混合儲存立方體市場：現況分析與預測（2023-2030）

Hybrid Memory Cube Market: Current Analysis and Forecast (2023-2030)

出版日期: 2024年04月01日 | 出版商:

UnivDatos Market Insights Pvt Ltd | 英文 136 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

由於人工智慧應用的普及，混合儲存立方體市場預計將以約26.50%的複合年增長率成長。此外，人工智慧的日益普及也是成長的一個因素。該技術本身正在以前所未有的速度發展和被採用。這種向人工智慧的轉變增加了對高效能 GPU 的需求，為 HMC 創造了有利的需求環境。例如，2024 年 2 月，全球最大的 GPU 製造商Nvidia宣佈，隨著全球人工智慧蓬勃發展，資料中心晶片和 GPU 的需求增加，其季度收入將增長兩倍。此外，企業正在將其營運轉移到雲端。這種向雲端的傾斜增加了對資料中心的需求，從而增加了對 HMC（一種更有效率、更省電的儲存技術）的需求。此外，由於訓練AI模型對高功率運算的需求不斷增加，高效能電腦的普及程度也不斷提高，促使市場對HMC的需求激增。

根據產品類型，混合儲存立方體市場分為 GPU、CPU、APU、FPGA 和 ASIC。在市場上，GPU 領域對 HMC 的需求最高。這種擴張主要是由生成式人工智慧的擴散所推動的。此外，Amazon和 Meta 等大公司雲端基礎設施的快速發展為 GPU 需求增加提供了有利的環境，因為對支援 AI 專案的運算能力有巨大的需求，我們正在為 HMC 需求的擴展做出貢獻。例如，2024年1月，Meta執行長宣佈將在2024年底前投資10億美元購買35萬片Nvidia H100圖形晶片，用於開發公司的運算基礎設施。

依應用劃分，市場分為圖形、人工智慧、高效能運算、網路和資料中心。人工智慧和 HPC 推動了 HMC 的大部分需求。需求激增主要是由生成式人工智慧近年來呈指數級增長所推動的。大量的運算能力用於訓練這些模型來處理大量資料。這種轉變促使對 HMC 整合 GPU 的需求激增，這些 GPU 可以處理支援這些大規模語言模型 (LLM) 所需的運算能力。此外，各種工業設置中越來越多地採用高效能運算來進行密集資料處理，也推動了對高效能記憶體的需求。

混合儲存立方體市場依最終用戶細分為企業儲存、通訊和網路、人工智慧開發人員等。人工智慧開發人員正在主導 HCM 的需求。這種需求主要是由數據密集型應用程式的快速成長所驅動的，特別是人工智慧和超級運算。此外，ChatGPT 等大規模人工智慧模型的使用不斷增加，促使 HBM1 的需求激增。這些模型需要快速的資料處理和資料傳輸，而這只能透過高頻寬記憶體來實現。此外，HBM 在需要頻寬的應用程式中很受歡迎。每個堆疊的速度約為 1.2 TB/s，任何傳統記憶體都無法在頻寬方面擊敗 HBM3E2。這種高頻寬對於人工智慧應用程式的高效運作至關重要。

為了更瞭解混合儲存立方體的市場介紹，我們在北美（美國、加拿大、北美其他地區）、歐洲（德國、英國、法國、西班牙、義大利、歐洲其他地區）、亞太地區（中國）進行了研究、日本、印度，根據其在韓國、台灣和世界其他地區（韓國、台灣和亞太地區其他地區）的全球影響力來分析市場。北美佔據了很大的佔有率。北美混合儲存立方體市場預計在未來幾年將快速成長。這種需求的成長在很大程度上是由需要高速資料處理的資料密集型應用程式的快速成長所推動的，特別是人工智慧和超級運算，而這反過來又需要高頻寬記憶體。此外，對人工智慧新創企業的資助增加正在加快該地區人工智慧技術開發和應用的步伐。此外，該地區政府對人工智慧發展的有利政策也鼓勵各行業採用人工智慧技術，對成長做出了巨大貢獻。生成式人工智慧的快速崛起正在推動資料中心市場對高速 HBM 技術的需求。人工智慧工作負載正在推動對更高頻寬的需求，以提高設備和處理單元之間的資料傳輸速度。超大規模企業和原始設備製造商 (OEM) 正在增加伺服器容量，並需要更多 AI 加速器來支援模型訓練和推理。因此，我們正在推動與這些加速器相關的 HBM 的強勁成長。

市場上的主要公司包括Micron Technology, Inc.; Samsung; SK HYNIX INC.; Intel Corporation; NVIDIA Corporation; Global Unichip Corp; Cambricon; Huawei Technologies Co.,; IBM; and Advanced Micro Devices, Inc.等

The Hybrid Memory Cube (HMC) is a high-performance computer random-access memory (RAM) interface for through-silicon via (TSV)-based stacked DRAM memory. It was co-developed by Samsung Electronics and Micron Technology in 2011. HMC uses standard DRAM cells but it has more data banks than classic DRAM memory of the same size. The memory controller is integrated as a separate die. It promised a 15 times speed improvement over DDR3. Though, Micron discontinued the HMC product in 2018 when it failed to achieve market adoption, however shifting market dynamics towards Artificial Intelligence is boosting the demand for Hybrid memory cubes in the market and encouraging manufacturers to mass produce the HMCs, with the demand exceeding the supply.

The Hybrid Memory Cube Market is expected to grow at a strong CAGR of around 26.50% owing to the growing widespread adoption of Artificial Intelligence applications. Furthermore, the growth can be attributed to the rising proliferation of artificial intelligence. The technology itself is experiencing an unprecedented rate of development and adoption. This shift towards AI increased demand for high-performance GPUs, creating a favorable demand environment for HMCs. For instance, in February 2024, Nvidia, the world's largest producer of GPUs, presented a forecast of a three-fold increase in its quarterly revenue with boosted demand for data center chips and GPUs amid the AI boom the world is witnessing. Furthermore, organizations shifting their operations to the cloud. This inclination towards cloud has increased demand for data centers, consequently driving up the need for HMCs, a more efficient and less power-consuming storage technology. Additionally, the popularity of high-performance computers is also rising due to the increased need for high-power computations to train AI models, further leading to a surge in demand for HMCs in the markets.

Based on product type, the hybrid memory cube market is categorized into GPU, CPU, APU, FPGA, and ASIC. The GPU segment is generating maximum demand for HMCs in the markets. The increasing prevalence of generative AI primarily drives this expansion. Furthermore, the rapid advancement in the development of cloud infrastructure, by large corporations such as Amazon, and Meta, amid the enormous demand for computing power to support AI projects, is creating a favorable environment of growth in demand for GPUs, subsequently benefitting the increasing need for HMCs. For instance, in Jan 2024, Meta CEO announced an investment of a billion dollars in purchasing 350,000 units of Nvidia's H100 graphic chips, for developing its computing infrastructure by the end of 2024.

Based on application the market is segmented into graphics, AI and high-performance computing, networking, and data centers. AI and HPC generate most of the demand for HMC. This surge in demand is primarily driven by the exponential growth witnessed by generative AI in the recent past. A considerable amount of computing power for massive data processing goes into training these models. This shift has led to a surge in demand for GPUs integrated with HMCs, that can match the potential necessary for computing power to support these large language models (LLMs). Furthermore, the growing adoption of high-performance computing in various industrial setups for intensive data processing further elevates the need for high-performance memory.

Based on end-users, the hybrid memory cube market is segmented into enterprise storage, telecommunication and networking, artificial intelligence developers, and others. The AI developers are dominating the demand for HCMs. The demand is primarily driven by the rapid growth of data-intensive applications, particularly in artificial intelligence and supercomputing. Furthermore, the increasing use of large AI models, such as ChatGPT, has led to a surge in demand for HBM1. These models require high-speed data processing and transfer, which can only be achieved with high-bandwidth memories. Additionally, HBM is popular among bandwidth-hungry applications. At around 1.2 TB/s per stack, no conventional memory can beat HBM3E in terms of bandwidth2. This high bandwidth is crucial for the efficient functioning of AI applications.

For a better understanding of the market adoption of Hybrid Memory Cubes, the market is analyzed based on its worldwide presence in countries such as North America (The U.S., Canada, and the Rest of North America), Europe (Germany, The U.K., France, Spain, Italy, Rest of Europe), Asia-Pacific (China, Japan, India, South Korea, Taiwan, Rest of Asia-Pacific), Rest of World. North America holds a prominent share of the market. The North American hybrid memory cube market is poised for rapid growth in the coming years. This rise in demand is primarily driven by the rapid growth of data-intensive applications, particularly in artificial intelligence and supercomputing, which require high-speed data processing, which necessitates high-bandwidth memories. Furthermore, The increased funding for AI startups has accelerated the pace of development and application of AI technologies in the region. Moreover, the favorable government policies of the region regarding AI development have also encouraged the industries to adopt AI technology and have significantly contributed towards the growth. This rapid rise of generative AI has boosted the demand for high-speed HBM technologies in the data center market. AI workloads are driving the need for higher bandwidth to increase data transfer rates between devices and processing units. Hyperscalers and original equipment manufacturers (OEMs) are increasing their server capacity to support model training and inference, requiring more AI accelerators. This is in turn driving strong growth in HBMs associated with these accelerators.

Some of the major players operating in the market include Micron Technology, Inc.; Samsung; SK HYNIX INC.; Intel Corporation; NVIDIA Corporation; Global Unichip Corp; Cambricon; Huawei Technologies Co.,; IBM; and Advanced Micro Devices, Inc.

1MARKET INTRODUCTION

1.1.Market Definitions
1.2.Main Objective
1.3.Stakeholders
1.4.Limitation

2RESEARCH METHODOLOGY OR ASSUMPTION

2.1.Research Process of the Hybrid Memory Cube Market
2.2.Research Methodology of the Hybrid Memory Cube Market
2.3.Respondent Profile

3MARKET SYNOPSIS

4EXECUTIVE SUMMARY

5IMPACT OF COVID-19 ON THE HYBRID MEMORY CUBE MARKET

6HYBRID MEMORY CUBE MARKET REVENUE (USD BN), 2020-2030F.

7MARKET INSIGHTS BY PRODUCT TYPE

7.1.GPU (Graphics Processing Unit)
7.2.CPU (Central Processing Unit)
7.3.APU (Accelerated Processing Unit)
7.4.FPGA (Field Programmable Gate Array)
7.5.ASIC (Application Specific Integrated Circuit)

8MARKET INSIGHTS BY APPLICATION

8.1.Graphics
8.2.AI and High-Performance Computing
8.3.Networking
8.4.Data Centres

9MARKET INSIGHTS BY END-USERS

9.1.Enterprise Storage
9.2.Telecommunications and Networking
9.3.Artificial Intelligence Developers
9.4.Others (Cryptocurrency Miners, Personal Devices, etc.)

10MARKET INSIGHTS BY REGION

10.1.North America
- 10.1.1.The U.S.
- 10.1.2.Canada
- 10.1.3.Rest of North America
10.2.Europe
- 10.2.1.Germany
- 10.2.2.The U.K.
- 10.2.3.France
- 10.2.4.Italy
- 10.2.5.Rest of Europe
10.3.Asia-Pacific
- 10.3.1.China
- 10.3.2.India
- 10.3.3.Japan
- 10.3.4.South Korea
- 10.3.5.Taiwan
- 10.3.6.Rest of Asia-Pacific
10.4.Rest of the World