • 6.3 Automotive
  • 6.4 Consumer electronics
  • 6.5 Industrial
  • 6.6 Medical
  • 6.7 Telecommunications
  • 6.8 Others

Chapter 7 Market Estimates & Forecast, By Region, 2021-2032 (USD Million and Units)

  • 7.1 Key trends
  • 7.2 North America
    • 7.2.1 U.S.
    • 7.2.2 Canada
  • 7.3 Europe
    • 7.3.1 UK
    • 7.3.2 Germany
    • 7.3.3 France
    • 7.3.4 Italy
    • 7.3.5 Spain
    • 7.3.6 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 China
    • 7.4.2 India
    • 7.4.3 Japan
    • 7.4.4 South Korea
    • 7.4.5 ANZ
    • 7.4.6 Rest of Asia Pacific
  • 7.5 Latin America
    • 7.5.1 Brazil
    • 7.5.2 Mexico
    • 7.5.3 Rest of Latin America
  • 7.6 MEA
    • 7.6.1 UAE
    • 7.6.2 South Africa
    • 7.6.3 Saudi Arabia
    • 7.6.4 Rest of MEA

Chapter 8 Company Profiles

  • 8.1 Ever spin Technologies, Inc.
  • 8.2 Fujitsu Limited
  • 8.3 GlobalFoundries
  • 8.4 Infineon Technologies AG
  • 8.5 Integrated Silicon Solution Inc.
  • 8.6 Intel Corporation
  • 8.7 KIOXIA Corporation
  • 8.8 Macronix International Co., Ltd
  • 8.9 Microchip Technology, Inc.
  • 8.10 Micron Technology, Inc.
  • 8.11 Nanya Technology Corporation
  • 8.12 NXP Semiconductors N.V.
  • 8.13 Renesas Electronics Corporation
  • 8.14 Samsung Electronics Co., Ltd.
  • 8.15 SK HYNIX INC
  • 8.16 Taiwan Semiconductor Manufacturing Company
  • 8.17 Texas Instruments Incorporated
  • 8.18 TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
  • 8.19 Western Digital Corporation
  • 8.20 Winbond Electronics Corporation