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1662593

2030 年記憶體積體電路市場預測：按產品類型、最終用戶和地區進行的全球分析

Memory Integrated Circuits Market Forecasts to 2030 - Global Analysis By Product Type, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據，全球記憶體積體電路市場規模預計在 2024 年將達到 956 億美元，到 2030 年將達到 1,451 億美元，預測期內的複合年成長率為 7.2%。

稱為記憶體積體電路（IC）的半導體元件用於儲存數位資料。儲存單元陣列通常由電晶體和電容器組成，用於表示二進位資料（0 和 1）。重要的類型是用於短期記憶的隨機存取記憶體 (RAM) 和用於長期記憶的唯讀記憶體 (ROM)。為了處理和儲存資料，記憶體積體電路（IC）是電腦、智慧型手機和其他電子設備中不可或缺的元件。

根據半導體產業協會（SIA）的數據，2022年全球半導體產業銷售額將達5,741億美元。

家用電子電器需求不斷成長

現代家用電子電器產品需要大容量、高速的記憶體解決方案來支援擴增實境、高解析度攝影機和無縫多工處理等高級功能。此外，物聯網設備和智慧家居技術的普及進一步推動了對高效能記憶體IC的需求。這一趨勢是由可支配收入的增加和技術進步所推動的，使得家用電子電器成為市場成長的主要動力。

製造成本高

製造記憶體IC需要複雜的製程、先進的材料和尖端的製造技術，因此高成本。 3D NAND 和 DRAM 擴展等技術創新需要在研發、專用設備和技術純熟勞工進行大量投資。這些因素增加了整體製造成本並限制了某些應用的可負擔性。此外，製造商之間的價格競爭也給利潤率帶來壓力，對先進記憶體IC的廣泛應用構成挑戰。

資料中心的成長

對雲端運算、巨量資料分析和人工智慧驅動應用的日益依賴需要具有大儲存容量和快​​速處理速度的高效能記憶體解決方案。 DRAM 和NAND快閃記憶體等記憶體 IC 對於處理超大規模資料中心的海量資料負載至關重要。隨著企業不斷將業務轉移到雲端，這一趨勢預計將繼續推動對先進記憶體技術的需求。

環境問題

由於高能耗、溫室氣體排放和有害物質的使用，製造記憶體積體電路對環境有很大影響。製造過程使用大量的水並產生有毒廢棄物，引發了人們永續性的擔憂。此外，電子廢棄物的不當處理也會造成污染。此類環境問題可能需要更嚴格的法規和永續的做法，從而增加生產成本並使製造商的合規性變得更加複雜。

COVID-19 的影響

由於供應鏈中斷和製造能力下降，COVID-19 疫情擾亂了記憶體 IC 市場。封鎖延誤了生產計劃並影響了原料的供應。然而，疫情期間遠距辦公的增加和對數位基礎設施的依賴提振了對家用電子電器和資料中心的需求，部分抵消了損失。疫情後的復甦努力加速了對半導體製造業的投資，確保了市場的長期成長。

預計非揮發性記憶體部分在預測期內將成為最大的部分。

非揮發性記憶體預計將在預測期內佔據最大的市場佔有率，因為它能夠在沒有電源的情況下保存資料，並且它在智慧型手機、固態硬碟和物聯網設備等應用中發揮著重要作用。 NAND快閃記憶體等技術因其耐用性和可擴展性而被廣泛應用於家用電子電器和企業儲存解決方案。該領域的成長得益於 3D NAND 技術的進步，該技術在降低成本的同時提高了儲存密度。它在各個行業的多功能性使其能夠繼續保持市場領先地位。

預計預測期內，IT 和通訊產業將實現最高的複合年成長率。

由於 5G 網路和雲端運算技術的日益普及，預計 IT 和通訊領域將在預測期內實現最高成長率。記憶體IC對於支援基地台和路由器等通訊基礎架構中的高速資料傳輸和儲存至關重要。此外，電訊人工智慧驅動應用的激增正在加速對先進記憶體解決方案的需求。

比最大的地區

由於亞太地區是全球半導體製造和家用電子電器生產的中心，預計將在預測期內佔據最大的市場佔有率。受國內智慧型手機、物聯網設備和汽車電子產品強勁需求的推動，中國、韓國和日本等國家在先進記憶體積體電路的生產方面處於領先地位。此外，政府支持技術創新的措施也進一步支持了該地區的發展。

複合年成長率最高的地區

在預測期內，由於人工智慧技術的進步和雲端基礎設施投資的增加，預計北美將呈現最高的複合年成長率。該地區對研發的高度重視正在推動高效能記憶體解決方案的創新。此外，自動駕駛汽車和智慧型裝置的日益普及也促進了該市場的強勁成長。

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訂閱此報告的客戶可享有以下免費自訂選項之一：

  • 公司簡介
    • 對其他市場參與企業（最多 3 家公司）進行全面分析
    • 主要企業的 SWOT 分析（最多 3 家公司）
  • 地理細分
    • 根據客戶興趣對主要國家進行市場估計、預測和複合年成長率（註：基於可行性檢查）
  • 競爭性基準化分析
    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章執行摘要

第 2 章 前言

  • 概述
  • 相關利益者
  • 研究範圍
  • 調查方法
    • 資料探勘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 研究資訊來源
    • 主要研究資訊來源
    • 二手研究資料資訊來源
    • 先決條件

第3章 市場走勢分析

  • 介紹
  • 驅動程式
  • 限制因素
  • 機會
  • 威脅
  • 產品分析
  • 最終用戶分析
  • 新興市場
  • COVID-19 的影響

第 4 章 波特五力分析

  • 供應商的議價能力
  • 買家的議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭對手之間的競爭

5. 全球記憶體積體電路市場（依產品類型）

  • 介紹
  • 揮發性記憶體
    • 動態隨機存取記憶體 (DRAM)
    • 靜態隨機存取記憶體（SRAM）
  • 非揮發性記憶體
    • 快閃記憶體
      • NAND快閃記憶體
      • 單層單元 (SLC)
      • 多層單元 (MLC)
      • 三層單元 (TLC)
      • 四層電池 (QLC)
      • NOR快閃記憶體
    • 唯讀記憶體（ROM）
      • 遮罩唯讀記憶體
      • 可程式 ROM (PROM)
      • 可擦除可編程 ROM (EPROM)
      • 電可擦除可程式設計體 (EEPROM)
    • 下一代記憶體
      • 磁阻電阻式記憶體(MRAM)
      • 鐵電RAM (FRAM)
      • 電阻式 RAM (ReRAM)
      • 相變記憶體（PCRAM）

6. 全球記憶體積體電路市場（依最終用戶分類）

  • 介紹
  • 家用電子電器
    • 智慧型手機和平板電腦
    • 電腦和筆記型電腦
    • 遊戲機
    • 穿戴式裝置
  • 資訊科技和通訊
    • 資料中心
    • 伺服器
    • 網路基礎設施
    • 儲存系統
  • 車
    • 高級駕駛輔助系統 (ADAS)
    • 資訊娛樂系統
    • 車輛控制單元
  • 產業
    • 工業自動化
    • 智慧製造
    • 過程控制系統
  • 航太和國防
    • 航空電子設備
    • 國防電子
    • 衛星系統
  • 醫療
    • 醫學影像設備
    • 診斷設備
    • 病患監測系統

7. 世界記憶體積體電路市場區域分佈

  • 介紹
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 歐洲其他地區
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲地區

第8章 主要進展

  • 協議、夥伴關係、合作和合資企業
  • 收購與合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第9章 公司概況

  • Advanced Micro Devices（AMD）
  • Analog Devices, Inc.
  • Broadcom Inc.
  • Cypress Semiconductor Corporation
  • Fujitsu Limited
  • Infineon Technologies AG
  • Intel Corporation
  • Integrated Silicon Solution Inc.
  • Macronix International Co., Ltd.
  • Maxim Integrated Products, Inc.
  • Micron Technology, Inc.
  • NVIDIA Corporation
  • NXP Semiconductors NV
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • SK Hynix Inc.
  • STMicroelectronics NV
  • Taiwan Semiconductor Manufacturing Company（TSMC）
Product Code: SMRC28454

According to Stratistics MRC, the Global Memory Integrated Circuits Market is accounted for $95.6 billion in 2024 and is expected to reach $145.1 billion by 2030 growing at a CAGR of 7.2% during the forecast period. Semiconductor devices called memory integrated circuits (ICs) are made to store digital data. They represent binary data (0s and 1s) using arrays of memory cells, usually transistors or capacitors. Random Access Memory (RAM) for short-term storage and Read-Only Memory (ROM) for long-term storage are important types. In order to process and store data, memory integrated circuits (ICs) are crucial parts of computers, smartphones, and other electronic devices.

According to the Semiconductor Industry Association (SIA), global semiconductor industry sales reached $574.1 billion in 2022.

Market Dynamics:

Driver:

Increasing demand for consumer electronics

Modern consumer electronics require high-capacity and high-speed memory solutions to support advanced features like augmented reality, high-resolution cameras, and seamless multitasking. Additionally, the proliferation of IoT devices and smart home technologies further boosts demand for efficient memory ICs. This trend is fueled by rising disposable incomes and technological advancements, making consumer electronics a key driver of market growth.

Restraint:

High manufacturing costs

The production of memory ICs involves complex processes, advanced materials, and cutting-edge manufacturing technologies, leading to high costs. Innovations like 3D NAND and DRAM scaling require significant investments in research and development, specialized equipment, and skilled labor. These factors increase the overall cost of production, limiting affordability for certain applications. Moreover, price competition among manufacturers pressures profit margins, posing a challenge to the widespread adoption of advanced memory ICs.

Opportunity:

Growth in data centers

Increasing reliance on cloud computing, big data analytics, and AI-driven applications necessitates high-performance memory solutions with large storage capacities and fast processing speeds. Memory ICs like DRAM and NAND flash are critical for handling the massive data loads in hyper scale data centers. As businesses continue to migrate operations to the cloud, this trend is expected to drive sustained demand for advanced memory technologies.

Threat:

Environmental concerns

The manufacturing of memory ICs has a substantial environmental impact due to high energy consumption, greenhouse gas emissions, and the use of hazardous materials. The production process involves significant water usage and generates toxic waste, raising concerns about sustainability. Additionally, improper disposal of electronic waste contributes to pollution. These environmental challenges necessitate stricter regulations and sustainable practices, which may increase production costs and complicate compliance for manufacturers.

Covid-19 Impact:

The COVID-19 pandemic disrupted the memory IC market due to supply chain interruptions and reduced manufacturing capacity. Lockdowns delayed production schedules and impacted raw material availability. However, increased reliance on remote work and digital infrastructure during the pandemic drove demand for consumer electronics and data centers, partially offsetting losses. Post-pandemic recovery efforts have accelerated investments in semiconductor manufacturing, ensuring long-term market growth.

The non-volatile memory segment is expected to be the largest during the forecast period

The non-volatile memory segment is expected to account for the largest market share during the forecast period due to its ability to retain data without power, making it essential for applications like smartphones, SSDs, and IoT devices. Technologies such as NAND flash are widely used in consumer electronics and enterprise storage solutions due to their durability and scalability. The segment's growth is driven by advancements in 3D NAND technology that enhance storage density while reducing costs. Its versatility across various industries ensures its continued leadership in the market.

The IT & telecommunication segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the IT & telecommunication segment is predicted to witness the highest growth rate due to increasing adoption of 5G networks and cloud computing technologies. Memory ICs are critical for supporting high-speed data transmission and storage in telecommunications infrastructure like base stations and routers. Additionally, the proliferation of AI-driven applications in telecom accelerates demand for advanced memory solutions.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share due to its position as a global hub for semiconductor manufacturing and consumer electronics production. Countries like China, South Korea, and Japan lead in producing advanced memory ICs driven by strong domestic demand for smartphones, IoT devices, and automotive electronics. Additionally, government initiatives supporting technological innovation further bolster regional growth.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR owing to advancements in AI technologies and increased investments in cloud infrastructure. The region's strong focus on research and development drives innovation in high-performance memory solutions. Additionally, rising adoption of autonomous vehicles and smart devices contributes to robust growth in this market.

Key players in the market

Some of the key players in Memory Integrated Circuits Market include Advanced Micro Devices (AMD), Analog Devices, Inc., Broadcom Inc., Cypress Semiconductor Corporation, Fujitsu Limited, Infineon Technologies AG, Intel Corporation, Integrated Silicon Solution Inc., Macronix International Co., Ltd., Maxim Integrated Products, Inc., Micron Technology, Inc., NVIDIA Corporation, NXP Semiconductors N.V., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., SK Hynix Inc., STMicroelectronics N.V. and Taiwan Semiconductor Manufacturing Company (TSMC).

Key Developments:

In January 2025, Micron Technology, Inc. announced expansions across its crucial consumer memory and storage portfolio, including unveiling the high-speed Crucial P510 SSD, and expanding density and form factor options across its existing DRAM portfolio to enable broader choice and flexibility for consumers. The P510 features read and write speeds of up to 11,000/9,550 megabytes per second (MB/s), bringing blazing fast Gen5 performance to the masses.

In December 2024, Broadcom Inc. announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP(TM)) platform technology, enabling consumer AI customers to develop next-generation custom accelerators (XPUs). The 3.5D XDSiP integrates more than 6000 mm2 of silicon and up to 12 high bandwidth memory (HBM) stacks in one packaged device to enable high-efficiency, low-power computing for AI at scale. Broadcom has achieved a significant milestone by developing and launching the industry's first Face-to-Face (F2F) 3.5D XPU.

In October 2024, AMD announced its third generation commercial AI mobile processors, designed specifically to transform business productivity with Copilot+ features including live captioning and language translation in conference calls and advanced AI image generators. The new Ryzen AI PRO 300 Series processors deliver industry-leading AI compute, with up to three times the AI performance than the previous generation, and offer uncompromising performance for everyday workloads.

Product Types Covered:

  • Volatile Memory
  • Non-Volatile Memory

End Users Covered:

  • Consumer Electronics
  • IT & Telecommunication
  • Automotive
  • Industrial
  • Aerospace & Defense
  • Healthcare

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Memory Integrated Circuits Market, By Product Type

  • 5.1 Introduction
  • 5.2 Volatile Memory
    • 5.2.1 Dynamic Random-Access Memory (DRAM)
    • 5.2.2 Static Random-Access Memory (SRAM)
  • 5.3 Non-Volatile Memory
    • 5.3.1 Flash Memory
      • 5.3.1.1 NAND Flash
      • 5.3.1.1.1 Single-Level Cell (SLC)
      • 5.3.1.1.2 Multi-Level Cell (MLC)
      • 5.3.1.1.3 Triple-Level Cell (TLC)
      • 5.3.1.1.4 Quad-Level Cell (QLC)
      • 5.3.1.2 NOR Flash
    • 5.3.2 Read-Only Memory (ROM)
      • 5.3.2.1 Mask ROM
      • 5.3.2.2 Programmable ROM (PROM)
      • 5.3.2.3 Erasable Programmable ROM (EPROM)
      • 5.3.2.4 Electrically Erasable Programmable ROM (EEPROM)
    • 5.3.3 Next-Generation Memory
      • 5.3.3.1 Magnetoresistive RAM (MRAM)
      • 5.3.3.2 Ferroelectric RAM (FRAM)
      • 5.3.3.3 Resistive RAM (ReRAM)
      • 5.3.3.4 Phase-Change Memory (PCRAM)

6 Global Memory Integrated Circuits Market, By End User

  • 6.1 Introduction
  • 6.2 Consumer Electronics
    • 6.2.1 Smartphones & Tablets
    • 6.2.2 Computers & Laptops
    • 6.2.3 Gaming Consoles
    • 6.2.4 Wearable Devices
  • 6.3 IT & Telecommunication
    • 6.3.1 Data Centers
    • 6.3.2 Servers
    • 6.3.3 Network Infrastructure
    • 6.3.4 Storage Systems
  • 6.4 Automotive
    • 6.4.1 Advanced Driver Assistance Systems (ADAS)
    • 6.4.2 Infotainment Systems
    • 6.4.3 Vehicle Control Units
  • 6.5 Industrial
    • 6.5.1 Industrial Automation
    • 6.5.2 Smart Manufacturing
    • 6.5.3 Process Control Systems
  • 6.6 Aerospace & Defense
    • 6.6.1 Avionics
    • 6.6.2 Defense Electronics
    • 6.6.3 Satellite Systems
  • 6.7 Healthcare
    • 6.7.1 Medical Imaging Equipment
    • 6.7.2 Diagnostic Devices
    • 6.7.3 Patient Monitoring Systems

7 Global Memory Integrated Circuits Market, By Geography

  • 7.1 Introduction
  • 7.2 North America
    • 7.2.1 US
    • 7.2.2 Canada
    • 7.2.3 Mexico
  • 7.3 Europe
    • 7.3.1 Germany
    • 7.3.2 UK
    • 7.3.3 Italy
    • 7.3.4 France
    • 7.3.5 Spain
    • 7.3.6 Rest of Europe
  • 7.4 Asia Pacific
    • 7.4.1 Japan
    • 7.4.2 China
    • 7.4.3 India
    • 7.4.4 Australia
    • 7.4.5 New Zealand
    • 7.4.6 South Korea
    • 7.4.7 Rest of Asia Pacific
  • 7.5 South America
    • 7.5.1 Argentina
    • 7.5.2 Brazil
    • 7.5.3 Chile
    • 7.5.4 Rest of South America
  • 7.6 Middle East & Africa
    • 7.6.1 Saudi Arabia
    • 7.6.2 UAE
    • 7.6.3 Qatar
    • 7.6.4 South Africa
    • 7.6.5 Rest of Middle East & Africa

8 Key Developments

  • 8.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 8.2 Acquisitions & Mergers
  • 8.3 New Product Launch
  • 8.4 Expansions
  • 8.5 Other Key Strategies

9 Company Profiling

  • 9.1 Advanced Micro Devices (AMD)
  • 9.2 Analog Devices, Inc.
  • 9.3 Broadcom Inc.
  • 9.4 Cypress Semiconductor Corporation
  • 9.5 Fujitsu Limited
  • 9.6 Infineon Technologies AG
  • 9.7 Intel Corporation
  • 9.8 Integrated Silicon Solution Inc.
  • 9.9 Macronix International Co., Ltd.
  • 9.10 Maxim Integrated Products, Inc.
  • 9.11 Micron Technology, Inc.
  • 9.12 NVIDIA Corporation
  • 9.13 NXP Semiconductors N.V.
  • 9.14 Renesas Electronics Corporation
  • 9.15 Samsung Electronics Co., Ltd.
  • 9.16 SK Hynix Inc.
  • 9.17 STMicroelectronics N.V.
  • 9.18 Taiwan Semiconductor Manufacturing Company (TSMC)

List of Tables

  • Table 1 Global Memory Integrated Circuits Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Memory Integrated Circuits Market Outlook, By Product Type (2022-2030) ($MN)
  • Table 3 Global Memory Integrated Circuits Market Outlook, By Volatile Memory (2022-2030) ($MN)
  • Table 4 Global Memory Integrated Circuits Market Outlook, By Dynamic Random-Access Memory (DRAM) (2022-2030) ($MN)
  • Table 5 Global Memory Integrated Circuits Market Outlook, By Static Random-Access Memory (SRAM) (2022-2030) ($MN)
  • Table 6 Global Memory Integrated Circuits Market Outlook, By Non-Volatile Memory (2022-2030) ($MN)
  • Table 7 Global Memory Integrated Circuits Market Outlook, By Flash Memory (2022-2030) ($MN)
  • Table 8 Global Memory Integrated Circuits Market Outlook, By Read-Only Memory (ROM) (2022-2030) ($MN)
  • Table 9 Global Memory Integrated Circuits Market Outlook, By Next-Generation Memory (2022-2030) ($MN)
  • Table 10 Global Memory Integrated Circuits Market Outlook, By End User (2022-2030) ($MN)
  • Table 11 Global Memory Integrated Circuits Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 12 Global Memory Integrated Circuits Market Outlook, By Smartphones & Tablets (2022-2030) ($MN)
  • Table 13 Global Memory Integrated Circuits Market Outlook, By Data Centers (2022-2030) ($MN)
  • Table 14 Global Memory Integrated Circuits Market Outlook, By Servers (2022-2030) ($MN)
  • Table 15 Global Memory Integrated Circuits Market Outlook, By Network Infrastructure (2022-2030) ($MN)
  • Table 16 Global Memory Integrated Circuits Market Outlook, By Storage Systems (2022-2030) ($MN)
  • Table 17 Global Memory Integrated Circuits Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 18 Global Memory Integrated Circuits Market Outlook, By Advanced Driver Assistance Systems (ADAS) (2022-2030) ($MN)
  • Table 19 Global Memory Integrated Circuits Market Outlook, By Infotainment Systems (2022-2030) ($MN)
  • Table 20 Global Memory Integrated Circuits Market Outlook, By Vehicle Control Units (2022-2030) ($MN)
  • Table 21 Global Memory Integrated Circuits Market Outlook, By Industrial (2022-2030) ($MN)
  • Table 22 Global Memory Integrated Circuits Market Outlook, By Industrial Automation (2022-2030) ($MN)
  • Table 23 Global Memory Integrated Circuits Market Outlook, By Smart Manufacturing (2022-2030) ($MN)
  • Table 24 Global Memory Integrated Circuits Market Outlook, By Process Control Systems (2022-2030) ($MN)
  • Table 25 Global Memory Integrated Circuits Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
  • Table 26 Global Memory Integrated Circuits Market Outlook, By Avionics (2022-2030) ($MN)
  • Table 27 Global Memory Integrated Circuits Market Outlook, By Defense Electronics (2022-2030) ($MN)
  • Table 28 Global Memory Integrated Circuits Market Outlook, By Satellite Systems (2022-2030) ($MN)
  • Table 29 Global Memory Integrated Circuits Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 30 Global Memory Integrated Circuits Market Outlook, By Medical Imaging Equipment (2022-2030) ($MN)
  • Table 31 Global Memory Integrated Circuits Market Outlook, By Diagnostic Devices (2022-2030) ($MN)
  • Table 32 Global Memory Integrated Circuits Market Outlook, By Patient Monitoring Systems (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.