覆晶市場規模、佔有率、成長分析，按封裝類型、封裝技術、凸塊技術、最終用途、地區 - 產業預測，2024-2031年

2022年全球覆晶市場規模為305億美元，從2023年的324.3億美元成長到2031年的497.4億美元，在預測期內（2024-2031年）預計年複合成長率為6.3%。

全球快速的數位化趨勢是創新半導體和晶片尤其是覆晶需求的主要驅動力。隨著設備小型化和半導體技術進步的加速、物聯網（IoT）設備的激增以及 5G 網路技術部署的加速，該市場有望成長。而且，汽車的電氣化日益增加對汽車電子產品的需求，進一步增加了覆晶市場的潛力。對高效能運算的需求不斷成長以及先進資料中心的建立預計將支持未來幾年覆晶的銷售。然而，溫度控管複雜性、替代封裝解決方案的可用性以及高昂的初始實施成本等挑戰可能會阻礙市場開拓。

目錄

介紹

• 研究目的
• 調查範圍
• 定義

調查方法

• 資訊採購
• 二級資料和一級資料方法
• 市場規模預測
• 市場假設與限制

執行摘要

• 全球市場展望
• 供需趨勢分析
• 依細分市場的機會分析

市場動態及展望

• 市場概況
• 市場規模
• 市場動態
  • 促進因素和機會
  • 抑制因素和挑戰
• 波特分析與影響
  • 競爭公司之間的敵對關係
  • 替代品的威脅
  • 買方議價能力
  • 新進入者的威脅
  • 供應商的議價能力

主要市場考察

• 關鍵成功因素
• 競爭程度
• 主要投資機會
• 市場生態系統
• 市場吸引力指數（2023）
• PESTEL分析
• 總體經濟指標
• 價值鏈分析
• 價格分析
• 技術進步
• 監管環境
• 案例研究

覆晶市場規模：依類型和年複合成長率（2024-2031）

• 球柵陣列
• 四方平面無引腳
• 晶片級封裝
• 封裝中的晶片系統

覆晶市場規模：封裝技術與年複合成長率（2024-2031）

• 3D
• 2.5D
• 2.1D

覆晶市場規模：凸塊技術與年複合成長率（2024-2031）

• 銅柱
• 焊料凸塊
• 金凸塊
• 其他

覆晶市場規模：依最終用途及年複合成長率（2024-2031）

• 航太和國防
• 製造業
• 汽車/交通
• 家電
• 資訊科技和通訊
• 其他

覆晶市場規模：依地區及年複合成長率（2024-2031）

• 北美洲
  • 美國
  • 加拿大
• 歐洲
  • 英國
  • 德國
  • 西班牙
  • 法國
  • 義大利
  • 其他歐洲國家地區
• 亞太地區
  • 中國
  • 印度
  • 日本
  • 韓國
  • 其他亞太地區
• 拉丁美洲
  • 巴西
  • 其他拉丁美洲地區
• 中東、非洲
  • 海灣合作理事會國家
  • 南非
  • 其他中東、非洲

競爭資訊

• 前5名企業比較
• 主要企業市場定位（2023年）
• 主要市場參與者所採取的策略
• 近期市場趨勢
• 公司市場佔有率分析（2023）
• 主要企業簡介
  • 公司簡介
  • 產品系列分析
  • 依細分市場分類的佔有率分析
  • 收益與前一年同期比較（2021-2023）

主要企業簡介

• IBM Corporation
• ASE Technology Holding Co., Ltd.
• Advanced Micro Devices, Inc.
• Intel Corporation
• Fujitsu
• Texas Instruments Incorporated
• Fujitsu Ltd.
• 3M
• Powertech Technology Inc.
• Samsung Electronics Co. Ltd.
• TSMC Ltd.,
• Apple Inc.
• AMD Inc.
• Amkor Technology
• International business machines corporation

結論和建議

Global Flip chip Market size was valued at USD 30.5 Billion in 2022 and is poised to grow from USD 32.43 Billion in 2023 to USD 49.74 Billion by 2031, growing at a CAGR of 6.3% during the forecast period (2024-2031).

The rapid global digitization trend is significantly driving the demand for innovative semiconductors and chips, particularly flip chips. As device miniaturization and semiconductor technology advancements accelerate, the market is poised for growth, fueled by the increasing prevalence of Internet of Things (IoT) devices and the rollout of 5G network technologies. Additionally, the electrification of vehicles is boosting the need for automotive electronics, further enhancing flip chip market potential. The rising demand for high-performance computing and the establishment of advanced data centers are expected to support flip chip sales in the coming years. However, challenges such as thermal management complexities, the availability of alternative packaging solutions, and high initial deployment costs may hinder market development.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Flip Chip market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Flip Chip Market Segmental Analysis

Global Flip Chip Market is segmented by Type, by Packaging Technology, by Bumping Technology, by End Use and by Region. Based on Type, the market is segmented into Ball Grid Array, Quad Flat No-Lead, Chip Scale Packaging, Chip System in Packaging. Based on Packaging Technology, the market is segmented into 3D, 2.5D, 2.1D. Based on Bumping Technology, the market is segmented into Copper Pillar, Solder Bumping, Gold Bumping, Others. Based on End User, the market is segmented into Consumer Electronics, IT & Telecommunication, Automotive, Industrial, Medical and Healthcare, Military & Aerospace, Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & and Africa.

Driver of the Global Flip Chip Market

One of the key drivers of the global flip chip market is the increasing utilization of automotive electronics. The automotive sector is experiencing significant transformation due to the growing incorporation of semiconductors and electronic components. The surge in popularity of electric vehicles, coupled with the demand for enhanced safety features and advanced infotainment systems, is driving the need for automotive semiconductors. This rising demand directly influences the flip chip market, as these technologies rely heavily on flip chip packaging for improved performance and efficiency. As a result, the evolution of the automotive landscape is favorably impacting the growth of the flip chip market.

Restraints in the Global Flip Chip Market

One of the significant restraints affecting the Global Flip Chip market is the complexity involved in its manufacturing process. Unlike traditional packaging methods, flip chip technology requires a series of intricate steps, including wafer bumping, underfill application, and die attachment. This multifaceted approach not only elevates the overall production complexity but also leads to increased manufacturing costs. Consequently, these heightened expenses can stifle market demand and hinder the growth prospects for flip chip technology moving forward. As manufacturers navigate these challenges, the intricate nature of flip chip production could continue to serve as a barrier to widespread adoption and utilization.

Market Trends of the Global Flip Chip Market

The Global Flip Chip market is increasingly driven by an emphasis on sustainability, prompting companies to innovate with lead-free solder technologies to align with stringent environmental standards. As regulations tighten with bans on hazardous materials and chemicals, manufacturers are compelled to explore new, eco-friendly materials for packaging solutions. This trend not only enhances the sustainability credentials of flip chip products but also positions companies favorably in a market that is progressively valuing environmentally responsible practices. Consequently, firms that prioritize sustainable development are likely to gain a competitive edge, thus shaping the future landscape of the Global Flip Chip market.

Table of Contents

Introduction

• Objectives of the Study
• Scope of the Report
• Definitions

Research Methodology

• Information Procurement
• Secondary & Primary Data Methods
• Market Size Estimation
• Market Assumptions & Limitations

Executive Summary

• Global Market Outlook
• Supply & Demand Trend Analysis
• Segmental Opportunity Analysis

Market Dynamics & Outlook

• Market Overview
• Market Size
• Market Dynamics
  • Driver & Opportunities
  • Restraints & Challenges
• Porters Analysis & Impact
  • Competitive rivalry
  • Threat of substitute
  • Bargaining power of buyers
  • Threat of new entrants
  • Bargaining power of suppliers

Key Market Insights

• Key Success Factors
• Degree of Competition
• Top Investment Pockets
• Market Ecosystem
• Market Attractiveness Index, 2023
• PESTEL Analysis
• Macro-Economic Indicators
• Value Chain Analysis
• Pricing Analysis
• Technological Advancement
• Regulatory Landscape
• Case Studies

Global Flip Chip Market Size by Type & CAGR (2024-2031)

• Ball Grid Array
• Quad Flat No-Lead
• Chip Scale Packaging
• Chip System in Packaging

Global Flip Chip Market Size by Packaging Technology & CAGR (2024-2031)

• 3D
• 2.5D
• 2.1D

Global Flip Chip Market Size by Bumping Technology & CAGR (2024-2031)

• Copper Pillar
• Solder Bumping
• Gold Bumping
• Others

Global Flip Chip Market Size by End Use & CAGR (2024-2031)

• Aerospace and Defense
• Manufacturing
• Automotive & Transportation
• Consumer Electronics
• IT & Telecommunications
• Others

Global Flip Chip Market Size by Region & CAGR (2024-2031)

• North America, (by Type, by Packaging Technology, by Bumping Technology, by End User)
  • US
  • Canada
• Europe, (by Type, by Packaging Technology, by Bumping Technology, by End User)
  • UK
  • Germany
  • Spain
  • France
  • Italy
  • Rest of Europe
• Asia-Pacific, (by Type, by Packaging Technology, by Bumping Technology, by End User)
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia Pacific
• Latin America, (by Type, by Packaging Technology, by Bumping Technology, by End User)
  • Brazil
  • Rest of Latin America
• Middle East & Africa, (by Type, by Packaging Technology, by Bumping Technology, by End User)
  • GCC Countries
  • South Africa
  • Rest of Middle East & Africa

Competitive Intelligence

• Top 5 Player Comparison
• Market Positioning of Key Players, 2023
• Strategies Adopted by Key Market Players
• Recent Developments in the Market
• Company Market Share Analysis, 2023
• Company Profiles of All Key Players
  • Company Details
  • Product Portfolio Analysis
  • Company's Segmental Share Analysis
  • Revenue Y-O-Y Comparison (2021-2023)

Key Company Profiles

• IBM Corporation
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• ASE Technology Holding Co., Ltd.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Advanced Micro Devices, Inc.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Intel Corporation
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Fujitsu
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Texas Instruments Incorporated
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Fujitsu Ltd.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• 3M
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Powertech Technology Inc.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Samsung Electronics Co. Ltd.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• TSMC Ltd.,
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Apple Inc.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• AMD Inc.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Amkor Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• International business machines corporation
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments

Conclusion & Recommendation