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1577118

2030 年 3D IC 市場預測:按組件、類型、應用、最終用戶和地區分類的全球分析

3D IC Market Forecasts to 2030 - Global Analysis By Component (Through Glass Via, Through-Silicon Via and Silicon Interposer), Type, Application, End User and By Geography

出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據Stratistics MRC的數據,2024年全球3D IC市場規模為197.3億美元,預計在預測期內將以20.9%的複合年成長率成長,到2030年達到616.2億美元。

3D IC(3D積體電路)是最尖端科技垂直堆疊多個半導體裝置層以提高效能和功能。與放置在單一平面上的傳統 2D IC 不同, 3D IC 利用垂直互連,可實現更快的資料傳輸和更低的訊號延遲。3D積體電路 (3D IC) 透過多層堆疊主動元件來提高效能並減少佔用空間,從而為現代電子產品帶來顯著優勢。

不斷成長的資料中心和雲端處理

資料中心對更高性能和能效的要求越來越高,而 3D IC 透過多層堆疊矽晶圓並使組件更緊密地結合在一起,提供了引人注目的解決方案。這可以減少延遲並提高頻寬。此外,3D IC 支援異質整合,允許將不同類型的晶片組合到一個封裝中,以最佳化功能和功耗。隨著雲端處理服務的擴展,對可擴展和高效能運算解決方案的需求正在推動 3D IC 技術的投資和創新。

溫度控管問題

溫度控管問題極大地阻礙了3D積體電路的發展和性能。 3D架構垂直堆疊電晶體,這增加了元件密度並在有限的空間內產生更多熱量。有效的散熱非常重要,因為溫度控管不當可能導致過熱、可靠性降低和效能下降。傳統的冷卻方法可能無法跟上 3D IC 的小型化步伐,需要先進的熱界面材料、微流體冷卻系統和增強傳熱技術等創新解決方案。

汽車應用的採用率提高

隨著車輛越來越依賴先進的電子設備來實現自動駕駛、資訊娛樂系統和高級駕駛輔助系統 (ADAS) 等功能,對更小、更高性能組件的需求也不斷增加。 3D IC 技術允許垂直堆疊多個半導體層,從而減少佔地面積並改善溫度控管。這種整合可以加快資料處理速度並提高能源效率,這對於現代車輛所需的複雜計算至關重要。

監管和標準化挑戰

3D 積體電路 (IC) 的進步面臨重大的監管和標準化挑戰,阻礙了其廣泛採用。由於 3D IC 技術採用了多層垂直堆疊電路,因此確保各個元件之間的相容性和互通性至關重要。目前,還沒有普遍接受的標準來管理設計方法、製造流程和測試通訊協定。然而,此類衝突可能會使不同製造商之間的合作變得複雜,導致成本增加和上市時間延遲。

COVID-19 的影響:

COVID-19 大流行對3D積體電路 (IC) 產業產生了重大影響,凸顯了脆弱性和機會。供應鏈中斷導致半導體材料和組件的生產延遲,導致成本增加和前置作業時間延長。隨著製造商努力應對勞動力短缺和工廠停工的問題,考慮到在緊湊外形規格中提高性能的潛力,3D IC 等先進封裝解決方案的緊迫性變得更加明顯。疫情期間遠端工作和數位服務的激增加速了對依賴先進半導體技術的高效能運算和資料中心的需求。

矽穿孔電極(TSV) 領域預計將在預測期內成為最大的領域。

透過實現多個半導體晶粒之間的垂直互連,預計穿通孔 (TSV) 細分市場將在預測期內成為最大的細分市場。這種創新方法可實現緊湊的設計,並顯著縮短訊號必須傳播的距離,從而提高性能和能源效率。 TSV 可實現更高的資料傳輸速率和頻寬,對於需要高速通訊的應用(例如高效能運算、圖形處理和進階行動裝置)至關重要。此外,使用 TSV 的晶片 3D 堆疊可最佳化空間,從而在更小的佔地面積內實現更多功能。

預計汽車業在預測期內複合年成長率最高。

由於對先進電子功能、性能改進和車輛小型化的需求不斷增加,預計汽車行業在預測期內將出現最高的複合年成長率。 3D IC允許多個電路層垂直堆疊,大幅提高空間效率和電源管理。該技術旨在將感測、處理和通訊等各種功能整合到一個小封裝中,這對於 ADAS(高級駕駛員輔助系統)、資訊娛樂和電動車 (EV) 管理等應用至關重要。此外,3D IC 還有助於實現高頻寬和低延遲,這對於自動駕駛系統中的即時資料處理和決策至關重要。

佔比最大的地區:

由於北美地區能夠將記憶體和處理功能無縫地結合在一個晶片內,因此預計在預測期內將佔據最大的市場佔有率。透過將記憶體直接堆疊在邏輯組件之上,製造商可以實現更高的頻寬和密度,同時保持緊湊的設計。隨著北美繼續引領半導體技術發展,對記憶體和邏輯整合的關注可能會促進科技巨頭和新興企業之間的合作以及進一步的進步。這種演變不僅將提高電子設備的性能,還將將該地區置於全球半導體創新的前沿,並確保其在快速發展的技術環境中保持競爭力。

複合年成長率最高的地區:

預計歐洲地區在預測期內將保持盈利成長。透過制定嚴格的安全、環境影響和性能標準,這些法規可確保 3D IC 技術的創新能滿足更廣泛的永續性目標。這不僅可以增強消費者和產業相關人員之間的信任,還可以鼓勵對研發的投資。對標準化的重視提高了設備之間的互通性,為更有效率的製造流程並縮短新產品的上市時間鋪平了道路。歐洲各國政府也透過獎勵半導體產業的本地生產和創新來優先考慮數位主權,以幫助該地區在全球範圍內保持競爭力。

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目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 研究資訊來源
    • 主要研究資訊來源
    • 二次研究資訊來源
    • 先決條件

第3章市場趨勢分析

  • 促進因素
  • 抑制因素
  • 機會
  • 威脅
  • 應用分析
  • 最終用戶分析
  • 新興市場
  • COVID-19 的影響

第4章波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭公司之間的敵對關係

第5章全球3D IC 市場:依組件分類

  • 玻璃通孔 (TGV)
  • 穿透矽通孔(TSV)
  • 矽中介層

第6章全球3D IC 市場:依類型

  • 單片3D
  • 堆疊 3d

第7章全球3D IC 市場:依應用分類

  • 航太
  • 成像和光電
  • 感應器
  • 其他用途

第 8 章全球3D IC 市場:依最終用戶分類

  • 通訊
  • 家電
  • 醫療設備
  • 其他最終用戶

第9章全球3D IC市場:按地區

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東/非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲

第10章 主要進展

  • 合約、夥伴關係、協作和合資企業
  • 收購和合併
  • 新產品發布
  • 業務拓展
  • 其他關鍵策略

第11章 公司概況

  • ASE Group
  • Infineon Technologies
  • Intel Corporation
  • Keyence Corporation
  • NXP Semiconductors
  • Qualcomm Incorporated
  • Renesas Electronics
  • Siliconware Precision Industries
  • Synopsys
  • United Microelectronics Corporation
Product Code: SMRC27429

According to Stratistics MRC, the Global 3D IC Market is accounted for $19.73 billion in 2024 and is expected to reach $61.62 billion by 2030 growing at a CAGR of 20.9% during the forecast period. A 3D IC, or three-dimensional integrated circuit, is a cutting-edge technology that stacks multiple layers of semiconductor devices vertically to enhance performance and functionality. Unlike traditional 2D ICs, which are laid out on a single plane, 3D ICs utilize vertical interconnections, enabling faster data transfer and reduced signal delay. Three-dimensional integrated circuits (3D ICs) offer significant advantages in modern electronics by stacking multiple layers of active components, leading to enhanced performance and reduced footprint.

Market Dynamics:

Driver:

Growing data centers and cloud computing

As the demand for higher performance and energy efficiency escalates in data centers, 3D ICs provide a compelling solution by stacking multiple layers of silicon wafers, enabling closer proximity of components. This reduces latency and improves bandwidth, crucial for handling massive data loads efficiently. Additionally, 3D ICs allow for heterogeneous integration, where different types of chips can be combined in a single package, optimizing functionality and power usage. As cloud computing services expand, the need for scalable, high-performance computing solutions drives investment and innovation in 3D IC technology.

Restraint:

Thermal management issues

Thermal management issues significantly hinder the development and performance of 3D integrated circuits. As transistors are stacked vertically in 3D architectures, the density of components increases, leading to higher heat generation in a confined space. Effective heat dissipation becomes critical, as inadequate thermal management can result in overheating, reduced reliability and lower performance. Traditional cooling methods may not be sufficient for the compactness of 3D ICs, necessitating innovative solutions such as advanced thermal interface materials, microfluidic cooling systems, or enhanced thermal conduction techniques.

Opportunity:

Rising adoption in automotive applications

As vehicles become increasingly reliant on advanced electronics for features like autonomous driving, infotainment systems, and advanced driver-assistance systems (ADAS), the demand for compact and high-performance components grows. 3D IC technology allows for vertical stacking of multiple semiconductor layers, reducing the footprint and improving thermal management. This integration leads to faster data processing and improved power efficiency, essential for the complex computations required in modern vehicles.

Threat:

Regulatory and standardization challenges

The advancement of 3D integrated circuits (ICs) faces significant regulatory and standardization challenges that hinder their widespread adoption. As 3D IC technology incorporates multiple layers of circuitry stacked vertically, ensuring compatibility and interoperability among various components is crucial. Currently, there is a lack of universally accepted standards governing design methodologies, manufacturing processes, and testing protocols. However, this inconsistency complicates collaboration among different manufacturers and can lead to increased costs and time-to-market delays.

Covid-19 Impact:

The COVID-19 pandemic significantly impacted the 3D integrated circuit (IC) industry, highlighting both vulnerabilities and opportunities. Supply chain disruptions caused delays in the production of semiconductor materials and components, leading to increased costs and longer lead times. As manufacturers grappled with labor shortages and factory shutdowns, the urgency for advanced packaging solutions like 3D ICs became more pronounced, given their potential for enhanced performance in compact form factors. The surge in remote work and digital services during the pandemic accelerated demand for high-performance computing and data centers, which rely on advanced semiconductor technologies.

The Through-Silicon Via (TSV) segment is expected to be the largest during the forecast period

Through-Silicon Via (TSV) segment is expected to be the largest during the forecast period by enabling vertical interconnections between multiple semiconductor dies. This innovative approach allows for a compact design, significantly reducing the distance that signals must travel, thereby improving performance and energy efficiency. TSVs facilitate higher data transfer rates and bandwidth, crucial for applications demanding rapid communication, such as high-performance computing, graphics processing and advanced mobile devices. Additionally, the 3D stacking of chips with TSVs optimizes space, allowing for more functionality within a smaller footprint.

The Automotive segment is expected to have the highest CAGR during the forecast period

Automotive segment is expected to have the highest CAGR during the forecast period due to the growing demands for advanced electronic features, enhanced performance and miniaturization in vehicles. 3D ICs allow for multiple layers of circuitry to be stacked vertically, significantly improving space efficiency and power management. This technology facilitates the integration of various functions-such as sensing, processing and communication-within a single compact package, which is crucial for applications like advanced driver-assistance systems (ADAS), infotainment, and electric vehicle (EV) management. Moreover, 3D ICs contribute to higher bandwidth and lower latency, essential for real-time data processing and decision-making in autonomous driving systems.

Region with largest share:

North America region is anticipated to command the largest share of the market over the extrapolated period by enabling the seamless combination of memory and processing functions within a single chip. By stacking memory directly on top of logic components, manufacturers can achieve higher bandwidth and density while maintaining compact designs. As North America continues to lead in semiconductor technology development, the focus on Memory and Logic Integration will drive further advancements, fostering collaboration between tech giants and startups. This evolution not only enhances the performance of electronic devices but also positions the region at the forefront of global semiconductor innovation, ensuring it remains competitive in a rapidly advancing technological landscape.

Region with highest CAGR:

Europe region is poised to hold profitable growth during the projected period. By establishing stringent standards for safety, environmental impact, and performance, these regulations ensure that innovations in 3D IC technology align with broader sustainability goals. This not only fosters trust among consumers and industry stakeholders but also encourages investment in research and development. The emphasis on standardization enhances interoperability among devices, paving the way for more efficient manufacturing processes and reduced time-to-market for new products. As European governments also prioritize digital sovereignty, they incentivize local production and innovation in the semiconductor sector, ensuring that the region remains competitive on a global scale.

Key players in the market

Some of the key players in 3D IC market include ASE Group, Infineon Technologies, Intel Corporation, Keyence Corporation, NXP Semiconductors, Qualcomm Incorporated, Renesas Electronics, Siliconware Precision Industries, Synopsys and United Microelectronics Corporation.

Key Developments:

In November 2023, Samsung Electronics is gearing up to introduce a new advanced 3D chip packaging technology named SAINT in a bid to viral Taiwan semiconductor manufacturing company's market dominance.

In February 2023, Cadence and UMC collaborated on a hybrid bonding reference flow for 3D-ICs. UMC intends to launch hybrid bonding solutions that are suitable for edge AI, image processing, and wireless communication across a broad range of technology nodes.

In October 2022, TSMC's 3DFabricTM offerings, including the integrated fan-out (InFO), chip-on-wafer-on-substrate (TSMC-SoICTM), and system-on-integrated chips (TSMC-SoICTM), have been certified by the leading Cadence(R) IntegrityTM 3D-IC platform and have met all reference design flow criteria. Cadence supports TSMC 3DbloxTM as part of the collaboration to accelerate the development of advanced multi-die packages for 5G, artificial intelligence, mobile, and hyperscale computing.

In March 2022, Amkor Technology, a company based in South Korea teamed up with the TSMC OIP 3D Fabric. With a first chance to use TSMC's 3D Fabric tech, new partners of the 3D Fabric Alliance can move their products forward at the same time as TSMC.

Components Covered:

  • Through Glass Via (TGV)
  • Through-Silicon Via (TSV)
  • Silicon Interposer

Types Covered:

  • Monolithic 3D
  • Stacked 3D

Applications Covered:

  • Aerospace
  • Imaging and Optoelectronics
  • Sensors
  • Other Applications

End Users Covered:

  • Telecommunications
  • Consumer Electronics
  • Automotive
  • Medical Devices
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global 3D IC Market, By Component

  • 5.1 Introduction
  • 5.2 Through Glass Via (TGV)
  • 5.3 Through-Silicon Via (TSV)
  • 5.4 Silicon Interposer

6 Global 3D IC Market, By Type

  • 6.1 Introduction
  • 6.2 Monolithic 3D
  • 6.3 Stacked 3D

7 Global 3D IC Market, By Application

  • 7.1 Introduction
  • 7.2 Aerospace
  • 7.3 Imaging and Optoelectronics
  • 7.4 Sensors
  • 7.5 Other Applications

8 Global 3D IC Market, By End User

  • 8.1 Introduction
  • 8.2 Telecommunications
  • 8.3 Consumer Electronics
  • 8.4 Automotive
  • 8.5 Medical Devices
  • 8.6 Other End Users

9 Global 3D IC Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 ASE Group
  • 11.2 Infineon Technologies
  • 11.3 Intel Corporation
  • 11.4 Keyence Corporation
  • 11.5 NXP Semiconductors
  • 11.6 Qualcomm Incorporated
  • 11.7 Renesas Electronics
  • 11.8 Siliconware Precision Industries
  • 11.9 Synopsys
  • 11.10 United Microelectronics Corporation

List of Tables

  • Table 1 Global 3D IC Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global 3D IC Market Outlook, By Component (2022-2030) ($MN)
  • Table 3 Global 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
  • Table 4 Global 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 5 Global 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
  • Table 6 Global 3D IC Market Outlook, By Type (2022-2030) ($MN)
  • Table 7 Global 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
  • Table 8 Global 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
  • Table 9 Global 3D IC Market Outlook, By Application (2022-2030) ($MN)
  • Table 10 Global 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
  • Table 11 Global 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
  • Table 12 Global 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 13 Global 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 14 Global 3D IC Market Outlook, By End User (2022-2030) ($MN)
  • Table 15 Global 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
  • Table 16 Global 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 17 Global 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 18 Global 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
  • Table 19 Global 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 20 North America 3D IC Market Outlook, By Country (2022-2030) ($MN)
  • Table 21 North America 3D IC Market Outlook, By Component (2022-2030) ($MN)
  • Table 22 North America 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
  • Table 23 North America 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 24 North America 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
  • Table 25 North America 3D IC Market Outlook, By Type (2022-2030) ($MN)
  • Table 26 North America 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
  • Table 27 North America 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
  • Table 28 North America 3D IC Market Outlook, By Application (2022-2030) ($MN)
  • Table 29 North America 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
  • Table 30 North America 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
  • Table 31 North America 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 32 North America 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 33 North America 3D IC Market Outlook, By End User (2022-2030) ($MN)
  • Table 34 North America 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
  • Table 35 North America 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 36 North America 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 37 North America 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
  • Table 38 North America 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 39 Europe 3D IC Market Outlook, By Country (2022-2030) ($MN)
  • Table 40 Europe 3D IC Market Outlook, By Component (2022-2030) ($MN)
  • Table 41 Europe 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
  • Table 42 Europe 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 43 Europe 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
  • Table 44 Europe 3D IC Market Outlook, By Type (2022-2030) ($MN)
  • Table 45 Europe 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
  • Table 46 Europe 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
  • Table 47 Europe 3D IC Market Outlook, By Application (2022-2030) ($MN)
  • Table 48 Europe 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
  • Table 49 Europe 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
  • Table 50 Europe 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 51 Europe 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 52 Europe 3D IC Market Outlook, By End User (2022-2030) ($MN)
  • Table 53 Europe 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
  • Table 54 Europe 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 55 Europe 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 56 Europe 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
  • Table 57 Europe 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 58 Asia Pacific 3D IC Market Outlook, By Country (2022-2030) ($MN)
  • Table 59 Asia Pacific 3D IC Market Outlook, By Component (2022-2030) ($MN)
  • Table 60 Asia Pacific 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
  • Table 61 Asia Pacific 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 62 Asia Pacific 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
  • Table 63 Asia Pacific 3D IC Market Outlook, By Type (2022-2030) ($MN)
  • Table 64 Asia Pacific 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
  • Table 65 Asia Pacific 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
  • Table 66 Asia Pacific 3D IC Market Outlook, By Application (2022-2030) ($MN)
  • Table 67 Asia Pacific 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
  • Table 68 Asia Pacific 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
  • Table 69 Asia Pacific 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 70 Asia Pacific 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 71 Asia Pacific 3D IC Market Outlook, By End User (2022-2030) ($MN)
  • Table 72 Asia Pacific 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
  • Table 73 Asia Pacific 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 74 Asia Pacific 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 75 Asia Pacific 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
  • Table 76 Asia Pacific 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 77 South America 3D IC Market Outlook, By Country (2022-2030) ($MN)
  • Table 78 South America 3D IC Market Outlook, By Component (2022-2030) ($MN)
  • Table 79 South America 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
  • Table 80 South America 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 81 South America 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
  • Table 82 South America 3D IC Market Outlook, By Type (2022-2030) ($MN)
  • Table 83 South America 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
  • Table 84 South America 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
  • Table 85 South America 3D IC Market Outlook, By Application (2022-2030) ($MN)
  • Table 86 South America 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
  • Table 87 South America 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
  • Table 88 South America 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 89 South America 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 90 South America 3D IC Market Outlook, By End User (2022-2030) ($MN)
  • Table 91 South America 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
  • Table 92 South America 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 93 South America 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 94 South America 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
  • Table 95 South America 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)
  • Table 96 Middle East & Africa 3D IC Market Outlook, By Country (2022-2030) ($MN)
  • Table 97 Middle East & Africa 3D IC Market Outlook, By Component (2022-2030) ($MN)
  • Table 98 Middle East & Africa 3D IC Market Outlook, By Through Glass Via (TGV) (2022-2030) ($MN)
  • Table 99 Middle East & Africa 3D IC Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 100 Middle East & Africa 3D IC Market Outlook, By Silicon Interposer (2022-2030) ($MN)
  • Table 101 Middle East & Africa 3D IC Market Outlook, By Type (2022-2030) ($MN)
  • Table 102 Middle East & Africa 3D IC Market Outlook, By Monolithic 3D (2022-2030) ($MN)
  • Table 103 Middle East & Africa 3D IC Market Outlook, By Stacked 3D (2022-2030) ($MN)
  • Table 104 Middle East & Africa 3D IC Market Outlook, By Application (2022-2030) ($MN)
  • Table 105 Middle East & Africa 3D IC Market Outlook, By Aerospace (2022-2030) ($MN)
  • Table 106 Middle East & Africa 3D IC Market Outlook, By Imaging and Optoelectronics (2022-2030) ($MN)
  • Table 107 Middle East & Africa 3D IC Market Outlook, By Sensors (2022-2030) ($MN)
  • Table 108 Middle East & Africa 3D IC Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 109 Middle East & Africa 3D IC Market Outlook, By End User (2022-2030) ($MN)
  • Table 110 Middle East & Africa 3D IC Market Outlook, By Telecommunications (2022-2030) ($MN)
  • Table 111 Middle East & Africa 3D IC Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 112 Middle East & Africa 3D IC Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 113 Middle East & Africa 3D IC Market Outlook, By Medical Devices (2022-2030) ($MN)
  • Table 114 Middle East & Africa 3D IC Market Outlook, By Other End Users (2022-2030) ($MN)