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全球倒裝晶片市場評估:按晶圓凸塊技術、按封裝方法、按產品、按行業、按地區、機會、預測（2016-2030）
市場調查報告書
商品編碼
1389882

全球倒裝晶片市場評估:按晶圓凸塊技術、按封裝方法、按產品、按行業、按地區、機會、預測（2016-2030）

Flip Chip Market Assessment, By Wafer Bumping Technology, By Packaging Method, By Product, By Industry, By Region, Opportunities and Forecast, 2016-2030F
出版日期: | 出版商: Market Xcel - Markets and Data | 英文 205 Pages | 商品交期: 3-5個工作天內

價格

全球倒裝晶片市場近年來呈現顯著成長，預計未來將維持強勁的擴張速度。 預計2022年營收約280.4億美元，2030年將達484.7億美元，2023年至2030年複合年增長率為7.1%。

由於對智慧型手機和物聯網設備等更小、更強大的電子設備的需求不斷增加，市場正在迅速擴大。 其次，5G、人工智慧等半導體技術的進步正在推動對高性能CPU的需求。 最後，汽車產業向電氣化和自動駕駛的發展將增加對倒裝晶片技術的需求，以增強車輛□□通訊和安全功能。

正如國際能源總署 (IEA) 所強調的那樣，電動車產業的快速成長將對倒裝晶片市場產生重大影響。 電動車依靠先進的半導體技術（包括倒裝晶片）來實現電源管理、馬達控制和電池管理系統等各種應用。 隨著全球電動車銷量持續成長，對倒裝晶片等小型高性能晶片的需求預計將大幅成長。 這一趨勢與更廣泛的汽車行業向電氣化的發展相一致，並為倒裝晶片市場提供了廣闊的前景，這將在推動電動車革命中發揮關鍵作用。

例如，2023年9月，Camtek以1億美元收購了FormFactor的FRT計量業務，加強了其在碳化矽領域先進封裝和精密計量解決方案方面的專業知識，鞏固了其在半導體行業的地位。

5G革命刺激倒裝晶片市場

5G網路的普及將大大促進倒裝晶片市場的成長。 倒裝晶片是 5G 技術的理想選擇，因為它們需要能夠管理更高資料吞吐量和更低延遲的高效能電路。 這些晶片改善了電氣和熱性能，從而實現更快的數據處理和更少的熱量產生。 此外，其小尺寸支援 5G 基礎設施節省空間的要求。 隨著5G在國際上不斷推廣，其應用範圍從智慧型手機擴展到物聯網、自動駕駛汽車和工業自動化，對高性能倒裝晶片的需求將激增，推動市場發展和創新。這很有可能。

例如，SET將於2022年11月推出一款先進的倒裝晶片，具有高精度，對準精度為±0.1m，適用於通訊、量子、汽車、國防、HPC、AI和VR應用。 Bonda FC150 PLATINUM已被釋放。

利用倒裝晶片創新汽車電子

在 ADAS（高級駕駛輔助系統）和電動車 (EV) 的推動下，汽車電子產業蓬勃發展，是推動倒裝晶片市場成長的關鍵因素。 對於防撞、自適應巡航控制和自動停車等任務，ADAS 依賴高性能 CPU，並需要小型、高效的半導體解決方案。 配備複雜電池管理系統和車載電腦的電動車需要可靠且節能的半導體。 倒裝晶片以其小巧的外形和高性能而著稱，並成功滿足了汽車電子產品的這些需求。 隨著汽車產業走向電氣化和自動化，對倒裝晶片的需求持續增加，從而加強了市場成長。

例如，2023 年 10 月，日月光半導體工程 (ASE) 宣布推出整合設計生態系統 (IDE)，以優化 VIPack 平台的封裝架構設計。 IDE 將 SoC 簡化為多晶片集成，將設計效率提高 50%，並顯著縮短週期時間。 此IDE支援封裝設計中的小晶片、記憶體和進階扇出結構。

本報告針對全球倒裝晶片市場進行研究和分析，提供市場規模和預測、市場動態、主要參與者的現狀和前景等。

目錄

第 1 章研究方法

第 2 章專案範圍與定義

第 3 章 COVID-19 對全球倒裝晶片市場的影響

第 4 章執行摘要

第 5 章客戶回饋

  • 產品與市場情報
  • 品牌識別方法
  • 購買決策時考慮的因素
  • 隱私和安全法規的考慮因素

第 6 章全球倒裝晶片市場展望（2016-2030）

  • 市場規模與預測
    • 金額
    • 數量
  • 透過晶圓凸點技術
    • 銅柱
    • 無鉛
    • 錫/鉛共晶焊料
    • 金螺柱+鍍錫焊料
  • 依包裝方式
    • 二維積體電路
    • 2.5D IC
    • 3D IC
  • 按產品
    • 記憶體
    • LED
    • CMOS影像感測器
    • SoC
    • GPU
    • CPU
  • 按行業
    • IT/通信
    • 工業
    • 電子
    • 汽車
    • 醫療
    • 航空航太/國防
    • 其他
  • 按地區
    • 北美
    • 歐洲
    • 亞太地區
    • 南美洲
    • 中東/非洲
  • 市佔率:依公司劃分（2022 年）

第 7 章全球倒裝晶片市場展望:按地區劃分（2016-2030 年）

  • 北美
    • 市場規模與預測
    • 透過晶圓凸點技術
    • 依包裝方式
    • 按產品
    • 按行業
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 法國
    • 義大利
    • 英國
    • 俄羅斯
    • 荷蘭
    • 西班牙
    • 土耳其
    • 波蘭
  • 亞太地區
    • 印度
    • 中國
    • 日本
    • 澳大利亞
    • 越南
    • 韓國
    • 印尼
    • 菲律賓
  • 南美洲
    • 巴西
    • 阿根廷
  • 中東/非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非

第 8 章市場地圖（2022 年）

  • 透過晶圓凸點技術
  • 依包裝方式
  • 按產品
  • 按行業
  • 按地區

第 9 章宏觀環境與產業結構

  • 需求與供給分析
  • 進出口分析
  • 價值鏈分析
  • PESTEL 分析
  • 波特五力分析

第 10 章市場動態

  • 生長促進因素
  • 抑製成長的因素（問題、限制因素）

第 11 章主要公司狀況

  • 前 5 名市場領導者的競爭矩陣
  • 前 5 位市場領導者的市場收入分析（2022 年）
  • 併購/合資企業（如果適用）
  • SWOT 分析（針對 5 家進入市場的公司）
  • 專利分析（如果適用）

第 12 章案例研究

第 13 章主要公司展望

  • Amkor Technology, Inc.
  • ASE Technology Holding Co, Ltd
  • FormFactor, Inc.
  • Globalfoundries Inc.
  • IBM Corporation
  • Intel Corporation
  • Samsung Electronics Co., Ltd.
  • Taiwan Semiconductor Manufacturing Company Limited
  • Texas Instruments Incorporated
  • United Microelectronics Corporation

第 14 章策略建議

第 15 章 關於公司，免責聲明

Product Code: MX10694

Global flip chip market has experienced significant growth in recent years and is expected to maintain a strong pace of expansion in the coming years. With projected revenue of approximately USD 28.04 billion in 2022, the market is forecasted to reach a value of USD 48.47 billion by 2030, displaying a robust CAGR of 7.1% from 2023 to 2030.

The flip chip market provides benefits like higher performance, electrical and thermal conductivity, lower power consumption, and smaller form factors. It enables faster and more reliable microelectronics, making it perfect for applications such as enhanced semiconductor packaging, mobile devices, and high-performance computing, promoting innovation and efficiency.

The flip chip market is expanding rapidly owing to rising demand for smaller and more powerful electronic devices such as smartphones and IoT devices. Second, advances in semiconductor technology, such as 5G and AI, fuel demand for high-performance CPUs. Finally, the automotive industry's push toward electrified and self-driving automobiles increases demand for flip chip technology to increase vehicle communication and safety features.

The surge in the electric vehicle sector, as highlighted by the International Energy Agency (IEA), holds substantial implications for the flip chip market. EVs rely on advanced semiconductor technology, including flip chips, for various applications like power management, motor control, and battery management systems. As EV sales continue to rise globally, the demand for compact, high-performance chips, like flip chips, is expected to grow significantly. The trend aligns with the broader automotive sector's move towards electrification, creating a promising outlook for the flip chip market, which plays a vital role in enabling the EV revolution.

For instance, in September 2023, Camtek purchased FormFactor's FRT Metrology business for USD 100 million, bolstering its expertise in high-precision metrology solutions for the Advanced Packaging and Silicon Carbide sectors, solidifying its standing in the semiconductor industry.

5G Revolution to Fuel Flip Chip Market

The proliferation of 5G networks contributes significantly to the growth of the flip chip market. Flip chips are an excellent choice for 5G technology since they require high-performance circuits that can manage higher data throughput and reduced latency. These chips have enhanced electrical and thermal properties, allowing faster data processing and less heat generation. Furthermore, their small size corresponds to the space-saving requirements of 5G infrastructure. As 5G continues to roll out internationally and its applications expand beyond smartphones towards IoT, autonomous vehicles, and industrial automation, the demand for high-performance flip chips will likely skyrocket, propelling market development and innovation.

For example, in November 2022, SET launched the FC150 PLATINUM, an advanced flip-chip bonder with improved precision and alignment accuracy of ± 0.1 µm for telecom, quantum, automotive, defense, HPC, AI, and VR applications.

Innovating Automotive Electronics with Flip Chips

Fueled by advanced driver-assistance systems (ADAS) and electric vehicles (EVs), the flourishing automotive electronics sector is a critical component driving the flip chip market's growth. For tasks such as collision avoidance, adaptive cruise control, and self-parking, ADAS relies on high-performance CPUs, necessitating small and efficient semiconductor solutions. With their complicated battery management systems and onboard computers, EVs require reliable and power efficient semiconductors. Flip chips, noted for their small form factor and improved performance, successfully satisfy these automotive electronics needs. As the automotive sector moves toward electrification and automation, demand for flip chips continues to rise, strengthening the market growth.

For example, in October 2023, Advanced Semiconductor Engineering (ASE) unveiled its Integrated Design Ecosystem (IDE), optimizing package architecture design for the VIPack platform. IDE simplifies SoC to multi-die integration, yielding 50% design efficiency improvements and substantial cycle time reduction. It supports chiplet, memory, and advanced fanout structures in package design.

Dominance of Copper Pillars in the Market

Copper pillars are emerging as a leading segment in the flip chip market, owing to their several advantages, such as great electrical and thermal conductivity, allowing for efficient heat dissipation and fast data transport. Copper's mechanical strength and dependability make it perfect for advanced semiconductor packing, allowing smaller form factors. Furthermore, their compatibility with fine-pitch designs and low-resistance properties aid in performance. As the demand for high-performance, miniaturized electronic devices grows, copper pillars become more popular, fueling their dominance in the flip chip market.

For instance, in March 2023, Jupiter Systems unveiled the Zavus Xtreme Pixel (XP) Flip Chip COB MicroLED, expanding its 21:9 ultra-wide display offerings for enterprise and industrial applications.

Asia-Pacific Dominates Flip Chip Market

Asia-Pacific is at the leading edge of the flip chip market owing to several factors. The region is a global semiconductor manufacturing powerhouse, with important businesses situated in Taiwan, South Korea, and China. Furthermore, Asia-Pacific has a large consumer electronics market, which drives the demand for miniature and high-performance CPUs in products such as smartphones and wearables. The growing adoption of IoT and proliferation of 5G technology in the region has increased the demand for superior flip chip technology. Hence, Asia-Pacific leads the global flip chip market due to its manufacturing capabilities and robust demand.

For instance, in June 2022, Luminus Devices introduced the MP-3030-110F flip-chip LEDs, which offer high efficacy, brightness, and durability. These wire-bond-free LEDs were ideal for horticulture and outdoor lighting, with improved sulfur resistance and a long life exceeding 50,000 hours.

Government Initiatives Acting as Catalyst to Flip Chip Market

The United States government, through the National Institute of Standards and Technology (NIST), is launching a substantial initiative to strengthen the domestic semiconductor sector, including the flip chip market. Under the CHIPS Incentives Program, especially the 2023-NIST-CHIPS-CFF-01 funding opportunity, the program is designed to enhance the United States' economic and national security. It is inviting applications for the construction, expansion, or modernization of semiconductor manufacturing facilities, encompassing those related to flip chip technology. Notably, the program strongly encourages projects with capital investments exceeding USD 300 million, emphasizing the government's commitment to fortify semiconductor infrastructure and maintain global tech competitiveness.

Impact of COVID-19

The flip chip market experienced a dual-phase impact from the COVID-19 pandemic. In the initial stages, supply chain disruptions, reduced consumer demand, and labor shortages led to manufacturing and production setbacks. However, the post-pandemic scenario saw a resurgence in the global flip chip market. With increased reliance on remote work technology, healthcare equipment, consumer electronics, and substantial investments in 5G infrastructure, the market has rebounded. Industry players adapted to the new normal, and the significance of high-performance and compact chips in various applications fueled the market's strong recovery, underscoring the resilience of the semiconductor sector.

Future Market Scenario (2024 - 2030F)

Advancements in materials, such as low-temperature solder and high-performance underfill substances, are poised to elevate the flip chip process.

The continuous growth of 5G infrastructure and the rising adoption of artificial intelligence are set to boost the need for high-performance flip chips in data centers, edge computing, and the telecommunications sector.

The expansion of the Internet of Things (IoT) is expected to persist, generating prospects for the utilization of flip chips in smart devices, wearables, and sensor applications.

There will be a growing focus on energy-efficient flip chips in the market, especially for devices that rely on battery or renewable energy sources.

Key Players Landscape and Outlook

The global flip chip market exhibits vigorous activity and fierce competition, driven by major industry players such as IBM Corporation, ASE Technology Holding Co., Ltd, Intel Corporation, Samsung Electronics Co., Ltd, and Taiwan Semiconductor Manufacturing Company Limited, dedicated to push the boundaries of innovation. Key market dynamics encompass a relentless pursuit of size reduction, the growing significance of 5G and AI technologies, and the expanding role of automotive electronics. This competitive landscape underscores a future characterized by advanced materials, heterogeneous integration, and enhanced energy efficiency, catering to a wide array of sectors. With the ever-increasing demand for compact, high-performance devices, the market's outlook remains highly promising.

In May 2023, FormFactor introduce the FRT MicroProf PT, a semiconductor metrology and inspection tool designed for larger rectangular panels, offering automation and hybrid metrology for 3D measurements and defect detection.

In September 2023, GlobalFoundries inaugurated a USD 4 billion expansion fabrication facility in Singapore, generating 1,000 high-value positions, predominantly focused on technicians and engineers. The facility's objective is to improve supply chain adaptability.

Table of Contents

1. Research Methodology

2. Project Scope & Definitions

3. Impact of COVID-19 on the Global Flip Chip Market

4. Executive Summary

5. Voice of Customer

  • 5.1. Product and Market Intelligence
  • 5.2. Mode of Brand Awareness
  • 5.3. Factors Considered in Purchase Decisions
    • 5.3.1. Features and other value-added service
    • 5.3.2. IT Infrastructure Compatibility
    • 5.3.3. Efficiency of Solutions
    • 5.3.4. After-Sales Support
  • 5.4. Consideration of Privacy & Safety Regulations

6. Global Flip Chip Market Outlook, 2016-2030F

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
    • 6.1.2. By Volume
  • 6.2. By Wafer Bumping Technology
    • 6.2.1. Copper Pillar
    • 6.2.2. Lead-free
    • 6.2.3. Tin/Lead Eutectic Solder
    • 6.2.4. Gold Stud+ Plated Solder
  • 6.3. By Packaging Method
    • 6.3.1. 2D IC
    • 6.3.2. 2.5D IC
    • 6.3.3. 3D IC
  • 6.4. By Product
    • 6.4.1. Memory
    • 6.4.2. Light Emitting Diode
    • 6.4.3. CMOS Image Sensor
    • 6.4.4. SoC
    • 6.4.5. GPU
    • 6.4.6. CPU
  • 6.5. By Industry
    • 6.5.1. IT & Telecommunication
    • 6.5.2. Industrial
    • 6.5.3. Electronic
    • 6.5.4. Automotive
    • 6.5.5. Healthcare
    • 6.5.6. Aerospace & Defense
    • 6.5.7. Others
  • 6.6. By Region
    • 6.6.1. North America
    • 6.6.2. Europe
    • 6.6.3. Asia-Pacific
    • 6.6.4. South America
    • 6.6.5. Middle East and Africa
  • 6.7. By Company Market Share (%), 2022

7. Global Flip Chip Market Outlook, By Region, 2016-2030F

  • 7.1. North America*
    • 7.1.1. Market Size & Forecast
      • 7.1.1.1. By Value
      • 7.1.1.2. By Volume
    • 7.1.2. By Wafer Bumping Technology
      • 7.1.2.1. Copper Pillar
      • 7.1.2.2. Lead-free
      • 7.1.2.3. Tin/Lead Eutectic Solder
      • 7.1.2.4. Gold Stud+ Plated Solder
    • 7.1.3. By Packaging Method
      • 7.1.3.1. 2D IC
      • 7.1.3.2. 2.5D IC
      • 7.1.3.3. 3D IC
    • 7.1.4. By Product
      • 7.1.4.1. Memory
      • 7.1.4.2. Light Emitting Diode
      • 7.1.4.3. CMOS Image Sensor
      • 7.1.4.4. SoC
      • 7.1.4.5. GPU
      • 7.1.4.6. CPU
    • 7.1.5. By Industry
      • 7.1.5.1. IT & Telecommunication
      • 7.1.5.2. Industrial
      • 7.1.5.3. Electronic
      • 7.1.5.4. Automotive
      • 7.1.5.5. Healthcare
      • 7.1.5.6. Aerospace & Defense
      • 7.1.5.7. Others
    • 7.1.6. United States*
      • 7.1.6.1. Market Size & Forecast
      • 7.1.6.1.1. By Value
      • 7.1.6.1.2. By Volume
      • 7.1.6.2. By Wafer Bumping Technology
      • 7.1.6.2.1. Copper Pillar
      • 7.1.6.2.2. Lead-free
      • 7.1.6.2.3. Tin/Lead Eutectic Solder
      • 7.1.6.2.4. Gold Stud+ Plated Solder
      • 7.1.6.3. By Packaging Method
      • 7.1.6.3.1. 2D IC
      • 7.1.6.3.2. 2.5D IC
      • 7.1.6.3.3. 3D IC
      • 7.1.6.4. By Product
      • 7.1.6.4.1. Memory
      • 7.1.6.4.2. Light Emitting Diode
      • 7.1.6.4.3. CMOS Image Sensor
      • 7.1.6.4.4. SoC
      • 7.1.6.4.5. GPU
      • 7.1.6.4.6. CPU
      • 7.1.6.5. By Industry
      • 7.1.6.5.1. IT & Telecommunication
      • 7.1.6.5.2. Industrial
      • 7.1.6.5.3. Electronic
      • 7.1.6.5.4. Automotive
      • 7.1.6.5.5. Healthcare
      • 7.1.6.5.6. Aerospace & Defense
      • 7.1.6.5.7. Others
    • 7.1.7. Canada
    • 7.1.8. Mexico

All segments will be provided for all regions and countries covered:

  • 7.2. Europe
    • 7.2.1. Germany
    • 7.2.2. France
    • 7.2.3. Italy
    • 7.2.4. United Kingdom
    • 7.2.5. Russia
    • 7.2.6. Netherlands
    • 7.2.7. Spain
    • 7.2.8. Turkey
    • 7.2.9. Poland
  • 7.3. Asia-Pacific
    • 7.3.1. India
    • 7.3.2. China
    • 7.3.3. Japan
    • 7.3.4. Australia
    • 7.3.5. Vietnam
    • 7.3.6. South Korea
    • 7.3.7. Indonesia
    • 7.3.8. Philippines
  • 7.4. South America
    • 7.4.1. Brazil
    • 7.4.2. Argentina
  • 7.5. Middle East & Africa
    • 7.5.1. Saudi Arabia
    • 7.5.2. UAE
    • 7.5.3. South Africa

8. Market Mapping, 2022

  • 8.1. By Wafer Bumping Technology
  • 8.2. By Packaging Method
  • 8.3. By Product
  • 8.4. By Industry
  • 8.5. By Region

9. Macro Environment and Industry Structure

  • 9.1. Demand Supply Analysis
  • 9.2. Import Export Analysis
  • 9.3. Value Chain Analysis
  • 9.4. PESTEL Analysis
    • 9.4.1. Political Factors
    • 9.4.2. Economic System
    • 9.4.3. Social Implications
    • 9.4.4. Technological Advancements
    • 9.4.5. Environmental Impacts
    • 9.4.6. Legal Compliances and Regulatory Policies (Statutory Bodies Included)
  • 9.5. Porter's Five Forces Analysis
    • 9.5.1. Supplier Power
    • 9.5.2. Buyer Power
    • 9.5.3. Substitution Threat
    • 9.5.4. Threat from New Entrant
    • 9.5.5. Competitive Rivalry

10. Market Dynamics

  • 10.1. Growth Drivers
  • 10.2. Growth Inhibitors (Challenges and Restraints)

11. Key Players Landscape

  • 11.1. Competition Matrix of Top Five Market Leaders
  • 11.2. Market Revenue Analysis of Top Five Market Leaders (in %, 2022)
  • 11.3. Mergers and Acquisitions/Joint Ventures (If Applicable)
  • 11.4. SWOT Analysis (For Five Market Players)
  • 11.5. Patent Analysis (If Applicable)

12. Case Studies

13. Key Players Outlook

  • 13.1. Amkor Technology, Inc.
    • 13.1.1. Company Details
    • 13.1.2. Key Management Personnel
    • 13.1.3. Products & Services
    • 13.1.4. Financials (As reported)
    • 13.1.5. Key Market Focus & Geographical Presence
    • 13.1.6. Recent Developments
  • 13.2. ASE Technology Holding Co, Ltd
  • 13.3. FormFactor, Inc.
  • 13.4. Globalfoundries Inc.
  • 13.5. IBM Corporation
  • 13.6. Intel Corporation
  • 13.7. Samsung Electronics Co., Ltd.
  • 13.8. Taiwan Semiconductor Manufacturing Company Limited
  • 13.9. Texas Instruments Incorporated
  • 13.10. United Microelectronics Corporation

Companies mentioned above DO NOT hold any order as per market share and can be changed as per information available during research work.

14. Strategic Recommendations

15. About Us & Disclaimer

List of Tables

  • Table 1. Pricing Analysis of Products from Key Players
  • Table 2. Competition Matrix of Top 5 Market Leaders
  • Table 3. Mergers & Acquisitions/ Joint Ventures (If Applicable)
  • Table 4. About Us - Regions and Countries Where We Have Executed Client Projects

List of Figures

  • Figure 1. Global Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 2. Global Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 3. Global Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 4. Global Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 5. Global Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 6. Global Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 7. Global Flip Chip Market Share, By Region, In USD Billion, 2016-2030F
  • Figure 8. North America Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 9. North America Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 10. North America Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 11. North America Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 12. North America Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 13. North America Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 14. North America Flip Chip Market Share, By Country, In USD Billion, 2016-2030F
  • Figure 15. United States Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 16. United States Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 17. United States Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 18. United States Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 19. United States Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 20. United States Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 21. Canada Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 22. Canada Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 23. Canada Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 24. Canada Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 25. Canada Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 26. Canada Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 27. Mexico Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 28. Mexico Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 29. Mexico Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 30. Mexico Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 31. Mexico Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 32. Mexico Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 33. Europe Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 34. Europe Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 35. Europe Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 36. Europe Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 37. Europe Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 38. Europe Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 39. Europe Flip Chip Market Share, By Country, In USD Billion, 2016-2030F
  • Figure 40. Germany Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 41. Germany Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 42. Germany Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 43. Germany Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 44. Germany Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 45. Germany Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 46. France Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 47. France Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 48. France Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 49. France Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 50. France Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 51. France Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 52. Italy Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 53. Italy Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 54. Italy Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 55. Italy Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 56. Italy Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 57. Italy Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 58. United Kingdom Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 59. United Kingdom Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 60. United Kingdom Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 61. United Kingdom Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 62. United Kingdom Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 63. United Kingdom Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 64. Russia Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 65. Russia Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 66. Russia Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 67. Russia Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 68. Russia Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 69. Russia Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 70. Netherlands Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 71. Netherlands Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 72. Netherlands Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 73. Netherlands Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 74. Netherlands Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 75. Netherlands Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 76. Spain Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 77. Spain Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 78. Spain Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 79. Spain Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 80. Spain Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 81. Spain Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 82. Turkey Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 83. Turkey Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 84. Turkey Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 85. Turkey Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 86. Turkey Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 87. Turkey Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 88. Poland Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 89. Poland Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 90. Poland Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 91. Poland Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 92. Poland Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 93. Poland Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 94. South America Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 95. South America Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 96. South America Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 97. South America Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 98. South America Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 99. South America Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 100. South America Flip Chip Market Share, By Country, In USD Billion, 2016-2030F
  • Figure 101. Brazil Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 102. Brazil Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 103. Brazil Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 104. Brazil Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 105. Brazil Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 106. Brazil Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 107. Argentina Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 108. Argentina Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 109. Argentina Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 110. Argentina Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 111. Argentina Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 112. Argentina Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 113. Asia-Pacific Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 114. Asia-Pacific Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 115. Asia-Pacific Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 116. Asia-Pacific Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 117. Asia-Pacific Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 118. Asia-Pacific Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 119. Asia-Pacific Flip Chip Market Share, By Country, In USD Billion, 2016-2030F
  • Figure 120. India Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 121. India Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 122. India Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 123. India Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 124. India Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 125. India Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 126. China Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 127. China Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 128. China Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 129. China Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 130. China Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 131. China Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 132. Japan Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 133. Japan Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 134. Japan Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 135. Japan Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 136. Japan Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 137. Japan Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 138. Australia Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 139. Australia Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 140. Australia Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 141. Australia Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 142. Australia Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 143. Australia Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 144. Vietnam Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 145. Vietnam Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 146. Vietnam Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 147. Vietnam Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 148. Vietnam Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 149. Vietnam Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 150. South Korea Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 151. South Korea Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 152. South Korea Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 153. South Korea Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 154. South Korea Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 155. South Korea Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 156. Indonesia Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 157. Indonesia Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 158. Indonesia Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 159. Indonesia Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 160. Indonesia Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 161. Indonesia Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 162. Philippines Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 163. Philippines Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 164. Philippines Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 165. Philippines Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 166. Philippines Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 167. Philippines Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 168. Middle East & Africa Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 169. Middle East & Africa Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 170. Middle East & Africa Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 171. Middle East & Africa Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 172. Middle East & Africa Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 173. Middle East & Africa Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 174. Middle East & Africa Flip Chip Market Share, By Country, In USD Billion, 2016-2030F
  • Figure 175. Saudi Arabia Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 176. Saudi Arabia Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 177. Saudi Arabia Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 178. Saudi Arabia Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 179. Saudi Arabia Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 180. Saudi Arabia Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 181. UAE Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 182. UAE Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 183. UAE Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 184. UAE Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 185. UAE Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 186. UAE Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 187. South Africa Flip Chip Market, By Value, In USD Billion, 2016-2030F
  • Figure 188. South Africa Flip Chip Market, By Volume, In Thousand Units, 2016-2030F
  • Figure 189. South Africa Flip Chip Market Share, By Wafer Bumping Technology, In USD Billion, 2016-2030F
  • Figure 190. South Africa Flip Chip Market Share, By Packaging Method, In USD Billion, 2016-2030F
  • Figure 191. South Africa Flip Chip Market Share, By Product, In USD Billion, 2016-2030F
  • Figure 192. South Africa Flip Chip Market Share, By Industry, In USD Billion, 2016-2030F
  • Figure 193. By Wafer Bumping Technology Map-Market Size (USD Billion) & Growth Rate (%), 2022
  • Figure 194. By Packaging Method Map-Market Size (USD Billion) & Growth Rate (%), 2022
  • Figure 195. By Product Map-Market Size (USD Billion) & Growth Rate (%), 2022
  • Figure 196. By Industry Map-Market Size (USD Billion) & Growth Rate (%), 2022
  • Figure 197. By Region Map-Market Size (USD Billion) & Growth Rate (%), 2022