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1530751

2030 年高頻寬記憶體 (HBM) 市場預測：按產品類型、介面類型、記憶體容量、應用、最終用戶和地區進行的全球分析

High Bandwidth Memory Market Forecasts to 2030 - Global Analysis By Product Type, Interface Type (HBM Stacked DRAM Interface, Open Compute Networking Interface and Other Interface Types), Memory Capacity, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據，2024 年全球高頻寬記憶體 (HBM) 市場規模將達到 25 億美元，預計到 2030 年將達到 92 億美元，預測期內複合年成長率為 24.2%。

高頻寬內存 (HBM) 是一種電腦內存，與傳統 DRAM 相比，它可提供更快的資料傳輸速率。這是透過垂直堆疊多個 DRAM晶粒並將它們與矽穿孔電極(TSV) 連接來實現的。 HBM 主要用於高效能運算應用、顯示卡和人工智慧加速器，其中海量資料吞吐量至關重要。 HBM 能夠提供大量頻寬，同時消耗更少的功耗，非常適合資料中心、科學模擬和高級遊戲系統等要求苛刻的任務。

據美光科技稱，其即將推出的 HBM3E 記憶體將提供超過 1.2TB/s 的頻寬，並且與競爭產品相比功耗降低 30%。美光計畫於 2024 年第二季推出 Nvidia H200 Tensor Core GPU 的 24GB 容量 HBM3E 晶片。

對高效能運算日益成長的需求

由於對更快資料處理和增強記憶體頻寬的需求不斷增加，對高效能運算 (HPC) 不斷成長的需求正在推動高頻寬記憶體 (HBM) 市場的發展。 HBM 提供卓越速度和效率的能力對於人工智慧 (AI)、資料中心和進階圖形等應用至關重要。巨量資料分析和複雜模擬的興起進一步推動了這一需求，推動了 HBM 在各種高效能運算環境中的採用。

產能有限

需要先進技術和精度的複雜製造流程限制了可以有效生產的單元數量。這套瓶頸可能會影響 HBM 的可用性，導致潛在的供不應求和價格上漲，並阻礙 HBM 解決方案在各行業的採用。

HBM 技術的進步

HBM 技術的進步代表著市場成長的重大機會。 HBM2E 和即將推出的 HBM3 等創新提供了更高的頻寬、更高的能源效率和更大的儲存容量，以滿足下一代運算應用不斷成長的需求。這些技術突破將提高人工智慧、機器學習和虛擬實境的效能，開拓新的細分市場，並加速 HBM 在新的高效能應用中的採用。

與替代技術的競爭

高頻寬快取 (HBC)、混合記憶體立方體 (HMC) 等新興解決方案以及傳統 DRAM 和 GDDR 技術的進步有可能以更低的成本提供可比的效能。隨著這些替代技術的發展，它們有可能在某些應用中獲得市場佔有率，在這些應用中，成本/效能權衡比 HBM 更有利。此外，對新記憶體架構和材料的研究增加可能會產生顛覆性技術，挑戰 HBM 在高效能運算應用中的地位，限制長期市場成長和採用率。

COVID-19 的影響：

由於供應鏈問題和製造能力下降，COVID-19 大流行最初擾亂了 HBM 的生產。但數位轉型工作也在加速，推動了醫療保健、遠距工作和電子商務等領域對高效能運算解決方案的需求。這導致資料中心擴張和人工智慧實施迅速增加，最終推動中長期對 HBM 的需求。

HBM2E 細分市場預計將在預測期內成為最大的細分市場

與前幾代產品相比，HBM2E 細分市場由於其卓越的性能特性提供更​​高的頻寬和更高的能源效率，預計將主導市場。 HBM2E 滿足了人工智慧、機器學習和高效能運算領域對資料密集型應用不斷成長的需求。 HBM2E 具有更高的容量和速度，是圖形處理單元 (GPU) 和資料中心加速器的理想選擇。 5G 基礎設施、自動駕駛汽車和高級分析等最尖端科技的採用進一步推動了該細分市場的成長，使 HBM2E 成為滿足各行業高頻寬記憶體需求的理想解決方案。

預計 16GB 細分市場在預測期內複合年成長率最高

由於需要大量記憶體的資料密集型應用程式的複雜性不斷增加，16GB 段的複合年成長率最高。這種容量最佳點平衡了許多高階運算應用程式的效能需求和成本考量。 16GB HBM 模組對於記憶體頻寬和容量至關重要的人工智慧訓練、科學模擬和進階圖形渲染特別有吸引力。隨著越來越多的行業採用人工智慧和巨量資料分析，對 16GB HBM 解決方案的需求預計將激增。

佔比最大的地區：

北美地區由於其在高效能運算、人工智慧和資料中心產業的強大影響力，在高頻寬記憶體（HBM）市場佔據主導地位。該地區擁有推動 HBM 應用創新的領先技術公司和研究機構。對人工智慧、雲端運算和進階分析的大量投資進一步推動了對高頻寬記憶體解決方案的需求。北美在最尖端科技開發方面的領先地位以及在多個領域較早採用HBM，使得北美在HBM實施和技術進步方面引領了全球趨勢，建立了壓倒性的市場地位。

複合年成長率最高的地區：

由於快速工業化和技術基礎設施投資的增加，亞太地區預計高頻寬記憶體（HBM）市場的複合年成長率最高。該地區半導體產業不斷發展，中國、日本和韓國等國家對高效能運算不斷成長的需求也推動了市場成長。資料中心的擴張以及人工智慧和虛擬實境應用的進步將進一步加速 HBM 在該地區的採用。

提供免費客製化：

訂閱此報告的客戶可以存取以下免費自訂選項之一：

  • 公司簡介
    • 其他市場參與者的綜合分析（最多 3 家公司）
    • 主要企業SWOT分析（最多3家企業）
  • 區域分割
    • 根據客戶興趣對主要國家的市場估計、預測和複合年成長率（註：基於可行性檢查）
  • 競爭基準化分析
    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 研究資訊來源
    • 主要研究資訊來源
    • 二次研究資訊來源
    • 先決條件

第3章市場趨勢分析

  • 促進因素
  • 抑制因素
  • 機會
  • 威脅
  • 產品分析
  • 應用分析
  • 最終用戶分析
  • 新興市場
  • COVID-19 的影響

第4章波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭公司之間的敵對關係

第5章全球高頻寬記憶體（HBM）市場：依產品類型

  • HBM1
  • HBM2
  • HBM2E
  • HBM3
  • 其他產品類型

第6章全球高頻寬記憶體（HBM）市場：依介面類型

  • HBM 堆疊 DRAM 介面 (HBI)
  • 開放運算網路 (OCN) 介面
  • 其他介面類型

第7章全球高頻寬記憶體（HBM）市場：依記憶體容量分類

  • 2GB
  • 4GB
  • 8GB
  • 16GB
  • 其他內存容量

第8章全球高頻寬記憶體 (HBM) 市場：按應用分類

  • 圖形處理單元（GPU）
  • 專用積體電路 (ASIC)
  • 中央處理器（CPU）
  • 加速處理單元 (APU)
  • 其他用途

第 9 章 全球高頻寬記憶體 (HBM) 市場：依最終用戶分類

  • 高效能運算 (HPC)
  • 人工智慧（AI）
  • 網路裝置
  • 通訊
  • 圖形渲染和遊戲
  • 資料中心
  • 其他最終用戶

第 10 章全球高頻寬記憶體 (HBM) 市場：按地區

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東/非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲

第11章 主要進展

  • 合約、夥伴關係、協作和合資企業
  • 收購和合併
  • 新產品發布
  • 業務拓展
  • 其他關鍵策略

第12章 公司概況

  • Samsung Electronics Co., Ltd.
  • SK Hynix Inc.
  • Micron Technology, Inc.
  • Advanced Micro Devices, Inc.（AMD）
  • NVIDIA Corporation
  • Intel Corporation
  • Xilinx, Inc.
  • Fujitsu Limited
  • IBM Corporation
  • Broadcom Inc.
  • MediaTek Inc.
  • Renesas Electronics Corporation
  • NXP Semiconductors NV
  • Texas Instruments Incorporated
  • Cadence Design Systems, Inc.
  • Arm Holdings plc
  • Marvell Technology Group Ltd.
  • InnoGrit Corporation
Product Code: SMRC26863

According to Stratistics MRC, the Global High Bandwidth Memory (HBM) Market is accounted for $2.5 billion in 2024 and is expected to reach $9.2 billion by 2030 growing at a CAGR of 24.2% during the forecast period. High-bandwidth memory (HBM) is a type of computer memory that offers significantly faster data transfer rates compared to traditional DRAM. It achieves this by stacking multiple DRAM dies vertically and connecting them with through-silicon vias (TSVs). HBM is primarily used in high-performance computing applications, graphics cards, and AI accelerators where massive data throughput is crucial. Its ability to provide substantial bandwidth while consuming less power makes it ideal for demanding tasks in data centers, scientific simulations, and advanced gaming systems.

According to Micron Technology, their upcoming HBM3E memory will offer over 1.2 TB/s bandwidth and 30% lower power consumption compared to competing products. Micron plans to launch 24GB capacity HBM3E chips in Q2 2024 for use in Nvidia's H200 Tensor Core GPUs.

Market Dynamics:

Driver:

Growing need for high-performance computing

The growing need for high-performance computing (HPC) drives the High Bandwidth Memory (HBM) market by increasing demand for faster data processing and enhanced memory bandwidth. HBM's ability to deliver exceptional speed and efficiency is crucial for applications in artificial intelligence (AI), data centers, and advanced graphics. This demand is further fueled by the rise in big data analytics and complex simulations, pushing the adoption of HBM in various high-performance computing environments.

Restraint:

Limited production capacity

The complex manufacturing process, requiring advanced technology and precision, restricts the number of units that can be produced efficiently. This bottleneck affects the availability of HBM, leading to potential supply shortages and increased prices, which can hinder the widespread adoption of HBM solutions across different industries.

Opportunity:

Advancements in HBM technology

Advancements in HBM technology present significant opportunities for market growth. Innovations such as HBM2E and upcoming HBM3 offer higher bandwidth, improved energy efficiency, and greater storage capacity, meeting the rising demands of next-generation computing applications. These technological breakthroughs enable enhanced performance in AI, machine learning, and virtual reality, opening new market segments and driving the adoption of HBM in emerging high-performance applications.

Threat:

Competition from alternative technologies

Emerging solutions like High Bandwidth Cache (HBC), Hybrid Memory Cube (HMC), and advancements in traditional DRAM and GDDR technologies could potentially offer comparable performance at lower costs. As these alternatives evolve, they may capture market share in certain applications where the cost-performance trade-off favors them over HBM. Additionally, ongoing research into novel memory architectures and materials could lead to disruptive technologies that challenge HBM's position in high-performance computing applications, potentially limiting its long-term market growth and adoption rates.

Covid-19 Impact:

The COVID-19 pandemic initially disrupted HBM production due to supply chain issues and reduced manufacturing capacity. However, it also accelerated digital transformation efforts, increasing demand for high-performance computing solutions in sectors like healthcare, remote work, and e-commerce. This led to a surge in data center expansions and AI implementations, ultimately driving demand for HBM in the medium to long term.

The HBM2E segment is expected to be the largest during the forecast period

The HBM2E segment is expected to dominate the market due to its superior performance characteristics, offering higher bandwidth and improved power efficiency compared to previous generations. HBM2E addresses the growing demands of data-intensive applications in AI, machine learning, and high-performance computing. Its increased capacity and speed make it ideal for graphics processing units (GPUs) and data center accelerators. The segment's growth is further fueled by its adoption of cutting-edge technologies like 5G infrastructure, autonomous vehicles, and advanced analytics, positioning HBM2E as the go-to solution for high-bandwidth memory requirements in various industries.

The 16GB segment is expected to have the highest CAGR during the forecast period

The 16GB segment is experiencing the highest CAGR due to the increasing complexity of data-intensive applications requiring larger memory capacities. This capacity sweet spot balances performance needs with cost considerations for many high-end computing applications. The 16GB HBM modules are particularly attractive for AI training, scientific simulations, and advanced graphics rendering, where memory bandwidth and capacity are crucial. As more industries adopt AI and big data analytics, the demand for 16GB HBM solutions is expected to surge.

Region with largest share:

The North America region is positioned to dominate the High Bandwidth Memory (HBM) Market due to its strong presence in high-performance computing, artificial intelligence, and data center industries. The region hosts major technology companies and research institutions driving innovation in HBM applications. Substantial investments in AI, cloud computing, and advanced analytics further fuel demand for high-bandwidth memory solutions. North America's leadership in developing cutting-edge technologies and its early adoption of HBM in various sectors contribute to its dominant market position, setting trends for global HBM adoption and technological advancements.

Region with highest CAGR:

The Asia Pacific region anticipates the highest CAGR in the High Bandwidth Memory (HBM) market owing to rapid industrialization and increasing investments in technology infrastructure. The region's growing semiconductor industry, coupled with rising demand for high-performance computing in countries like China, Japan, and South Korea, fuels market growth. Expanding data centers and advancements in AI and VR applications further accelerate HBM adoption in the region.

Key players in the market

Some of the key players in High Bandwidth Memory (HBM) market include Samsung Electronics, SK Hynix, Micron Technology, AMD, NVIDIA, Intel, Xilinx, Fujitsu, IBM, Broadcom, MediaTek, Renesas Electronics, NXP Semiconductors, Texas Instruments, Cadence Design Systems, Arm Holdings, Marvell Technology Group, and InnoGrit Corporation.

Key Developments:

In February 2024, Samsung Electronics, a world leader in advanced memory technology announced that it has developed HBM3E 12H, the industry's first 12-stack HBM3E DRAM and the highest-capacity HBM product to date. Samsung's HBM3E 12H provides an all-time high bandwidth of up to 1,280 gigabytes per second (GB/s) and an industry-leading capacity of 36 gigabytes (GB). In comparison to the 8-stack HBM3 8H, both aspects have improved by more than 50%.

In December 2023, Nvidia has paid hundreds of millions of dollars in advance to SK Hynix and Micron to ensure a stable supply of High Bandwidth Memory (HBM). Recently, Samsung Electronics completed product testing and signed an HBM product supply contract with Nvidia. According to industry sources cited by Chosun Biz, SK Hynix, and Micron each received between KRW700 billion and KRW1 trillion (approximately US$540 million to US$770 million) in advance payments from Nvidia for the supply of advanced memory products. Although the details are not disclosed, the industry believes this is a measure by Nvidia to secure the supply of HBM3e for its new GPU products in 2024.

In November 2023, Nvidia announced the H200 and GH200 product line at Supercomputing 23 this morning. These are the most powerful chips Nvidia has ever created, building on the existing Hopper H100 architecture but adding more memory and more compute. These are set to power the future generation of AI supercomputers, with over 200 exaflops of AI compute set to come online during 2024.

Product Types Covered:

  • HBM1
  • HBM2
  • HBM2E
  • HBM3
  • Other Product Types

Interface Types Covered:

  • HBM Stacked DRAM Interface (HBI)
  • Open Compute Networking (OCN) Interface
  • Other Interface Types

Memory Capacities Covered:

  • 2GB
  • 4GB
  • 8GB
  • 16GB
  • Other Memory Capacities

Applications Covered:

  • Graphics Processing Unit (GPU)
  • Application-Specific Integrated Circuit (ASIC)
  • Central Processing Unit (CPU)
  • Accelerated Processing Unit (APU)
  • Other Applications

End Users Covered:

  • High-Performance Computing (HPC)
  • Artificial Intelligence (AI)
  • Networking Equipment
  • Telecommunications
  • Graphics Rendering and Gaming
  • Data Centers
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Product Analysis
  • 3.7 Application Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global High Bandwidth Memory (HBM) Market, By Product Type

  • 5.1 Introduction
  • 5.2 HBM1
  • 5.3 HBM2
  • 5.4 HBM2E
  • 5.5 HBM3
  • 5.6 Other Product Types

6 Global High Bandwidth Memory (HBM) Market, By Interface Type

  • 6.1 Introduction
  • 6.2 HBM Stacked DRAM Interface (HBI)
  • 6.3 Open Compute Networking (OCN) Interface
  • 6.4 Other Interface Types

7 Global High Bandwidth Memory (HBM) Market, By Memory Capacity

  • 7.1 Introduction
  • 7.2 2GB
  • 7.3 4GB
  • 7.4 8GB
  • 7.5 16GB
  • 7.6 Other Memory Capacities

8 Global High Bandwidth Memory (HBM) Market, By Application

  • 8.1 Introduction
  • 8.2 Graphics Processing Unit (GPU)
  • 8.3 Application-Specific Integrated Circuit (ASIC)
  • 8.4 Central Processing Unit (CPU)
  • 8.5 Accelerated Processing Unit (APU)
  • 8.6 Other Applications

9 Global High Bandwidth Memory (HBM) Market, By End User

  • 9.1 Introduction
  • 9.2 High-Performance Computing (HPC)
  • 9.3 Artificial Intelligence (AI)
  • 9.4 Networking Equipment
  • 9.5 Telecommunications
  • 9.6 Graphics Rendering and Gaming
  • 9.7 Data Centers
  • 9.8 Other End Users

10 Global High Bandwidth Memory (HBM) Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Samsung Electronics Co., Ltd.
  • 12.2 SK Hynix Inc.
  • 12.3 Micron Technology, Inc.
  • 12.4 Advanced Micro Devices, Inc. (AMD)
  • 12.5 NVIDIA Corporation
  • 12.6 Intel Corporation
  • 12.7 Xilinx, Inc.
  • 12.8 Fujitsu Limited
  • 12.9 IBM Corporation
  • 12.10 Broadcom Inc.
  • 12.11 MediaTek Inc.
  • 12.12 Renesas Electronics Corporation
  • 12.13 NXP Semiconductors N.V.
  • 12.14 Texas Instruments Incorporated
  • 12.15 Cadence Design Systems, Inc.
  • 12.16 Arm Holdings plc
  • 12.17 Marvell Technology Group Ltd.
  • 12.18 InnoGrit Corporation

List of Tables

  • Table 1 Global High Bandwidth Memory (HBM) Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global High Bandwidth Memory (HBM) Market Outlook, By Component (2022-2030) ($MN)
  • Table 3 Global High Bandwidth Memory (HBM) Market Outlook, By Hardware (2022-2030) ($MN)
  • Table 4 Global High Bandwidth Memory (HBM) Market Outlook, By Base Stations (2022-2030) ($MN)
  • Table 5 Global High Bandwidth Memory (HBM) Market Outlook, By Antennas (2022-2030) ($MN)
  • Table 6 Global High Bandwidth Memory (HBM) Market Outlook, By Routers (2022-2030) ($MN)
  • Table 7 Global High Bandwidth Memory (HBM) Market Outlook, By Switches (2022-2030) ($MN)
  • Table 8 Global High Bandwidth Memory (HBM) Market Outlook, By Other Hardware (2022-2030) ($MN)
  • Table 9 Global High Bandwidth Memory (HBM) Market Outlook, By Software (2022-2030) ($MN)
  • Table 10 Global High Bandwidth Memory (HBM) Market Outlook, By Network Management Software (2022-2030) ($MN)
  • Table 11 Global High Bandwidth Memory (HBM) Market Outlook, By Security Solutions (2022-2030) ($MN)
  • Table 12 Global High Bandwidth Memory (HBM) Market Outlook, By Other Software (2022-2030) ($MN)
  • Table 13 Global High Bandwidth Memory (HBM) Market Outlook, By Deployment Type (2022-2030) ($MN)
  • Table 14 Global High Bandwidth Memory (HBM) Market Outlook, By On-premises (2022-2030) ($MN)
  • Table 15 Global High Bandwidth Memory (HBM) Market Outlook, By Cloud-based (2022-2030) ($MN)
  • Table 16 Global High Bandwidth Memory (HBM) Market Outlook, By Organization Size (2022-2030) ($MN)
  • Table 17 Global High Bandwidth Memory (HBM) Market Outlook, By Small and Medium-sized Enterprises (SMEs) (2022-2030) ($MN)
  • Table 18 Global High Bandwidth Memory (HBM) Market Outlook, By Large Enterprises (2022-2030) ($MN)
  • Table 19 Global High Bandwidth Memory (HBM) Market Outlook, By Technology (2022-2030) ($MN)
  • Table 20 Global High Bandwidth Memory (HBM) Market Outlook, By LTE (2022-2030) ($MN)
  • Table 21 Global High Bandwidth Memory (HBM) Market Outlook, By 5G (2022-2030) ($MN)
  • Table 22 Global High Bandwidth Memory (HBM) Market Outlook, By Wi-Fi (2022-2030) ($MN)
  • Table 23 Global High Bandwidth Memory (HBM) Market Outlook, By Other Technologies (2022-2030) ($MN)
  • Table 24 Global High Bandwidth Memory (HBM) Market Outlook, By Application (2022-2030) ($MN)
  • Table 25 Global High Bandwidth Memory (HBM) Market Outlook, By Manufacturing (2022-2030) ($MN)
  • Table 26 Global High Bandwidth Memory (HBM) Market Outlook, By Healthcare (2022-2030) ($MN)
  • Table 27 Global High Bandwidth Memory (HBM) Market Outlook, By Transportation and Logistics (2022-2030) ($MN)
  • Table 28 Global High Bandwidth Memory (HBM) Market Outlook, By Energy and Utilities (2022-2030) ($MN)
  • Table 29 Global High Bandwidth Memory (HBM) Market Outlook, By Emergency Services (2022-2030) ($MN)
  • Table 30 Global High Bandwidth Memory (HBM) Market Outlook, By Other Applications (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.