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全球 3D IC 市場規模研究與預測，按類型、組件（矽通孔、玻璃通孔、矽中介層）、應用、最終用戶和區域分析，2023-2030 年
市場調查報告書
商品編碼
1407979

全球 3D IC 市場規模研究與預測，按類型、組件（矽通孔、玻璃通孔、矽中介層）、應用、最終用戶和區域分析，2023-2030 年

Global 3D IC Market Size study & Forecast, by Type, by Component (Through-Silicon Via, Through Glass Via, Silicon Interposer), by Application, by End User and Regional Analysis, 2023-2030
出版日期: | 出版商: Bizwit Research & Consulting LLP | 英文 | 商品交期: 2-3個工作天內

價格

2022年全球3D IC市場價值約為120.5億美元，預計在2023-2030年預測期內將以超過20%的健康成長率成長。 3D IC，即3D積體電路，是指將多個半導體晶片（也稱為積體電路（IC））垂直堆疊在一起以創建3D結構的技術。該技術應用於微電子和積體電路設計領域，以克服傳統2D積體電路的一些限制。由於消費性電子產品需求不斷成長以及連網穿戴裝置需求不斷成長等因素，3D IC 市場正在不斷擴大。因此，在2023-2030年預測期內，國際市場對3D IC的需求將逐漸增加。

智慧型手機、平板電腦和遊戲機等消費性電子產品不斷努力提升效能。 3D IC 技術可實現更快的資料傳輸、減少訊號延遲並提高電源效率。隨著消費者需要更快、更強大、更節能的設備，製造商轉向 3D IC 來滿足這些要求。根據Statista預測，2023年消費性電子市場規模預計將達到6,025億美元，預計2027年將在2023-2027年間達到9,503億美元，成長率為12.07%。此外，2023年，美國消費性電子零售額將達4,850億美元。推動 3D IC 市場的另一個重要因素是對連網穿戴裝置的需求不斷成長。穿戴式裝置變得越來越複雜，能夠執行複雜的任務，例如健康監測、健身追蹤、導航和通訊。 3D IC 滿足了穿戴式裝置對增強處理能力的需求，它提供了一種在狹小的空間中整合強大的處理器和記憶體的方法。此外，根據 Statista 的數據，到 2022 年，全球連網穿戴裝置數量將大幅增加，從一年前的 9.29 億台增加到 11 億台。此外，3D IC 在智慧家電中的整合度不斷提高，以及物聯網技術的日益普及，預計將在預測期內為市場創造利潤豐厚的成長機會。然而，與 3D IC 技術相關的高成本和技術複雜性將阻礙 2023-2030 年預測期內的整體市場成長。

全球 3D IC 市場研究涵蓋的關鍵區域包括亞太地區、北美、歐洲、拉丁美洲以及中東和非洲。由於該地區的技術進步導致對積體電路的需求增加，北美在 2022 年佔據了市場主導地位。該地區的主導表現預計將推動 3D IC 的整體需求。此外，由於該地區對技術升級的日益關注以及對智慧設備的需求不斷成長等因素，預計亞太地區在預測期內將成長最快。對智慧型設備不斷成長的需求推動了對改善無線和寬頻網路的投資，確保這些設備能夠無縫、高效地運作。

研究的目的是確定近年來不同細分市場和國家的市場規模，並預測未來幾年的價值。該報告旨在涵蓋參與研究的國家內該行業的定性和定量方面。

該報告還提供了有關促進因素和挑戰等關鍵方面的詳細資訊，這些因素將決定市場的未來成長。此外，它還涵蓋了利害關係人投資的微觀市場的潛在機會，以及對主要參與者的競爭格局和產品供應的詳細分析。

目錄

第 1 章：執行摘要

  • 市場概況
  • 2020-2030 年全球與細分市場估計與預測
    • 2020-2030 年 3D IC 市場（按地區）
    • 3D IC 市場（按類型），2020-2030 年
    • 3D IC 市場（按組件），2020-2030 年
    • 3D IC 市場（按應用），2020-2030 年
    • 3D IC 市場（按最終用戶），2020-2030 年
  • 主要趨勢
  • 估算方法
  • 研究假設

第 2 章：全球 3D IC 市場定義與範圍

  • 研究目的
  • 市場定義和範圍
    • 產業演變
    • 研究範圍
  • 研究涵蓋的年份
  • 貨幣兌換率

第 3 章：全球 3D IC 市場動態

  • 3D IC市場影響分析（2020-2030）
    • 市場促進因素
      • 消費性電子產品需求不斷成長
      • 對連網穿戴裝置的需求不斷成長
    • 市場挑戰
      • 與 3D IC 技術相關的高成本
      • 技術複雜性
    • 市場機會
      • 3D IC 在智慧家電的整合度不斷提高
      • 物聯網技術的日益採用

第 4 章：全球 3D IC 市場產業分析

  • 波特的五力模型
    • 供應商的議價能力
    • 買家的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭競爭
  • 波特的五力影響分析
  • PEST分析
    • 政治的
    • 經濟
    • 社會的
    • 技術性
    • 環境的
    • 合法的
  • 頂級投資機會
  • 最佳制勝策略
  • COVID-19 影響分析
  • 顛覆性趨勢
  • 產業專家視角
  • 分析師推薦與結論

第 5 章：全球 3D IC 市場（按類型）

  • 市場概況
  • 全球 3D IC 市場（按類型、性能）- 潛力分析
  • 2020-2030 年按類型分類的全球 3D IC 市場估計和預測
  • 3D IC 市場區隔分析
    • 堆疊 3D
    • 單片3D

第 6 章：全球 3D IC 市場（按組件）

  • 市場概況
  • 全球 3D IC 市場（按組件、性能）- 潛力分析
  • 2020-2030 年全球 3D IC 市場按組件預測
  • 3D IC 市場區隔分析
    • 矽通孔 (TSV)
    • 玻璃通孔 (TGV)
    • 矽中介層

第 7 章：全球 3D IC 市場（按應用）

  • 市場概況
  • 全球 3D IC 市場（按應用、效能）- 潛力分析
  • 2020-2030 年全球 3D IC 市場預測（按應用）
  • 3D IC 市場區隔分析
    • 邏輯
    • 成像與光電
    • 記憶
    • MEMS/感測器
    • 引領
    • 其他

第 8 章：全球 3D IC 市場（按最終用戶）

  • 市場概況
  • 全球 3D IC 市場（按最終用戶）、效能 - 潛力分析
  • 2020-2030 年最終用戶全球 3D IC 市場估計與預測
  • 3D IC 市場區隔分析
    • 消費性電子產品
    • 電信
    • 汽車
    • 軍事與航太
    • 醫療設備
    • 工業的
    • 其他

第 9 章：全球 3D IC 市場、區域分析

  • 領先國家
  • 頂尖新興國家
  • 3D IC 市場、區域市場概況
  • 北美洲
    • 美國
      • 2020-2030 年型別細分估計與預測
      • 2020-2030 年組件細分估計與預測
      • 2020-2030 年應用細分估計與預測
      • 2020-2030 年最終用戶細分估計與預測
    • 加拿大
  • 歐洲 3D IC 市場概況
    • 英國
    • 德國
    • 法國
    • 西班牙
    • 義大利
    • 歐洲其他地區
  • 亞太地區 3D IC 市場概況
    • 中國
    • 印度
    • 日本
    • 澳洲
    • 韓國
    • 亞太地區其他地區
  • 拉丁美洲 3D IC 市場概況
    • 巴西
    • 墨西哥
  • 中東和非洲
    • 沙烏地阿拉伯
    • 南非
    • 中東和非洲其他地區

第 10 章：競爭情報

  • 重點企業SWOT分析
    • 公司1
    • 公司2
    • 公司3
  • 頂級市場策略
  • 公司簡介
    • Advanced Semiconductor Engineering, Inc
      • 關鍵訊息
      • 概述
      • 財務（視數據可用性而定）
      • 產品概要
      • 最近的發展
    • Amkor Technology, Inc
    • Samsung Electronics Co., Ltd.
    • United Microelectronics Corporation
    • STMicroelectronics NV
    • Toshiba Corporation
    • Intel Corporation
    • Micron Technology, Inc
    • Taiwan Semiconductor Manufacturing Company Limited
    • Xilinx Inc

第 11 章：研究過程

  • 研究過程
    • 資料探勘
    • 分析
    • 市場預測
    • 驗證
    • 出版
  • 研究屬性
  • 研究假設

Global 3D IC Market is valued at approximately USD 12.05 billion in 2022 and is anticipated to grow with a healthy growth rate of more than 20% over the forecast period 2023-2030. 3D IC, or 3D Integrated Circuit, refers to a technology in which multiple semiconductor chips, also known as Integrated Circuits (ICs), are stacked vertically on top of each other to create a three-dimensional structure. This technology is employed in the field of microelectronics and integrated circuit design to overcome some of the limitations of traditional 2D integrated circuits. The 3D IC Market is expanding because of factors such as increasing demand for consumer electronics and growing demand for connected wearable devices. As a result, the demand for 3D IC has progressively increased in the international market during the forecast period 2023-2030.

Consumer electronics, such as smartphones, tablets, and gaming consoles, are continuously striving for improved performance. 3D IC technology allows for faster data transfer, reduced signal delays, and better power efficiency. As consumers demand faster, more powerful, and more energy-efficient devices, manufacturers turn to 3D ICs to meet these requirements. According to Statista, in 2023, the Consumer Electronics market is expected to be worth USD 602.50 billion and estimated to reach up to USD 950.30 billion by 2027 in between 2023-2027 at a rate of 12.07%. Furthermore, in 2023, consumer electronics retail sales in the United States account for USD 485 billion. Another important factor that drives the 3D IC Market is the increasing demand for connected wearable devices. Wearable devices are becoming more sophisticated and capable of performing complex tasks, such as health monitoring, fitness tracking, navigation, and communication. The demand for increased processing power in wearables is met by 3D ICs, which provide a way to integrate powerful processors and memory in a small space. In addition, as per Statista, in 2022, the global number of connected wearable devices increased substantially and reached up to 1.1 billion in number as compared to 929 million a year before. Moreover, the rising integration of 3D IC in smart home appliances and the growing adoption of IoT technology is anticipated to create lucrative growth opportunities for the market over the forecast period. However, high costs associated with 3D IC technology and technical complexity are going to impede overall market growth throughout the forecast period of 2023-2030.

The key regions considered for the Global 3D IC Market study includes Asia Pacific, North America, Europe, Latin America, and Middle East & Africa. North America dominated the market in 2022 owing to the increased demand for integrated circuits due to technological advancements in the region. The region's dominant performance is anticipated to propel the overall demand for 3D IC. Furthermore, Asia Pacific is expected to grow fastest over the forecast period, owing to factors such as increased focus on technological upgradations and growing demand for smart devices in the region. The growing demand for smart devices has driven investments in improved wireless and broadband networks, ensuring that these devices can function seamlessly and efficiently.

Major market player included in this report are:

  • Advanced Semiconductor Engineering, Inc
  • Amkor Technology, Inc
  • Samsung Electronics Co., Ltd.
  • United Microelectronics Corporation
  • STMicroelectronics N.V.
  • Toshiba Corporation
  • Intel Corporation
  • Micron Technology, Inc
  • Taiwan Semiconductor Manufacturing Company Limited
  • Xilinx Inc

Recent Developments in the Market:

  • In October 2023, During the TSMC 2023 OIP Ecosystem Forum, Taiwan Semiconductor Manufacturing Co. Ltd unveiled the new 3Dblox 2.0 open standard and highlighted important achievements within its Open Innovation Platform (OIP) 3DFabric Alliance. 3Dblox 2.0 features sophisticated 3D IC design tools that are intended to considerably improve design efficiency. Simultaneously, the 3DFabric Alliance continues to promote integration across memory, substrate, testing, manufacturing, and packaging. TSMC stays at the forefront of 3D IC innovation, bringing its vast 3D silicon stacking and superior packaging capabilities to a wider variety of customers.

Global 3D IC Market Report Scope:

  • Historical Data - 2020 - 2021
  • Base Year for Estimation - 2022
  • Forecast period - 2023-2030
  • Report Coverage - Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
  • Segments Covered - Type, Component, Application, End User, Region
  • Regional Scope - North America; Europe; Asia Pacific; Latin America; Middle East & Africa
  • Customization Scope - Free report customization (equivalent up to 8 analyst's working hours) with purchase. Addition or alteration to country, regional & segment scope*

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Type

  • Stacked 3D
  • Monolithic 3D

By Component

  • Through-Silicon Via (TSV)
  • Through Glass Via (TGV)
  • Silicon Interposer

By Application

  • Logic
  • Imaging & optoelectronics
  • Memory
  • MEMS/Sensors
  • LED
  • Others

By End User

  • Consumer Electronics
  • Telecommunication
  • Automotive
  • Military & Aerospace
  • Medical Devices
  • Industrial
  • Others

By Region:

  • North America
  • U.S.
  • Canada
  • Europe
  • UK
  • Germany
  • France
  • Spain
  • Italy
  • ROE
  • Asia Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
  • RoAPAC
  • Latin America
  • Brazil
  • Mexico
  • Middle East & Africa
  • Saudi Arabia
  • South Africa
  • Rest of Middle East & Africa

Table of Contents

Chapter 1. Executive Summary

  • 1.1. Market Snapshot
  • 1.2. Global & Segmental Market Estimates & Forecasts, 2020-2030 (USD Billion)
    • 1.2.1. 3D IC Market, by Region, 2020-2030 (USD Billion)
    • 1.2.2. 3D IC Market, by Type, 2020-2030 (USD Billion)
    • 1.2.3. 3D IC Market, by Component, 2020-2030 (USD Billion)
    • 1.2.4. 3D IC Market, by Application, 2020-2030 (USD Billion)
    • 1.2.5. 3D IC Market, by End User, 2020-2030 (USD Billion)
  • 1.3. Key Trends
  • 1.4. Estimation Methodology
  • 1.5. Research Assumption

Chapter 2. Global 3D IC Market Definition and Scope

  • 2.1. Objective of the Study
  • 2.2. Market Definition & Scope
    • 2.2.1. Industry Evolution
    • 2.2.2. Scope of the Study
  • 2.3. Years Considered for the Study
  • 2.4. Currency Conversion Rates

Chapter 3. Global 3D IC Market Dynamics

  • 3.1. 3D IC Market Impact Analysis (2020-2030)
    • 3.1.1. Market Drivers
      • 3.1.1.1. Increasing demand for consumer electronics
      • 3.1.1.2. Growing demand for connected wearable devices
    • 3.1.2. Market Challenges
      • 3.1.2.1. High costs associated with 3D IC technology
      • 3.1.2.2. Technical complexity
    • 3.1.3. Market Opportunities
      • 3.1.3.1. Rising integration of 3D IC in smart home appliances
      • 3.1.3.2. Growing adoption of IoT technology

Chapter 4. Global 3D IC Market Industry Analysis

  • 4.1. Porter's 5 Force Model
    • 4.1.1. Bargaining Power of Suppliers
    • 4.1.2. Bargaining Power of Buyers
    • 4.1.3. Threat of New Entrants
    • 4.1.4. Threat of Substitutes
    • 4.1.5. Competitive Rivalry
  • 4.2. Porter's 5 Force Impact Analysis
  • 4.3. PEST Analysis
    • 4.3.1. Political
    • 4.3.2. Economical
    • 4.3.3. Social
    • 4.3.4. Technological
    • 4.3.5. Environmental
    • 4.3.6. Legal
  • 4.4. Top investment opportunity
  • 4.5. Top winning strategies
  • 4.6. COVID-19 Impact Analysis
  • 4.7. Disruptive Trends
  • 4.8. Industry Expert Perspective
  • 4.9. Analyst Recommendation & Conclusion

Chapter 5. Global 3D IC Market, by Type

  • 5.1. Market Snapshot
  • 5.2. Global 3D IC Market by Type, Performance - Potential Analysis
  • 5.3. Global 3D IC Market Estimates & Forecasts by Type 2020-2030 (USD Billion)
  • 5.4. 3D IC Market, Sub Segment Analysis
    • 5.4.1. Stacked 3D
    • 5.4.2. Monolithic 3D

Chapter 6. Global 3D IC Market, by Component

  • 6.1. Market Snapshot
  • 6.2. Global 3D IC Market by Component, Performance - Potential Analysis
  • 6.3. Global 3D IC Market Estimates & Forecasts by Component 2020-2030 (USD Billion)
  • 6.4. 3D IC Market, Sub Segment Analysis
    • 6.4.1. Through-Silicon Via (TSV)
    • 6.4.2. Through Glass Via (TGV)
    • 6.4.3. Silicon Interposer

Chapter 7. Global 3D IC Market, by Application

  • 7.1. Market Snapshot
  • 7.2. Global 3D IC Market by Application, Performance - Potential Analysis
  • 7.3. Global 3D IC Market Estimates & Forecasts by Application 2020-2030 (USD Billion)
  • 7.4. 3D IC Market, Sub Segment Analysis
    • 7.4.1. Logic
    • 7.4.2. Imaging & optoelectronics
    • 7.4.3. Memory
    • 7.4.4. MEMS/Sensors
    • 7.4.5. LED
    • 7.4.6. Others

Chapter 8. Global 3D IC Market, by End User

  • 8.1. Market Snapshot
  • 8.2. Global 3D IC Market by End User, Performance - Potential Analysis
  • 8.3. Global 3D IC Market Estimates & Forecasts by End User 2020-2030 (USD Billion)
  • 8.4. 3D IC Market, Sub Segment Analysis
    • 8.4.1. Consumer Electronics
    • 8.4.2. Telecommunication
    • 8.4.3. Automotive
    • 8.4.4. Military & Aerospace
    • 8.4.5. Medical Devices
    • 8.4.6. Industrial
    • 8.4.7. Others

Chapter 9. Global 3D IC Market, Regional Analysis

  • 9.1. Top Leading Countries
  • 9.2. Top Emerging Countries
  • 9.3. 3D IC Market, Regional Market Snapshot
  • 9.4. North America 3D IC Market
    • 9.4.1. U.S. 3D IC Market
      • 9.4.1.1. Type breakdown estimates & forecasts, 2020-2030
      • 9.4.1.2. Component breakdown estimates & forecasts, 2020-2030
      • 9.4.1.3. Application breakdown estimates & forecasts, 2020-2030
      • 9.4.1.4. End User breakdown estimates & forecasts, 2020-2030
    • 9.4.2. Canada 3D IC Market
  • 9.5. Europe 3D IC Market Snapshot
    • 9.5.1. U.K. 3D IC Market
    • 9.5.2. Germany 3D IC Market
    • 9.5.3. France 3D IC Market
    • 9.5.4. Spain 3D IC Market
    • 9.5.5. Italy 3D IC Market
    • 9.5.6. Rest of Europe 3D IC Market
  • 9.6. Asia-Pacific 3D IC Market Snapshot
    • 9.6.1. China 3D IC Market
    • 9.6.2. India 3D IC Market
    • 9.6.3. Japan 3D IC Market
    • 9.6.4. Australia 3D IC Market
    • 9.6.5. South Korea 3D IC Market
    • 9.6.6. Rest of Asia Pacific 3D IC Market
  • 9.7. Latin America 3D IC Market Snapshot
    • 9.7.1. Brazil 3D IC Market
    • 9.7.2. Mexico 3D IC Market
  • 9.8. Middle East & Africa 3D IC Market
    • 9.8.1. Saudi Arabia 3D IC Market
    • 9.8.2. South Africa 3D IC Market
    • 9.8.3. Rest of Middle East & Africa 3D IC Market

Chapter 10. Competitive Intelligence

  • 10.1. Key Company SWOT Analysis
    • 10.1.1. Company 1
    • 10.1.2. Company 2
    • 10.1.3. Company 3
  • 10.2. Top Market Strategies
  • 10.3. Company Profiles
    • 10.3.1. Advanced Semiconductor Engineering, Inc
      • 10.3.1.1. Key Information
      • 10.3.1.2. Overview
      • 10.3.1.3. Financial (Subject to Data Availability)
      • 10.3.1.4. Product Summary
      • 10.3.1.5. Recent Developments
    • 10.3.2. Amkor Technology, Inc
    • 10.3.3. Samsung Electronics Co., Ltd.
    • 10.3.4. United Microelectronics Corporation
    • 10.3.5. STMicroelectronics N.V.
    • 10.3.6. Toshiba Corporation
    • 10.3.7. Intel Corporation
    • 10.3.8. Micron Technology, Inc
    • 10.3.9. Taiwan Semiconductor Manufacturing Company Limited
    • 10.3.10. Xilinx Inc

Chapter 11. Research Process

  • 11.1. Research Process
    • 11.1.1. Data Mining
    • 11.1.2. Analysis
    • 11.1.3. Market Estimation
    • 11.1.4. Validation
    • 11.1.5. Publishing
  • 11.2. Research Attributes
  • 11.3. Research Assumption

LIST OF TABLES

  • TABLE 1. Global 3D IC Market, report scope
  • TABLE 2. Global 3D IC Market estimates & forecasts by Region 2020-2030 (USD Billion)
  • TABLE 3. Global 3D IC Market estimates & forecasts by Type 2020-2030 (USD Billion)
  • TABLE 4. Global 3D IC Market estimates & forecasts by Component 2020-2030 (USD Billion)
  • TABLE 5. Global 3D IC Market estimates & forecasts by Application 2020-2030 (USD Billion)
  • TABLE 6. Global 3D IC Market estimates & forecasts by End User 2020-2030 (USD Billion)
  • TABLE 7. Global 3D IC Market by segment, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 8. Global 3D IC Market by region, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 9. Global 3D IC Market by segment, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 10. Global 3D IC Market by region, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 11. Global 3D IC Market by segment, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 12. Global 3D IC Market by region, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 13. Global 3D IC Market by segment, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 14. Global 3D IC Market by region, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 15. Global 3D IC Market by segment, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 16. Global 3D IC Market by region, estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 17. U.S. 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 18. U.S. 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 19. U.S. 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 20. Canada 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 21. Canada 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 22. Canada 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 23. UK 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 24. UK 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 25. UK 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 26. Germany 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 27. Germany 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 28. Germany 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 29. France 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 30. France 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 31. France 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 32. Italy 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 33. Italy 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 34. Italy 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 35. Spain 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 36. Spain 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 37. Spain 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 38. RoE 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 39. RoE 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 40. RoE 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 41. China 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 42. China 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 43. China 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 44. India 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 45. India 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 46. India 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 47. Japan 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 48. Japan 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 49. Japan 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 50. South Korea 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 51. South Korea 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 52. South Korea 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 53. Australia 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 54. Australia 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 55. Australia 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 56. RoAPAC 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 57. RoAPAC 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 58. RoAPAC 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 59. Brazil 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 60. Brazil 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 61. Brazil 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 62. Mexico 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 63. Mexico 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 64. Mexico 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 65. RoLA 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 66. RoLA 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 67. RoLA 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 68. Saudi Arabia 3D IC Market estimates & forecasts, 2020-2030 (USD Billion)
  • TABLE 69. South Africa 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 70. RoMEA 3D IC Market estimates & forecasts by segment 2020-2030 (USD Billion)
  • TABLE 71. List of secondary sources, used in the study of global 3D IC Market
  • TABLE 72. List of primary sources, used in the study of global 3D IC Market
  • TABLE 73. Years considered for the study
  • TABLE 74. Exchange rates considered

List of tables and figures and dummy in nature, final lists may vary in the final deliverable

LIST OF FIGURES

  • FIG 1. Global 3D IC Market, research methodology
  • FIG 2. Global 3D IC Market, Market estimation techniques
  • FIG 3. Global Market size estimates & forecast methods
  • FIG 4. Global 3D IC Market, key trends 2022
  • FIG 5. Global 3D IC Market, growth prospects 2023-2030
  • FIG 6. Global 3D IC Market, porters 5 force model
  • FIG 7. Global 3D IC Market, pest analysis
  • FIG 8. Global 3D IC Market, value chain analysis
  • FIG 9. Global 3D IC Market by segment, 2020 & 2030 (USD Billion)
  • FIG 10. Global 3D IC Market by segment, 2020 & 2030 (USD Billion)
  • FIG 11. Global 3D IC Market by segment, 2020 & 2030 (USD Billion)
  • FIG 12. Global 3D IC Market by segment, 2020 & 2030 (USD Billion)
  • FIG 13. Global 3D IC Market by segment, 2020 & 2030 (USD Billion)
  • FIG 14. Global 3D IC Market, regional snapshot 2020 & 2030
  • FIG 15. North America 3D IC Market 2020 & 2030 (USD Billion)
  • FIG 16. Europe 3D IC Market 2020 & 2030 (USD Billion)
  • FIG 17. Asia pacific 3D IC Market 2020 & 2030 (USD Billion)
  • FIG 18. Latin America 3D IC Market 2020 & 2030 (USD Billion)
  • FIG 19. Middle East & Africa 3D IC Market 2020 & 2030 (USD Billion)

List of tables and figures and dummy in nature, final lists may vary in the final deliverable