面板級封裝的全球市場：市場佔有率分析、產業趨勢/統計、成長預測（2024-2029）

Panel Level Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)

出版日期: 2024年08月14日 | 出版商:

Mordor Intelligence | 英文 112 Pages | 商品交期: 2-3個工作天內

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簡介目錄

預計2024年全球面板級封裝市場規模將達2.5億美元，2029年將達13.8億美元，預計在預測期內（2024-2029年）複合年成長率為41.07%。

半導體產業正在經歷快速成長，半導體已成為所有現代技術的基本組成部分。該領域的進步和創新對所有下游技術產生直接影響，從而推動了市場研究的需求。

主要亮點

隨著半導體產業重要性的增加，對增強封裝解決方案的需求也在增加，從而導致了新的半導體封裝技術的發展。
面板級封裝（PLP）是最近備受關注的技術。 PLP是指以面板尺寸加工的半導體封裝。對於面板級封裝，組裝過程包括面板級的晶片貼裝、重新佈線、成型和凸塊製造。
由於更多的封裝以面板並行格式進行處理，因此與圓形晶圓幾何形狀相比，這種類型的封裝提供了更好的面積利用率（面板/晶圓尺寸與封裝尺寸之間的差異）。因此，包裝成本的降低已成為市場成長的主要動力之一。 PLP 對環境的影響也很小，因為它產生的廢棄物較少，碳足跡也較少。
面板級封裝（PLP）市場也面臨挑戰。該技術的高成本及其實施的複雜性可能會阻礙其廣泛接受。封裝製程有兩種類型：模具領先型和RDL領先型。然而，這種封裝類型會帶來晶片移位的問題。晶片移位被認為是最大的問題之一，因為它會降低產量比率或對產量比率產生負面影響。這增加了對包裝過程進行更大控制的需求，從而增加了複雜性並限制了市場成長。
在後 COVID-19 時期，由於成本效益以及從晶圓到大型面板格式的封裝尺寸的增加，面板級封裝預計將獲得更多關注。並行製造的封裝數量的增加也是支持市場成長的主要優勢。 PLP 可以採用其他技術領域的製程、材料和設備。印刷電路基板(PCB)、液晶顯示器 (LCD)、太陽能設備等均以面板尺寸製造，為扇出面板級封裝提供了一種新方法。

面板級封裝市場趨勢

市場區隔：家電產業佔主要佔有率

智慧型手機、穿戴式裝置、平板裝置等家用電器變得越來越薄、越來越小。為了滿足更小尺寸和更輕重量的需求，PLP 允許製造商增加組件密度並更有效地利用空間。對於這些設備，PLP 減少的佔地面積對於實現複雜的設計和充分利用可用空間至關重要。
消費性電子產業與努力實現產品差異化的製造商競爭。 PLP 透過在消費性電子產品中實現複雜的設計、增加的功能和改進的性能來提供市場優勢。為了維持市場地位，製造商正在利用 PLP 來滿足消費者需求並推出創新產品。
近年來，5G和物聯網的日益普及為市場創造了巨大的成長機會。例如，根據 5G Americas 的數據，全球 5G 用戶數量預計在 2024 年將達到 28 億，2027 年將達到 59 億。
隨著5G投資的增加，對相容5G的智慧型手機的需求也隨之增加。 Cybermedia Research 的一份報告顯示，自 2020 年首次推出以來，5G 智慧型手機銷量成長了 13 倍，到 2023年終，5G 智慧型手機出貨量每年成長 70%。 5G智慧型手機的市場佔有率預計到2023年將達到45%，而2020年僅為4%。
同樣，由於物聯網 (IoT) 的日益普及，連接設備的數量近年來也迅速增加，物聯網是一種使用網際網路和支援 IP 的通訊協定來實現物與人之間通訊的技術。例如，據思科稱，到 2023 年，連網設備數量將達到 293 億台。物聯網用例的顯著擴展預計將成為市場成長的主要驅動力。

中國可望引領市場

中國是最大的半導體消費國，這主要得益於國內電子市場的規模。該國是世界上最大的消費性電子產品生產國和出口國，許多全球供應商都建立了設施以利用低廉的勞動力成本。
電子製造業近期也持續穩定擴張。根據工業信部《中國日報》報道，2023年，電子資訊製造業主要企業付加增加價值年均成長3.4%。工信部表示，主要產品中，行動電話產量15.7億部，與前一年同期比較成長6.9%，其中智慧型手機11.4億部，與前一年同期比較成長1.9%。近年來，為促進電子產業的成長做出了多項努力。
中國在5G採用方面也處於世界領先地位。根據工業和資訊化部 (MIIT) 的數據，截至 2023 年 2 月，中國的 5G 用戶目標為 5.9201 億。到 2025 年，這一數字預計將超過 10 億。基礎設施建設正在進行中，以擴大 5G 在中國的普及。
例如，截至2023年10月，中國約有322萬個5G基地台，佔所有行動基地台的28.1%。
隨著5G在日本的普及，5G相容設備的普及也不斷增加。例如，根據中國通訊研究院預測，2023年全國5G智慧型手機出貨量將與前一年同期比較增加約11.9%，達到2.4億台，整體智慧型手機出貨量市場將與前一年同期比較增加約1.1%。這些趨勢預計將有利於該國研究市場的成長，因為先進的封裝技術可以幫助解決 5G 晶片的許多性能要求。
此外，中國在生產和消費方面均領先汽車市場，預計將有利於該國的市場成長。對更清潔、更安全的車輛的需求不斷成長是該國汽車行業的主要趨勢之一，並正在推動所研究市場的成長。自動駕駛汽車、電氣化、機艙豐富化、連接性和軟體定義以及區域架構等主要行業趨勢也支持汽車行業的市場成長。

面板級封裝產業概述

面板級封裝市場處於半固化狀態，主要參與者包括三星電子、英特爾公司、Nepes 公司、日月光集團和力成科技公司。市場公司正在採取聯盟和收購等策略來增強其產品陣容並獲得永續的競爭優勢。

2023年12月－NEPES開發了“METIS”，一種用於邊緣運算的智慧半導體。 Metis 採用了 Nepes 尖端 2.5D 和 3D 封裝平台 nePACTM 中的 cx-BGA（球柵陣列）。 nePACTM是新一代尖端封裝技術，基於扇出技術和覆晶接合技術，實現多層佈線和精細RDL佈線。適用於人工智慧半導體等高整合、高性能晶片。
2023年6月－日月光科技控股子公司環旭電子在波蘭設立工廠。此舉反映出歐洲客戶對該公司產品的需求不斷成長。此次擴建將使環旭電子能夠在波蘭生產更多產品，以滿足客戶需求並因應市場成長。

其他好處：

Excel 格式的市場預測 (ME) 表
3 個月的分析師支持

Key Highlights

With the importance of the semiconductor industry growing, the demand for enhanced packaging solutions is also increasing, leading to the development of new semiconductor packaging techniques.
Panel-level packaging (PLP) is a technology that has gained prominence recently. PLP refers to semiconductor packaging processed on a panel size. In panel-level packaging, the assembly process includes the fabrication of die attach, redistribution lines, molding, and bumping at the panel level.
As more packages may be processed in panel and parallel formats, this type of packaging facilitates a much better area utilization (ratio between panel/wafer size and package size) compared to round wafer shapes. Hence, a lower packaging cost is among the primary drivers for the market's growth. PLP has a lower environmental impact due to a lower waste generation and carbon footprint.
The panel-level packaging (PLP) market also encounters certain challenges. The substantial expenses linked to the technology and the intricate nature of its implementation might impede its extensive acceptance. The packaging process involves both types, mold first and RDL first. However, the type of packaging involves problems in die shift. Shifting the die is considered one of the biggest issues as it may cause lesser yield or negatively influence the yields. This increases the need for more control over the packaging process and adds complexity, restraining the market's growth.
In the post-COVID-19 period, the focus on panel-level packaging is anticipated to increase due to the cost benefits and the expansion of the packaging size from wafers to larger panel formats. Increasing the number of packages manufactured in parallel is another major advantage supporting the market's growth. PLP may adopt processes, materials, and equipment from other technology areas. Printed circuit boards (PCB), liquid crystal displays (LCD), or solar equipment are manufactured on panel sizes and offer new approaches for fan-out panel-level packaging.

Panel Level Packaging Market Trends

Consumer Electronics Segment to Hold Major Market Share

Consumer electronics such as smartphones, wearables, and tablets are becoming increasingly thin and compact. To meet the needs of miniaturization and light form factors, PLP allows manufacturers to achieve greater component density and more efficient use of space. For these devices, the reduced footprint caused by PLP is essential as it will enable sleek designs and maximize their utilization of available space.
The consumer electronics industry competes with manufacturers who strive to differentiate products. By enabling sleek designs, increased functionality, and improved performance for consumer electronics devices, PLP provides an advantage to the market. To maintain their position in the market, manufacturers take advantage of PLP to meet consumer demands and introduce innovative products.
The increasing penetration of 5G and IoT in recent years presents significant growth opportunities for the market. For instance, as per 5G Americas, the 5G subscriptions worldwide are estimated to reach 2.8 billion in 2024 and 5.9 billion by 2027.
With the rising investments in 5G, the demand for 5G-enabled smartphones is also increasing parallelly. According to a report from Cybermedia Research, by the end of 2023, after recording a 13 times increase in 5G smartphone sales since its first introduction in 2020, shipments of 5G smartphones increased by 70% yearly. From only 4% in 2020, 5G smartphones were projected to capture a possible 45% market share in 2023.
Similarly, owing to the rising adoption of the Internet of Things (IoT), the technology that enables communications between things and people using the Internet and IP-enabled protocols, the number of connected devices has been increasing rapidly in recent years. For instance, as per Cisco, there would be 29.3 billion networked devices in 2023. The massive expansion in IoT use cases will provide a significant impetus to market growth.

China is Expected to Lead the Market

China is the largest semiconductor consumer, primarily due to the size of the domestic electronics market. The country is the world's largest producer and exporter of consumer electronics, as a significantly more significant number of global vendors have established their facilities to leverage the benefits of cheap labor costs.
The electronics manufacturing industry has also recently continued to maintain steady expansion. As per a report by the Ministry of Industry and Information Technology via China Daily, in 2023, the industrial added value of major companies in the electronic information manufacturing sector grew by 3.4% yearly. According to the ministry, among significant products, the output of mobile phones increased by 6.9% Y-o-Y to 1.57 billion units, within which the number of smartphones increased by 1.9% Y-o-Y to 1.14 billion units. Several initiatives have been taken in recent years to boost the electronics industry's growth.
China also leads in 5G adoption globally. According to the Ministry of Industry and Information Technology (MIIT), China aims to have 592.01 million 5G users as of February 2023. This number is anticipated to surpass 1 billion mark by 2025. A combined effort is being made to develop the supporting infrastructure to expand the footprint of 5G across the country.
For instance, as of October 2023, China had about 3.22 million 5G base stations, constituting 28.1% of its entire mobile base station.
The growing implementation of 5G in the country has also increased the uptake of 5G-enabled devices. For instance, according to the China Academy of Information and Communications Technology (CAICT), in 2023, 5G smartphone shipments in the country grew by about 11.9% Y-o-Y to 240 million units, while the overall smartphone shipments market grew by about 1.1%, compared to the previous year. As advanced packaging technologies may help resolve many of the 5G chip performance requirements, such trends are anticipated to favor the studied market's growth in the country.
China is also a leading automotive market in production and consumption, which is anticipated to favor the market's growth in the country. The rising demand for cleaner and safer vehicles is among the major trends in the country's automotive industry, which supports the studied market's growth. Industry megatrends, including autonomous vehicles, electrification, enriched cabins, connectivity and software definition, and zonal architecture, also support the market's growth in the automotive segment.

Panel Level Packaging Industry Overview

The panel level packaging market is semi-consolidated with the presence of major players like Samsung Electronics Co. Ltd, Intel Corporation, Nepes Corporation, ASE Group, and Powertech Technology Inc. Players in the market are adopting strategies such as partnerships and acquisitions to enhance their product offerings and gain sustainable competitive advantage.

December 2023 - NEPES developed 'METIS,' an intelligent semiconductor for edge computing. Metis applied cx-BGA (Ball Grid Array) of nePACTM, Nepes' cutting-edge 2.5D & 3D package platform. nePACTM is a next-generation cutting-edge package technology that implements multi-layer and fine RDL wiring based on fan-out technology and flip-chip bonding technology. It is suitable for highly integrated, high-performance chips such as artificial intelligence semiconductors.
June 2023 - USI, a subsidiary of ASE Technology Holding Co. Ltd, inaugurated another factory in Poland. This move reflects the growing need for the company's products from European customers. By expanding, USI may make more goods in Poland, meet customer needs, and keep up with market growth.

Additional Benefits:

The market estimate (ME) sheet in Excel format
3 months of analyst support

1 INTRODUCTION

1.1 Study Assumptions and Market Definition
1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

4.1 Market Overview
4.2 Industry Attractiveness - Porter's Five Forces Analysis
- 4.2.1 Bargaining Power of Suppliers
- 4.2.2 Bargaining Power of Buyers
- 4.2.3 Threat of New Entrants
- 4.2.4 Threat of Substitute Products
- 4.2.5 Intensity of Competitive Rivalry
4.3 Industry Value Chain/Supply Chain Analysis
4.4 Assessment of Impact of Macroeconomic Factors on the Market

5 MARKET DYNAMICS

5.1 Market Drivers
- 5.1.1 Reduced Cost of Packaging Process
- 5.1.2 Increasing Demand for Compact and High Functionality Electronic Devices
- 5.1.3 Increased Investment on Research and Development Activities
5.2 Market Restraints
- 5.2.1 Complexity in Packaging Process

6 MARKET SEGMENTATION

6.1 By Industry Application
- 6.1.1 Consumer Electronics
- 6.1.2 Automotive
- 6.1.3 Telecommunication
- 6.1.4 Other Industry Applications
6.2 By Geography
- 6.2.1 United States
- 6.2.2 China
- 6.2.3 Korea
- 6.2.4 Taiwan
- 6.2.5 Japan
- 6.2.6 Europe
- 6.2.7 Rest of the World

7 COMPETITIVE LANDSCAPE

7.1 Company Profiles*
- 7.1.1 Samsung Electronics Co. Ltd
- 7.1.2 Intel Corporation
- 7.1.3 Nepes Corporation
- 7.1.4 ASE Group
- 7.1.5 Powertech Technology Inc.
- 7.1.6 Fraunhofer Institute for Reliability and Micro integration IZM
- 7.1.7 Unimicron Technology Corporation
- 7.1.8 DECA Technologies Inc.
- 7.1.9 JCET/ STATSChipPAC