3D IC 市場：按最終用途部門、按基板類型、按製造製程、按產品、按地區 - 2020-2027 年市場規模、佔有率、前景、機會分析

3D ICs Market, By End-Use Sectors, by Substrate Type, by Fabrication Process, by Product and by Region - Size, Share, Outlook, and Opportunity Analysis, 2020 - 2027

出版日期: 2024年06月27日 | 出版商:

Coherent Market Insights | 英文 140 Pages | 商品交期: 2-3個工作天內

價格

簡介目錄

預計2024年全球3D IC市場規模為164.5億美元，2031年將達602.3億美元，2024年至2031年複合年成長率為20.4%。

報告範圍		報告詳情
基準年	2023年	2024年市場規模	164.5億美元
實際資料	2019-2023	預測期	2024年至2031年
預測 2024-2031 年複合年成長率：	20.40%	2031年價值預測	602.3億美元

圖：2024 年按地區分類的 3D IC市場佔有率(%)

隨著對更緊湊和高性能電子設備的需求不斷增加，全球 3D IC 市場正在經歷強勁成長。 3D IC，也稱為3D積體電路，是指堆疊兩個或多個IC晶片並透過矽通孔（TSV）垂直連接以縮短互連長度並提高訊號傳播速度的一種垂直組裝。透過將許多組件整合到較小的佔地面積中，可以使設備變得更小。 3D IC 技術透過堆疊晶粒並將其整合到單一封裝中來最大限度地提高晶片密度，從而有助於降低晶片成本。記憶體、圖形、處理器和無線電子裝置等各種組件可以放置在一個模組中。與 3D IC 相關的高頻寬和低功耗特性正在推動各種應用的需求，包括家用電子電器、醫療設備和汽車產業。

市場動態：

全球 3D IC 市場受到對高性能可攜式電子產品日益成長的需求的推動。對在緊湊外形規格中增加功能的設備的需求正在推動對 3D IC 的需求。然而，與製造 3D IC 相關的高製造成本是其廣泛使用的問題。設計和製造過程的複雜性增加了製造成本。商機在於 3D IC 在自動駕駛汽車、擴增實境和虛擬實境設備中的新應用。使用 3D IC 技術整合邏輯晶片、記憶體和感測器組件有助於實現汽車中的高級駕駛輔助、導航和資訊娛樂服務。 3D IC 支援更高的頻寬和更低的功耗，有助於在具有圖形和處理密集要求的電池供電設備中採用。

本研究的主要特點

該報告對全球3D IC市場進行了詳細分析，並列出了以2023年為基準年的預測期（2024-2031）的市場規模和年複合成長率（CAGR%）。
它還揭示了各個細分市場的潛在商機，並說明了該市場有吸引力的投資提案矩陣。
它還提供了有關市場促進因素、限制因素、機會、新產品發布和核准、市場趨勢、區域前景、主要企業採取的競爭策略等的重要見解。
它根據公司亮點、產品系列、主要亮點、財務業績和策略等參數，對全球 3D IC 市場的主要企業進行了介紹。
該報告的見解使負責人和公司經營團隊能夠就未來的產品發布、類型升級、市場擴張和行銷策略做出明智的決策。
本研究報告針對該產業的各個相關人員，如投資者、供應商、產品製造商、經銷商、新進業者和財務分析師。
相關人員可以透過用於分析全球 3D IC 市場的各種策略矩陣來促進決策。

Report Coverage	Report Details
Base Year:	2023	Market Size in 2024:	US$ 16.45 Bn
Historical Data for:	2019 to 2023	Forecast Period:	2024 to 2031
Forecast Period 2024 to 2031 CAGR:	20.40%	2031 Value Projection:	US$ 60.23 Bn

The global 3D ICs market is witnessing robust growth with the rising demand for more compact and high-performance electronic devices. 3D ICs, also known as three-dimensional integrated circuits, refers to the vertical assembly of two or more IC chips stacked and connected vertically via through-silicon vias (TSVs) to reduce wire length and improve the signal propagation speeds. It enables device miniaturization by integrating more components in a small footprint. 3D ICs technology helps maximize chip density by stacking silicon dies and integrating them into one package which helps reduce the chip cost. It allows the placement of different components such as memory, graphics, processors, and radio electronics in one module. The higher bandwidth and low power consumption features associated with 3D ICs are fueling their demand for various applications across consumer electronics, medical devices, and automotive industries.

Market Dynamics:

The global 3D ICs market is driven by the increasing demand for high performance portable consumer electronics. The demand for devices with improved functionality in a compact form factor is propelling the need for 3D ICs. However, the high manufacturing cost associated with 3D ICs fabrication poses a challenge for widespread adoption. The complexity in the design and manufacturing process increases production costs. Opportunities lies in the emerging applications of 3D ICs in autonomous vehicles, augmented and virtual reality devices. The integration of logic chips, memory, and sensor components using 3D ICs technology can help enable advanced driver assistance, navigation, and infotainment services in vehicles. 3D ICs supports higher bandwidth and low-power consumption which will drive their adoption in battery-operated devices with graphics and processing-intensive requirements. efforts to lower manufacturing costs through new materials and design techniques will further help address barriers.

Key Features of the Study:

This report provides in-depth analysis of the global 3D ICs market, and provides market size (US$ Billion) and compound annual growth rate (CAGR%) for the forecast period (2024-2031), considering 2023 as the base year
It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players
It profiles key players in the global 3D ICs market based on the following parameters - company highlights, products portfolio, key highlights, financial performance, and strategies
Key companies covered as a part of this study include Amkor Technology, ASE Group, BeSang Inc., IBM Corporation, Intel Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., Micron Technology Inc., MonolithIC 3D ICs Inc., Samsung Electronics Co. Ltd., STATS ChipPAC Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company, Tezzaron Semiconductor, Toshiba Corporation, United Microelectronics Corporation, and Xilinx Inc.
Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
The global 3D ICs market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global 3D ICs market

Detailed Segmentation:

By Product Type
- LED
- Memories
- MEMS
- Sensor
- Logic
- Others
By Substrate Type
- Silicon on Insulator (SOI)
- Bulk Silicon
By Application
- Information and Communication Technology
- Military
- Consumer Electronics
- Others
By Region:
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East
- Africa
Key Players Insights
- Amkor Technology
- ASE Group
- BeSang Inc.
- IBM Corporation
- Intel Corporation
- Jiangsu Changjiang Electronics Technology Co., Ltd.
- Micron Technology Inc.
- MonolithIC 3D ICs Inc.
- Samsung Electronics Co. Ltd.
- STATS ChipPAC Ltd.
- STMicroelectronics N.V.
- Taiwan Semiconductor Manufacturing Company
- Tezzaron Semiconductor
- Toshiba Corporation
- United Microelectronics Corporation
- Xilinx Inc.

1. Research Objectives and Assumptions

Research Objectives
Assumptions
Abbreviations

2. Market Purview

Report Description
- Market Definition and Scope
Executive Summary
- Market Snippet, By End-Use Sectors
- Market Snippet, By Substrate Type
- Market Snippet, By Fabrication Process
- Market Snippet, By Process
- Market Snippet, By Region
Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

Market Dynamics
- Drivers
- Restraints
- Market Opportunities
Regulatory Scenario
Industry Trend
Merger and Acquisitions
New System Launch/Approval

4. Impact of COVID-19 Pandemic on 3D ICs Market

Short Term and Long Term Impact, By Region
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East and Africa

5. Global 3D ICs Market, By End- Use Sectors, 2017-2027 (US$ Billion)

Introduction
- Market Share Analysis, 2019 and 2027 (%)
- Segment Trends
Consumer electronics
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)
Information and communication technology
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)
Transport (automotive and aerospace)
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)
Military
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)
Others (Biomedical applications and R&D)
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)

6. Global 3D ICs Market, By Substrate Type, 2017-2027 (US$ Billion)

Introduction
- Market Share Analysis, 2019 and 2027 (%)
- Segment Trends
Silicon on insulator (SOI)
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)
Bulk silicon
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)

7. Global 3D ICs Market, By Fabrication Process, 2017-2027 (US$ Billion)

Introduction
- Market Share Analysis, 2019 and 2027 (%)
- Segment Trends
Beam re-crystallization
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)
Wafer bonding
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)
Silicon epitaxial growth
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)
Solid phase crystallization
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)

8. Global 3D ICs Market, By Process, 2017-2027 (US$ Billion)

Introduction
- Market Share Analysis, 2019 and 2027 (%)
- Segment Trends
MEMS and Sensor
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)
RF SiP
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)
Optoelectronics and imaging
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)
Memories (3D Stacks)
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)
Logic (3D Sip/Soc)
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)
HB LED
- Introduction
- Market Size and Forecast, 2020-2027, (US$ Billion)

9. Global 3D ICs Market, By Region, 2017-2027 (US$ Billion)

Introduction
- Market Share Analysis, By Region, 2019 and 2027 (%)
North America
- Regional Trends
- Market Size and Forecast, By End-Use Sectors, 2020-2027 (US$ Billion)
- Market Size and Forecast, By Substrate Type, 2020-2027 (US$ Billion)
- Market Size and Forecast, By Fabrication Process, 2020-2027 (US$ Billion)
- Market Size and Forecast, By Process, 2020-2027 (US$ Billion)
- Market Share Analysis, By Country, 2019 and 2027 (%)
  - U.S.
  - Canada
Europe
- Regional Trends
- Market Size and Forecast, By End-Use Sectors, 2020-2027 (US$ Billion)
- Market Size and Forecast, By Substrate Type, 2020-2027 (US$ Billion)
- Market Size and Forecast, By Fabrication Process, 2020-2027 (US$ Billion)
- Market Size and Forecast, By Process, 2020-2027 (US$ Billion)
- Market Share Analysis, By Country, 2019 and 2027 (%)
  - U.K.
  - Germany
  - Italy
  - France
  - Russia
  - Rest of Europe
Asia Pacific
- Regional Trends
- Regional Trends
- Market Size and Forecast, By End-Use Sectors, 2020-2027 (US$ Billion)
- Market Size and Forecast, By Substrate Type, 2020-2027 (US$ Billion)
- Market Size and Forecast, By Fabrication Process, 2020-2027 (US$ Billion)
- Market Size and Forecast, By Process, 2020-2027 (US$ Billion)
- Market Share Analysis, By Country, 2019 and 2027 (%)
  - India
  - Japan
  - ASEAN
  - Australia
  - South Korea
  - Rest of Asia Pacific
Latin America
- Regional Trends
- Market Size and Forecast, By End-Use Sectors, 2020-2027 (US$ Billion)
- Market Size and Forecast, By Substrate Type, 2020-2027 (US$ Billion)
- Market Size and Forecast, By Fabrication Process, 2020-2027 (US$ Billion)
- Market Size and Forecast, By Process, 2020-2027 (US$ Billion)
- Market Share Analysis, By Country, 2019 and 2027 (%)
  - Brazil
  - Argentina
  - Mexico
  - Rest of Latin America
Middle East and Africa
- Regional Trends
- Market Size and Forecast, By End-Use Sectors, 2020-2027 (US$ Billion)
- Market Size and Forecast, By Substrate Type, 2020-2027 (US$ Billion)
- Market Size and Forecast, By Fabrication Process, 2020-2027 (US$ Billion)
- Market Size and Forecast, By Process, 2020-2027 (US$ Billion)
- Market Share Analysis, By Country, 2019 and 2027 (%)
  - GCC Countries
  - South Africa
  - Rest of the Middle East and Africa

10. Competitive Landscape

Company Profiles
- Taiwan Semiconductor Manufacturing Company, Ltd
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- MonolithIC 3D Inc.
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- XILINX, Inc.
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- Elpida Memory, Inc.
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- (Micron Technology, Inc.)
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- The 3M Company,
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- Ziptronix, Inc.
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- STATS ChipPAC Ltd.
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- United Microelectronics Corporation
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates
- Tezzaron Semiconductor Corporation
  - Company Overview
  - Product Portfolio
  - Financial Performance
  - Key Strategies
  - Recent Developments/Updates