ToF 3D 相機 IC 市場報告：2030 年趨勢、預測與競爭分析

ToF 3D相機IC趨勢與預測

預計2024年至2030年，全球ToF 3D相機IC市場將以32.1%的複合年成長率成長。該市場的主要驅動力是人們對具有複雜拍攝功能的智慧型手機的興趣不斷成長，對生物識別和臉部辨識系統不斷成長的需求，以及ToF相機感測器尺寸、精度和解析度的開拓。電路。全球ToF 3D相機IC市場前景廣闊，受惠於家用電子電器市場與汽車市場的機會。

ToF 3D 相機 IC 市場洞察

根據 Lucintel 的預測，間接 ToF 感測器領域預計將在預測期內實現最高成長，因為它具有更高的精度和更低的功耗。

預計亞太地區在預測期內將出現最高成長。

常問問題

Q1.市場成長預測如何？

A1. 2024年至2030年，全球ToF 3D相機IC市場預計將以32.1%的複合年成長率成長。

Q2.影響市場成長的主要促進因素有哪些？

A2. 該市場的主要驅動力包括對具有先進攝影功能的智慧型手機的興趣不斷成長，對生物識別和臉部認證系統的需求不斷成長，以及感測器尺寸、精度和解析度的改進、整合ToF相機的持續技術開拓和創新電路。

Q3.市場的主要區隔市場有哪些？

A3. 全球ToF 3D相機IC市場前景廣闊，家用電子電器與汽車市場蘊含機會。

Q4.市場上主要企業有哪些？

A4.主要ToF 3D相機IC公司如下。

• ams OSRAM
• Infineon & PMD
• Melexis
• STMicroelectronics
• Texas Instruments
• Nuvoton
• Toppan

Q5.未來最大的區隔市場是什麼？

A5.Lucintel 預測，間接 ToF 感測器領域預計將在預測期內實現最高成長，因為它具有更高的精度和消耗更少的功耗。

Q6. 未來五年預計哪個地區將成為最大的市場？

預計 A6.APAC 在預測期內將出現最高成長。

Q7. 可以客製化報告嗎？

A7. 是的，Lucintel 提供 10% 的客製化服務，無需額外費用。

目錄

第1章執行摘要

第2章全球ToF 3D相機IC市場：市場動態

• 簡介、背景、分類
• 供應鏈
• 產業促進因素與課題

第3章 2018-2030年市場趨勢及預測分析

• 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
• 全球ToF 3D相機IC市場趨勢（2018-2023）與預測（2024-2030）
• 全球 ToF 3D 相機 IC 市場（依類型）
  • 直接 ToF 感測器
  • 間接ToF感測器
• 全球 ToF 3D 相機 IC 市場（依應用）
  • 家用電器產品
  • 車
  • 其他

第4章 2018-2030年區域市場趨勢及預測分析

• 全球ToF 3D相機IC市場區域分佈
• 北美ToF 3D相機IC市場
• 歐洲ToF 3D相機IC市場
• 亞太地區 ToF 3D 相機 IC 市場
• 其他地區ToF 3D相機IC市場

第5章 競爭分析

• 產品系列分析
• 營運整合
• 波特五力分析

第6章 成長機會與策略分析

• 成長機會分析
  • 全球 ToF 3D 相機 IC 市場成長機會（依類型）
  • 全球 ToF 3D 相機 IC 市場成長機會（依應用）
  • 全球ToF 3D相機IC市場成長機會（依地區）
• 全球ToF 3D相機IC市場新趨勢
• 戰略分析
  • 新產品開發
  • 全球ToF 3D相機IC市場產能擴張
  • 全球ToF 3D相機IC市場併購及合資
  • 認證和許可

第7章主要企業概況

• ams OSRAM
• Infineon & PMD
• Melexis
• STMicroelectronics
• Texas Instruments
• Nuvoton
• Toppan

ToF 3D Camera IC Trends and Forecast

The future of the global ToF 3D camera IC market looks promising with opportunities in the consumer electronic and automobile markets. The global ToF 3D camera IC market is expected to grow with a CAGR of 32.1% from 2024 to 2030. The major drivers for this market are rising interest in smartphones with sophisticated photography features, growing demand for biometric and facial recognition systems, as well as, continuous technological development and innovation in ToF camera integrated circuits, including enhanced size, precision, and resolution of the sensor.

A more than 150-page report is developed to help in your business decisions.

ToF 3D Camera IC by Segment

The study includes a forecast for the global ToF 3D camera IC by type, application, and region.

ToF 3D Camera IC Market by Type [Shipment Analysis by Value from 2018 to 2030]:

• Direct ToF Sensor
• Indirect ToF Sensor

ToF 3D Camera IC Market by Application [Shipment Analysis by Value from 2018 to 2030]:

• Consumer Electronic
• Automobile
• Others

ToF 3D Camera IC Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of ToF 3D Camera IC Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies ToF 3D camera IC companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the ToF 3D camera IC companies profiled in this report include-

• ams OSRAM
• Infineon & PMD
• Melexis
• STMicroelectronics
• Texas Instruments
• Nuvoton
• Toppan

ToF 3D Camera IC Market Insights

Lucintel forecasts that indirect ToF sensor segment is expected to witness highest growth over the forecast period because it shows higher accuracy and consumes less power.

APAC is expected to witness highest growth over the forecast period.

Features of the Global ToF 3D Camera IC Market

Market Size Estimates: ToF 3D camera IC market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: ToF 3D camera IC market size by type, application, and region in terms of value ($B).

Regional Analysis: ToF 3D camera IC market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the ToF 3D camera IC market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the ToF 3D camera IC market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the growth forecast for ToF 3D camera IC market?

Answer: The global ToF 3D camera IC market is expected to grow with a CAGR of 32.1% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of the ToF 3D camera IC market?

Answer: The major drivers for this market are rising interest in smartphones with sophisticated photography features, growing demand for biometric and facial recognition systems, as well as, continuous technological development and innovation in ToF camera integrated circuits, including enhanced size, precision, and resolution of the sensor.

Q3. What are the major segments for ToF 3D camera IC market?

Answer: The future of the global ToF 3D camera IC market looks promising with opportunities in the consumer electronic and automobile markets.

Q4. Who are the key ToF 3D camera IC market companies?

Answer: Some of the key ToF 3D camera IC companies are as follows.

• ams OSRAM
• Infineon & PMD
• Melexis
• STMicroelectronics
• Texas Instruments
• Nuvoton
• Toppan

Q5. Which ToF 3D camera IC market segment will be the largest in future?

Answer: Lucintel forecasts that indirect ToF sensor segment is expected to witness highest growth over the forecast period because it shows higher accuracy and consumes less power.

Q6. In ToF 3D camera IC market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the ToF 3D camera IC market by type (direct ToF sensor and indirect ToF sensor), application (consumer electronic, automobile, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global ToF 3D Camera IC Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

• 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
• 3.2. Global ToF 3D Camera IC Market Trends (2018-2023) and Forecast (2024-2030)
• 3.3: Global ToF 3D Camera IC Market by Type
  • 3.3.1: Direct ToF Sensor
  • 3.3.2: Indirect ToF Sensor
• 3.4: Global ToF 3D Camera IC Market by Application
  • 3.4.1: Consumer Electronic
  • 3.4.2: Automobile
  • 3.4.3: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

• 4.1: Global ToF 3D Camera IC Market by Region
• 4.2: North American ToF 3D Camera IC Market
  • 4.2.2: North American ToF 3D Camera IC Market by Application: Consumer Electronic, Automobile, and Others
• 4.3: European ToF 3D Camera IC Market
  • 4.3.1: European ToF 3D Camera IC Market by Type: Direct ToF Sensor and Indirect ToF Sensor
  • 4.3.2: European ToF 3D Camera IC Market by Application: Consumer Electronic, Automobile, and Others
• 4.4: APAC ToF 3D Camera IC Market
  • 4.4.1: APAC ToF 3D Camera IC Market by Type: Direct ToF Sensor and Indirect ToF Sensor
  • 4.4.2: APAC ToF 3D Camera IC Market by Application: Consumer Electronic, Automobile, and Others
• 4.5: ROW ToF 3D Camera IC Market
  • 4.5.1: ROW ToF 3D Camera IC Market by Type: Direct ToF Sensor and Indirect ToF Sensor
  • 4.5.2: ROW ToF 3D Camera IC Market by Application: Consumer Electronic, Automobile, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global ToF 3D Camera IC Market by Type
  • 6.1.2: Growth Opportunities for the Global ToF 3D Camera IC Market by Application
  • 6.1.3: Growth Opportunities for the Global ToF 3D Camera IC Market by Region
• 6.2: Emerging Trends in the Global ToF 3D Camera IC Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global ToF 3D Camera IC Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global ToF 3D Camera IC Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: ams OSRAM
• 7.2: Infineon & PMD
• 7.3: Melexis
• 7.4: STMicroelectronics
• 7.5: Texas Instruments
• 7.6: Nuvoton
• 7.7: Toppan