市場調查報告書
商品編碼
1442003
先進封裝市場 - 按封裝類型(覆晶、扇入晶圓級封裝、嵌入式晶片、扇出、2.5 維/3 維)、按應用(消費電子、汽車、工業、醫療保健、A&D)和預測, 2024 - 2032Advanced Packaging Market - By Packaging Type (Flip-chip, Fan-in Wafer Level Packaging, Embedded-die, Fan-out, 2.5 Dimensional/3 Dimensional), By Application (Consumer Electronics, Automotive, Industrial, Healthcare, A&D) & Forecast, 2024 - 2032 |
由於越來越多的公司在領先的行業活動中推出,全球先進封裝市場在 2024 年至 2032 年間的CAGR將超過 10%。這些活動為該公司提供了展示其最新包裝技術創新的平台,包括先進材料、設計和製造流程。
例如,2024 年 2 月,領先的專用先進封裝 (ASAP) 服務供應商 Sarcina Technology 宣布將在 Chiplet 峰會上推出其 WIPO 服務。 WIPO(晶圓輸入、產品輸出)簡化了封裝、測試和生產流程,降低了與維護專用硬體團隊相關的成本。 WIPO涵蓋晶圓凸塊、封裝設計、晶片組裝和最終測試等各個階段,成為半導體產業新興的專用高級封裝(ASAP)服務的基石。
這些創新著重於永續性、效率和產品保護,滿足食品和飲料、醫療保健和電子等各行業不斷變化的需求。隨著公司競相在競爭激烈的市場中保持領先地位,對先進封裝解決方案的需求持續成長,推動市場成長和創新。
先進封裝市場的整體佔有率根據封裝類型、醫療保健和地區進行分類。
嵌入式晶片細分市場從 2024 年到 2032 年將經歷重大發展。嵌入式晶片封裝將半導體晶片直接整合到基板或封裝中,為各種應用提供緊湊、高性能的解決方案。隨著智慧型手機、物聯網設備和汽車電子產品的激增,需要小型高效組件,嵌入式晶片封裝成為關鍵解決方案。其優點包括提高效能、減少佔地面積和增強熱管理。隨著各行業尋求最佳化電子設備的空間和功能,對嵌入式晶片封裝解決方案的需求持續成長,推動市場擴張和創新。
2024年至2032年,醫療保健領域的先進封裝市場規模將出現顯著的CAGR。隨著醫療設備變得更加複雜和緊湊,先進封裝技術在確保可靠性、小型化和性能方面發揮著至關重要的作用。先進的封裝解決方案可滿足各種醫療保健應用的需求,包括植入式設備、診斷設備和藥物傳輸系統。隨著醫療電子產品精度和可靠性的關注,對先進封裝的需求持續成長,推動創新和市場成長,以滿足醫療保健行業不斷變化的需求。
歐洲先進封裝產業從 2024 年到 2032 年將呈現出值得稱讚的CAGR。汽車、醫療保健和電子等眾多行業都在尋求先進封裝解決方案,歐洲提供了一個利潤豐厚的市場機會。該地區對永續性和效率的重視進一步刺激了對先進封裝技術的需求,這些技術可最佳化空間、提高性能並減少對環境的影響。
隨著歐洲工業繼續優先考慮創新,對先進包裝解決方案的需求仍然強勁,推動了市場的成長和發展。例如,2023年12月,Amkor Technology計劃在亞利桑那州皮奧裡亞建造一座尖端封裝和測試設施,投資約20億美元,建成後將僱用約2,000名員工。 Amkor 預計將成為美國最大的外包先進封裝廠,旨在增強美國的半導體供應鏈。
Global Advanced Packaging Market will witness over 10% CAGR between 2024 and 2032 as a result of rising company launches at leading industry events. These events serve as platforms for companies to showcase their latest innovations in packaging technology, including advanced materials, designs, and manufacturing processes.
For instance, in February 2024, Sarcina Technology, a leading provider of Application Specific Advanced Packaging (ASAP) Services, announced that it is set to introduce its WIPO service at the Chiplet Summit. WIPO, or wafer-in, product-out, streamlined packaging, testing, and production processes, reducing costs associated with maintaining dedicated hardware teams. WIPO encompassed various stages, including wafer bumping, package design, chip assembly, and final test, serving as the cornerstone for the emerging Application Specific Advanced Package (ASAP) Service in the semiconductor industry.
With a focus on sustainability, efficiency, and product protection, these innovations cater to the evolving needs of various sectors, such as food and beverage, healthcare, and electronics. As companies vie to stay ahead in a competitive market, the demand for advanced packaging solutions continues to rise, driving market growth and innovation.
The overall Advanced Packaging Market share is classified based on the packaging type, healthcare, and region.
Embedded-die segment will undergo significant development from 2024 to 2032. Embedded-die packaging integrates semiconductor chips directly into substrates or packages, offering compact, high-performance solutions for various applications. With the proliferation of smartphones, IoT devices, and automotive electronics requiring miniaturized and efficient components, embedded-die packaging emerges as a key solution. Its advantages include improved performance, reduced footprint, and enhanced thermal management. As industries seek to optimize space and functionality in electronic devices, the demand for embedded-die packaging solutions continues to grow, driving market expansion and innovation.
Advanced packaging market size from the healthcare segment will register a noteworthy CAGR from 2024 to 2032. As medical devices become more complex and compact, advanced packaging technologies play a crucial role in ensuring reliability, miniaturization, and performance. Advanced packaging solutions cater to the needs of various healthcare applications, including implantable devices, diagnostic equipment, and drug delivery systems. With a focus on precision and reliability in medical electronics, the demand for advanced packaging continues to rise, driving innovation and market growth to meet the evolving needs of the healthcare industry.
Europe advanced packaging industry will showcase a commendable CAGR from 2024 to 2032. With a diverse range of industries, including automotive, healthcare, and electronics, seeking advanced packaging solutions, Europe presents a lucrative market opportunity. The region's emphasis on sustainability and efficiency further fuels demand for advanced packaging technologies that optimize space, enhance performance and reduce environmental impact.
As European industries continue to prioritize innovation, the demand for advanced packaging solutions remains strong, driving market growth and development. For instance, in December 2023, Amkor Technology planned to build a cutting-edge packaging and testing facility in Peoria, Arizona, investing approximately US$2 billion and hiring about 2,000 employees upon completion. Expected to be the largest outsourced advanced packaging facility in the US, Amkor aimed to enhance America's semiconductor supply chain.