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市場調查報告書
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1435809

HBM（高頻寬記憶體）：市場佔有率分析、產業趨勢與統計、成長預測（2024-2029）

High Bandwidth Memory - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

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簡介目錄

HBM（高頻寬記憶體）市場規模預計到 2024 年為 25.2 億美元，預計到 2029 年將達到 79.5 億美元，在預測期內（2024-2029 年）複合年成長率為 25.86%。

HBM市場

推動 HBM 市場成長的主要因素包括對高頻寬、低功耗和高度擴充性記憶體的需求不斷成長，人工智慧的採用不斷增加，以及電子設備小型化的趨勢日益明顯。

主要亮點

  • HBM 是一種用於 3D 堆疊 SDRAM 的高速電腦記憶體介面，通常用於高效能圖形加速器、網路設備和超級電腦。
  • 透過在電路上堆疊多達 8 個 DRAM晶粒並將它們與 TSV 互連，HBM 提供了顯著更高的頻寬，同時以相對較小的外形尺寸降低了功耗。此外，HBM 具有 128 位元通道，總合8 個通道，提供 1024 位元介面。因此，具有 4 個 HBM 堆疊的 GPU 提供 4096 位元記憶體匯流排。
  • 隨著圖形應用程式的成長，對更快的資訊傳輸（頻寬）的需求也在成長。因此，HBM內存在性能和功效方面將優於先前使用的GDDR5，為HBM市場創造成長機會。
  • 此外，由於 COVID-19 在全球蔓延，主要半導體供應商的產能業務減少。此外，由於勞動力短缺，中國許多包裝和檢驗工廠已經減少或關閉業務。對於依賴此類後端封裝和測試能力的晶片公司來說，這一直是一個瓶頸。
  • 然而，推動市場成長的因素包括人工智慧的日益普及，對低功耗、高頻寬和高度擴充性記憶體的需求不斷增加，以及電子設備小型化的趨勢日益增強。

HBM 市場趨勢

汽車及其他應用領域預計將顯著成長

  • HBM 應用正在擴展到汽車領域，尤其是隨著自動駕駛汽車和 ADAS 整合的興起。汽車行業的進步正在推動高性能記憶體的採用並支持 HBM 的成長。
  • HBM 透過使用 2.5D 技術改進傳統 DRAM、降低驅動訊號所需的功耗並使訊號更接近 CPU，同時最大限度地減少 RC 延遲來取得進步。自動駕駛市場正在擴大，並廣泛使用資料集來解釋和分析環境。資料處理速度非常快，以防止事故和即將發生的災難。對快速、強大 GPU 的需求增加了對系統中安裝的 HBM 的需求。
  • 先進的駕駛員輔助技術以及自動駕駛在汽車行業中變得非常普及。以前的 ADAS 設計使用 DDR4 和 LPDDR4 等記憶體晶片，因為它們在當時很容易獲得。然而，隨著汽車產業從成本效益轉向更好的性能參數，ADAS 製造商正在將 HBM 技術涵蓋其設計架構中。
  • 汽車技術的快速進步以及汽車中邊緣技術的使用增加預計將增加該領域的 HBM 和 DDRAM 銷售。

北美佔最大市場佔有率

  • HBM 內存在北美的高採用率主要​​是由於高效能運算 (HPC) 應用程式的成長，這些應用程式需要高頻寬記憶體解決方案來進行高速資料處理。人工智慧、機器學習和雲端運算市場的擴大正在增加北美對 HPC 的需求。
  • 各行業技術的快速變化和大量資料的產生需要更有效率的處理系統。這些也是推動該地區 HBM 市場需求的一些因素。
  • 此外，美國政府也啟動了資料中心最佳化舉措（DCOI），以整合全國眾多資料中心，為公民提供更好的服務，同時增加納稅人的投資收益。整合過程包括建置超大型資料中心和關閉表現不佳的資料中心。根據 Cloudscene 的數據，截至 2022 年 1 月，美國約有 2,701 個資料中心。
  • 此外，北美記憶體製造商正在尋求擴大生產的機會。例如，英特爾宣布推出採用 HBM 的新一代 Sapphire Rapids (SPR) Xeon 可擴充處理器。 Sapphire Rapids 支援的 DDR5 有望取代目前伺服器記憶體趨勢的 DDR4，並支援 HBM，從而顯著擴展了 CPU 可用的記憶體頻寬。

HBM行業概況

HBM 市場競爭激烈且高度分散，由多家大型企業組成。該產業競爭對手之間的競爭主要取決於透過創新、市場滲透和競爭策略所獲得的永續競爭優勢。由於該市場是資金集中的，退出障礙也很高。該市場的主要參與者包括英特爾公司、東芝公司、富士通有限公司等。市場近期的主要發展包括：

  • 2022 年 2 月 - Advanced Micro Devices Inc. 宣布收購 Xilinx。該公司預計此次收購將在第一年增加非公認會計準則利潤率、非公認會計準則每股收益和自由現金流的產生。此外，收購賽靈思匯集了AMD高度互補的產品、客戶和市場，以及差異化的IP和世界一流的人才，使AMD成為業界高性能、適應性強的計算組織之一。 。
  • 2022 年 11 月—英特爾公司發布了兩款針對高效能運算 (HPC) 和人工智慧 (AI) 的尖端解決方案，作為英特爾 Max 系列產品家族的一部分。英特爾至強CPU Max系列（代號Sapphire Rapids）HBM和英特爾資料中心GPU Max系列（代號Ponte Vecchio），這些新產品將為計畫在阿貢國家實驗室建造的「Aurora」超級電腦供電。

其他福利

  • Excel 格式的市場預測 (ME) 表
  • 3 個月分析師支持

目錄

第1章簡介

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章市場洞察

  • 市場概況
  • 產業價值鏈分析
  • 產業吸引力－波特五力分析
    • 供應商的議價能力
    • 買家/消費者的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭公司之間敵對關係的強度
  • COVID-19 市場影響評估
  • 市場促進因素
    • 對高頻寬、低功耗和高度擴充性記憶體的需求不斷成長
    • 人工智慧的採用率不斷提高
    • 電子設備小型化趨勢日益明顯
  • 市場挑戰
    • 與 HBM 相關的高成本和設計複雜性
  • 記憶體市場
    • DRAM收益與需求預測（2023-2028）
    • 按地區分類的 DRAM 銷售額（與 HBM 市場相同的地區）
    • DDR5 RAM 產品的當前價格
    • DDR5產品廠商名單

第5章市場區隔

  • 按申請
    • 伺服器
    • 聯網
    • 消費者
    • 汽車和其他應用
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
    • 歐洲
      • 德國
      • 法國
      • 英國
      • 其他歐洲國家
    • 亞太地區
      • 印度
      • 中國
      • 日本
      • 其他亞太地區
    • 世界其他地區

第6章 競爭形勢

  • 公司簡介
    • 主要 HBM 內存晶粒供應商
      • Micron Technology Inc.
      • Samsung Electronics Co. Ltd
      • SK Hynix Inc.
    • 主要相關人員簡介
      • Intel Corporation
      • Fujitsu Limited
      • Advanced Micro Devices Inc.
      • Xilinx Inc.
      • Nvidia Corporation
      • Open Silicon Inc.

第7章 投資分析

第8章 市場機會及未來趨勢

簡介目錄
Product Code: 69589

The High Bandwidth Memory Market size is estimated at USD 2.52 billion in 2024, and is expected to reach USD 7.95 billion by 2029, growing at a CAGR of 25.86% during the forecast period (2024-2029).

High Bandwidth Memory - Market

Major factors driving the growth of the high bandwidth memory (HBM) market include the growing need for high-bandwidth, low power consumption, and highly scalable memories, increasing adoption of artificial intelligence, and a rising trend of miniaturization of electronic devices.

Key Highlights

  • High Bandwidth Memory (HBM) is a high-speed computer memory interface for 3D-stacked SDRAM, usually used with high-performance graphics accelerators, network devices, and supercomputers.
  • By stacking up to 8 DRAM dies on the circuit and interconnecting them by TSVs, HBM offers a substantially higher bandwidth while using less power in a relatively more minor form factor. Also, with 128-bit channels and a total of 8 channels, the HBM offers a 1024-bit interface; a GPU with four HBM stacks would therefore provide a memory bus with 4096 bits.
  • With the growing graphics application, the appetite for fast information delivery (bandwidth) has also increased. Therefore HBM memory performs better than a GDDR5, which was used earlier in terms of performance and power efficiency, resulting in growth opportunities for the high bandwidth memory market.
  • Moreover, the major semiconductor vendors are working with reduced capacity owing to the spread of COVID-19 worldwide. Additionally, due to the shortage of laborers, many packages and testing plants in China reduced or even stopped operations. This created a bottleneck for chip companies that rely on such back-end packages and testing capacity.
  • However, some factors driving the market's growth include the increasing adoption of artificial intelligence, increasing demand for low power consumption, high bandwidth, highly scalable memories, and a rising trend of miniaturization of electronic devices.

High Bandwidth Memory (HBM) Market Trends

Automotive and Other Applications Segment is Expected to Grow Significantly

  • The applications of high bandwidth memory are spanning in the automotive sector due to the rise of self-driving cars and ADAS integration, among others. The advancement in the automotive industry has driven the adoption of high-performance memory, which supports the growth of high-bandwidth memory.
  • HBM has evolved by improving upon conventional DRAM using 2.5D technology, bringing it closer to the CPU while requiring less power to drive a signal and minimizing RC latency. The autonomous driving market is expanding, extensively using data sets to interpret and analyze the environment. To prevent mishaps and impending catastrophes, data processing is carried out at a very rapid pace. The demand for quick and potent GPUs has increased the demand for high-bandwidth memory to be included in the systems.
  • Advanced driver-assistance technologies have become quite popular in the car industry alongside autonomous driving. Earlier ADAS designs use memory chips like DDR4 and LPDDR4 since they were readily available at the time. However, the automobile industry's transition from cost-effectiveness to better performance parameters pushes ADAS makers to incorporate HBM technology into their design architecture.
  • The rapid advancement of technology in automobiles and increasing usage of edge technologies in cars will boost the sales of High Bandwidth Memory and DDRAM in the sector.

North America to Hold the Largest Share in the Market

  • The high adoption of HBM memories in North America is primarily due to the growth in high-performance computing (HPC) applications that require high-bandwidth memory solutions for fast data processing. HPC demand in North America is growing due to the increasing market for AI, machine learning, and cloud computing.
  • The rapidly changing technologies and high data generation across industries create a need for more efficient processing systems. These are also some of the factors driving the demand for the high bandwidth memory market in the region.
  • Additionally, the US government has started the Data Center Optimization Initiative (DCOI) to deliver better services to the public while increasing return on investment to taxpayers by consolidating many data centers in the country. The consolidation process includes the process of building hyper-scale data centers and shut-off the underperforming ones. According to Cloudscene, the country has around 2,701 data centers in the United States as of January 2022.
  • Moreover, memory manufacturing companies in North America seek production expansions opportunities. For instance, Intel announced the launch of the next generation Sapphire Rapids (SPR) Xeon Scalable processor with high-bandwidth memory (HBM). DDR5, supported by Sapphire Rapids, is expected to replace DDR4, the current trend in server memory, with high-bandwidth memory (HBM) support that significantly expands the memory bandwidth available to the CPU.

High Bandwidth Memory (HBM) Industry Overview

The high bandwidth memory market is highly fragmented as the market is highly competitive and consists of several major players. This industry's competitive rivalry primarily depends on sustainable competitive advantage through innovation, market penetration, and competitive strategy power. Since the market is capital-intensive, the barriers to exit are also high. Some of the key players in the market are Intel Corporation, Toshiba Corporation, Fujitsu Ltd, etc. Some of the key recent developments in the market are -

  • February 2022 - Advanced Micro Devices Inc. announced the acquisition of Xilinx. The company expects the purchase to boost non-GAAP margins, non-GAAP EPS, and free cash flow generation in the first year. Furthermore, AMD claims that the Xilinx acquisition brings together a highly complementary collection of products, customers, and markets, as well as differentiated IP and world-class personnel, to build the industry's high-performance and adaptive computing organization.
  • November 2022 - Two cutting-edge solutions for high-performance computing (HPC) and artificial intelligence (AI) have been released by Intel Corporation as part of the Intel Max Series product family: the Intel Xeon CPU Max Series (code-named Sapphire Rapids HBM) and the Intel Data Centre GPU Max Series (code-named Ponte Vecchio). The new items will power the forthcoming Aurora supercomputer at Argonne National Laboratory.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Value Chain Analysis
  • 4.3 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.3.1 Bargaining Power of Suppliers
    • 4.3.2 Bargaining Power of Buyers/Consumers
    • 4.3.3 Threat of New Entrants
    • 4.3.4 Threat of Substitutes
    • 4.3.5 Intensity of Competitive Rivalry
  • 4.4 Assessment of the impact of COVID-19 on the Market
  • 4.5 Market Drivers
    • 4.5.1 Growing Need for High-bandwidth, Low Power Consuming, and Highly Scalable Memories
    • 4.5.2 Increasing Adoption of Artificial Intelligence
    • 4.5.3 Rising Trend of Miniaturization of Electronic Devices
  • 4.6 Market Challenges
    • 4.6.1 Exorbitant Costs and Design Complexities associated with HBM
  • 4.7 DRAM MARKET
    • 4.7.1 DRAM Revenue and Demand Forecast (2023-2028)
    • 4.7.2 DRAM Revenue by Geography (Same geographical regions as in the HBM Market)
    • 4.7.3 Current Pricing of DDR5 RAM Products
    • 4.7.4 List of DDR5 Product Manufacturers

5 MARKET SEGMENTATION

  • 5.1 By Application
    • 5.1.1 Servers
    • 5.1.2 Networking
    • 5.1.3 Consumer
    • 5.1.4 Automotive and Other Applications
  • 5.2 By Geography
    • 5.2.1 North America
      • 5.2.1.1 United States
      • 5.2.1.2 Canada
    • 5.2.2 Europe
      • 5.2.2.1 Germany
      • 5.2.2.2 France
      • 5.2.2.3 United Kingdom
      • 5.2.2.4 Rest of Europe
    • 5.2.3 Asia Pacific
      • 5.2.3.1 India
      • 5.2.3.2 China
      • 5.2.3.3 Japan
      • 5.2.3.4 Rest of Asia Pacific
    • 5.2.4 Rest of the World

6 COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Key HBM Memory Die Suppliers
      • 6.1.1.1 Micron Technology Inc.
      • 6.1.1.2 Samsung Electronics Co. Ltd
      • 6.1.1.3 SK Hynix Inc.
    • 6.1.2 Key Stakeholders Profiles
      • 6.1.2.1 Intel Corporation
      • 6.1.2.2 Fujitsu Limited
      • 6.1.2.3 Advanced Micro Devices Inc.
      • 6.1.2.4 Xilinx Inc.
      • 6.1.2.5 Nvidia Corporation
      • 6.1.2.6 Open Silicon Inc.

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS