亞太地區 HMC(混合記憶體立方體)和 HBM(寬頻記憶體)市場:按應用、最終用戶、記憶體類型、容量和國家進行分析和預測(2023-2033 年)
市場調查報告書
商品編碼
1503256

亞太地區 HMC(混合記憶體立方體)和 HBM(寬頻記憶體)市場:按應用、最終用戶、記憶體類型、容量和國家進行分析和預測(2023-2033 年)

Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market: Focus on Application, End Use, Memory Type, Capacity, and Country - Analysis and Forecast, 2023-2033

出版日期: | 出版商: BIS Research | 英文 63 Pages | 商品交期: 1-5個工作天內

價格

亞太地區HMC(混合儲存立方體)和HBM(寬頻儲存)市場規模預計將從2023年的約11.072億美元成長到2033年的123.286億美元,預測期內複合年成長率為27.25%。與美元相當的規模。

人工智慧、巨量資料分析和高效能運算的使用正在迅速增加各個領域產生的資料量,推動對高頻寬、大容量儲存解決方案的需求。這些先進的記憶體解決方案對於有效管理大型資料集至關重要,特別是在人工智慧加速器和物聯網/自動化系統的邊緣運算應用中,從而推動市場成長。

主要市場統計數據
預測期 2023-2033
2023年評估 11.072 億美元
2033年預測 123.286 億美元
複合年成長率 27.25%

在以資料為中心的應用程式興起的推動下,亞太地區 HMC(混合記憶體立方體)和 HBM(高頻寬記憶體)市場正在經歷顯著成長。該地區的通訊、汽車和消費性電子產品等行業正在快速採用人工智慧、物聯網和高效能運算,推動了對先進記憶體解決方案的需求。 HMC 和 HBM 技術提供卓越的頻寬、效率和效能,使其成為管理大型資料集和提高運算能力的理想選擇。中國、日本和韓國等國家在技術和基礎設施方面進行了大量投資,在市場上處於領先地位。

本報告調查了亞太地區HMC(混合儲存立方體)和HBM(高頻寬儲存)市場,提供了行業趨勢、技術和專利趨勢、市場成長促進和限制因素、市場規模趨勢和預測等資訊,它總結了各個類別和主要國家的詳細分析、競爭狀況、主要企業概況等。

市場分類

第 1 部分:按應用

  • GPU
  • ASIC
  • CPU
  • APU
  • 其他

第 2 部分:最終用戶

  • 高效能運算
  • 網路/通訊
  • 資料中心
  • 圖形渲染遊戲
  • 其他

第 3 部分:按記憶體類型

  • 混合儲存立方體 (HMC)
  • 高頻寬記憶體 (HBM)

第 4 部分:按產能

  • 2GB~8GB
  • 8GB~16GB
  • 16GB以上

第 5 部分:按國家分類

  • 中國
  • 印度
  • 日本
  • 韓國
  • 其他

目錄

執行摘要

第1章 市場

  • 趨勢:當前和未來的影響評估
    • 趨勢分析:HMC和HBM市場
    • 資料中心應用的進步
    • 記憶體產業越來越關注節能技術解決方案
  • 供應鏈概覽
    • 價值鏈分析
    • 市場地圖
  • 研發回顧
    • 專利申請趨勢(按國家/公司)
  • 全球重大事件影響分析
  • 市場動態概覽
    • 市場促進因素
    • 市場挑戰
    • 市場機會

第2章 區域

  • 區域概況
  • 亞太地區
    • 區域概況
    • 市場成長推進因素
    • 市場問題
    • 目的
    • 產品
    • 中國
    • 印度
    • 日本
    • 韓國
    • 其他

第3章市場:競爭基準化分析/公司簡介

  • 競爭格局
    • Samsung Electronics Co., Ltd.
    • Fujitsu Ltd.
    • SK HYNIX INC.
    • Renesas Electronics Corporation

第4章調查方法

Product Code: ESS2161SS

Introduction to Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market

The Asia-Pacific memory cube and high-bandwidth memory market was valued at around $1,107.2 million in 2023 and is expected to reach $12,328.6 million by 2033, at a CAGR of 27.25% from 2023 to 2033. The rapid increase in data generation across multiple sectors, spurred by the use of AI, big data analytics, and high-performance computing, is driving the need for high-bandwidth and high-capacity memory solutions. These advanced memory solutions are essential for managing large datasets effectively, particularly in AI accelerators and edge computing applications for IoT and autonomous systems, thereby propelling market growth.

KEY MARKET STATISTICS
Forecast Period2023 - 2033
2023 Evaluation$1,107.2 Million
2033 Forecast$12,328.6 Million
CAGR27.25%

Market Introduction

The APAC Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) market is witnessing significant growth driven by increasing data-centric applications. The region's rapid adoption of AI, IoT, and high-performance computing in industries such as telecommunications, automotive, and consumer electronics fuels the demand for advanced memory solutions. HMC and HBM technologies provide superior bandwidth, efficiency, and performance, making them ideal for managing large datasets and enhancing computational capabilities. Countries like China, Japan, and South Korea are leading the market, backed by substantial investments in technology and infrastructure. According to Market Research Future, the APAC region is expected to dominate the HMC and HBM market due to these technological advancements and growing industry applications.

Market Segmentation:

Segmentation 1: by Application

  • Graphics Processing Unit (GPU)
  • Application-Specific Integrated Circuit (ASIC)
  • Central Processing Unit (CPU)
  • Accelerated Processing Unit (APU)
  • Others

Segmentation 2: by End Use

  • High-Performance Computing
  • Networking and Telecommunications
  • Data Centers
  • Graphics Rendering and Gaming
  • Others

Segmentation 3: by Memory Type

  • Hybrid Memory Cube (HMC)
  • High-Bandwidth Memory (HBM)

Segmentation 4: by Capacity

  • 2GB to 8GB
  • 8GB to 16GB
  • Above 16GB

Segmentation 5: by Country

  • China
  • India
  • Japan
  • South Korea
  • Rest-of-Asia-Pacific

Key Market Players and Competition Synopsis

The companies that are profiled in the market have been selected based on inputs gathered from primary experts and analyzing company coverage, product portfolio, and market penetration.

Some of the prominent names in the market are:

  • Samsung Electronics Co., Ltd.
  • Fujitsu Ltd.
  • SK HYNIX INC.
  • Renesas Electronics Corporation

Table of Contents

Executive Summary

Scope and Definition

1 Markets

  • 1.1 Trends: Current and Future Impact Assessment
    • 1.1.1 Trend Analysis: Hybrid Memory Cube and High-Bandwidth Memory Market
    • 1.1.2 Advancements in Data Center Applications
    • 1.1.3 Increasing Focus on Energy-Efficient Technology Solutions in the Memory Industry
  • 1.2 Supply Chain Overview
    • 1.2.1 Value Chain Analysis
    • 1.2.2 Market Map
      • 1.2.2.1 Hybrid Memory Cube and High-Bandwidth Memory Market - Product (by Memory Type)
        • 1.2.2.1.1 Hybrid Memory Cube (HMC)
        • 1.2.2.1.2 High-Bandwidth Memory (HBM)
  • 1.3 Research and Development Review
    • 1.3.1 Patent Filing Trend (by Country, Company)
  • 1.4 Impact Analysis for Key Global Events
  • 1.5 Market Dynamics Overview
    • 1.5.1 Market Drivers
      • 1.5.1.1 Massive Growth of Artificial Intelligence (AI)
      • 1.5.1.2 Increasing Use of Augmented Reality (AR) and Virtual Reality (VR)
    • 1.5.2 Market Challenges
      • 1.5.2.1 Higher Cost than Other Standard DRAMs
      • 1.5.2.2 Heat Dissipation Problems due to Integrated 3D Architectures
    • 1.5.3 Market Opportunities
      • 1.5.3.1 Growing Applications of Edge-Based Technologies
      • 1.5.3.2 Increasing Adoption of Autonomous Driving

2 Regions

  • 2.1 Regional Summary
  • 2.2 Asia-Pacific
    • 2.2.1 Regional Overview
    • 2.2.2 Driving Factors for Market Growth
    • 2.2.3 Factors Challenging the Market
    • 2.2.4 Application
    • 2.2.5 Product
    • 2.2.6 China
    • 2.2.7 India
    • 2.2.8 Japan
    • 2.2.9 South Korea
    • 2.2.10 Rest-of-Asia-Pacific

3 Markets - Competitive Benchmarking & Company Profiles

  • 3.1 Competitive Landscape
    • 3.1.1 Samsung Electronics Co., Ltd.
      • 3.1.1.1 Overview
      • 3.1.1.2 Top Products/Product Portfolio
      • 3.1.1.3 Top Competitors
      • 3.1.1.4 Target Customers
      • 3.1.1.5 Key Personnel
      • 3.1.1.6 Analyst View
      • 3.1.1.7 Market Share (2022)
    • 3.1.2 Fujitsu Ltd.
      • 3.1.2.1 Overview
      • 3.1.2.2 Top Products/Product Portfolio
      • 3.1.2.3 Top Competitors
      • 3.1.2.4 Target Customers
      • 3.1.2.5 Key Personnel
      • 3.1.2.6 Analyst View
      • 3.1.2.7 Market Share (2022)
    • 3.1.3 SK HYNIX INC.
      • 3.1.3.1 Overview
      • 3.1.3.2 Top Products/Product Portfolio
      • 3.1.3.3 Top Competitors
      • 3.1.3.4 Target Customers
      • 3.1.3.5 Key Personnel
      • 3.1.3.6 Analyst View
      • 3.1.3.7 Market Share (2022)
    • 3.1.4 Renesas Electronics Corporation
      • 3.1.4.1 Overview
      • 3.1.4.2 Top Products/Product Portfolio
      • 3.1.4.3 Top Competitors
      • 3.1.4.4 Target Customers
      • 3.1.4.5 Key Personnel
      • 3.1.4.6 Analyst View
      • 3.1.4.7 Market Share (2022)

4 Research Methodology

  • 4.1 Data Sources
    • 4.1.1 Primary Data Sources
    • 4.1.2 Secondary Data Sources
    • 4.1.3 Data Triangulation
  • 4.2 Market Estimation and Forecast

List of Figures

  • Figure 1: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), 2022, 2026, and 2033
  • Figure 2: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), 2022, 2026, and 2033
  • Figure 3: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), 2022, 2026, and 2033
  • Figure 4: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), 2022, 2026, and 2033
  • Figure 5: Hybrid Memory Cube and High-Bandwidth Memory, Recent Developments
  • Figure 6: Supply Chain Analysis for Hybrid Memory Cube and High-Bandwidth Memory Market
  • Figure 7: Patent Filed (by Company), January 2020-December 2023
  • Figure 8: Patent Filed (by Country), January 2020-December 2023
  • Figure 9: Impact Analysis of Market Navigating Factors, 2022-2033
  • Figure 10: Strategic Initiatives, 2020-2023
  • Figure 11: Share of Strategic Initiatives
  • Figure 12: Data Triangulation
  • Figure 13: Top-Down and Bottom-Up Approach
  • Figure 14: Assumptions and Limitations

List of Tables

  • Table 1: Market Snapshot
  • Table 2: Hybrid Memory Cube and High-Bandwidth Memory Market, Regional Opportunities
  • Table 3: Hybrid Memory Cube and High-Bandwidth Memory Market (by Region), $Million, 2022-2033
  • Table 4: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
  • Table 5: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
  • Table 6: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
  • Table 7: Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
  • Table 8: China Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
  • Table 9: China Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
  • Table 10: China Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
  • Table 11: China Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
  • Table 12: India Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
  • Table 13: India Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
  • Table 14: India Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
  • Table 15: India Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
  • Table 16: Japan Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
  • Table 17: Japan Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
  • Table 18: Japan Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
  • Table 19: Japan Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
  • Table 20: South Korea Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
  • Table 21: South Korea Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
  • Table 22: South Korea Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
  • Table 23: South Korea Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
  • Table 24: Rest-of-Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Application), $Million, 2022-2033
  • Table 25: Rest-of-Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by End Use), $Million, 2022-2033
  • Table 26: Rest-of-Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Memory Type), $Million, 2022-2033
  • Table 27: Rest-of-Asia-Pacific Hybrid Memory Cube and High-Bandwidth Memory Market (by Capacity), $Million, 2022-2033
  • Table 28: Market Share