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嵌入式芯片封裝技術全球市場規模、份額和行業趨勢分析報告：按行業、平台和地區劃分的展望和預測，2022-2028 年
市場調查報告書
商品編碼
1219858

嵌入式芯片封裝技術全球市場規模、份額和行業趨勢分析報告：按行業、平台和地區劃分的展望和預測，2022-2028 年

Global Embedded Die Packaging Technology Market Size, Share & Industry Trends Analysis Report By Vertical, By Platform, By Regional Outlook and Forecast, 2022 - 2028
出版日期: | 出版商: KBV Research | 英文 198 Pages | 訂單完成後即時交付

價格

到 2028 年，嵌入式芯片封裝技術的全球市場規模預計將達到 2.141 億美元，預測期內復合年增長率為 18.6%。

但是，嵌入式芯片封裝是一種使用多步驟製造工藝將組件嵌入基板的概念。 大量裸片，例如 MEMS 和無源器件，可以並排集成在有機層壓基板的底部。 鍍銅通孔用於連接組件。 基板是通常放置嵌入式封裝的地方，可讓您釋放系統中的空間。

嵌入式芯片封裝技術使用多步驟製造工藝將組件嵌入到基板中。 一個管芯、多個管芯或無源器件可以並排放置在有機基板的中間。 鍍銅過孔放置在電路板上，用於連接組件以節省系統空間。 預計這種存儲節省將推動對嵌入式芯片封裝技術的需求。

對嵌入式芯片封裝技術的需求源於技術的改進和發展。 嵌入式技術符合許多標準，包括芯片尺寸、電氣性能和連接性。 小型化還允許更靈活的設計和更關鍵的電路板佈局，因為它們可能會堆疊成多層並嵌入嵌入式組件。

COVID-19 影響分析

COVID-19 大流行對嵌入式芯片封裝技術市場產生了各種影響。 政府實施或延長的封鎖導致生產和工業設施關閉，造成危機和勞動力短缺。 因此，考慮到嵌入式裸片封裝技術生態系統中不同公司的賬戶，以及來自價值鏈不同環節（如 OEM、供應商、集成商、最終用戶和分銷商）的眾多行業專家的意見，市場我們判斷我們從2019年到2020年經歷了下降。

市場增長因素

對小型電子設備的需求不斷擴大

在全球範圍內，電子產品的小型化正在迅速蔓延。 電子產品、便攜式設備和更輕便的電子產品越來越受到消費者的歡迎。 結果，越來越多的人使用更少的電子元件。 小型電子元件用於電子設備的開發，以增加可用空間並改進最終產品的設計。 客戶需要小巧、功能強大的便攜式電子設備。 公司創建微型電路以將大部分組件安裝在單個芯片上，以改善用戶體驗。 客戶將受益於增強的功能，因為大多數組件（包括傳感器和處理器）都集成到單個芯片上。

消費電子消費和 5g 網絡使用量增加

消費電子產品是世界上使用最廣泛的商品之一。 用於非商業目的的電子產品稱為消費電子產品。 隨著家庭部門接受更廣泛的消費電子產品，消費電子行業經歷了巨大的增長。 將各種數字技術融入消費電子產品對製造商來說是一項重大投資，他們也越來越注重為客戶提供高質量的體驗。 此外，隨著主要製造商增加研發和創新支出，不斷推出具有尖端功能的新產品。

市場製約因素

成本高

嵌入式芯片封裝技術價格昂貴，可能成為市場擴張的障礙。 裸片封裝需要復雜的程序和昂貴的設備，導致成本高。 晶圓封裝成本高昂，儘管矽是地球上第二豐富的材料。 矽被提煉成半導體晶圓和芯片，但過程複雜且成本高。 由於封裝技術成本上升，行業運營商和競爭對手減少，市場容易受到濫用。

平台展望

嵌入式芯片封裝技術市場按平台分為剛性板嵌入式芯片、柔性板嵌入式芯片和 IC 封裝基板嵌入式芯片。 2021 年，柔性板嵌入式芯片部分的收入份額很大。 印刷電路板的產品價值隨著技術的進步而不斷上升，未來用於各種可穿戴設備和IoT（物聯網）設備的柔性印刷電路板的銷售額有望增加。 此外，在各種小型電子設備中安裝柔性電路正在取得進展。

行業展望

嵌入式芯片封裝技術市場按行業劃分為消費電子、汽車、醫療保健、IT 和電信等。 2021年，消費電子領域貢獻了最大的收入份額。 家庭安全系統、家用電器、手錶和打印機等消費電子產品開始包含嵌入式系統。 冰箱、微波爐和洗衣機等家用電器使用簡單的嵌入式系統來提供功能、收集用戶反饋並根據用戶喜好調整項目。

區域展望

嵌入式芯片封裝技術市場按地區劃分為北美、歐洲、亞太地區和 LAMEA。 在預測期內，北美地區正以可喜的速度增長。 這是由於高度發達的電信行業、越來越多地使用物聯網以及汽車行業的強勁發展。 美國也是世界上一些最大的汽車製造商的所在地，他們投資於電動汽車市場。 集成技術通過自適應巡航控制等駕駛員輔助功能提高了駕駛舒適度。

內容

第1章市場範圍與研究方法

  • 市場定義
  • 目的
  • 市場規模
  • 細分
    • 全球嵌入式芯片封裝技術市場，按行業分類
    • 全球芯片封裝技術市場：按平台分類
    • 全球嵌入式芯片封裝技術市場，按地區
  • 調查方法

第 2 章市場概述

  • 簡介
    • 概覽
      • 市場構成和情景
  • 影響市場的主要因素
    • 市場驅動因素
    • 市場製約因素

第 3 章嵌入式芯片封裝技術市場的發展戰略

第 4 章全球嵌入式芯片封裝技術市場：按行業分類

  • 全球消費電子市場：按地區
  • 按地區劃分的 IT 和電信全球市場
  • 汽車行業區域市場
  • 全球醫療保健市場：按地區
  • 其他行業的世界市場：按地區

第 5 章全球嵌入式芯片封裝技術市場：按平台分類

  • IC 封裝基板中嵌入式芯片的全球市場：按地區
  • 安裝在剛性基板上的嵌入式芯片的全球市場：按地區
  • 安裝在柔性基板上的嵌入式芯片的全球市場：按地區

第 6 章全球芯片封裝技術市場：按地區

  • 北美
    • 北美國家/地區的嵌入式芯片封裝技術市場
      • 美國
      • 加拿大
      • 墨西哥
      • 其他北美地區
  • 歐洲
    • 按國家/地區劃分的歐洲嵌入式芯片封裝技術市場
      • 德國
      • 英國
      • 法國
      • 俄羅斯
      • 西班牙
      • 意大利
      • 其他歐洲
  • 亞太地區
    • 按國家/地區劃分的亞太地區嵌入式芯片封裝技術市場
      • 中國
      • 日本
      • 印度
      • 韓國
      • 新加坡
      • 馬來西亞
      • 其他亞太地區
  • 拉美
    • LAMEA 嵌入式芯片封裝技術市場：按國家/地區分類
      • 巴西
      • 阿根廷
      • 阿聯酋
      • 沙特阿拉伯
      • 南非
      • 尼日利亞
      • 其他拉美地區

第7章公司簡介

  • General Electric（GE）Co
  • Infineon Technologies AG
  • TDK Corporation
  • Fujikura Ltd.
  • Amkor Technology, Inc.
  • Taiwan Semiconductor Manufacturing Company Limited
  • ASE Group（ASE Technology Holding）
  • Microsemi Corporation（Microchip Technology）
  • Schweizer Electronic AG（Wus Printed Circuit）
  • AT&S Group

The Global Embedded Die Packaging Technology Market size is expected to reach $214.1 Million by 2028, rising at a market growth of 18.6% CAGR during the forecast period.

System-in-package (SiP) solutions using embedded die packaging technology enable a size reduction of around 70% and are natively 3D-compliant. Miniaturization, enhanced electrical and thermal performance, heterogeneous integration, the potential for cost reduction, and effective OEM logistics are some of this technology's benefits.

Additionally, it provides quick turnaround for customized designs, outstanding robustness, and improved package dependability. Packaging with embedded dies is distinct from other kinds of packaging. Typically, the devices in many IC packages are positioned on top of a substrate. The substrate acts as a link between the devices and aboard in a system. There are several definitions for the phrase "embedded packaging."

However, in embedded die packaging, the concept uses a multi-step manufacturing process to embed components into the substrate. The base of an organic laminate substrate may accommodate the side-by-side integration of a die; many dies, MEMS, or passives. Copper-plated vias are used to link the parts. The board is where the embedded package is located overall, freeing up space in the system.

Embedded die packaging technology uses a multi-step manufacturing process to embed the components into the substrate. In the center of an organic substrate, a die, many dies, or a passive may be placed in a side-by-side configuration. Copper-plated vias, which are located on the board and save up space in the system, are used to link the components. The reduced storage benefit is projected to increase demand for embedded die packaging technology.

The need for embedded die packaging technology results from technological improvements and developments. Embedding technologies meet many criteria, including chip size, electrical performance, and connectivity. In addition, miniaturization allows for more flexible design and more significant board layouts because embedded components may be stacked in several layers with embedded components.

COVID-19 Impact Analysis

The COVID-19 pandemic outbreak has mixed effects on the Embedded die packaging technology market. Lockdowns have been imposed and extended by the governments of various countries, which has caused production and industrial facilities to shut, creating a crisis and a labor shortage. Therefore, it is determined that the market experienced a decline between 2019 and 2020 after taking into account the opinions of numerous industry experts from different segments of the value chain, including OEMs, suppliers, aggregators, end users, and distributors, in addition to the financial results of different businesses in the embedded die packaging technology ecosystem.

Market Growth Factors

Increasing demand for smaller electronic devices

Globally, the downsizing of electrical items is gaining ground quickly. Electronic, portable, lightweight, and lightweight electronic products are becoming more popular with customers. As a result, more people are using fewer electric components. Small form factor electrical components are being used in developing electronic devices to increase available space and enhance the final product design. Customers want portable electronic gadgets that are tiny, modest in size, and packed with functionality. Companies are creating tiny circuits to fit most components onto a single die in order to improve user experience. Customers benefit from enhanced functionality when most components, including sensors and processors, are integrated into a single chip.

A rise in consumer electronics consumption and the use of 5g networks

Consumer electronics are one of the most widely used goods worldwide. Electronics for non-commercial usage is referred to as consumer electronics. The consumer electronics industry has grown tremendously due to the household sector's increasing adoption of a more extensive range of consumer electronics. Integrating different digital technologies into consumer electronics devices is receiving significant investment from manufacturers, who also place more and more emphasis on giving customers high-quality experiences. In addition, new products with cutting-edge features are being introduced due to the leading market companies' increasing expenditures in R&D and innovation.

Market Restraining Factors

Associated high costs

The embedded die packaging technique is expensive so it might be a barrier to market expansion. Die packing involves intricate procedures, expensive equipment, and hefty costs. Despite silicon being the second most common material on Earth, wafer packaging is costly. Silicon must be purified before being used to create semiconductor wafers and chips, a complicated procedure that raises costs. Because there are fewer businesses in this industry and fewer rivals due to the growing cost of packaging technologies, this market is vulnerable to abuse.

Platform Outlook

Based on platform, the Embedded Die Packaging Technology Market is divided into Embedded Die in Rigid Board, Embedded Die in Flexible Board, and Embedded Die in IC Package Substrate. The Embedded Die in Flexible Board segment experienced a significant revenue share in 2021. The printed circuit board's product value is rising in line with technological advancements, and sales of flexible boards for use in different wearable and Internet of Things (IoT) devices are anticipated to rise in the future. In addition, flexible circuits are increasingly being embedded for use in several types of small electronic devices.

Vertical Outlook

Based on vertical, the Embedded Die Packaging Technology Market is classified into Consumer Electronics, Automotive, Healthcare, IT & Telecommunications, and Others. The consumer electronics segment contributed the largest revenue share in 2021. Consumer electronics products like home security systems, home appliances, watches, printers, and more are beginning to include embedded systems. Simple embedded systems are used in household appliances like refrigerators, microwaves, and washing machines to give functions, gather user feedback, and regulate items following user preferences.

Regional Outlook

Based on region, the Embedded Die Packaging Technology Market is categorized into North America, Europe, Asia Pacific, and LAMEA. The North American region is growing at the promising rate during the forecast period. This is due to the highly developed telecommunications sector, increasing IoT use, and strong development in the automobile sector. In addition, the United States is home to some of the largest automakers in the world that are making investments in the electric vehicle market. With driver assistance features like adaptive cruise control, integrated technologies improve driving comfort.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include General Electric (GE) Co., Infineon Technologies AG, TDK Corporation, Fujikura Ltd., Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited, ASE Group (ASE Technology Holding), Microsemi Corporation (Microchip Technology), Schweizer Electronic AG (Wus Printed Circuit), and AT&S Group.

Strategies Deployed in Embedded Die Packaging Technology Market

Sep-2022: Taiwan Semiconductor Manufacturing Company partnered with Samsung Electronics Co, a South Korean multinational electronics corporation headquartered in Yeongtong-gu, Suwon, South Korea, and Intel Corp, an American multinational corporation and technology company headquartered in Santa Clara, California. Through this partnership, the trio is committed to establishing a single standard for next-gen chip-packaging technologies which is a Chiplet. Moreover, a chipset is a small unit that forms processors and is similar to a Lego block.

Jun-2022: Advanced Semiconductor Engineering, Inc. (ASE Group) unveiled VIPack. It is an evolved packaging platform created to facilitate vertically integrated package solutions. Additionally, pack describes ASE's next generation of 3D heterogeneous integration architecture that expands design rules and reaches performance and ultra-high density.

May-2022: TDK Corporation launched InvenSense IAM-20380HT. It is a high-temperature automotive monolithic 3-axis MotionTracking sensor platform solution for non-safety automotive applications, which contains the DK-20380HT Developer Kit and the IAM-20380HT 3-axis MEMS gyroscope. Additionally, IAM-20380HT is a stand-alone gyroscope in a thin 3 x 3 x 0.75 mm (16-pin LGA) package that can perform over a wide temperature range, delivering reliable and highly accurate measurement data.

Mar-2022: TDK Corporation unveiled FS1412 microPOL (μPOL™) power module. The FS1412 is an element of a new series of μPOL™ DC-DC converters with the smallest available size, increased performance, and ease of use. Moreover, it is helpful in simplified integration for applications such as machine learning, big data, 5G cells, artificial intelligence (AI), computing enterprise, and IoT networking.

Nov-2021: Amkor Technology Inc, expanded its geographical footprints to a smart factory in Bac Ninh, Vietnam. Moreover, Amkor Technology Inc is investing in Bac Ninh to develop its manufacturing impression in the consent of customer requirements for an alternative cost-competitive supply chain solution for Advanced SiP and additional packaging solutions in the future.

Mar-2021: Advanced Semiconductor Engineering, Inc. (ASE) collaborated with Siemens Digital Industries Software, an American computer software company specializing in 3D & 2D Product Lifecycle Management software. Through this collaboration, both organizations have developed two new enablement solutions. Furthermore, ASE would be able to leverage the mutually developed flow to greatly reduce 2.5D/3D IC and FOCoS package assembly planning and verification cycle times by about 30 to 50 percent in each design iteration by embracing the Calibre 3DSTACK technologies and Siemens Xpedition Substrate Integrator.

Sep-2021: Infineon Technologies AG extended its footprint by opening a high-tech chip factory for power electronics on 300-millimeter thin wafers at its Villach site in Austria. Additionally, Infineon accepts that the opportunity to build new capacity in Europe could not be better considering the growing global demand for power semiconductors.

Jun-2019: Infineon Technologies AG took over Cypress Semiconductor Corporation, an American semiconductor design, and manufacturing company. Through this acquisition, Infineon would fasten and strengthen its profitable growth and shift its business on a more comprehensive basis. Moreover, this acquisition is a landmark step in Infineon's strategic development.

Nov-2018: Infineon Technologies AG took over Siltectra GmbH, a start-up based in Dresden. Through this acquisition, Infineon Technologies would be able to extend its portfolio with the fresh material silicon carbide. Moreover, Infineon Technologies' system knowledge of thin wafer technology would be perfectly complemented by the Cold Split technology and the innovative capacity of Siltectra.

May-2018: TDK Corporation took over Faraday Semi LLC, a U.S.-based venture-backed company engaged in the design of advanced power semiconductor Ics. Under this acquisition, TDK Corporation would be able to provide increased efficiency and ease of use at a lower total system cost than what is currently available nowadays.

Scope of the Study

Market Segments covered in the Report:

By Vertical

  • Consumer Electronics
  • IT & Telecommunication
  • Automotive
  • Healthcare
  • Others

By Platform

  • Embedded Die in IC Package Substrate
  • Embedded Die in Rigid Board
  • Embedded Die in Flexible Board

By Geography

  • North America
    • US
    • Canada
    • Mexico
    • Rest of North America
  • Europe
    • Germany
    • UK
    • France
    • Russia
    • Spain
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Singapore
    • Malaysia
    • Rest of Asia Pacific
  • LAMEA
    • Brazil
    • Argentina
    • UAE
    • Saudi Arabia
    • South Africa
    • Nigeria
    • Rest of LAMEA

Companies Profiled

  • General Electric (GE) Co.
  • Infineon Technologies AG
  • TDK Corporation
  • Fujikura Ltd.
  • Amkor Technology, Inc.
  • Taiwan Semiconductor Manufacturing Company Limited
  • ASE Group (ASE Technology Holding)
  • Microsemi Corporation (Microchip Technology)
  • Schweizer Electronic AG (Wus Printed Circuit)
  • AT&S Group

Unique Offerings from KBV Research

  • Exhaustive coverage
  • Highest number of market tables and figures
  • Subscription based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology

  • 1.1 Market Definition
  • 1.2 Objectives
  • 1.3 Market Scope
  • 1.4 Segmentation
    • 1.4.1 Global Embedded Die Packaging Technology Market, by Vertical
    • 1.4.2 Global Embedded Die Packaging Technology Market, by Platform
    • 1.4.3 Global Embedded Die Packaging Technology Market, by Geography
  • 1.5 Methodology for the research

Chapter 2. Market Overview

  • 2.1 Introduction
    • 2.1.1 Overview
      • 2.1.1.1 Market Composition & Scenario
  • 2.2 Key Factors Impacting the Market
    • 2.2.1 Market Drivers
    • 2.2.2 Market Restraints

Chapter 3. Strategies Deployed in Embedded Die Packaging Technology Market

Chapter 4. Global Embedded Die Packaging Technology Market by Vertical

  • 4.1 Global Consumer Electronics Market by Region
  • 4.2 Global IT & Telecommunication Market by Region
  • 4.3 Global Automotive Market by Region
  • 4.4 Global Healthcare Market by Region
  • 4.5 Global Others Market by Region

Chapter 5. Global Embedded Die Packaging Technology Market by Platform

  • 5.1 Global Embedded Die in IC Package Substrate Market by Region
  • 5.2 Global Embedded Die in Rigid Board Market by Region
  • 5.3 Global Embedded Die in Flexible Board Market by Region

Chapter 6. Global Embedded Die Packaging Technology Market by Region

  • 6.1 North America Embedded Die Packaging Technology Market
    • 6.1.1 North America Embedded Die Packaging Technology Market by Vertical
      • 6.1.1.1 North America Consumer Electronics Market by Country
      • 6.1.1.2 North America IT & Telecommunication Market by Country
      • 6.1.1.3 North America Automotive Market by Country
      • 6.1.1.4 North America Healthcare Market by Country
      • 6.1.1.5 North America Others Market by Country
    • 6.1.2 North America Embedded Die Packaging Technology Market by Platform
      • 6.1.2.1 North America Embedded Die in IC Package Substrate Market by Country
      • 6.1.2.2 North America Embedded Die in Rigid Board Market by Country
      • 6.1.2.3 North America Embedded Die in Flexible Board Market by Country
    • 6.1.3 North America Embedded Die Packaging Technology Market by Country
      • 6.1.3.1 US Embedded Die Packaging Technology Market
        • 6.1.3.1.1 US Embedded Die Packaging Technology Market by Vertical
        • 6.1.3.1.2 US Embedded Die Packaging Technology Market by Platform
      • 6.1.3.2 Canada Embedded Die Packaging Technology Market
        • 6.1.3.2.1 Canada Embedded Die Packaging Technology Market by Vertical
        • 6.1.3.2.2 Canada Embedded Die Packaging Technology Market by Platform
      • 6.1.3.3 Mexico Embedded Die Packaging Technology Market
        • 6.1.3.3.1 Mexico Embedded Die Packaging Technology Market by Vertical
        • 6.1.3.3.2 Mexico Embedded Die Packaging Technology Market by Platform
      • 6.1.3.4 Rest of North America Embedded Die Packaging Technology Market
        • 6.1.3.4.1 Rest of North America Embedded Die Packaging Technology Market by Vertical
        • 6.1.3.4.2 Rest of North America Embedded Die Packaging Technology Market by Platform
  • 6.2 Europe Embedded Die Packaging Technology Market
    • 6.2.1 Europe Embedded Die Packaging Technology Market by Vertical
      • 6.2.1.1 Europe Consumer Electronics Market by Country
      • 6.2.1.2 Europe IT & Telecommunication Market by Country
      • 6.2.1.3 Europe Automotive Market by Country
      • 6.2.1.4 Europe Healthcare Market by Country
      • 6.2.1.5 Europe Others Market by Country
    • 6.2.2 Europe Embedded Die Packaging Technology Market by Platform
      • 6.2.2.1 Europe Embedded Die in IC Package Substrate Market by Country
      • 6.2.2.2 Europe Embedded Die in Rigid Board Market by Country
      • 6.2.2.3 Europe Embedded Die in Flexible Board Market by Country
    • 6.2.3 Europe Embedded Die Packaging Technology Market by Country
      • 6.2.3.1 Germany Embedded Die Packaging Technology Market
        • 6.2.3.1.1 Germany Embedded Die Packaging Technology Market by Vertical
        • 6.2.3.1.2 Germany Embedded Die Packaging Technology Market by Platform
      • 6.2.3.2 UK Embedded Die Packaging Technology Market
        • 6.2.3.2.1 UK Embedded Die Packaging Technology Market by Vertical
        • 6.2.3.2.2 UK Embedded Die Packaging Technology Market by Platform
      • 6.2.3.3 France Embedded Die Packaging Technology Market
        • 6.2.3.3.1 France Embedded Die Packaging Technology Market by Vertical
        • 6.2.3.3.2 France Embedded Die Packaging Technology Market by Platform
      • 6.2.3.4 Russia Embedded Die Packaging Technology Market
        • 6.2.3.4.1 Russia Embedded Die Packaging Technology Market by Vertical
        • 6.2.3.4.2 Russia Embedded Die Packaging Technology Market by Platform
      • 6.2.3.5 Spain Embedded Die Packaging Technology Market
        • 6.2.3.5.1 Spain Embedded Die Packaging Technology Market by Vertical
        • 6.2.3.5.2 Spain Embedded Die Packaging Technology Market by Platform
      • 6.2.3.6 Italy Embedded Die Packaging Technology Market
        • 6.2.3.6.1 Italy Embedded Die Packaging Technology Market by Vertical
        • 6.2.3.6.2 Italy Embedded Die Packaging Technology Market by Platform
      • 6.2.3.7 Rest of Europe Embedded Die Packaging Technology Market
        • 6.2.3.7.1 Rest of Europe Embedded Die Packaging Technology Market by Vertical
        • 6.2.3.7.2 Rest of Europe Embedded Die Packaging Technology Market by Platform
  • 6.3 Asia Pacific Embedded Die Packaging Technology Market
    • 6.3.1 Asia Pacific Embedded Die Packaging Technology Market by Vertical
      • 6.3.1.1 Asia Pacific Consumer Electronics Market by Country
      • 6.3.1.2 Asia Pacific IT & Telecommunication Market by Country
      • 6.3.1.3 Asia Pacific Automotive Market by Country
      • 6.3.1.4 Asia Pacific Healthcare Market by Country
      • 6.3.1.5 Asia Pacific Others Market by Country
    • 6.3.2 Asia Pacific Embedded Die Packaging Technology Market by Platform
      • 6.3.2.1 Asia Pacific Embedded Die in IC Package Substrate Market by Country
      • 6.3.2.2 Asia Pacific Embedded Die in Rigid Board Market by Country
      • 6.3.2.3 Asia Pacific Embedded Die in Flexible Board Market by Country
    • 6.3.3 Asia Pacific Embedded Die Packaging Technology Market by Country
      • 6.3.3.1 China Embedded Die Packaging Technology Market
        • 6.3.3.1.1 China Embedded Die Packaging Technology Market by Vertical
        • 6.3.3.1.2 China Embedded Die Packaging Technology Market by Platform
      • 6.3.3.2 Japan Embedded Die Packaging Technology Market
        • 6.3.3.2.1 Japan Embedded Die Packaging Technology Market by Vertical
        • 6.3.3.2.2 Japan Embedded Die Packaging Technology Market by Platform
      • 6.3.3.3 India Embedded Die Packaging Technology Market
        • 6.3.3.3.1 India Embedded Die Packaging Technology Market by Vertical
        • 6.3.3.3.2 India Embedded Die Packaging Technology Market by Platform
      • 6.3.3.4 South Korea Embedded Die Packaging Technology Market
        • 6.3.3.4.1 South Korea Embedded Die Packaging Technology Market by Vertical
        • 6.3.3.4.2 South Korea Embedded Die Packaging Technology Market by Platform
      • 6.3.3.5 Singapore Embedded Die Packaging Technology Market
        • 6.3.3.5.1 Singapore Embedded Die Packaging Technology Market by Vertical
        • 6.3.3.5.2 Singapore Embedded Die Packaging Technology Market by Platform
      • 6.3.3.6 Malaysia Embedded Die Packaging Technology Market
        • 6.3.3.6.1 Malaysia Embedded Die Packaging Technology Market by Vertical
        • 6.3.3.6.2 Malaysia Embedded Die Packaging Technology Market by Platform
      • 6.3.3.7 Rest of Asia Pacific Embedded Die Packaging Technology Market
        • 6.3.3.7.1 Rest of Asia Pacific Embedded Die Packaging Technology Market by Vertical
        • 6.3.3.7.2 Rest of Asia Pacific Embedded Die Packaging Technology Market by Platform
  • 6.4 LAMEA Embedded Die Packaging Technology Market
    • 6.4.1 LAMEA Embedded Die Packaging Technology Market by Vertical
      • 6.4.1.1 LAMEA Consumer Electronics Market by Country
      • 6.4.1.2 LAMEA IT & Telecommunication Market by Country
      • 6.4.1.3 LAMEA Automotive Market by Country
      • 6.4.1.4 LAMEA Healthcare Market by Country
      • 6.4.1.5 LAMEA Others Market by Country
    • 6.4.2 LAMEA Embedded Die Packaging Technology Market by Platform
      • 6.4.2.1 LAMEA Embedded Die in IC Package Substrate Market by Country
      • 6.4.2.2 LAMEA Embedded Die in Rigid Board Market by Country
      • 6.4.2.3 LAMEA Embedded Die in Flexible Board Market by Country
    • 6.4.3 LAMEA Embedded Die Packaging Technology Market by Country
      • 6.4.3.1 Brazil Embedded Die Packaging Technology Market
        • 6.4.3.1.1 Brazil Embedded Die Packaging Technology Market by Vertical
        • 6.4.3.1.2 Brazil Embedded Die Packaging Technology Market by Platform
      • 6.4.3.2 Argentina Embedded Die Packaging Technology Market
        • 6.4.3.2.1 Argentina Embedded Die Packaging Technology Market by Vertical
        • 6.4.3.2.2 Argentina Embedded Die Packaging Technology Market by Platform
      • 6.4.3.3 UAE Embedded Die Packaging Technology Market
        • 6.4.3.3.1 UAE Embedded Die Packaging Technology Market by Vertical
        • 6.4.3.3.2 UAE Embedded Die Packaging Technology Market by Platform
      • 6.4.3.4 Saudi Arabia Embedded Die Packaging Technology Market
        • 6.4.3.4.1 Saudi Arabia Embedded Die Packaging Technology Market by Vertical
        • 6.4.3.4.2 Saudi Arabia Embedded Die Packaging Technology Market by Platform
      • 6.4.3.5 South Africa Embedded Die Packaging Technology Market
        • 6.4.3.5.1 South Africa Embedded Die Packaging Technology Market by Vertical
        • 6.4.3.5.2 South Africa Embedded Die Packaging Technology Market by Platform
      • 6.4.3.6 Nigeria Embedded Die Packaging Technology Market
        • 6.4.3.6.1 Nigeria Embedded Die Packaging Technology Market by Vertical
        • 6.4.3.6.2 Nigeria Embedded Die Packaging Technology Market by Platform
      • 6.4.3.7 Rest of LAMEA Embedded Die Packaging Technology Market
        • 6.4.3.7.1 Rest of LAMEA Embedded Die Packaging Technology Market by Vertical
        • 6.4.3.7.2 Rest of LAMEA Embedded Die Packaging Technology Market by Platform

Chapter 7. Company Profiles

  • 7.1 General Electric (GE) Co.
    • 7.1.1 Company Overview
    • 7.1.2 Financial Analysis
    • 7.1.3 Segmental and Regional Analysis
    • 7.1.4 Research & Development Expense
    • 7.1.5 SWOT Analysis
  • 7.2 Infineon Technologies AG
    • 7.2.1 Company Overview
    • 7.2.2 Financial Analysis
    • 7.2.3 Segmental and Regional Analysis
    • 7.2.4 Research & Development Expense
    • 7.2.5 Recent strategies and developments:
      • 7.2.5.1 Acquisition and Mergers:
      • 7.2.5.2 Geographical Expansions:
    • 7.2.6 SWOT Analysis
  • 7.3 TDK Corporation
    • 7.3.1 Company Overview
    • 7.3.2 Financial Analysis
    • 7.3.3 Regional & Segmental Analysis
    • 7.3.4 Research & Development Expenses
    • 7.3.5 Recent strategies and developments:
      • 7.3.5.1 Product Launches and Product Expansions:
      • 7.3.5.2 Acquisition and Mergers:
  • 7.4 Fujikura Ltd.
    • 7.4.1 Company Overview
    • 7.4.2 Financial Analysis
    • 7.4.3 Segmental and Regional Analysis
    • 7.4.4 Research & Development Expenses
  • 7.5 Amkor Technology, Inc.
    • 7.5.1 Company Overview
    • 7.5.2 Financial Analysis
    • 7.5.3 Regional Analysis
    • 7.5.4 Research & Development Expense
    • 7.5.5 Recent strategies and developments:
      • 7.5.5.1 Geographical Expansions:
  • 7.6 Taiwan Semiconductor Manufacturing Company Limited
    • 7.6.1 Company overview
    • 7.6.2 Financial Analysis
    • 7.6.3 Regional Analysis
    • 7.6.4 Research & Development Expenses
    • 7.6.5 Recent strategies and developments:
      • 7.6.5.1 Partnerships, Collaborations, and Agreements:
  • 7.7 ASE Group (ASE Technology Holding)
    • 7.7.1 Company Overview
    • 7.7.2 Financial Analysis
    • 7.7.3 Segmental and Regional Analysis
    • 7.7.4 Research & Development Expenses
    • 7.7.5 Recent strategies and developments:
      • 7.7.5.1 Partnerships, Collaborations, and Agreements:
      • 7.7.5.2 Product Launches and Product Expansions:
  • 7.8 Microsemi Corporation (Microchip Technology)
    • 7.8.1 Company Overview
    • 7.8.2 Financial Analysis
    • 7.8.3 Segmental and Regional Analysis
    • 7.8.4 Research & Development Expenses
  • 7.9 Schweizer Electronic AG (Wus Printed Circuit)
    • 7.9.1 Company Overview
    • 7.9.2 Financial Analysis
    • 7.9.3 Regional Analysis
    • 7.9.4 Research & Development Expenses
  • 7.10. AT&S Group
    • 7.10.1 Company Overview
    • 7.10.2 Financial Analysis
    • 7.10.3 Segmental and Regional Analysis
    • 7.10.4 Research & Development Expenses

LIST OF TABLES

  • TABLE 1 Global Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 2 Global Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 3 Global Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 4 Global Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 5 Global Consumer Electronics Market by Region, 2018 - 2021, USD Thousands
  • TABLE 6 Global Consumer Electronics Market by Region, 2022 - 2028, USD Thousands
  • TABLE 7 Global IT & Telecommunication Market by Region, 2018 - 2021, USD Thousands
  • TABLE 8 Global IT & Telecommunication Market by Region, 2022 - 2028, USD Thousands
  • TABLE 9 Global Automotive Market by Region, 2018 - 2021, USD Thousands
  • TABLE 10 Global Automotive Market by Region, 2022 - 2028, USD Thousands
  • TABLE 11 Global Healthcare Market by Region, 2018 - 2021, USD Thousands
  • TABLE 12 Global Healthcare Market by Region, 2022 - 2028, USD Thousands
  • TABLE 13 Global Others Market by Region, 2018 - 2021, USD Thousands
  • TABLE 14 Global Others Market by Region, 2022 - 2028, USD Thousands
  • TABLE 15 Global Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 16 Global Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 17 Global Embedded Die in IC Package Substrate Market by Region, 2018 - 2021, USD Thousands
  • TABLE 18 Global Embedded Die in IC Package Substrate Market by Region, 2022 - 2028, USD Thousands
  • TABLE 19 Global Embedded Die in Rigid Board Market by Region, 2018 - 2021, USD Thousands
  • TABLE 20 Global Embedded Die in Rigid Board Market by Region, 2022 - 2028, USD Thousands
  • TABLE 21 Global Embedded Die in Flexible Board Market by Region, 2018 - 2021, USD Thousands
  • TABLE 22 Global Embedded Die in Flexible Board Market by Region, 2022 - 2028, USD Thousands
  • TABLE 23 Global Embedded Die Packaging Technology Market by Region, 2018 - 2021, USD Thousands
  • TABLE 24 Global Embedded Die Packaging Technology Market by Region, 2022 - 2028, USD Thousands
  • TABLE 25 North America Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 26 North America Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 27 North America Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 28 North America Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 29 North America Consumer Electronics Market by Country, 2018 - 2021, USD Thousands
  • TABLE 30 North America Consumer Electronics Market by Country, 2022 - 2028, USD Thousands
  • TABLE 31 North America IT & Telecommunication Market by Country, 2018 - 2021, USD Thousands
  • TABLE 32 North America IT & Telecommunication Market by Country, 2022 - 2028, USD Thousands
  • TABLE 33 North America Automotive Market by Country, 2018 - 2021, USD Thousands
  • TABLE 34 North America Automotive Market by Country, 2022 - 2028, USD Thousands
  • TABLE 35 North America Healthcare Market by Country, 2018 - 2021, USD Thousands
  • TABLE 36 North America Healthcare Market by Country, 2022 - 2028, USD Thousands
  • TABLE 37 North America Others Market by Country, 2018 - 2021, USD Thousands
  • TABLE 38 North America Others Market by Country, 2022 - 2028, USD Thousands
  • TABLE 39 North America Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 40 North America Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 41 North America Embedded Die in IC Package Substrate Market by Country, 2018 - 2021, USD Thousands
  • TABLE 42 North America Embedded Die in IC Package Substrate Market by Country, 2022 - 2028, USD Thousands
  • TABLE 43 North America Embedded Die in Rigid Board Market by Country, 2018 - 2021, USD Thousands
  • TABLE 44 North America Embedded Die in Rigid Board Market by Country, 2022 - 2028, USD Thousands
  • TABLE 45 North America Embedded Die in Flexible Board Market by Country, 2018 - 2021, USD Thousands
  • TABLE 46 North America Embedded Die in Flexible Board Market by Country, 2022 - 2028, USD Thousands
  • TABLE 47 North America Embedded Die Packaging Technology Market by Country, 2018 - 2021, USD Thousands
  • TABLE 48 North America Embedded Die Packaging Technology Market by Country, 2022 - 2028, USD Thousands
  • TABLE 49 US Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 50 US Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 51 US Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 52 US Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 53 US Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 54 US Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 55 Canada Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 56 Canada Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 57 Canada Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 58 Canada Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 59 Canada Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 60 Canada Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 61 Mexico Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 62 Mexico Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 63 Mexico Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 64 Mexico Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 65 Mexico Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 66 Mexico Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 67 Rest of North America Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 68 Rest of North America Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 69 Rest of North America Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 70 Rest of North America Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 71 Rest of North America Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 72 Rest of North America Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 73 Europe Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 74 Europe Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 75 Europe Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 76 Europe Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 77 Europe Consumer Electronics Market by Country, 2018 - 2021, USD Thousands
  • TABLE 78 Europe Consumer Electronics Market by Country, 2022 - 2028, USD Thousands
  • TABLE 79 Europe IT & Telecommunication Market by Country, 2018 - 2021, USD Thousands
  • TABLE 80 Europe IT & Telecommunication Market by Country, 2022 - 2028, USD Thousands
  • TABLE 81 Europe Automotive Market by Country, 2018 - 2021, USD Thousands
  • TABLE 82 Europe Automotive Market by Country, 2022 - 2028, USD Thousands
  • TABLE 83 Europe Healthcare Market by Country, 2018 - 2021, USD Thousands
  • TABLE 84 Europe Healthcare Market by Country, 2022 - 2028, USD Thousands
  • TABLE 85 Europe Others Market by Country, 2018 - 2021, USD Thousands
  • TABLE 86 Europe Others Market by Country, 2022 - 2028, USD Thousands
  • TABLE 87 Europe Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 88 Europe Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 89 Europe Embedded Die in IC Package Substrate Market by Country, 2018 - 2021, USD Thousands
  • TABLE 90 Europe Embedded Die in IC Package Substrate Market by Country, 2022 - 2028, USD Thousands
  • TABLE 91 Europe Embedded Die in Rigid Board Market by Country, 2018 - 2021, USD Thousands
  • TABLE 92 Europe Embedded Die in Rigid Board Market by Country, 2022 - 2028, USD Thousands
  • TABLE 93 Europe Embedded Die in Flexible Board Market by Country, 2018 - 2021, USD Thousands
  • TABLE 94 Europe Embedded Die in Flexible Board Market by Country, 2022 - 2028, USD Thousands
  • TABLE 95 Europe Embedded Die Packaging Technology Market by Country, 2018 - 2021, USD Thousands
  • TABLE 96 Europe Embedded Die Packaging Technology Market by Country, 2022 - 2028, USD Thousands
  • TABLE 97 Germany Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 98 Germany Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 99 Germany Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 100 Germany Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 101 Germany Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 102 Germany Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 103 UK Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 104 UK Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 105 UK Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 106 UK Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 107 UK Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 108 UK Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 109 France Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 110 France Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 111 France Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 112 France Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 113 France Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 114 France Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 115 Russia Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 116 Russia Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 117 Russia Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 118 Russia Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 119 Russia Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 120 Russia Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 121 Spain Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 122 Spain Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 123 Spain Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 124 Spain Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 125 Spain Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 126 Spain Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 127 Italy Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 128 Italy Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 129 Italy Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 130 Italy Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 131 Italy Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 132 Italy Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 133 Rest of Europe Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 134 Rest of Europe Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 135 Rest of Europe Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 136 Rest of Europe Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 137 Rest of Europe Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 138 Rest of Europe Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 139 Asia Pacific Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 140 Asia Pacific Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 141 Asia Pacific Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 142 Asia Pacific Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 143 Asia Pacific Consumer Electronics Market by Country, 2018 - 2021, USD Thousands
  • TABLE 144 Asia Pacific Consumer Electronics Market by Country, 2022 - 2028, USD Thousands
  • TABLE 145 Asia Pacific IT & Telecommunication Market by Country, 2018 - 2021, USD Thousands
  • TABLE 146 Asia Pacific IT & Telecommunication Market by Country, 2022 - 2028, USD Thousands
  • TABLE 147 Asia Pacific Automotive Market by Country, 2018 - 2021, USD Thousands
  • TABLE 148 Asia Pacific Automotive Market by Country, 2022 - 2028, USD Thousands
  • TABLE 149 Asia Pacific Healthcare Market by Country, 2018 - 2021, USD Thousands
  • TABLE 150 Asia Pacific Healthcare Market by Country, 2022 - 2028, USD Thousands
  • TABLE 151 Asia Pacific Others Market by Country, 2018 - 2021, USD Thousands
  • TABLE 152 Asia Pacific Others Market by Country, 2022 - 2028, USD Thousands
  • TABLE 153 Asia Pacific Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 154 Asia Pacific Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 155 Asia Pacific Embedded Die in IC Package Substrate Market by Country, 2018 - 2021, USD Thousands
  • TABLE 156 Asia Pacific Embedded Die in IC Package Substrate Market by Country, 2022 - 2028, USD Thousands
  • TABLE 157 Asia Pacific Embedded Die in Rigid Board Market by Country, 2018 - 2021, USD Thousands
  • TABLE 158 Asia Pacific Embedded Die in Rigid Board Market by Country, 2022 - 2028, USD Thousands
  • TABLE 159 Asia Pacific Embedded Die in Flexible Board Market by Country, 2018 - 2021, USD Thousands
  • TABLE 160 Asia Pacific Embedded Die in Flexible Board Market by Country, 2022 - 2028, USD Thousands
  • TABLE 161 Asia Pacific Embedded Die Packaging Technology Market by Country, 2018 - 2021, USD Thousands
  • TABLE 162 Asia Pacific Embedded Die Packaging Technology Market by Country, 2022 - 2028, USD Thousands
  • TABLE 163 China Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 164 China Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 165 China Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 166 China Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 167 China Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 168 China Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 169 Japan Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 170 Japan Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 171 Japan Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 172 Japan Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 173 Japan Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 174 Japan Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 175 India Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 176 India Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 177 India Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 178 India Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 179 India Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 180 India Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 181 South Korea Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 182 South Korea Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 183 South Korea Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 184 South Korea Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 185 South Korea Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 186 South Korea Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 187 Singapore Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 188 Singapore Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 189 Singapore Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 190 Singapore Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 191 Singapore Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 192 Singapore Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 193 Malaysia Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 194 Malaysia Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 195 Malaysia Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 196 Malaysia Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 197 Malaysia Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 198 Malaysia Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 199 Rest of Asia Pacific Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 200 Rest of Asia Pacific Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 201 Rest of Asia Pacific Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 202 Rest of Asia Pacific Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 203 Rest of Asia Pacific Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 204 Rest of Asia Pacific Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 205 LAMEA Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 206 LAMEA Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 207 LAMEA Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 208 LAMEA Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 209 LAMEA Consumer Electronics Market by Country, 2018 - 2021, USD Thousands
  • TABLE 210 LAMEA Consumer Electronics Market by Country, 2022 - 2028, USD Thousands
  • TABLE 211 LAMEA IT & Telecommunication Market by Country, 2018 - 2021, USD Thousands
  • TABLE 212 LAMEA IT & Telecommunication Market by Country, 2022 - 2028, USD Thousands
  • TABLE 213 LAMEA Automotive Market by Country, 2018 - 2021, USD Thousands
  • TABLE 214 LAMEA Automotive Market by Country, 2022 - 2028, USD Thousands
  • TABLE 215 LAMEA Healthcare Market by Country, 2018 - 2021, USD Thousands
  • TABLE 216 LAMEA Healthcare Market by Country, 2022 - 2028, USD Thousands
  • TABLE 217 LAMEA Others Market by Country, 2018 - 2021, USD Thousands
  • TABLE 218 LAMEA Others Market by Country, 2022 - 2028, USD Thousands
  • TABLE 219 LAMEA Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 220 LAMEA Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 221 LAMEA Embedded Die in IC Package Substrate Market by Country, 2018 - 2021, USD Thousands
  • TABLE 222 LAMEA Embedded Die in IC Package Substrate Market by Country, 2022 - 2028, USD Thousands
  • TABLE 223 LAMEA Embedded Die in Rigid Board Market by Country, 2018 - 2021, USD Thousands
  • TABLE 224 LAMEA Embedded Die in Rigid Board Market by Country, 2022 - 2028, USD Thousands
  • TABLE 225 LAMEA Embedded Die in Flexible Board Market by Country, 2018 - 2021, USD Thousands
  • TABLE 226 LAMEA Embedded Die in Flexible Board Market by Country, 2022 - 2028, USD Thousands
  • TABLE 227 LAMEA Embedded Die Packaging Technology Market by Country, 2018 - 2021, USD Thousands
  • TABLE 228 LAMEA Embedded Die Packaging Technology Market by Country, 2022 - 2028, USD Thousands
  • TABLE 229 Brazil Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 230 Brazil Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 231 Brazil Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 232 Brazil Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 233 Brazil Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 234 Brazil Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 235 Argentina Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 236 Argentina Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 237 Argentina Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 238 Argentina Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 239 Argentina Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 240 Argentina Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 241 UAE Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 242 UAE Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 243 UAE Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 244 UAE Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 245 UAE Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 246 UAE Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 247 Saudi Arabia Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 248 Saudi Arabia Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 249 Saudi Arabia Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 250 Saudi Arabia Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 251 Saudi Arabia Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 252 Saudi Arabia Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 253 South Africa Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 254 South Africa Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 255 South Africa Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 256 South Africa Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 257 South Africa Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 258 South Africa Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 259 Nigeria Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 260 Nigeria Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 261 Nigeria Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 262 Nigeria Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 263 Nigeria Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 264 Nigeria Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 265 Rest of LAMEA Embedded Die Packaging Technology Market, 2018 - 2021, USD Thousands
  • TABLE 266 Rest of LAMEA Embedded Die Packaging Technology Market, 2022 - 2028, USD Thousands
  • TABLE 267 Rest of LAMEA Embedded Die Packaging Technology Market by Vertical, 2018 - 2021, USD Thousands
  • TABLE 268 Rest of LAMEA Embedded Die Packaging Technology Market by Vertical, 2022 - 2028, USD Thousands
  • TABLE 269 Rest of LAMEA Embedded Die Packaging Technology Market by Platform, 2018 - 2021, USD Thousands
  • TABLE 270 Rest of LAMEA Embedded Die Packaging Technology Market by Platform, 2022 - 2028, USD Thousands
  • TABLE 271 Key Information - General Electric (GE) Co.
  • TABLE 272 Key Information - Infineon Technologies AG
  • TABLE 273 Key information - TDK Corporation
  • TABLE 274 Key Information - Fujikura Ltd.
  • TABLE 275 Key Information - Amkor Technology, Inc.
  • TABLE 276 Key Information- Taiwan Semiconductor Manufacturing Company Limited
  • TABLE 277 Key Information - ASE Group
  • TABLE 278 Key Information - Microsemi Corporation
  • TABLE 279 Key Information - Schweizer Electronic AG
  • TABLE 280 Key Information - AT&S Group

List of Figures

  • FIG 1 Methodology for the research
  • FIG 2 Global Embedded Die Packaging Technology Market Share by Vertical, 2021
  • FIG 3 Global Embedded Die Packaging Technology Market Share by Vertical, 2028
  • FIG 4 Global Embedded Die Packaging Technology Market by Vertical, 2018 - 2028, USD Thousands
  • FIG 5 Global Embedded Die Packaging Technology Market Share by Platform, 2021
  • FIG 6 Global Embedded Die Packaging Technology Market Share by Platform, 2028
  • FIG 7 Global Embedded Die Packaging Technology Market by Platform, 2018 - 2028, USD Thousands
  • FIG 8 Global Embedded Die Packaging Technology Market Share by Region, 2021
  • FIG 9 Global Embedded Die Packaging Technology Market Share by Region, 2028
  • FIG 10 Global Embedded Die Packaging Technology Market by Region, 2018 - 2028, USD Thousands
  • FIG 11 Swot analysis: General electric (GE) Co.
  • FIG 12 Recent strategies and developments: Infenion Technologies AG
  • FIG 13 Swot analysis: INFINEON TECHNOLOGIES AG
  • FIG 14 Recent strategies and developments: TDK Corporation