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市場調查報告書
商品編碼
1284288
到 2028 年的熱界面材料 (TIM) 市場預測 - 按產品類型、成分、應用和地區分類的全球分析Thermal Interface Materials Market Forecasts to 2028 - Global Analysis By Product Type, Composition, Application and By Geography |
根據 Stratistics MRC,全球熱界面材料 (TIM) 市場將在 2022 年達到 21.4 億美元,在預測期內以 13.3% 的複合年增長率增長,到 2028 年將達到 45%。預計將達到2億美元。
熱界面填料用於封閉發熱組件與其相應散熱器之間自然形成的空間或界面。 為了最大限度地提高熱傳遞,這些界面材料提供了一種導電介質並消除了空隙。 隨著更小、更小和更高能量密度的小工具的生產,對能夠改善從設備芯片到散熱器的熱傳遞並防止熱量積聚以延長小工具壽命的產品的需求不斷增加。。
根據行業分析,到 2030 年,全球汽車行業預計將增長到不到 9 萬億美元。 預計新車銷量將佔其中的 38% 左右。 因此,汽車行業的增長將為熱界面材料 (TIM) 市場的增長創造有利可圖的機會。
由於 LED 市場的擴張,對熱界面材料 (TIM) 的需求正在增加。
熒光燈消耗的能量超出了必要,現在正被 LED 燈取代。 然而,LED照明具有內在的物理矛盾。 為了產生所需的流明輸出,LED 的功率必須很高。 另一方面,LED電流要小,以減少能量損耗和發熱。 解決這種物理矛盾,需要運用“時空分離”、“系統分離”、“條件分離”四項分離原則。 在許多優化達到極限的情況下,隔離是最好的選擇。 但是,要延長LED的壽命,就需要足夠的熱交換介質。 TIM 在成本、散熱能力和可用空間之間取得了理想的平衡。 預計對 TIM 的需求將隨著對 LED 照明需求的增長而增長。 結合光學和熱設計以提高整個系統(包括電子驅動系統)的效率和光質量,是先進 LED 設計面臨的挑戰。 因此,TIM 的需求和有效性將受到與 LED 設計複雜程度成比例的影響。
熱界面材料 (TIM) 的性能受其物理特性的限制。
在過去幾十年中,電子設備(尤其是微處理器芯片)的功率密度有所增加。 由於器件尺寸越來越小的持續趨勢,電子電路中的熱問題正在顯著增加。 因此,關注熱管理以確保電子設備按預期運行變得越來越重要和基本。 傳導熱傳遞通常用於將熱量從原點分配到散熱器的擴大表面積。 然而,熱管理系統可以使用任何類型的熱傳遞來將溫度保持在適當的範圍內並確保最佳性能和可靠性。 連接固體表面以最小化接觸電阻的組件的一個關鍵組成部分是將 TIM 注入接頭以填充空隙。 眾所周知,TIM 是系統熱阻的主要貢獻者,儘管 TIM 的引入促進了界面處的熱傳遞。
汽車中使用的熱界面材料 (TIM) 有多種類型,包括必需的凝膠、間隙填充和絕緣墊、膠帶和潤滑脂。 根據行業分析,到 2030 年,全球汽車行業預計將增長到略低於 9 萬億美元。 預計新車銷量將佔其中的 38% 左右。 因此,汽車行業的擴張為擴大熱界面材料 (TIM) 市場提供了機會。 此外,在預測期內,技術進步、終端用戶行業多樣化以及新興國家對熱界面材料不斷增長的需求將為市場擴張帶來許多新機遇。
TIM 的導熱性與其價格直接相關。 然而,增加的導熱性也會對整體組件產生負面影響,例如操作不便和相容性差。 TIM 的成本和設備擁有成本受導熱性、相變、粘度、壓力、除氣、表面光潔度、應用便利性和材料機械性能等因素的影響。
COVID-19 疫情顯著降低了對熱界面材料 (TIM) 的需求,但只是持續了很短的一段時間。 隨著電話會議的普及和遠程工作的趨勢,材料成為必需品。 在家工作的策略刺激了市場增長,並促進了筆記本電腦、智能手機、個人電腦等產品的銷售。 在醫療設備中,由於對醫療設備的需求不斷增加,需要更多的熱界面材料 (TIM)。
有機矽部分佔據了最大的市場份額。 在熱界面材料 (TIM) 中,矽將在 2021 年處於領先地位。 矽因其在各種應用中的有效性能而得到更廣泛的應用。 矽對沖擊、振動和機械應力具有很強的抵抗力。 有機矽經常用於許多產品中,例如護墊、填縫劑、潤滑脂和粘合劑。
由於在電氣和電子元件中提供導熱性的處理和安裝程序易於處理,預計彈性墊在預測期內將實現顯著的複合年增長率。 然而,有限的應用空間和較高的產品單價預計將抑制預測期內的增長。
亞太地區在 2019 年以超過 37% 的最高收入份額引領市場,因為該地區各行各業都擁有大型製造基地。 除了該地區的製造業基地外,較低的公司稅、較高的家庭收入、較低的商品和服務稅 (GST)、消費者健康意識、政府支持政策和生活方式的改變等因素都有助於該地區的增長。據信這影響了熱界面材料 (TIM) 領域的發展。
預計亞太地區在預測期內將顯著增長。 由於城市化、工業化以及對消費和電信設備的需求增加,該地區的熱界面材料 (TIM) 市場正在擴大。 導熱界面材料 (TIM) 在亞太地區的應用因其在醫療設備中的日益使用以及電動和混合動力汽車的普及而得到進一步推動。 鼓勵使用可再生能源的計劃的引入、公共和私營機構對研發的投資以及技術進步都有助於加速該地區的市場增長。
2022 年 6 月,道康寧公司推出了新的 TIM,DOWSIL TC-4040。 這種填縫劑易於分配,具有高導熱性和抗塌落性。 這一新產品的推出將有助於公司在 TIM 市場保持競爭力。
2022 年 1 月,3M 擴大了在田納西州克林頓的業務。 3M 將在田納西州克林頓工廠投資約 4.7 億美元,到 2025 年將新增約 600 個工作崗位。
2020 年 9 月,Parker Hannifin Corporation 推出了 THERM-A-GAP GEL 37,這是一種新型單組分導熱可分配材料。 這一新產品的推出加強了公司在 TIM 市場的產品組合。
According to Stratistics MRC, the Global Thermal Interface Materials Market is accounted for $2.14 billion in 2022 and is expected to reach $4.52 billion by 2028 growing at a CAGR of 13.3% during the forecast period. Thermal interface fillers are used to close up spaces and interfaces that naturally form between heat-generating parts and their corresponding heat sinks. In order to maximize heat transfer, these interface materials provide a conductive medium and eliminate air gaps. The demand for products that can improve heat transfer from device chips to the heat sink, preventing heat buildup and extending the life of the gadget, has increased with the production of compact, miniaturized, and high-energy-density gadgets.
According to the industrial analysis, it is expected that the automotive industry will grow to under nine trillion US dollars by 2030 globally. The new vehicle sales will account for approx. 38% of this value. Hence, the growing automotive sector will create beneficial opportunities for the growth of the thermal interface materials market.
Thermal interface materials are in demand due to the expanding led market.
Fluorescent lighting that uses more energy than necessary is currently being replaced by LED. However, there are some physical inconsistencies with LED lights by nature. To produce the desired lumen outputs, LED power must be high. At the same time, LED current must be low to minimize energy loss and heat generation. Applying the four separation principles separation in time and space, separation at the system level, and separation on condition can resolve these physical contradictions. Separation is the best course of action in many situations where optimizations have reached their limits. But a sufficient heat exchange medium is needed to lengthen the LED's operating life. They strike the ideal balance between factors like cost, heat dissipating capacity, and available space. The demand for TIMs is anticipated to increase proportionally to the growth in demand for LED lighting. Combining the optical and thermal design disciplines to improve the overall system efficiency and light quality, including the electronic driving system, is the challenge of a sophisticated LED design. As a result, the demand for and effectiveness of TIMs will be affected proportionately as LED designs become more advanced.
Performance of thermal interface materials is constrained by physical properties.
Power densities in electronic devices, particularly in microprocessor chips, have increased over the last few decades. Electronic circuit thermal problems have significantly increased as a result of the ongoing trend toward smaller device dimensions. Thus, it is increasingly important and fundamental to focus on thermal management in order to guarantee that electronic devices function as intended. Conductive heat transfer is typically used to disperse the heat from its point of generation into the extended surface area of a heat sink. However, a thermal management system may use all modes of heat transfer to maintain temperatures within their appropriate limits and ensure maximum performance and reliability. A crucial component of an assembly when solid surfaces are connected together to minimize contact resistance is the injection of TIMs into the joint to fill the air spaces. It is well known that TIMs are the primary cause of the system's thermal resistance, even though their introduction facilitates heat transfer across an interface.
There are numerous types of thermal interface materials found in automobiles, including essential gels, gap-filling and insulating pads, adhesive tapes, and greases. The automotive industry is anticipated to grow to less than nine trillion US dollars globally by 2030, according to the industrial analysis. This value will be accounted for by new car sales to the tune of about 38%. In light of this, the expanding automotive industry will present favorable opportunities for the market for thermal interface materials to expand. Additionally, the forecast period will bring about a number of new opportunities for the market to expand due to rising technological advancements, a variety of end-user industries, and rising demand for thermal interface materials from emerging economies.
The thermal conductivity of TIMs directly relates to their price. However, an increase in thermal conductivity also has a detrimental effect on the assembly as a whole due to poor handling and decreased conformability. The cost of TIMs and the cost of ownership of equipment are influenced by factors like thermal conductivity, phase change, viscosity, pressure, outgassing, surface finish, ease of application, and mechanical properties of the material.
The COVID-19 epidemic significantly reduced demand for thermal interface materials, but it only lasted a short while. The growing Acceptance of teleconferencing and trends toward remote working have necessitated the materials. The work-from-home strategy stimulated market growth and raised sales of laptops, smartphones, personal computers, and other technology. Healthcare devices require more thermal interface materials due to the rise in demand for medical equipment.
The largest market share was held by the silicone segment. In terms of thermal interface materials, silicon led the way in 2021. Silicone has become more widely used as a result of its effective performance in a variety of applications. Silicone has a high level of resistance to shock, vibration, and mechanical stress. In numerous products, including pads, gap fillers, greases, and adhesives, silicone is frequently used.
Due to their straightforward handling and installation procedures for thermal conductivity in electrical and electronic components, elastomeric pads are predicted to experience a significant CAGR during the forecasted period. However, it is anticipated that the limited application space and high product unit costs will stifle growth in the anticipated time frame.
Due to the presence of a sizable manufacturing base for a variety of industries in the region, Asia Pacific led the market with the highest revenue share of more than 37% in 2019. Aside from the region's manufacturing base, factors like lower corporate taxes, rising household incomes, a decline in the Goods and Services Tax (GST), consumer health consciousness, supportive governmental policies, and changing lifestyles may have had an impact on the development of the thermal interface materials sector in the area.
During the forecast period, Asia-Pacific is anticipated to grow significantly. The region's market for thermal interface materials is expanding as a result of increased urbanization, industrialization, and consumer and telecommunications device demand. The adoption of thermal interface materials in Asia-Pacific is further boosted by their expanding use in medical devices and the rising popularity of electric and hybrid vehicles. The introduction of programs to encourage the use of renewable energy sources, investments in R&D by both public and private organizations, and technological advancements all help to speed up market growth in the area.
Some of the key players in Thermal Interface Materials market include AIM Specialty Materials, AOS Thermal Compounds LLC, CSL Silicones Inc. , CSW Industrials, Inc. , Fuji Polymer Industries Co., Ltd., GrafTech International Ltd., Henkel AG and Co. KgaA , Honeywell International, Inc., Hylomar LLC , Indium Corporation, Laird Technologies, Inc., Linseis GmbH, llinois Tool Works Inc , Mcgill Airseal LLC , Momentive Performance Materials, Inc., Parker Hannifin Corp., Pidilite Industries Ltd. , PPG Industries , Shin-Etsu Chemical Co. Ltd., The 3M Company, The Dow Chemical Company, Wacker Chemie AG and Wakefield Thermal, Inc.
In June 2022, Dow Corning Corporation launched a new TIMs, DOWSIL TC-4040. This gap filler is easy to dispense, possess high thermal conductivity, and resist slumping. This new product launch will help the company stay competitive in the TIMs market.
In January 2022, 3M expanded its operations in Clinton, Tennessee. 3M invested approximately USD 470 million and adding around 600 new jobs by 2025 at its plant in Clinton, Tennessee.
In September 2020, Parker Hannifin Corporation launched THERM-A-GAP GEL 37, a new single component, thermally conductive dispensable material. This new product launch will help the company to strengthen its product portfolio in the TIMs market.