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半導體生產設備

市場調查報告書

商品編碼

1588489

3D IC 市場規模、佔有率、成長分析，按基板、按產品、按組件、按 3D 技術、按應用、按地區 - 行業預測，2024-2031 年

3D IC Market Size, Share, Growth Analysis, By Substrate(Silicon on Insulator, Bulk Silicon), By Product(Sensors, Memories, Logics, Light Emitting Diodes ), By Component, By 3D Technology, By Application, By Region - Industry Forecast 2024-2031

出版日期: 2024年11月02日 | 出版商:

SkyQuest | 英文 197 Pages | 商品交期: 3-5個工作天內

價格

簡介目錄

2022年全球3D IC市場規模為106.2億美元，從2023年的114.9億美元成長到2031年的216億美元，複合年成長率預計為8.21%。

由於技術的快速發展以及對緊湊型和高性能電子設備的需求不斷增加，全球 3D 積體電路 (IC) 市場正處於強勁成長軌道。消費性電子產品（特別是智慧型手機和平板電腦）中採用 3D IC 反映了市場希望透過多層堆疊積體電路來提高運作效率和消費量。這種創新架構不僅可以促進節能並增強訊號完整性，還可以滿足消費者對更輕、更小、更節能的設備的偏好。儘管面臨初始實施成本高、製造流程複雜以及溫度控管和互通性問題等挑戰，3D IC 市場仍提供了巨大的機會。人工智慧 (AI) 和機器學習 (ML) 的興起以及 5G 技術的推出，凸顯了對更快資料處理能力的需求，這使得 3D IC 對現代電子創新至關重要。隨著產業不斷克服標準化和協作障礙，市場有望大幅擴張。對下一代電子產品的需求將激增，要求製造商利用 3D IC 技術的進步。總體而言，在追求更小、更有效率、更快的電子解決方案的推動下，3D IC 市場被定位為不斷發展的數位領域的關鍵參與者。

市場概況
北美洲
- 美國
- 加拿大
歐洲
- 德國
- 西班牙
- 法國
- 英國
- 義大利
- 其他歐洲國家地區
亞太地區
- 中國
- 印度
- 日本
- 韓國
- 其他亞太地區
拉丁美洲
- 巴西
- 其他拉丁美洲地區
中東和非洲 (MEA)
- 海灣合作理事會國家
- 南非
- 其他中東/非洲地區

競爭格局

前5名企業對比
主要企業市場定位（2023年）
主要市場參與者所採取的策略
近期市集活動
主要企業市場佔有率（2023年）

主要企業簡介

Advanced Semiconductor Engineering
ST Microelectronics
STATS ChipPAC
Taiwan Semiconductor Manufacturing
Samsung Electronics
IBM
AMKOR TECHNOLOGY
Toshiba Corporation
United Microelectronics Corporation
Xilinx Inc.
Micron Technology, Inc.
Samsung Electronics Co. Ltd.
Cadence
Monolithic 3D Inc.
Intel Corporation
NXP Semiconductors
Qualcomm
Broadcom Inc.
Analog Devices, Inc.
Siemens

簡介目錄

Product Code: SQMIG45K2097

Global 3D IC Market size was valued at USD 10.62 billion in 2022 and is poised to grow from USD 11.49 billion in 2023 to USD 21.60 billion by 2031, growing at a CAGR of 8.21% during the forecast period (2024-2031).

The global 3D Integrated Circuit (IC) market is on a robust growth trajectory, driven by rapid technological developments and an escalating demand for compact, high-performance electronic devices. The adoption of 3D ICs across consumer electronics, particularly smartphones and tablets, reflects the market's aim to enhance operational efficiency and energy consumption by stacking multiple layers of integrated circuits. This innovative architecture not only facilitates energy savings and strengthens signal integrity but also caters to consumers' preferences for lighter, smaller, and more energy-efficient gadgets. Despite facing challenges such as high initial implementation costs, intricate manufacturing processes, and concerns over heat management and interoperability, the 3D IC market presents substantial opportunities. The rise of artificial intelligence (AI) and machine learning (ML), alongside the rollout of 5G technology, underscores the necessity for faster data processing capabilities, making 3D ICs integral to modern electronic innovations. As the industry continues to overcome hurdles related to standardization and collaborative efforts, the market is poised for significant expansion. Manufacturers are urged to leverage advancements in 3D IC technology, as the demand for next-generation electronics is set to soar. Overall, the 3D IC market is propelled by the quest for smaller, efficient, and high-speed electronic solutions, positioning itself as a vital player in the evolving digital landscape.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global 3D Ic market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global 3D Ic Market Segmental Analysis

Global 3D IC Market is segmented by Substrate, Product, Component, 3D Technology, Application, and Region. Based on Substrate, the market is segmented into Silicon on Insulator (SOI), Bulk Silicon. Based on Product, the market is segmented into Sensors, Memories, Logics, Light Emitting Diodes (LED), Micro Electro Mechanical Systems (MEMS). Based on Component, the market is segmented into Through Silicon Vias, Through Glass Vias, Silicon Interposer, Others. Based on 3D Technology, the market is segmented into Wafer Level Packaging, System Integration. Based on Application, the market is segmented into Consumer Electronics, ICT/Telecommunication, Military, Automotive, Biomedical, Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global 3D Ic Market

The global 3D IC market is driven by the increasing consumer demand for compact and high-performance electronic devices. As consumers gravitate towards smaller, lighter, and more powerful gadgets such as smartphones, tablets, and wearables, 3D IC technology provides a crucial solution by enabling the stacking of multiple layers of integrated circuits. This innovative approach enhances processing capabilities while minimizing power consumption and physical dimensions. Consequently, it aligns perfectly with the evolving needs of tech-savvy users seeking advanced functionality in their devices, fueling the expansion of the 3D IC market across various applications in electronics.

Restraints in the Global 3D Ic Market

The high start-up costs associated with 3D integrated circuit (IC) technology represent a significant market restraint, limiting its widespread adoption. The intricate fabrication processes and the requirement for specialized equipment result in elevated production costs, which can be prohibitive for many manufacturers. These initial financial barriers deter potential entrants and established companies from investing in the transition to 3D IC technology, slowing down industrial uptake across various sectors. Consequently, the reluctance to embrace this innovative technology restricts its market potential, hindering the overall growth and evolution of the 3D IC market on a global scale.

Market Trends of the Global 3D Ic Market

The global 3D IC market is witnessing a significant trend driven by the increasing integration of 3D ICs in artificial intelligence (AI) and machine learning (ML) applications. As industries demand enhanced data processing capabilities and superior performance to support the growing complexity of AI algorithms, the adoption of 3D IC technology is surging. This technology enables higher integration density and faster data transfer rates, essential for the efficient functioning of AI and ML systems. Consequently, this trend not only propels the demand for advanced 3D ICs but also signifies a broader technological evolution, positioning the market for substantial growth in the coming years.

Introduction

Objectives of the Study
Definitions
Market Scope

Research Methodology

Information Procurement
Secondary & Primary Data Sources
Market Size Estimation
Market Assumptions & Limitations

Executive Summary

Market Overview Outlook
Supply Demand Trend Analysis
Segmental Opportunity Analysis

Market Dynamics & Outlook

Market Dynamics
- Drivers
- Opportunities
- Restraints
- Challenges
Porters Analysis
- Competitive rivalry
- Threat of Substitute Products
- Bargaining Power of Buyers
- Threat of New Entrants
- Bargaining Power of Suppliers

Key Market Insights

Technology Analysis
Value Chain Analysis
Ecosystem of the Market
Patent Analysis
Pricing Analysis
Regulatory Landscape
Innovation Matrix
PESTEL Analysis
Top Investment Analysis
Key Success Factor
Degree of Competition

3D IC Market by Substrate

Market Overview
Silicon on Insulator (SOI)
Bulk Silicon

3D IC Market by Product

Market Overview
Sensors
Memories
Logics
Light Emitting Diodes (LED)
Micro Electro Mechanical Systems (MEMS)

3D IC Market by Component

Market Overview
Through Silicon Vias
Through Glass Vias
Silicon Interposer
Others

3D IC Market by 3D Technology

Market Overview
Wafer Level Packaging
System Integration

3D IC Market by Application

Market Overview
Consumer Electronics
ICT/Telecommunication
Military
Automotive
Biomedical
Others

3D IC Market Size by Region

Market Overview
North America
- USA
- Canada
Europe
- Germany
- Spain
- France
- UK
- Italy
- Rest of Europe
Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
Latin America
- Brazil
- Rest of Latin America
Middle East & Africa (MEA)
- GCC Countries
- South Africa
- Rest of MEA

Competitive Landscape

Top 5 Player Comparison
Market Positioning of Key Players, 2023
Strategies Adopted by Key Market Players
Recent Activities in the Market
Key Companies Market Share (%), 2023

Key Company Profiles

Advanced Semiconductor Engineering
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
ST Microelectronics
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
STATS ChipPAC
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Taiwan Semiconductor Manufacturing
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Samsung Electronics
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
IBM
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
AMKOR TECHNOLOGY
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Toshiba Corporation
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
United Microelectronics Corporation
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Xilinx Inc.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Micron Technology, Inc.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Samsung Electronics Co. Ltd.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Cadence
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Monolithic 3D Inc.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Intel Corporation
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
NXP Semiconductors
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Qualcomm
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Broadcom Inc.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Analog Devices, Inc.
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Siemens
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments