半導體後端設備市場：未來預測（2025-2030年）

Semiconductor Back-End Equipment Market - Forecasts from 2025 to 2030

出版日期: 2025年03月24日 | 出版商:

Knowledge Sourcing Intelligence | 英文 155 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄

預計半導體後端設備市場將以 6.89% 的複合年成長率成長，從 2025 年的 1,130.06 億美元成長到 2030 年的 1,576.93 億美元。

由於筆記型電腦、數位相機和智慧型手機等電子產品對小型設備的需求不斷增加及其功能的不斷發展，預計市場將會擴大。隨著積體電路（IC）設計變得越來越複雜，並且需要引入更多的半導體產品來製造IC，對半導體後端設備的需求正在穩步成長。半導體用於積體電路開發，以降低成本、加快大規模生產並提高成品的營運價值。

市場趨勢：

半導體需求快速成長：受各工業領域應用不斷擴大的推動，全球對半導體的需求持續成長。新興企業和年輕公司擴大轉向原始設計製造商 (ODM) 和外包半導體組裝和測試 (OSAT) 供應商來滿足其產品開發和生產需求。為了減少對海外供應商的依賴，世界各國政府都優先考慮本地半導體製造，鼓勵現有製造商的直接投資，並提供一個支持性的法規結構。例如，半導體產業協會（SIA）報告稱，2024年全球半導體銷售額將達到6,276億美元，較2023年的5,268億美元成長19.1%。
製造業需求不斷成長：半導體製造設備對於生產半導體晶圓、IC晶片、儲存晶片、電路和其他組件至關重要。矽晶圓製造設備在製造的早期階段發揮關鍵作用，而晶圓加工設備——包括微影術、蝕刻、化學氣相沉積、計量和製程/品管設備——對工作流程至關重要。由於各種終端用戶應用對分立元件、功率半導體和高功率模組的需求不斷增加，預計半導體後端設備市場將會擴大。此外，將多種半導體功能整合到單一晶片上的趨勢正在推動消費者對更小、更緊湊的產品的偏好，而後處理設備主要用於將這些組件組裝到整合晶片上。
亞太地區快速成長：預計預測期內亞太地區半導體後端設備市場將快速成長。這一快速成長是由國內領先供應商的戰略投資和該地區成熟半導體產業的擴張所推動的。隨著晶片消費量的增加，預計未來四年亞太半導體市場規模將達到美洲的三倍。 5G技術的推出進一步推動了該地區對半導體晶片的需求，刺激了製造設備市場的成長。 5G 的進步預計將顯著增強全球數位基礎設施。

報告中介紹的主要企業包括 ASML Holding NV、應用材料、Lam Research、東京電子、Rapidus Corporation、KLA Corporation 和 Onto Innovation Inc.

本報告的主要優點

深刻分析：獲得涵蓋主要地區和新興地區的深入市場洞察，重點關注客戶群、政府政策和社會經濟因素、消費者偏好、垂直行業和其他子區隔。
競爭格局：了解全球主要企業所採用的策略策略，並了解正確策略帶來的潛在市場滲透。
市場促進因素和未來趨勢：探索動態因素和關鍵市場趨勢以及它們將如何影響市場的未來發展。
可行的建議：利用洞察力進行策略決策，在動態環境中開闢新的業務流和收益。
適用範圍廣：對於新興企業、研究機構、顧問公司、中小企業和大型企業來說，它都是實用且具有成本效益的。

它有什麼用途？

產業與市場洞察、商業機會評估、產品需求預測、打入市場策略、地理擴張、資本支出決策、法律規範與影響、新產品開發、競爭影響

分析範圍

歷史資料（2022-2024）和預測資料（2025-2030）
成長機會、挑戰、供應鏈前景、法規結構、顧客行為、趨勢分析
競爭對手定位、策略和市場佔有率分析
按部門和地區（國家）分類的收益成長和預測分析
公司概況（策略、產品、財務資訊、主要趨勢等）

半導體後端設備市場區隔：

一步步

晶圓檢測
黏合
切塊
測量
組裝和包裝

按地區

美洲
美國
歐洲、中東和非洲
德國
荷蘭
其他
亞太地區
中國
日本
台灣
韓國
其他

The market is expected to grow due to the increasing demand for small devices and functional advancements in electronic goods like laptops, digital cameras, smartphones, and others. Since integrated circuit (IC) designs are becoming highly complex and more semiconductor products must be introduced to manufacture ICs, the demand for semiconductor back-end equipment is increasing steadily. Semiconductors are used in IC development because they lower costs, speed up mass production, and increase the operational value of the finished product.

Market Trends:

Surging Semiconductor Demand: Global demand for semiconductors is on the rise, driven by expanding applications across various industries. Emerging and younger companies are increasingly turning to Original Design Manufacturers (ODMs) and Outsourced Semiconductor Assembly and Test (OSAT) providers to meet their product development and production needs. Governments worldwide are prioritizing local semiconductor manufacturing to lessen dependence on foreign suppliers, encouraging direct investments from established manufacturers and offering supportive regulatory frameworks. For example, the Semiconductor Industry Association (SIA) reported that global semiconductor sales hit US$627.6 billion in 2024, reflecting a 19.1% increase from the US$526.8 billion recorded in 2023.
Growing Needs in Manufacturing: Semiconductor manufacturing equipment is essential for producing semiconductor wafers, IC chips, memory chips, circuits, and other components. Silicon wafer production equipment plays a key role in the initial stages of manufacturing, while wafer processing tools-such as photolithography machines, etching devices, chemical vapor deposition systems, measurement tools, and process/quality control equipment-are critical to the workflow. The market for semiconductor back-end equipment is expected to grow due to increasing demand for discrete devices, power semiconductors, and high-power modules across various end-user applications. Additionally, the trend of integrating multiple semiconductor functions onto a single chip is gaining traction as consumers favor smaller, compact products, with back-end equipment primarily used for assembling these components into a unified chip.
Exponential Growth in Asia Pacific: The Asia-Pacific semiconductor back-end equipment market is set to experience rapid growth during the forecast period. This surge is driven by strategic investments from leading domestic suppliers and the expansion of the region's well-established semiconductor industry. With chip consumption on the rise, the Asia-Pacific semiconductor market is projected to triple in size compared to the Americas over the next four years. The rollout of 5G technology has further amplified demand for semiconductor chips in the region, spurring growth in the market for manufacturing equipment. This advancement in 5G is expected to significantly enhance digital infrastructure worldwide.

Some of the major players covered in this report include ASML Holding N.V., Applied Materials, Lam Research, Tokyo Electron Limited, Rapidus Corporation, KLA Corporation, Onto Innovation Inc., among others.

Key Benefits of this Report:

Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

Historical data from 2022 to 2024 & forecast data from 2025 to 2030
Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
Competitive Positioning, Strategies, and Market Share Analysis
Revenue Growth and Forecast Assessment of segments and regions including countries
Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

Semiconductor Back-End Equipment Market Segmentation:

By Procedure

Wafer Testing
Bonding
Dicing
Metrology
Assembly Packaging

By Geography

Americas
US
Europe, the Middle East, and Africa
Germany
Netherlands
Others
Asia Pacific
China
Japan
Taiwan
South Korea
Others

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

2.1. Market Overview
2.2. Market Definition
2.3. Scope of the Study
2.4. Market Segmentation

3. BUSINESS LANDSCAPE

3.1. Market Drivers
3.2. Market Restraints
3.3. Market Opportunities
3.4. Porter's Five Forces Analysis
3.5. Industry Value Chain Analysis
3.6. Policies and Regulations
3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. SEMICONDUCTOR BACK-END EQUIPMENT MARKET BY PROCEDURE

5.1. Introduction
5.2. Wafer Testing
5.3. Bonding
5.4. Dicing
5.5. Metrology
5.6. Assembly Packaging

6. SEMICONDUCTOR BACK-END EQUIPMENT MARKET BY GEOGRAPHY

6.1. Introduction
6.2. Americas
- 6.2.1. USA
6.3. Europe, Middle East, and Africa
- 6.3.1. Germany
- 6.3.2. Netherlandss
- 6.3.3. Others
6.4. Asia Pacific
- 6.4.1. China
- 6.4.2. Japan
- 6.4.3. Taiwan
- 6.4.4. South Korea
- 6.4.5. Others