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市場調查報告書
商品編碼
1702689

2025年先進晶片封裝全球市場報告

Advanced Chip Packaging Global Market Report 2025
出版日期: | 出版商: The Business Research Company | 英文 200 Pages | 商品交期: 2-10個工作天內

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簡介目錄

預計未來幾年先進晶片封裝的市場規模將快速成長。到 2029 年，這一數字將成長至 286.9 億美元，複合年成長率為 18.2%。預測期內的成長可歸因於 5G 技術的廣泛採用、物聯網 (IoT) 設備的成長、人工智慧 (AI) 和機器學習的興起以及穿戴式技術的擴展。預測期內先進封裝趨勢包括 3D 封裝技術的日益普及、先進的溫度控管、高密度互連技術的進步、扇出晶圓層次電子構裝技術的擴展以及軟性和伸縮性封裝技術的發展。

家用電子電器需求的成長預計將推動先進晶片封裝市場的成長。家用電子電器包括智慧型手機、平板電腦、筆記型電腦等。網際網路和無線網路的擴張大大增加了對這些設備的需求。先進的晶片封裝技術有助於將多種功能整合到緊湊的設計中，這對於高性能家用電子電器至關重要。這些技術提高了處理能力、效率和散熱性，從而能夠創造出功能豐富、緊湊的設備。例如，根據日本電子情報技術產業協會2023年5月發布的報告，消費性電子產品的產值達到2.095億美元，與前一年同期比較成長127%。因此，家用電子電器需求的不斷成長刺激了先進晶片封裝市場的擴張。

先進晶片封裝市場的關鍵參與者正專注於晶片規模封裝 (CSP) 技術的開發，以提高半導體裝置的性能、小型化和可靠性。 CSP技術涉及封裝尺寸與半導體晶片本身大致相同的封裝。 2022 年 9 月，美國LED 創新公司 Bridgelux Inc. 推出了晶片級封裝 (CSP) LED，提供 1800K 至 6500K 的溫度、70 至 95 的 CRI 值以及全光譜的 RGB 顏色。這款 LED 採用磷光體塗層覆晶技術，無需接合線和塑膠成型，從而改善了溫度控管並提高了流明產量。 CSP2727 車型擁有業界領先的功效，350 mA 時為 209 lm/W，700 mA 時為 190 lm/W，適用於商業照明應用。 CSP LED 有利於平滑、靈活的基板組裝，從而為商業、娛樂、工業和戶外等各種照明應用創建客戶特定的板上晶片 (COB) 模組。

目錄

第1章執行摘要

第2章 市場特徵

第3章 市場趨勢與策略

第4章 市場 - 宏觀經濟情景，包括利率、感染疾病、地緣政治、新冠疫情、經濟復甦對市場的影響

第5章 全球成長分析與策略分析框架

  • 全球先進晶片封裝PESTEL分析（政治、社會、技術、環境、法律因素、促進因素與限制因素）
  • 最終用途產業分析
  • 全球先進晶片封裝市場：成長率分析
  • 全球先進晶片封裝市場表現：規模與成長，2019-2024
  • 全球先進晶片封裝市場預測：規模與成長，2024-2029 年，2034 年
  • 全球先進晶片封裝總目標市場（TAM）

第6章市場區隔

  • 全球先進晶片封裝市場（依封裝類型、效能及預測）：2019-2024 年、2024-2029 年、2034 年
  • 球柵陣列（BGA）
  • 四方扁平封裝（QFP）
  • 晶片級封裝（CSP）
  • 晶圓級晶片尺寸封裝 (WLCSP)
  • 全球先進晶片封裝市場技術、效能及預測（2019-2024 年、2024-2029 年及 2034 年）
  • 5D包裝
  • 3D（3D）包裝
  • 扇出型晶圓級封裝
  • 覆晶構裝
  • 系統級封裝解決方案
  • 全球先進晶片封裝市場依終端用途產業、績效及預測，2019-2024 年、2024-2029 年、2034 年
  • 電子產品
  • 車
  • 通訊
  • 產業
  • 衛生保健
  • 航太和國防
  • 全球先進晶片封裝市場球柵陣列（BGA）細分（按類型）、績效及預測，2019-2024 年、2024-2029 年、2034 年
  • 微型BGA
  • 帶狀BGA
  • 塑膠球柵陣列 (PBGA)
  • 陶瓷球柵陣列 (CBGA)
  • 全球先進晶片封裝市場，以四方扁平封裝 (QFP) 類型細分，效能與預測，2019-2024 年、2024-2029 年、2034 年
  • 薄型QFP（TQFP）
  • 塑膠QFP（PQFP）
  • Low profileQFP（LQFP）
  • 散熱器QFP（HQFP）
  • 全球先進晶片封裝市場按晶片級封裝 (CSP) 類型細分，實際狀況及預測，2019-2024 年、2024-2029 年、2034 年
  • 覆晶CSP
  • 晶圓級晶片尺寸封裝
  • 扇入 CSP
  • 扇出型CSP
  • 全球先進晶片封裝市場，按晶圓級晶片規模封裝 (WLCSP) 類型細分，性能和預測，2019-2024 年、2024-2029 年、2034 年
  • 覆晶WLCSP
  • 線路重布(RDL) WLCSP
  • 扇出型WLCSP
  • 凸塊WLCSP

第7章 區域和國家分析

  • 全球先進晶片封裝市場：依地區、績效及預測，2019-2024 年、2024-2029 年、2034 年
  • 全球先進晶片封裝市場：依國家/地區、業績及預測，2019-2024 年、2024-2029 年、2034 年

第8章 亞太市場

第9章：中國市場

第10章 印度市場

第11章 日本市場

第12章 澳洲市場

第13章 印尼市場

第14章 韓國市場

第15章 西歐市場

第16章英國市場

第17章 德國市場

第18章 法國市場

第19章：義大利市場

第20章：西班牙市場

第21章 東歐市場

第22章 俄羅斯市場

第23章 北美市場

第24章美國市場

第25章：加拿大市場

第26章 南美洲市場

第27章：巴西市場

第28章 中東市場

第29章：非洲市場

第30章競爭格局與公司概況

  • 先進晶片封裝市場：競爭格局
  • 先進晶片封裝市場：公司簡介
    • Samsung Electronics Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • Advanced Micro Devices Inc. Overview, Products and Services, Strategy and Financial Analysis
    • Advanced Semiconductor Engineering Inc Overview, Products and Services, Strategy and Financial Analysis
    • Henkel Group Overview, Products and Services, Strategy and Financial Analysis
    • Texas Instruments Incorporated Overview, Products and Services, Strategy and Financial Analysis

第31章 其他大型創新企業

  • Lam Research Corporation
  • NXP Semiconductors
  • Onsemi
  • Amkor Technology
  • Nordson Corporation
  • Siliconware Precision Industries Co. Ltd.
  • Kulicke and Soffa Industries Inc.
  • ChipMOS Technologies Inc.
  • SUSS MicroTec SE
  • EV Group
  • Indium Corporation
  • Palomar Technologies
  • Brewer Science Inc.
  • MacDermid Alpha Electronics Solutions
  • Universal Instruments Corporation

第 32 章全球市場競爭基準化分析與儀表板

第33章 重大併購

第34章近期市場趨勢

第 35 章 高市場潛力國家、細分市場與策略

  • 2029年先進晶片封裝市場：提供新機會的國家
  • 2029年先進晶片封裝市場：細分領域帶來新機會
  • 2029年先進晶片封裝市場：成長策略
    • 基於市場趨勢的策略
    • 競爭對手的策略

第36章 附錄

簡介目錄
Product Code: r29341

Advanced chip packaging refers to advanced processes and technologies used to encase and connect semiconductor devices (chips) to their external environments, commonly found within electronic devices. This method offers design flexibility, allowing for the creation of tailored solutions for specific applications and performance requirements.

The main types of advanced chip packaging include ball grid array (BGA), quad flat package (QFP), chip scale package (CSP), and wafer-level chip scale package (WLCSP). A ball grid array is an integrated circuit packaging type that employs an array of solder balls on the bottom of the package to provide electrical connections to the printed circuit board. This design facilitates higher pin counts, enhanced thermal performance, and more compact designs compared to traditional pin-based packages. Technologies such as five-dimensional (5D) packaging, three-dimensional (3D) packaging, fan-out wafer-level packaging, flip-chip packaging, and system-in-package solutions are utilized in various industries, including electronics, automotive, telecommunications, industrial, healthcare, aerospace, and defense.

The advanced chip packaging market research report is one of a series of new reports from The Business Research Company that provides advanced chip packaging market statistics, including the advanced chip packaging industry global market size, regional shares, competitors with the advanced chip packaging market share, detailed advanced chip packaging market segments, market trends, and opportunities, and any further data you may need to thrive in the advanced chip packaging industry. These advanced chip packaging market research reports deliver a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.

The advanced chip packaging market size has grown rapidly in recent years. It will grow from $12.41 billion in 2024 to $14.71 billion in 2025 at a compound annual growth rate (CAGR) of 18.5%. The growth in the historic period can be attributed to the demand for smaller, more powerful consumer electronics, the rise of mobile devices and smartphones, the growth of high-speed data networks, increasing automotive electronics, and the evolution of computing needs.

The advanced chip packaging market size is expected to see rapid growth in the next few years. It will grow to $28.69 billion in 2029 at a compound annual growth rate (CAGR) of 18.2%. The growth in the forecast period can be attributed to the proliferation of 5G technology, the growth of the Internet of Things (IoT) devices, the rise of artificial intelligence (AI) and machine learning, the expansion of wearable technology. Major trends in the forecast period include the growing adoption of 3D packaging technologies, advanced thermal management, advancements in high-density interconnect technologies, expansion of fan-out wafer-level packaging technologies, and development of flexible and stretchable packaging technologies.

The rising demand for consumer electronic devices is anticipated to drive the growth of the advanced chip packaging market. Consumer electronic devices, which are designed for everyday use in private homes, include smartphones, tablets, and laptops. The expansion of internet and wireless networks has significantly increased the demand for these devices. Advanced chip packaging technologies facilitate the integration of multiple functions into compact designs, which are essential for high-performance consumer electronics. These technologies improve processing power, efficiency, and heat dissipation, enabling the creation of feature-rich, compact devices. For instance, a report published by the Japan Electronics and Information Technology Industries Association in May 2023 indicated that consumer electronics production reached $209.50 million, representing a 127% increase compared to the previous year. Consequently, the growing demand for consumer electronic devices is fueling the expansion of the advanced chip packaging market.

Major players in the advanced chip packaging market are focusing on the development of chip-scale package (CSP) technology to enhance semiconductor device performance, miniaturization, and reliability. CSP technology involves packaging where the package dimensions are nearly the same as the semiconductor chip itself. In September 2022, Bridgelux Inc., a US-based LED innovation company, introduced its Chip Scale Package (CSP) LEDs, which range from 1800K to 6500K, with CRI values from 70 to 95, and offer RGB color to full spectrum. Utilizing flip-chip technology with a phosphor coating, these LEDs eliminate the need for bond wires and plastic molds, resulting in improved heat management and increased luminous flux production. The CSP2727 model boasts an industry-leading efficacy of 209 lm/W at 350 mA and 190 lm/W at 700 mA, making it well-suited for commercial lighting applications. The CSP LEDs facilitate smooth and flexible board assembly, allowing for the creation of customer-specific Chip-on-Board (COB) modules for various lighting applications including commercial, entertainment, industrial, and outdoor settings.

In November 2022, Lam Research Corporation, a US-based semiconductor company, acquired SEMSYSCO GmbH for an undisclosed amount. This acquisition expands Lam Research's capabilities in innovative packaging solutions, particularly for advanced logic chips and chipset-based systems. The acquisition includes a state-of-the-art research and development facility located in Austria, which enhances Lam Research's expertise in next-generation substrates and heterogeneous packaging. SEMSYSCO GmbH, an Austria-based provider of wet-processing semiconductor equipment, will contribute to Lam Research's advanced chip packaging efforts.

Major companies operating in the advanced chip packaging market are Samsung Electronics Co. Ltd., Advanced Micro Devices Inc., Advanced Semiconductor Engineering Inc, Henkel Group, Texas Instruments Incorporated, Lam Research Corporation, NXP Semiconductors, Onsemi, Amkor Technology, Nordson Corporation, Siliconware Precision Industries Co. Ltd., Kulicke and Soffa Industries Inc., ChipMOS Technologies Inc., SUSS MicroTec SE, EV Group, Indium Corporation, Palomar Technologies, Brewer Science Inc., MacDermid Alpha Electronics Solutions, Universal Instruments Corporation, CHIPBOND Technology Corporation

Asia-Pacific was the largest region in the advanced chip packaging market in 2024. The regions covered in the advanced chip packaging market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the advanced chip packaging market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The advanced chip packaging market consists of revenues earned by entities by providing services such as multi-chip modules, through-silicon vias, lead frame packages, and embedded die packaging. The market value includes the value of related goods sold by the service provider or included within the service offering. The advanced chip packaging market also includes sales of wire bonders, encapsulation equipment, die-attach equipment, and test and inspection equipment. Values in this market are 'factory gate' values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Advanced Chip Packaging Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on advanced chip packaging market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

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Where is the largest and fastest growing market for advanced chip packaging ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The advanced chip packaging market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

  • The market characteristics section of the report defines and explains the market.
  • The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
  • The forecasts are made after considering the major factors currently impacting the market. These include:

The forecasts are made after considering the major factors currently impacting the market. These include the Russia-Ukraine war, rising inflation, higher interest rates, and the legacy of the COVID-19 pandemic.

  • Market segmentations break down the market into sub markets.
  • The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
  • The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
  • The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

  • Markets Covered:1) By Packaging: Ball Grid Array (BGA); Quad Flat Package (QFP); Chip Scale Package (CSP); Wafer-Level Chip Scale Package (WLCSP)
  • 2) By Technology: Five-Dimensional (5D) Packaging; Three-Dimensional (3D) Packaging; Fan-Out Wafer-Level Packaging; Flip-Chip Packaging; System-In-Package Solutions
  • 3) By End-Use Industry: Electronics; Automotive; Telecommunications; Industrial; Healthcare; Aerospace And Defense
  • Subsegments:
  • 1) By Ball Grid Array (BGA): Micro BGA; Tape BGA; Plastic BGA (PBGA); Ceramic BGA (CBGA)
  • 2) By Quad Flat Package (QFP): Thin QFP (TQFP); Plastic QFP (PQFP); Low-Profile QFP (LQFP); Heat Sink QFP (HQFP)
  • 3) By Chip Scale Package (CSP): Flip-Chip CSP; Wafer-Level CSP; Fan-In CSP; Fan-Out CSP
  • 4) By Wafer-Level Chip Scale Package (WLCSP): Flip-Chip WLCSP; Redistribution Layer (RDL) WLCSP; Fan-Out WLCSP; Bumped WLCSP
  • Companies Mentioned: Samsung Electronics Co. Ltd.; Advanced Micro Devices Inc.; Advanced Semiconductor Engineering Inc; Henkel Group; Texas Instruments Incorporated
  • Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
  • Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
  • Time series: Five years historic and ten years forecast.
  • Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
  • Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
  • Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
  • Delivery format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Advanced Chip Packaging Market Characteristics

3. Advanced Chip Packaging Market Trends And Strategies

4. Advanced Chip Packaging Market - Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics, Covid And Recovery On The Market

5. Global Advanced Chip Packaging Growth Analysis And Strategic Analysis Framework

  • 5.1. Global Advanced Chip Packaging PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
  • 5.2. Analysis Of End Use Industries
  • 5.3. Global Advanced Chip Packaging Market Growth Rate Analysis
  • 5.4. Global Advanced Chip Packaging Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
  • 5.5. Global Advanced Chip Packaging Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
  • 5.6. Global Advanced Chip Packaging Total Addressable Market (TAM)

6. Advanced Chip Packaging Market Segmentation

  • 6.1. Global Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Ball Grid Array (BGA)
  • Quad Flat Package (QFP)
  • Chip Scale Package (CSP)
  • Wafer-Level Chip Scale Package (WLCSP)
  • 6.2. Global Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Five-Dimensional (5D) Packaging
  • Three-Dimensional (3D) Packaging
  • Fan-Out Wafer-Level Packaging
  • Flip-Chip Packaging
  • System-In-Package Solutions
  • 6.3. Global Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Electronics
  • Automotive
  • Telecommunications
  • Industrial
  • Healthcare
  • Aerospace And Defence
  • 6.4. Global Advanced Chip Packaging Market, Sub-Segmentation Of Ball Grid Array (BGA), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Micro BGA
  • Tape BGA
  • Plastic BGA (PBGA)
  • Ceramic BGA (CBGA)
  • 6.5. Global Advanced Chip Packaging Market, Sub-Segmentation Of Quad Flat Package (QFP), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Thin QFP (TQFP)
  • Plastic QFP (PQFP)
  • Low-Profile QFP (LQFP)
  • Heat Sink QFP (HQFP)
  • 6.6. Global Advanced Chip Packaging Market, Sub-Segmentation Of Chip Scale Package (CSP), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Flip-Chip CSP
  • Wafer-Level CSP
  • Fan-In CSP
  • Fan-Out CSP
  • 6.7. Global Advanced Chip Packaging Market, Sub-Segmentation Of Wafer-Level Chip Scale Package (WLCSP), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Flip-Chip WLCSP
  • Redistribution Layer (RDL) WLCSP
  • Fan-Out WLCSP
  • Bumped WLCSP

7. Advanced Chip Packaging Market Regional And Country Analysis

  • 7.1. Global Advanced Chip Packaging Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 7.2. Global Advanced Chip Packaging Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8. Asia-Pacific Advanced Chip Packaging Market

  • 8.1. Asia-Pacific Advanced Chip Packaging Market Overview
  • Region Information, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
  • 8.2. Asia-Pacific Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 8.3. Asia-Pacific Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 8.4. Asia-Pacific Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

9. China Advanced Chip Packaging Market

  • 9.1. China Advanced Chip Packaging Market Overview
  • 9.2. China Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
  • 9.3. China Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
  • 9.4. China Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

10. India Advanced Chip Packaging Market

  • 10.1. India Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 10.2. India Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 10.3. India Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11. Japan Advanced Chip Packaging Market

  • 11.1. Japan Advanced Chip Packaging Market Overview
  • 11.2. Japan Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 11.3. Japan Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 11.4. Japan Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12. Australia Advanced Chip Packaging Market

  • 12.1. Australia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 12.2. Australia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 12.3. Australia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13. Indonesia Advanced Chip Packaging Market

  • 13.1. Indonesia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 13.2. Indonesia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 13.3. Indonesia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14. South Korea Advanced Chip Packaging Market

  • 14.1. South Korea Advanced Chip Packaging Market Overview
  • 14.2. South Korea Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 14.3. South Korea Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 14.4. South Korea Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15. Western Europe Advanced Chip Packaging Market

  • 15.1. Western Europe Advanced Chip Packaging Market Overview
  • 15.2. Western Europe Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 15.3. Western Europe Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 15.4. Western Europe Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16. UK Advanced Chip Packaging Market

  • 16.1. UK Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 16.2. UK Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 16.3. UK Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17. Germany Advanced Chip Packaging Market

  • 17.1. Germany Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 17.2. Germany Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 17.3. Germany Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18. France Advanced Chip Packaging Market

  • 18.1. France Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 18.2. France Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 18.3. France Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19. Italy Advanced Chip Packaging Market

  • 19.1. Italy Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 19.2. Italy Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 19.3. Italy Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20. Spain Advanced Chip Packaging Market

  • 20.1. Spain Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 20.2. Spain Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 20.3. Spain Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21. Eastern Europe Advanced Chip Packaging Market

  • 21.1. Eastern Europe Advanced Chip Packaging Market Overview
  • 21.2. Eastern Europe Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 21.3. Eastern Europe Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 21.4. Eastern Europe Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22. Russia Advanced Chip Packaging Market

  • 22.1. Russia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 22.2. Russia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 22.3. Russia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23. North America Advanced Chip Packaging Market

  • 23.1. North America Advanced Chip Packaging Market Overview
  • 23.2. North America Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 23.3. North America Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 23.4. North America Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24. USA Advanced Chip Packaging Market

  • 24.1. USA Advanced Chip Packaging Market Overview
  • 24.2. USA Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 24.3. USA Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 24.4. USA Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25. Canada Advanced Chip Packaging Market

  • 25.1. Canada Advanced Chip Packaging Market Overview
  • 25.2. Canada Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 25.3. Canada Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 25.4. Canada Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26. South America Advanced Chip Packaging Market

  • 26.1. South America Advanced Chip Packaging Market Overview
  • 26.2. South America Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 26.3. South America Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 26.4. South America Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27. Brazil Advanced Chip Packaging Market

  • 27.1. Brazil Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 27.2. Brazil Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 27.3. Brazil Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28. Middle East Advanced Chip Packaging Market

  • 28.1. Middle East Advanced Chip Packaging Market Overview
  • 28.2. Middle East Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 28.3. Middle East Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 28.4. Middle East Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29. Africa Advanced Chip Packaging Market

  • 29.1. Africa Advanced Chip Packaging Market Overview
  • 29.2. Africa Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 29.3. Africa Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 29.4. Africa Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

30. Advanced Chip Packaging Market Competitive Landscape And Company Profiles

  • 30.1. Advanced Chip Packaging Market Competitive Landscape
  • 30.2. Advanced Chip Packaging Market Company Profiles
    • 30.2.1. Samsung Electronics Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.2. Advanced Micro Devices Inc. Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.3. Advanced Semiconductor Engineering Inc Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.4. Henkel Group Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.5. Texas Instruments Incorporated Overview, Products and Services, Strategy and Financial Analysis

31. Advanced Chip Packaging Market Other Major And Innovative Companies

  • 31.1. Lam Research Corporation
  • 31.2. NXP Semiconductors
  • 31.3. Onsemi
  • 31.4. Amkor Technology
  • 31.5. Nordson Corporation
  • 31.6. Siliconware Precision Industries Co. Ltd.
  • 31.7. Kulicke and Soffa Industries Inc.
  • 31.8. ChipMOS Technologies Inc.
  • 31.9. SUSS MicroTec SE
  • 31.10. EV Group
  • 31.11. Indium Corporation
  • 31.12. Palomar Technologies
  • 31.13. Brewer Science Inc.
  • 31.14. MacDermid Alpha Electronics Solutions
  • 31.15. Universal Instruments Corporation

32. Global Advanced Chip Packaging Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The Advanced Chip Packaging Market

34. Recent Developments In The Advanced Chip Packaging Market

35. Advanced Chip Packaging Market High Potential Countries, Segments and Strategies

  • 35.1 Advanced Chip Packaging Market In 2029 - Countries Offering Most New Opportunities
  • 35.2 Advanced Chip Packaging Market In 2029 - Segments Offering Most New Opportunities
  • 35.3 Advanced Chip Packaging Market In 2029 - Growth Strategies
    • 35.3.1 Market Trend Based Strategies
    • 35.3.2 Competitor Strategies

36. Appendix

  • 36.1. Abbreviations
  • 36.2. Currencies
  • 36.3. Historic And Forecast Inflation Rates
  • 36.4. Research Inquiries
  • 36.5. The Business Research Company
  • 36.6. Copyright And Disclaimer