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1496997

HDI PCB 市場：趨勢、機會與競爭分析 [2024-2030]

HDI PCB Market: Trends, Opportunities and Competitive Analysis [2024-2030]
出版日期: | 出版商: Lucintel | 英文 195 Pages | 商品交期: 3個工作天內

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簡介目錄

HDI PCB市場趨勢及預測

預計到 2030 年，全球 HDI PCB 市場將達到 208 億美元，2024 年至 2030 年複合年成長率為 4.8%。該市場的主要驅動力是消費性電子市場的成長、電子設備的小型化以及對高性能設備的需求不斷增加。全球 HDI PCB 市場的未來性充滿希望，智慧型手機、電腦、通訊/資料通訊、消費性電子和汽車產業都有機遇。

  • Lucintel 預測，由於智慧型手機和通訊設備的需求增加，4-6 層仍將是最大的細分市場。由於智慧型穿戴裝置和連網型設備的需求不斷成長，預計 10 層以上 HDI PCB 市場將在預測期內實現最高成長。
  • 由於對高性能 PCB 和大型智慧型手機電池空間的需求不斷增加，智慧型手機將繼續成為最大的最終用途產業。由於汽車電子產品的進步，預計汽車產業將在預測期內實現最高成長。
  • 亞太地區仍然是最大的市場，由於汽車電子含量的增加以及消費性電子和通訊產品的成長，預計在預測期內將經歷最高的成長。

亞太地區仍是最大的 HDI PCB 市場。

1.美國：英特爾公司、蘋果公司和高通等公司在HDI PCB技術方面處於主導地位。美國政府致力於推動半導體製造創新，正在推動HDI PCB的研發，應用於智慧型手機、筆記型電腦和汽車電子領域。

2.中國：華為技術有限公司、騰訊控股有限公司和小米公司等中國公司是該市場的主要參與者。中國政府對半導體產業的支持和「中國製造2025」計畫等措施正在推動HDI PCB技術在通訊、消費性電子和汽車應用中的採用。

3.德國：博世、西門子、英飛凌等公司在市場上佔有重要地位。德國政府推動工業 4.0 和數位化的舉措正在推動智慧製造和汽車電子領域 HDI PCB 的創新。

4.台灣：台積電、富士康科技集團等台灣企業在HDI PCB製造中扮演重要角色。政府對台灣半導體產業的支持以及對技術研究的投資正在加速各種電子設備的HDI PCB技術的進步。

5.日本：Sony Corporation、Panasonic Corporation、Canon Inc.等公司活躍在HDI PCB市場。日本政府對技術研究的投資以及與公司的合作正在促進消費性電子產品、醫療設備和汽車系統的 HDI PCB 的開發。

HDI PCB市場新趨勢

對產業動態有直接影響的新興趨勢包括電子產品的小型化以及對低損耗/高速 HDI PCB 不斷成長的需求。

HDI PCB市場近期趨勢

1.消費電子領域對HDI PCB的需求不斷成長 在更小尺寸、更高功能和更高性能等趨勢的推動下，消費性電子領域對HDI PCB的需求持續成長。用於智慧型手機、平板電腦、穿戴式裝置和其他可攜式電子設備的 HDI PCB 訂單正在迅速增加。採用先進的 HDI 技術（例如雷射鑽孔和連續式層壓）可以生產超緊湊的 PCB 設計，並提高完整性和可靠性。

2.擴大HDI PCB產能：領先的PCB製造商正在擴大其HDI PCB產能，以滿足各個最終用途行業不斷成長的需求。公司正在投資新的製造設施、設備升級和流程最佳化，以提高產量和效率。此次產能擴張旨在滿足市場對高密度、高性能PCB解決方案的需求，並支援下一代電子產品的開發。

3.專注於先進的HDI技術：PCB製造商專注於推進HDI技術，以滿足現代電子設備不斷發展的要求。最近的趨勢包括雷射鑽孔、微孔形成和互連技術的創新，以增加層數、縮小跡線/空間寬度並提高完整性。這些技術進步使得 HDI 印刷基板的開發具有改進的電氣性能、溫度控管和可靠性，支援尖端電子設備的設計和製造。

4. HDI印刷電路基板在汽車應用中的興起：由於ADAS（高級駕駛輔助系統）、資訊娛樂系統和電動車（EV）技術的日益採用，HDI印刷電路基板在汽車應用中越來越受歡迎。汽車製造商依靠 HDI 印刷電路基板來製造小型、輕量的電子模組，從而在惡劣的汽車環境中提供卓越的性能和可靠性。 HDI 技術允許將複雜的功能整合到更小的外形規格中，支援更智慧、更連網型的車輛的開發。

5.5G基礎設施對HDI印刷電路基板的需求：5G網路的部署正在增加基地台、天線和路由器等通訊基礎設施設備對HDI PCB的需求。 HDI PCB 在支援 5G通訊系統的高速、高頻要求、實現更快的資料傳輸、更低的延遲和更大的網路容量方面發揮關鍵作用。製造商正在加大針對 5G 應用最佳化的 HDI PCB 的生產，採用先進材料和設計技術，以滿足下一代無線網路的嚴格性能標準。

常問問題

Q1.市場規模為：

A1. 到2030年，全球HDI PCB市場預計將達到208億美元。

Q2.市場成長預測是多少：

A2. 2024年至2030年，HDI PCB市場預計將以4.8%的複合年成長率成長。

Q3.影響市場成長的主要促進因素是：

A3. 該市場的主要促進因素是消費性電子市場的成長、電子設備的小型化以及對高性能設備的需求不斷增加。

Q4.HDI PCB的主要用途和最終用途產業有哪些？

A4. 智慧型手機、平板電腦和電腦是HDI PCB市場的主要最終用途產業。

Q5.HDI PCB市場有哪些新趨勢？

A5. 將直接影響產業動態的新興趨勢包括電子設備的小型化以及對低損耗/高速 HDI 印刷電路基板不斷成長的需求。

Q6.主要企業有哪些？

A6. 主要HDI PCB公司如下：

  • TTM Technologies, Inc.
  • Tripod Technology Corporation
  • AT&S
  • Kingboard Holdings Ltd.
  • CCTC
  • DG Shengyi Electronics
  • Dynamic Electronics Co. Ltd.
  • Gold Circuit Electronics
  • Olympic
  • DAP
  • Unimicron Technology Corp.
  • Compeq Manufacturing Co., Ltd.
  • Ibiden Co., Ltd.
  • Zhen Ding Technology Holding Limited
  • Unitech
  • Samsung Electro-Mechanics
  • Meiko Electronics Co. Ltd

Q7. 未來哪個HDI印刷基板技術領域將成為最大？

A7.Lucintel 預測，由於智慧型手機、電信和資料通訊的需求不斷成長，4-6 級仍將是最大的細分市場。由於智慧型穿戴裝置和連網型設備的需求不斷成長，預計 10 層以上 HDI PCB 市場將在預測期內實現最高成長。

Q8.未來五年，哪個地區的 HDI PCB 市場預計成長最快？

A8.預計未來五年亞太地區仍將是最大的地區並呈現最高的成長。

Q9. 可以客製化報告嗎？

A9. 是的，Lucintel 提供 10% 的客製化服務，無需額外付費。

目錄

第1章執行摘要

第2章 市場背景及分類

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球HDI PCB市場趨勢（2018-2023）與預測（2024-2030）
  • 按最終用途行業分類的 HDI PCB 市場
    • 智慧型手機和平板電腦
    • 電腦
    • 通訊/資料通訊
    • 家用電器
    • 車
    • 其他
  • 按技術分類的 HDI PCB 市場
    • 4-6層HDI PCB
    • 8-10層HDI PCB
    • 10層以上HDI PCB
  • 按建構結構分類的 HDI PCB 市場
    • 1+N+1 HDI PCB
    • 2+N+2 HDI PCB
    • 3+N+3 HDI PCB
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 按地區分類的 HDI PCB 市場
  • 北美HDI PCB市場
  • 歐洲HDI PCB市場
  • 亞太地區HDI PCB市場
  • 其他地區HDI PCB市場

第5章 競爭分析

  • 產品系列分析
  • 地理範圍
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 最終用途產業的 HDI PCB 市場成長機會
    • HDI PCB 市場成長機會（按技術）
    • 按建構結構分類的 HDI PCB 市場成長機會
    • 按地區分類的 HDI PCB 市場成長機會
  • 全球HDI PCB市場新趨勢
  • 戰略分析
    • HDI PCB市場新產品開發
    • 擴大全球HDI PCB市場產能
    • 全球HDI PCB市場併購
    • 全球HDI PCB市場技術發展

第7章主要企業概況

  • TTM Technologies, Inc.
  • Tripod Technology Corporation
  • AT&S
  • Kingboard Holdings Ltd.
  • CCTC
  • DG Shengyi Electronics
  • Dynamic Electronics Co. Ltd.
  • Gold Circuit Electronics
  • Olympic
  • DAP
  • Unimicron Technology Corp.
  • Compeq Manufacturing Co., Ltd.
  • Ibiden Co., Ltd.
  • Zhen Ding Technology Holding Limited
  • Unitech
  • Samsung Electro-Mechanics
  • Meiko Electronics Co. Ltd
簡介目錄

HDI PCB Market Trends and Forecast

The future of the global high-density interconnect (HDI) PCB market looks promising with opportunities in the smartphone, computer, telecom and datacom, consumer electronics, and automotive industries. The global HDI PCB market is expected to reach an estimated $20.8 billion by 2030 with a CAGR of 4.8% from 2024 to 2030. The major drivers for this market are growth in consumer electronics market, miniaturization of electronic devices, and increasing demand for high performance devices.

  • Lucintel forecasts that 4-6 layers will remain the largest segment due to increasing demand in smartphones and telecommunication equipment. The 10+ layer HDI PCB market is expected to witness the highest growth during the forecast period due to the growing demand for smart wearables and connected devices.
  • Smartphones will remain the largest end use industry due to the increasing demand for high performance PCB and growing demand for more space in smartphones for larger batteries. Automotive is expected to witness the highest growth over the forecast period due to advancement in automotive electronics.
  • Asia Pacific will remain the largest market, and it is also expected to witness the highest growth over the forecast period due to the increasing electronic content in automotive and growth in consumer electronic devices & telecommunication products.

Asia Pacific will remain the largest market in the HDI PCB Market

1. United States: Companies like Intel Corporation, Apple Inc., and Qualcomm Incorporated are leading initiatives in HDI PCB technology. The US government's focus on promoting innovation in semiconductor manufacturing drives research and development in HDI PCBs for applications in smartphones, laptops, and automotive electronics.

2. China: Chinese companies such as Huawei Technologies Co., Ltd., Tencent Holdings Limited, and Xiaomi Corporation are prominent players in the market. China's government support for the semiconductor industry and initiatives like the "Made in China 2025" plan drive the adoption of HDI PCB technology for telecommunications, consumer electronics, and automotive applications.

3. Germany: Companies like Bosch GmbH, Siemens AG, and Infineon Technologies AG are significant in the market. Germany's government initiatives to promote Industry 4.0 and digitalization drive innovation in HDI PCBs for smart manufacturing and automotive electronics.

4. Taiwan: Taiwanese companies such as Taiwan Semiconductor Manufacturing Company Limited (TSMC) and Foxconn Technology Group play a key role in HDI PCB manufacturing. Taiwan's government support for the semiconductor industry and investment in technology research accelerates advancements in HDI PCB technology for various electronic devices.

5. Japan: Companies like Sony Corporation, Panasonic Corporation, and Canon Inc. are active in the HDI PCB market. Japan's government investment in technology research and collaboration with companies promote the development of HDI PCBs for consumer electronics, medical devices, and automotive systems.

Emerging Trends in the HDI PCB Market

Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high-speed HDI PCBs.

A total of 99 figures / charts and 76 tables are provided in this 195-page report to help in your business decisions. Sample figures with insights are shown below.

HDI PCB Market by Segment

The study includes trends and forecast for the global high density interconnect (HDI) PCB market by end use industry, technology, build-up layer count, and region as follows:

By End Use Industry [$M and Thousand Sqm shipment analysis for 2018 - 2030]:

  • Smartphones and Tablets
  • Computers
  • Telecom/Datacom
  • Consumer Electronics
  • Automotive
  • Others

By Technology [$M and Thousand Sqm shipment analysis for 2018 - 2030]:

  • 4-6 Layer
  • 8-10 Layer
  • 10+ Layer

By Build-Up Structure [$M and Thousand Sqm shipment analysis for 2018 - 2030]:

  • 1+n+1
  • 2+n+2
  • 3+n+3
  • Others

By Region [$M and Thousand Sqm shipment analysis for 2018 - 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of HDI PCB Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies HDI PCB companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the HDI PCB companies profiled in this report includes.

  • TTM Technologies, Inc.
  • Tripod Technology Corporation
  • AT&S
  • Kingboard Holdings Ltd.
  • CCTC
  • DG Shengyi Electronics
  • Dynamic Electronics Co. Ltd.
  • Gold Circuit Electronics
  • Olympic
  • DAP
  • Unimicron Technology Corp.
  • Compeq Manufacturing Co., Ltd.
  • Ibiden Co., Ltd.
  • Zhen Ding Technology Holding Limited
  • Unitech
  • Samsung Electro-Mechanics
  • Meiko Electronics Co. Ltd

Recent Developments in the HDI PCB Market

1. Rising Demand for HDI PCBs in Consumer Electronics: The demand for HDI PCBs continues to grow in the consumer electronics sector, driven by trends such as miniaturization, increased functionality, and higher performance requirements. Manufacturers are witnessing a surge in orders for HDI PCBs used in smartphones, tablets, wearable devices, and other portable electronics. The adoption of advanced HDI technologies, including laser drilling and sequential lamination, enables the production of ultra-compact PCB designs with improved signal integrity and reliability.

2. Expansion of HDI PCB Production Capacity: Leading PCB manufacturers are expanding their production capacity for HDI PCBs to meet growing demand from various end-use industries. Companies are investing in new manufacturing facilities, equipment upgrades, and process optimizations to increase output and improve efficiency. The expansion of production capacity is aimed at addressing market demand for high-density, high-performance PCB solutions and supporting the development of next-generation electronic devices.

3. Focus on Advanced HDI Technologies: PCB manufacturers are focusing on advancing HDI technologies to meet the evolving requirements of modern electronic devices. Recent developments include innovations in laser drilling, microvia formation, and interconnection techniques to achieve higher layer counts, finer trace/space widths, and improved signal integrity. These technological advancements enable the development of HDI PCBs with enhanced electrical performance, thermal management, and reliability, supporting the design and production of cutting-edge electronics.

4. Rise of HDI PCBs in Automotive Applications: HDI PCBs are gaining traction in automotive applications, driven by the increasing adoption of advanced driver-assistance systems (ADAS), infotainment systems, and electric vehicle (EV) technology. Automakers are leveraging HDI PCBs to enable compact and lightweight electronic modules that deliver superior performance and reliability in harsh automotive environments. The use of HDI technology allows for the integration of complex functionalities into smaller form factors, supporting the development of smarter and more connected vehicles.

5. Demand for HDI PCBs in 5G Infrastructure: The rollout of 5G networks is fueling demand for HDI PCBs in telecommunications infrastructure equipment, including base stations, antennas, and routers. HDI PCBs play a crucial role in supporting the high-speed, high-frequency requirements of 5G communication systems, enabling faster data transmission, lower latency, and greater network capacity. Manufacturers are ramping up production of HDI PCBs optimized for 5G applications, incorporating advanced materials and design techniques to meet the stringent performance criteria of next-generation wireless networks.

Features of HDI PCB Market

  • Market Size Estimates: High Density Interconnect (HDI) PCB market size estimation in terms of value ($M) and Volume (Thousand Sqm)
  • Trend and Forecast Analysis: Market trends (2018-2023) and forecast (2024-2030) by various segments and regions.
  • Segmentation Analysis: High Density Interconnect (HDI) PCB market size by various segments, such as end use industry, technology, and built-up structure, in terms of value and volume.
  • Regional Analysis: High Density Interconnect (HDI) PCB market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in various end use industries, technologies, built-up structures, and regions for the high density interconnect (HDI) PCB market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the high density interconnects (HDI) PCB market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the HDI PCB market size?

Answer: The global HDI PCB market is expected to reach an estimated $20.8 billion by 2030.

Q2. What is the growth forecast for HDI PCB market?

Answer: The HDI PCB market is expected to grow at a CAGR of 4.8% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the HDI PCB market?

Answer: The major drivers for this market are growth in the consumer electronics market, miniaturization of electronic devices, and increasing demand for high performance devices.

Q4. What are the major applications or end use industries for HDI PCB?

Answer: Smart phones and tablets, and computers are the major end use industries for HDI PCB market.

Q5. What are the emerging trends in HDI PCB market?

Answer: Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high-speed HDI PCBs.

Q6. Who are the key HDI PCB companies?

Answer: Some of the key HDI PCB companies are as follows:

  • TTM Technologies, Inc.
  • Tripod Technology Corporation
  • AT&S
  • Kingboard Holdings Ltd.
  • CCTC
  • DG Shengyi Electronics
  • Dynamic Electronics Co. Ltd.
  • Gold Circuit Electronics
  • Olympic
  • DAP
  • Unimicron Technology Corp.
  • Compeq Manufacturing Co., Ltd.
  • Ibiden Co., Ltd.
  • Zhen Ding Technology Holding Limited
  • Unitech
  • Samsung Electro-Mechanics
  • Meiko Electronics Co. Ltd

Q7.Which HDI PCB technology segment will be the largest in future?

Answer: Lucintel forecasts that 4-6 layers will remain the largest segment due to increasing demand in smartphone and telecom and datacom. The 10+ layer HDI PCB market is expected to witness the highest growth during the forecast period due to the growing demand for smart wearables and connected devices.

Q8: In HDI PCB market, which region is expected to be the largest in next 5 years?

Answer: Asia Pacific is expected to remain the largest region and witness the highest growth over next 5 years.

Q9. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

  • Q.1 What are some of the most promising potential, high-growth opportunities for the global high density interconnect (HDI) PCB market by end use industry (smartphones and tablets, computers, telecom/datacom, consumer electronics, automotive and others), technology (4-6 layer, 8-10 layer, 10+ layer), build-up layer count (1+n+1, 2+n+2, 3+n+3, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2 Which segments will grow at a faster pace and why?
  • Q.3 Which regions will grow at a faster pace and why?
  • Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the High Density Interconnect (HDI) PCB market?
  • Q.5 What are the business risks and threats to the high density interconnect (HDI) PCB market?
  • Q.6 What are the emerging trends in the high density interconnect (HDI) PCB market and the reasons behind them?
  • Q.7 What are some changing demands of customers in the high density interconnect (HDI) PCB market?
  • Q.8 What are the new developments in the high density interconnect (HDI) PCB market? Which companies are leading these developments?
  • Q.9 Who are the major players in the high density interconnect (HDI) PCB market? What strategic initiatives are being implemented by key players for business growth?
  • Q.10 What are some of the competitive products and processes in the high density interconnect (HDI) PCB market, and how big of a threat do they pose for loss of market share via material or product substitution?
  • Q.11 What M&A activities did take place in the last five years in the high density interconnect (HDI) PCB market?

Table of Contents

1. Executive Summary

2. Market Background and Classifications

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1: Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2: Global High Density Interconnect (HDI) PCB Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global High Density Interconnect (HDI) PCB Market by End Use Industry
    • 3.3.1: Smartphones and Tablets
    • 3.3.2: Computers
    • 3.3.3: Telecom/Datacom
    • 3.3.4: Consumer Electronics
    • 3.3.5: Automotive
    • 3.3.6: Others
  • 3.4: Global High Density Interconnect (HDI) PCB Market by Technology
    • 3.4.1: 4-6 Layer HDI PCBs
    • 3.4.2: 8-10 Layer HDI PCBs
    • 3.4.3: 10+ Layer HDI PCBs
  • 3.5: Global High Density Interconnect (HDI) PCB Market by Built-Up Structure
    • 3.5.1: 1+N+1 HDI PCBs
    • 3.5.2: 2+N+2 HDI PCBs
    • 3.5.3: 3+N+3 HDI PCBs
    • 3.5.4: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global High Density Interconnect (HDI) PCB Market by Region
  • 4.2: North American High Density Interconnect (HDI) PCB Market
    • 4.2.1: Market by End Use Industry
    • 4.2.2: Market by Technology
    • 4.2.3: Market by Built-Up Structure
  • 4.3: European High Density Interconnect (HDI) PCB Market
    • 4.3.1: Market by End Use Industry
    • 4.3.2: Market by Technology
    • 4.3.3: Market by Built-Up Structure
  • 4.4: APAC High Density Interconnect (HDI) PCB Market
    • 4.4.1: Market by End Use Industry
    • 4.4.2: Market by Technology
    • 4.4.3: Market by Built-Up Structure
  • 4.5: ROW High Density Interconnect (HDI) PCB Market
    • 4.5.1: Market by End Use Industry
    • 4.5.2: Market by Technology
    • 4.5.3: Market by Built-Up Structure

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Geographical Reach
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by End Use Industry
    • 6.1.2: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by Technology
    • 6.1.3: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by Built-Up Structure
    • 6.1.4: Growth Opportunities for the Global High Density Interconnect (HDI) PCB Market by Region
  • 6.2: Emerging Trends in the Global High Density Interconnect (HDI) PCB Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development in the Global High Density Interconnect (HDI) PCB Market
    • 6.3.2: Capacity Expansions in the Global High Density Interconnect (HDI) PCB Market
    • 6.3.3: Mergers and Acquisitions in the Global High Density Interconnect (HDI) PCB Market
    • 6.3.4: Technology Development of the Global High Density Interconnect (HDI) PCB Market

7. Company Profiles of Leading Players

  • 7.1: TTM Technologies, Inc.
  • 7.2: Tripod Technology Corporation
  • 7.3: AT&S
  • 7.4: Kingboard Holdings Ltd.
  • 7.5: CCTC
  • 7.6: DG Shengyi Electronics
  • 7.7: Dynamic Electronics Co. Ltd.
  • 7.8: Gold Circuit Electronics
  • 7.9: Olympic
  • 7.10: DAP
  • 7.11: Unimicron Technology Corp.
  • 7.12: Compeq Manufacturing Co., Ltd.
  • 7.13: Ibiden Co., Ltd.
  • 7.14: Zhen Ding Technology Holding Limited
  • 7.15: Unitech
  • 7.16: Samsung Electro-Mechanics
  • 7.17: Meiko Electronics Co. Ltd