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市場調查報告書
商品編碼
1449665

裝載埠模組市場：按裝載端口模組類型、按自動化水準、按最終用戶行業、按通訊介面、按晶圓尺寸、按應用、按清潔級別、按建築材料、按地區

Load Port Module Market, By Type of Load Port Module, By Automation Level, By End-User Industry, By Communication Interface, By Wafer Size, By Application, By Cleanliness Level, By Component Material, By Geography
出版日期: | 出版商: Coherent Market Insights | 英文 160 Pages | 商品交期: 2-3個工作天內

價格
簡介目錄

裝載埠模組市場規模預計到2024年將達到4.451億美元，到2031年將達到7.949億美元，2024年至2031年的年複合成長率為8.6%。

報告範圍 報告詳情
基準年 2023年 2023/2024年市場規模 4.451 億美元
實際資料 2019-2023 預測期 2024-2031
預測期間2023/2024 至2030/2031年年複合成長率： 8.60% 2030/2031價值預測 7.949 億美元
圖 1.2024年裝載埠模組的全球市場佔有率（%）（依地區）
裝載埠模組市場-IMG1

市場動態

對半導體裝置的需求不斷成長、半導體製造、自動化和工業 4.0 的進步預計將在預測期內推動全球裝載埠模組市場的成長。此外，對產量比率提高的關注預計也將推動預測期內全球裝載埠模組市場的成長。先進材料的採用、智慧技術的整合以及特定應用的客製化預計將為預測期內的全球裝​​載端口模組市場提供成長機會。

然而，高初始投資、整合複雜性、維護和停機時間預計將阻礙預測期內全球裝載埠模組市場的成長。

本研究的主要特點

  • 本報告詳細分析了全球裝載埠模組市場，並提供了以2023年為基準年的預測期（2024-2031）的市場規模和年複合成長率（CAGR%）。
  • 揭示了各個細分市場的潛在商機，並為該市場說明了一系列有吸引力的投資提案。
  • 提供了有關市場促進因素、限制因素、機會、新產品發布和核准、市場趨勢、區域前景、主要企業採取的競爭策略等的重要見解。
  • 根據公司亮點、產品系列、主要亮點、財務表現和策略等參數，介紹了全球裝載埠模組市場的主要企業。
  • 本報告的見解使行銷人員和經營團隊負責人就未來的產品發布、類型升級、市場擴張和行銷策略做出明智的決策。
  • 全球裝載埠模組市場報告滿足該行業的各種相關人員，例如投資者、供應商、產品製造商、經銷商、新進入者和財務分析師。
  • 相關人員可以透過用於分析全球裝載埠模組市場的各種策略矩陣來促進他們的決策。

目錄：

第1章 研究目的與前提

  • 研究目標
  • 先決條件
  • 簡稱

第2章 市場展望

  • 報告說明
    • 市場定義和範圍
  • 執行摘要
  • Coherent Opportunity Map（COM）

第3章 市場動態、法規及趨勢分析

  • 市場動態
    • 促進因素
  • 半導體裝置需求增加
  • 半導體製造的進步
  • 自動化與工業4.0
  • 致力於提高產量
    • 機會
  • 採用先進材料
  • 智慧科技融合
  • 針對特定應用的客製化
  • 注意能源效率
    • 抑制因素
  • 初期投資高
  • 整合複雜度
  • 維護和停機
  • 主要亮點
  • 監管場景
  • 最近的趨勢
  • 產品發布/核准
  • PEST分析
  • 波特的分析
  • 合併、收購和合作

第4章 全球裝載埠模組市場 - 冠狀病毒（COVID-19）大流行的影響

  • 新型冠狀病毒感染疾病（COVID-19）的流行病學
  • 供需面分析
  • 經濟影響

第5章 全球裝載埠模組市場，依裝載埠模組類型，2019-2031

  • Front-Opening Unified Pod (FOUP)
  • Front-Opening Individual Pod (FOIP)
  • Front-Opening Shipping Box (FOSB)

第6章 全球裝載埠模組市場，依自動化程度分類，2019-2031

  • 手動裝載埠模組
  • 半自動裝載埠模組
  • 全自動裝載埠模組

第7章 全球裝載埠模組市場，依最終用戶產業分類，2019-2031年

  • 半導體製造
  • 電子設備製造

第8章 2019-2031年全球裝載埠模組市場，依晶圓尺寸

  • 200mm負載口模組
  • 300mm負載口模組
  • 其他

第9章 全球裝載埠模組市場，依通訊介面，2019-2031

  • SECS/GEM
  • 其他

第10章 全球裝載埠模組市場，依應用，2024-2031年

  • 晶圓運輸
  • 晶圓儲存

第11章 全球裝載模組市場，依清潔等級分類，2019-2031年

  • 高真空裝載埠模組
  • 標準裝載埠模組

第12章 全球裝載模組市場，依構成材料，2019-2031

  • 不銹鋼裝載埠模組
  • 鋁製裝載埠模組

第13章 全球裝載埠模組市場，依地區，2019-2031

  • 北美洲
  • 美國
  • 加拿大
  • 歐洲
  • 德國
  • 英國
  • 西班牙
  • 法國
  • 義大利
  • 俄羅斯
  • 歐洲其他地區
  • 亞太地區
  • 中國
  • 印度
  • 日本
  • 韓國
  • 澳洲
  • ASEAN
  • 其他亞太地區
  • 拉丁美洲
  • 巴西
  • 阿根廷
  • 墨西哥
  • 其他拉丁美洲
  • 中東、非洲
  • 海灣合作理事會國家
  • 以色列
  • 南非
  • 北非
  • 中部非洲
  • 其他中東、非洲

第14章 競爭格局

  • 公司簡介
    • Brooks Automation Inc.
    • Entegris, Inc.
    • Tokyo Electron Limited（TEL）
    • Lam Research Corporation
    • ASML Holding NV
    • Applied Materials, Inc.
    • Hitachi High-Tech Corporation
    • AMAT Applied Materials AG
    • KLA Corporation
    • Mattson Technology, Inc.
    • Tokyo Seimitsu Co., Ltd.（Accretech）
    • Advantest Corporation
    • Ultratech（acquired by Veeco Instruments Inc.）
    • MKS Instruments, Inc.
    • Novellus Systems（acquired by Lam Research Corporation）

第15章

  • 參考
  • 調查方法
  • 關於出版商
簡介目錄
Product Code: CMI6119

The Load port module market size is valued at US$ 445.1 Million in 2024 and is expected to reach US$ 794.9 million by 2031, exhibiting a compound annual growth rate (CAGR) of 8.6% from 2024 to 2031.

Report Coverage Report Details
Base Year: 2023 Market Size in 2023/2024: US$ 445.1 Mn
Historical Data for: 2019 to 2023 Forecast Period: 2024 - 2031
Forecast Period 2023/2024 to 2030/2031 CAGR: 8.60% 2030/2031 Value Projection: US$ 794.9 Mn
Figure 1. Global Load Port Module Market Share (%), By Region, 2024
Load Port Module Market - IMG1

Market Dynamics

Increasing demand for semiconductor devices, advancements in semiconductor manufacturing, and automation and industry 4.0 is anticipated to drive growth of the global load port module market over the forecast period. Moreover, focus on yield enhancement is also expected to boost growth of the global load port module market over the forecast period. Adoption of advanced materials, integration of smart technologies, and customization for specific applications is expected to create growth opportunities for the global load port module market during the forecast period.

However, high initial investment, integration complexity, and maintenance and downtime are expected to hamper growth of the global load port module market over the forecast period.

Key features of the study:

  • This report provides in-depth analysis of the global load port module market, and provides market size (US$ Million) and compound annual growth rate (CAGR %) for the forecast period (2024-2031), considering 2023 as the base year.
  • It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market.
  • This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players.
  • It profiles key players in the global load port module market based on the following parameters - company highlights, products portfolio, key highlights, financial performance, and strategies.
  • Key companies covered as a part of this study include Brooks Automation Inc., Entegris, Inc., Tokyo Electron Limited (TEL), Lam Research Corporation, ASML Holding N.V., Applied Materials, Inc., Hitachi High-Tech Corporation, AMAT Applied Materials AG, KLA Corporation, Mattson Technology, Inc., Tokyo Seimitsu Co., Ltd. (Accretech), Advantest Corporation, Ultratech (acquired by Veeco Instruments Inc.), MKS Instruments, Inc., Novellus Systems (acquired by Lam Research Corporation).
  • Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics.
  • Global load port module market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
  • Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global load port module market.

Detailed Segmentation:

  • Load Port Module Market, By Type of Load Port Module:
    • Front-Opening Unified Pod (FOUP)
    • Front-Opening Individual Pod (FOIP)
    • Front-Opening Shipping Box (FOSB)
  • Load Port Module Market, By Market Automation Level:
    • Manual Load Port Module
    • Semi-Automated Load Port Module
    • Fully Automated Load Port Module
  • Load Port Module Market, By End User Industry:
    • Semiconductor Manufacturing
    • Electronics Manufacturing
  • Load Port Module Market, By Communication Interface:
    • SECS/GEM
    • Others
  • Load Port Module Market, By Wafer Size:
    • 200mm Load Port Module
    • 300mm Load Port Module
    • Others
  • Load Port Module Market, By Application:
    • Wafer Transportation
    • Wafer Storage
  • Load Port Module Market, By Cleanliness Level:
    • High Vacuum Load Port Module
    • Standard Load Port Module
  • Load Port Module Market, By Component Material:
    • Stainless Steel Load Port Module
    • Aluminum Load Port Module
  • Load Port Module Market, By Region:
    • North America
    • Latin America
    • Europe
    • Asia Pacific
    • Middle East & Africa
  • Top Companies in the Global Load Port Module Market:
    • Brooks Automation Inc.
    • Entegris, Inc.
    • Tokyo Electron Limited (TEL)
    • Lam Research Corporation
    • ASML Holding N.V.
    • Applied Materials, Inc.
    • Hitachi High-Tech Corporation
    • AMAT Applied Materials AG
    • KLA Corporation
    • Mattson Technology, Inc.
    • Tokyo Seimitsu Co., Ltd. (Accretech)
    • Advantest Corporation
    • Ultratech (acquired by Veeco Instruments Inc.)
    • MKS Instruments, Inc.
    • Novellus Systems (acquired by Lam Research Corporation)

Table of Contents:

1. Research Objectives and Assumptions

  • Research Objectives
  • Assumptions
  • Abbreviations

2. Market Purview

  • Report Description
    • Market Definition and Scope
  • Executive Summary
    • Global Load Port Module Market Snippet, By Type of Load Port Module
    • Global Load Port Module Market Snippet, By Automation Level
    • Global Load Port Module Market Snippet, By End User Industry
    • Global Load Port Module Market Snippet, By Communication Interface
    • Global Load Port Module Market Snippet, By Wafer Size
    • Global Load Port Module Market Snippet, By Application
    • Global Load Port Module Market Snippet, By Cleanliness Level
    • Global Load Port Module Market Snippet, By Component Material
    • Global Load Port Module Market Snippet, By Region
  • Coherent Opportunity Map (COM)

3. Market Dynamics, Regulations, and Trends Analysis

  • Market Dynamics
    • Drivers
  • Increasing demand for semiconductor devices
  • Advancements in semiconductor manufacturing
  • Automation and industry 4.0
  • Focus on yield enhancement
    • Opportunities
  • Adoption of advanced materials
  • Integration of smart technologies
  • Customization for specific applications
  • Focus on energy efficiency
    • Restrains
  • High initial investment
  • Integration complexity
  • Maintenance and downtime
  • Key Highlights
  • Regulatory Scenario
  • Recent Trends
  • Product Launches/Approvals
  • PEST Analysis
  • PORTER's Analysis
  • Merger, Acquisitions, and Collaborations

4. Global Load Port Module Market- Impact of Coronavirus (COVID-19) Pandemic

  • COVID-19 Epidemiology
  • Supply Side and Demand Side Analysis
  • Economic Impact

5. Global Load Port Module Market, By Type of Load Port Module, 2019-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, 2019- 2031
    • Segment Trends
  • Front-Opening Unified Pod (FOUP)
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Front-Opening Individual Pod (FOIP)
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Front-Opening Shipping Box (FOSB)
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million

6. Global Load Port Module Market, By Automation Level, 2019-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, 2019 - 2031
    • Segment Trends
  • Manual Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Semi-Automated Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Fully Automated Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)

7. Global Load Port Module Market, By End User Industry, 2019-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, 2019 - 2031
    • Segment Trends
  • Semiconductor Manufacturing
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Electronics Manufacturing
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)

8. Global Load Port Module Market, By Wafer Size, 2019-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, 2019 - 2031
    • Segment Trends
  • 200mm Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • 300mm Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Others
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)

9. Global Load Port Module Market, By Communication Interface, 2019-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, 2019 - 2031
    • Segment Trends
  • SECS/GEM
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Others
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)

10. Global Load Port Module Market, By Application, 202417-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, 2019 - 2031
    • Segment Trends
  • Wafer Transportation
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Wafer Storage
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)

11. Global Load Port Module Market, By Cleanliness Level, 2019-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, 2019 - 2031
    • Segment Trends
  • High Vacuum Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Standard Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)

12. Global Load Port Module Market, By Component Material, 2019-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, 2019 - 2031
    • Segment Trends
  • Stainless Steel Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)
  • Aluminum Load Port Module
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, 2024-2031,(US$ Million)

13. Global Load Port Module Market, By Region, 2019-2031, (US$ Million)

  • Introduction
    • Market Share Analysis, By Sub-region, 2024 and 2031 (%)
    • Y-o-Y Growth Analysis, For Sub-region, 2018 -2031
    • Country Trends
  • North America
    • Introduction
    • Market Size and Forecast, and Y-o-Y Growth, By Type of Load Port Module, 2024-2031,(US$ Million)
    • Market Size and Forecast, and Y-o-Y Growth, By Automation Level, 2024-2031,(US$ Million
    • Market Size and Forecast, and Y-o-Y Growth, By End User Industry, 2024-2031,(US$ Million)
    • Market Size and Forecast, and Y-o-Y Growth, By Communication Interface, 2024-2031,(US$ Million
    • Market Size and Forecast, and Y-o-Y Growth, By Wafer Size, 2024-2031,(US$ Million)
    • Market Size and Forecast, and Y-o-Y Growth, By Application, 2024-2031,(US$ Million
    • Market Size and Forecast, and Y-o-Y Growth, By Cleanliness Level, 2024-2031,(US$ Million)
    • Market Size and Forecast, and Y-o-Y Growth, By Component Material, 2024-2031,(US$ Million)
    • Market Size and Forecast, and Y-o-Y Growth, By Country, 2024-2031,(US$ Million)
  • US
  • Canada
  • Europe
  • Germany
  • UK
  • Spain
  • France
  • Italy
  • Russia
  • Rest of Europe
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • ASEAN
  • Rest of Asia Pacific
  • Latin America
  • Brazil
  • Argentina
  • Mexico
  • Rest of Latin America
  • Middle East & Africa
  • GCC Countries
  • Israel
  • South Africa
  • North Africa
  • Central Africa
  • Rest of Middle East & Africa

14. Competitive Landscape

  • Company Profile
    • Brooks Automation Inc.
  • Company Highlights
  • Product Portfolio
  • Key Developments
  • Financial Performance
  • Strategies
    • Entegris, Inc.
    • Tokyo Electron Limited (TEL)
    • Lam Research Corporation
    • ASML Holding N.V.
    • Applied Materials, Inc.
    • Hitachi High-Tech Corporation
    • AMAT Applied Materials AG
    • KLA Corporation
    • Mattson Technology, Inc.
    • Tokyo Seimitsu Co., Ltd. (Accretech)
    • Advantest Corporation
    • Ultratech (acquired by Veeco Instruments Inc.)
    • MKS Instruments, Inc.
    • Novellus Systems (acquired by Lam Research Corporation)
  • Analyst Views

15. Section

  • References
  • Research Methodology
  • About us