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1451639

2024-2032 年半導體封裝市場報告（按類型、封裝材料、技術、最終用戶和地區）

Semiconductor Packaging Market Report by Type, Packaging Material, Technology, End User, and Region 2024-2032
出版日期: | 出版商: IMARC | 英文 144 Pages | 商品交期: 2-3個工作天內

價格

2023年全球半導體封裝市場規模達349億美元。展望未來， IMARC Group預計到2032年市場規模將達到663億美元，2024-2032年複合年成長率（CAGR）為7.17%。由於對緊湊型高性能設備的需求不斷成長、技術的快速進步以及對人工智慧和異構整合不斷成長的需求，市場正在經歷穩定成長，從而促進封裝解決方案的創新，以滿足現代電子和半導體技術不斷變化的需求。

半導體封裝市場分析：

市場成長與規模：在智慧型手機、物聯網設備和汽車電子等先進電子產品需求不斷成長的推動下，全球市場正在經歷強勁成長。根據最新消息，市場規模巨大，其中亞太地區由於其在電子製造領域的主導地位而佔據最大佔有率。

主要市場促進因素：主要促進因素包括連網設備的成長、對高效能運算的需求不斷成長以及消費性電子產品的不斷發展。汽車產業對半導體解決方案的依賴日益增加，尤其是在電動車和先進駕駛輔助系統 (ADAS) 領域，這對市場成長做出了巨大貢獻。

技術進步：持續的技術進步集中在小型化、3D 整合和異構整合，從而在緊湊的外形尺寸內實現更高水平的功能。系統級封裝 (SiP) 和扇出晶圓級封裝 (FOWLP) 等先進封裝技術正日益受到重視。

產業應用：半導體封裝在各產業都有廣泛的應用，包括消費性電子、汽車、醫療保健、IT 和電信、航空航太和國防。該行業的適應性體現在它對 5G、人工智慧和物聯網 (IoT) 等新興技術的貢獻。

主要市場趨勢：當前趨勢包括轉向先進封裝解決方案，以提高熱性能、提高能源效率和增加功能。永續性和環保包裝材料正在成為突出趨勢，與全球環保計劃保持一致。

地理趨勢：亞太地區仍是市場的主導力量，作為主要的製造中心，主要參與者位於中國、日本、韓國和台灣等國家。在 IT、醫療保健和汽車領域的技術創新和應用的推動下，北美和歐洲做出了巨大貢獻。

競爭格局：競爭格局的特點是主要參與者投資於研發、建立策略夥伴關係以及進行併購以增強能力和市場佔有率。公司致力於透過持續創新、協作和滿足電子產業的動態需求來保持相關性。

挑戰與機會：挑戰包括解決 3D 整合的複雜性、管理散熱以及確保經濟高效的製造流程。機會在於開發新興技術的解決方案、擴展到未開發的市場以及滿足電動車對先進封裝的需求。

未來展望：在技術不斷進步、各行業應用不斷增加以及全球電子市場持續成長的推動下，全球市場的未來前景廣闊。創新、永續發展和滿足不斷變化的消費者需求的機會將決定未來幾年市場的成長。

半導體封裝市場趨勢：

快速的技術進步和小型化

不斷的技術進步和持續的小型化趨勢推動著市場。隨著電子設備變得更加複雜和緊湊，對更小和更有效率的半導體封裝的需求不斷增加。 3D 封裝和系統級封裝 (SiP) 等封裝技術的進步可將更多組件整合到單一封裝中，從而增強整體設備性能和功能。小型化不僅迎合了消費者對時尚攜帶設備的偏好，而且在汽車電子和物聯網設備等空間限制至關重要的應用中也發揮著至關重要的作用。

半導體裝置的複雜度不斷增加

半導體裝置日益複雜，是封裝市場的重要驅動力。隨著半導體元件變得更加強大和多功能，對先進封裝解決方案的需求不斷增加。複雜的設備，包括高效能處理器、記憶體模組和系統單晶片 (SoC)，需要複雜的封裝技術來確保最佳的效能、熱管理和可靠性。封裝產業透過開發創新解決方案來應對複雜的半導體架構帶來的特定挑戰，從而促進半導體封裝市場的整體成長。

異質整合需求不斷成長

異質整合，即將不同的半導體技術融合到一個封裝中，是推動市場發展的關鍵因素。這種整合涉及結合不同的材料、製程和技術，以提高性能、能源效率和成本效益。人工智慧 (AI) 和 5G 網路等應用受益於異質整合，因為它可以將各種功能無縫整合在單一晶片上。對增強系統級性能的追求以及在空間有限的電子設備中容納多種功能的需求推動了異質整合的需求，使其成為塑造全球行業格局的關鍵力量。

目錄

第1章：前言

第 2 章：範圍與方法

  • 研究目的
  • 利害關係人
  • 資料來源
    • 主要資源
    • 二手資料
  • 市場預測
    • 自下而上的方法
    • 自上而下的方法
  • 預測方法

第 3 章：執行摘要

第 4 章：簡介

  • 概述
  • 主要行業趨勢

第 5 章：全球半導體封裝市場

  • 市場概況
  • 市場業績
  • COVID-19 的影響
  • 市場預測

第 6 章：市場區隔：按類型

  • 覆晶
    • 市場走向
    • 市場預測
  • 嵌入式DIE
    • 市場走向
    • 市場預測
  • 扇入WLP
    • 市場走向
    • 市場預測
  • 扇出WLP
    • 市場走向
    • 市場預測

第 7 章：市場區隔：依包裝材料

  • 有機基材
    • 市場走向
    • 市場預測
  • 鍵合線
    • 市場走向
    • 市場預測
  • 引線框架
    • 市場走向
    • 市場預測
  • 陶瓷封裝
    • 市場走向
    • 市場預測
  • 晶片黏接材料
    • 市場走向
    • 市場預測
  • 其他
    • 市場走向
    • 市場預測

第 8 章：市場區隔：依技術

  • 網格陣列
    • 市場走向
    • 市場預測
  • 小外形封裝
    • 市場走向
    • 市場預測
  • 扁平無引線封裝
    • 市場走向
    • 市場預測
  • 雙列直插式封裝
    • 市場走向
    • 市場預測
  • 其他
    • 市場走向
    • 市場預測

第 9 章：市場區隔：按最終用戶

  • 消費性電子產品
    • 市場走向
    • 市場預測
  • 汽車
    • 市場走向
    • 市場預測
  • 衛生保健
    • 市場走向
    • 市場預測
  • 資訊科技和電信
    • 市場走向
    • 市場預測
  • 航太和國防
    • 市場走向
    • 市場預測
  • 其他
    • 市場走向
    • 市場預測

第 10 章：市場區隔：按地區

  • 北美洲
    • 美國
      • 市場走向
      • 市場預測
    • 加拿大
      • 市場走向
      • 市場預測
  • 亞太
    • 中國
      • 市場走向
      • 市場預測
    • 日本
      • 市場走向
      • 市場預測
    • 印度
      • 市場走向
      • 市場預測
    • 韓國
      • 市場走向
      • 市場預測
    • 澳洲
      • 市場走向
      • 市場預測
    • 印尼
      • 市場走向
      • 市場預測
    • 其他
      • 市場走向
      • 市場預測
  • 歐洲
    • 德國
      • 市場走向
      • 市場預測
    • 法國
      • 市場走向
      • 市場預測
    • 英國
      • 市場走向
      • 市場預測
    • 義大利
      • 市場走向
      • 市場預測
    • 西班牙
      • 市場走向
      • 市場預測
    • 俄羅斯
      • 市場走向
      • 市場預測
    • 其他
      • 市場走向
      • 市場預測
  • 拉丁美洲
    • 巴西
      • 市場走向
      • 市場預測
    • 墨西哥
      • 市場走向
      • 市場預測
    • 其他
      • 市場走向
      • 市場預測
  • 中東和非洲
    • 市場走向
    • 市場細分：按國家/地區
    • 市場預測

第 11 章：SWOT 分析

  • 概述
  • 優勢
  • 弱點
  • 機會
  • 威脅

第 12 章：價值鏈分析

第 13 章：波特五力分析

  • 概述
  • 買家的議價能力
  • 供應商的議價能力
  • 競爭程度
  • 新進入者的威脅
  • 替代品的威脅

第 14 章：價格分析

第15章：競爭格局

  • 市場結構
  • 關鍵參與者
  • 關鍵參與者簡介
    • Amkor Technology Inc.
    • ASE Group
    • ChipMOS Technologies Inc.
    • Fujitsu Limited
    • Intel Corporation
    • International Business Machines Corporation
    • Jiangsu Changjiang Electronics Technology Co., Ltd.
    • Powertech Technology Inc.
    • Qualcomm Incorporated
    • Samsung Electronics Co. Ltd.
    • STMicroelectronics International NV
    • Taiwan Semiconductor Manufacturing Company Limited
    • Texas Instruments Incorporated
Product Code: SR112024A4930

The global semiconductor packaging market size reached US$ 34.9 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 66.3 Billion by 2032, exhibiting a growth rate (CAGR) of 7.17% during 2024-2032. The market is experiencing steady growth driven by the rising need for compact, high-performance devices, rapid technological advancements, and the growing demand for AI and heterogeneous integration, fostering innovation in packaging solutions to meet the evolving requirements of modern electronics and semiconductor technologies.

Semiconductor Packaging Market Analysis:

Market Growth and Size: The global market is experiencing robust growth, driven by increasing demand for advanced electronics, including smartphones, IoT devices, and automotive electronics. As of the latest available information, the market size is substantial, with Asia Pacific holding the largest share due to its dominant position in electronics manufacturing.

Major Market Drivers: Key drivers include the growth of connected devices, rising demand for high-performance computing, and the continuous evolution of consumer electronics. The automotive industry's increasing reliance on semiconductor solutions, especially in electric vehicles and advanced driver-assistance systems (ADAS), contributes significantly to market growth.

Technological Advancements: Ongoing technological advancements focus on miniaturization, 3D integration, and heterogeneous integration, enabling higher levels of functionality within compact form factors. Advanced packaging technologies such as System-in-Package (SiP) and Fan-Out Wafer-Level Packaging (FOWLP) are gaining prominence.

Industry Applications: Semiconductor packaging finds extensive applications across diverse industries, including consumer electronics, automotive, healthcare, IT and telecommunications, and aerospace and defense. The industry's adaptability is evident in its contributions to emerging technologies like 5G, artificial intelligence, and the Internet of Things (IoT).

Key Market Trends: Current trends include a shift towards advanced packaging solutions for improved thermal performance, enhanced energy efficiency, and increased functionality. Sustainability and eco-friendly packaging materials are becoming prominent trends, aligning with global environmental initiatives.

Geographical Trends: Asia Pacific remains a dominant force in the market, serving as a major manufacturing hub with key players located in countries like China, Japan, South Korea, and Taiwan. North America and Europe contribute significantly, driven by technological innovation and applications in IT, healthcare, and automotive sectors.

Competitive Landscape: The competitive landscape is characterized by key players investing in research and development, forming strategic partnerships, and engaging in mergers and acquisitions to enhance capabilities and market presence. Companies are focused on maintaining relevance through continuous innovation, collaboration, and addressing the dynamic needs of the electronics industry.

Challenges and Opportunities: Challenges include addressing the complexities of 3D integration, managing heat dissipation, and ensuring cost-effective manufacturing processes. Opportunities lie in developing solutions for emerging technologies, expanding into untapped markets, and meeting the demand for advanced packaging in electric vehicles.

Future Outlook: The future outlook for the global market is promising, driven by ongoing technological advancements, increasing applications in various industries, and the continued growth of the electronics market globally. Opportunities for innovation, sustainability, and addressing evolving consumer demands will shape the growth of the market in the coming years.

Semiconductor Packaging Market Trends:

Rapid technological advancements and miniaturization

The market is propelled by continuous technological advancements and the ongoing trend of miniaturization. As electronic devices become more sophisticated and compact, there is an increasing demand for smaller and more efficient semiconductor packages. Advancements in packaging technologies, such as 3D packaging and System-in-Package (SiP), enable the integration of more components into a single package, enhancing overall device performance and functionality. Miniaturization not only caters to consumer preferences for sleek and portable gadgets but also plays a crucial role in applications like automotive electronics and IoT devices, where space constraints are paramount.

Increasing complexity of semiconductor devices

The growing complexity of semiconductor devices is a significant driver for the packaging market. As semiconductor components become more powerful and multifunctional, the need for advanced packaging solutions rises. Complex devices, including high-performance processors, memory modules, and system-on-chips (SoCs), require sophisticated packaging techniques to ensure optimal performance, thermal management, and reliability. The packaging industry responds by developing innovative solutions that address the specific challenges posed by intricate semiconductor architectures, contributing to the overall growth of the semiconductor packaging market.

Rising demand for heterogeneous integration

Heterogeneous integration, the amalgamation of diverse semiconductor technologies into a single package, is a key factor fueling the market. This integration involves combining different materials, processes, and technologies to achieve improved performance, energy efficiency, and cost-effectiveness. Applications like artificial intelligence (AI) and 5G networks benefit from heterogeneous integration as it enables the seamless incorporation of various functionalities on a single chip. The demand for heterogeneous integration is driven by the pursuit of enhanced system-level performance and the need to accommodate diverse functionalities within space-constrained electronic devices, making it a pivotal force shaping the landscape of the global industry.

Semiconductor Packaging Industry Segmentation:

IMARC Group provides an analysis of the key trends in each segment of the market, along with forecasts at the global, regional, and country levels for 2024-2032. Our report has categorized the market based on type, packaging material, technology, and end user.

Breakup by Type:

Flip Chip

Embedded DIE

Fan-in WLP

Fan-out WLP

Flip chip account for the majority of the market share

The report has provided a detailed breakup and analysis of the market based on the type. This includes a flip chip, embedded DIE, fan-in WLP, and fan-out WLP. According to the report, flip chip represented the largest segment.

Breakup by Packaging Material:

Organic Substrate

Bonding Wire

Leadframe

Ceramic Package

Die Attach Material

Others

Organic substrate holds the largest share of the industry

A detailed breakup and analysis of the market based on the packaging material have also been provided in the report. This includes an organic substrate, bonding wire, leadframe, ceramic package, die attach material, and others. According to the report, organic substrate accounted for the largest market share.

Breakup by Technology:

Grid Array

Small Outline Package

Flat no-leads Package

Dual In-Line Package

Others

Grid array represents the leading market segment

The report has provided a detailed breakup and analysis of the market based on the technology. This includes grid array, small outline package, flat no-leads package, dual in-line package, and others. According to the report, the grid array represented the largest segment.

Breakup by End User:

Consumer Electronics

Automotive

Healthcare

IT and Telecommunication

Aerospace and Defense

Others

Consumer electronics represents the leading market segment

The report has provided a detailed breakup and analysis of the market based on the end user. This includes consumer electronics, automotive, healthcare, IT and telecommunication, aerospace and defense, and others. According to the report, consumer electronics represented the largest segment.

Breakup by Region:

North America

United States

Canada

Asia-Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Asia Pacific leads the market, accounting for the largest semiconductor packaging market share

The market research report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific accounted for the largest market share.

The market research report has provided a comprehensive analysis of the competitive landscape. Detailed profiles of all major companies have also been provided. Some of the key players in the market include:

Amkor Technology Inc.

ASE Group

ChipMOS Technologies Inc.

Fujitsu Limited

Intel Corporation

International Business Machines Corporation

Jiangsu Changjiang Electronics Technology Co., Ltd.

Powertech Technology Inc.

Qualcomm Incorporated

Samsung Electronics Co. Ltd.

STMicroelectronics International N.V.

Taiwan Semiconductor Manufacturing Company Limited

Texas Instruments Incorporated

Key Questions Answered in This Report

  • 1. What was the size of the global semiconductor packaging market in 2023?
  • 2. What is the expected growth rate of the global semiconductor packaging market during 2024-2032?
  • 3. What are the key factors driving the global semiconductor packaging market?
  • 4. What has been the impact of COVID-19 on the global semiconductor packaging market?
  • 5. What is the breakup of the global semiconductor packaging market based on the type?
  • 6. What is the breakup of the global semiconductor packaging market based on the packaging material?
  • 7. What is the breakup of the global semiconductor packaging market based on the technology?
  • 8. What is the breakup of the global semiconductor packaging market based on the end user?
  • 9. What are the key regions in the global semiconductor packaging market?
  • 10. Who are the key players/companies in the global semiconductor packaging market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Semiconductor Packaging Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 Flip Chip
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 Embedded DIE
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast
  • 6.3 Fan-in WLP
    • 6.3.1 Market Trends
    • 6.3.2 Market Forecast
  • 6.4 Fan-out WLP
    • 6.4.1 Market Trends
    • 6.4.2 Market Forecast

7 Market Breakup by Packaging Material

  • 7.1 Organic Substrate
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Bonding Wire
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Leadframe
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Ceramic Package
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast
  • 7.5 Die Attach Material
    • 7.5.1 Market Trends
    • 7.5.2 Market Forecast
  • 7.6 Others
    • 7.6.1 Market Trends
    • 7.6.2 Market Forecast

8 Market Breakup by Technology

  • 8.1 Grid Array
    • 8.1.1 Market Trends
    • 8.1.2 Market Forecast
  • 8.2 Small Outline Package
    • 8.2.1 Market Trends
    • 8.2.2 Market Forecast
  • 8.3 Flat no-leads Package
    • 8.3.1 Market Trends
    • 8.3.2 Market Forecast
  • 8.4 Dual In-Line Package
    • 8.4.1 Market Trends
    • 8.4.2 Market Forecast
  • 8.5 Others
    • 8.5.1 Market Trends
    • 8.5.2 Market Forecast

9 Market Breakup by End User

  • 9.1 Consumer Electronics
    • 9.1.1 Market Trends
    • 9.1.2 Market Forecast
  • 9.2 Automotive
    • 9.2.1 Market Trends
    • 9.2.2 Market Forecast
  • 9.3 Healthcare
    • 9.3.1 Market Trends
    • 9.3.2 Market Forecast
  • 9.4 IT and Telecommunication
    • 9.4.1 Market Trends
    • 9.4.2 Market Forecast
  • 9.5 Aerospace and Defense
    • 9.5.1 Market Trends
    • 9.5.2 Market Forecast
  • 9.6 Others
    • 9.6.1 Market Trends
    • 9.6.2 Market Forecast

10 Market Breakup by Region

  • 10.1 North America
    • 10.1.1 United States
      • 10.1.1.1 Market Trends
      • 10.1.1.2 Market Forecast
    • 10.1.2 Canada
      • 10.1.2.1 Market Trends
      • 10.1.2.2 Market Forecast
  • 10.2 Asia-Pacific
    • 10.2.1 China
      • 10.2.1.1 Market Trends
      • 10.2.1.2 Market Forecast
    • 10.2.2 Japan
      • 10.2.2.1 Market Trends
      • 10.2.2.2 Market Forecast
    • 10.2.3 India
      • 10.2.3.1 Market Trends
      • 10.2.3.2 Market Forecast
    • 10.2.4 South Korea
      • 10.2.4.1 Market Trends
      • 10.2.4.2 Market Forecast
    • 10.2.5 Australia
      • 10.2.5.1 Market Trends
      • 10.2.5.2 Market Forecast
    • 10.2.6 Indonesia
      • 10.2.6.1 Market Trends
      • 10.2.6.2 Market Forecast
    • 10.2.7 Others
      • 10.2.7.1 Market Trends
      • 10.2.7.2 Market Forecast
  • 10.3 Europe
    • 10.3.1 Germany
      • 10.3.1.1 Market Trends
      • 10.3.1.2 Market Forecast
    • 10.3.2 France
      • 10.3.2.1 Market Trends
      • 10.3.2.2 Market Forecast
    • 10.3.3 United Kingdom
      • 10.3.3.1 Market Trends
      • 10.3.3.2 Market Forecast
    • 10.3.4 Italy
      • 10.3.4.1 Market Trends
      • 10.3.4.2 Market Forecast
    • 10.3.5 Spain
      • 10.3.5.1 Market Trends
      • 10.3.5.2 Market Forecast
    • 10.3.6 Russia
      • 10.3.6.1 Market Trends
      • 10.3.6.2 Market Forecast
    • 10.3.7 Others
      • 10.3.7.1 Market Trends
      • 10.3.7.2 Market Forecast
  • 10.4 Latin America
    • 10.4.1 Brazil
      • 10.4.1.1 Market Trends
      • 10.4.1.2 Market Forecast
    • 10.4.2 Mexico
      • 10.4.2.1 Market Trends
      • 10.4.2.2 Market Forecast
    • 10.4.3 Others
      • 10.4.3.1 Market Trends
      • 10.4.3.2 Market Forecast
  • 10.5 Middle East and Africa
    • 10.5.1 Market Trends
    • 10.5.2 Market Breakup by Country
    • 10.5.3 Market Forecast

11 SWOT Analysis

  • 11.1 Overview
  • 11.2 Strengths
  • 11.3 Weaknesses
  • 11.4 Opportunities
  • 11.5 Threats

12 Value Chain Analysis

13 Porters Five Forces Analysis

  • 13.1 Overview
  • 13.2 Bargaining Power of Buyers
  • 13.3 Bargaining Power of Suppliers
  • 13.4 Degree of Competition
  • 13.5 Threat of New Entrants
  • 13.6 Threat of Substitutes

14 Price Analysis

15 Competitive Landscape

  • 15.1 Market Structure
  • 15.2 Key Players
  • 15.3 Profiles of Key Players
    • 15.3.1 Amkor Technology Inc.
      • 15.3.1.1 Company Overview
      • 15.3.1.2 Product Portfolio
      • 15.3.1.3 Financials
      • 15.3.1.4 SWOT Analysis
    • 15.3.2 ASE Group
      • 15.3.2.1 Company Overview
      • 15.3.2.2 Product Portfolio
      • 15.3.2.3 Financials
    • 15.3.3 ChipMOS Technologies Inc.
      • 15.3.3.1 Company Overview
      • 15.3.3.2 Product Portfolio
      • 15.3.3.3 Financials
    • 15.3.4 Fujitsu Limited
      • 15.3.4.1 Company Overview
      • 15.3.4.2 Product Portfolio
      • 15.3.4.3 Financials
      • 15.3.4.4 SWOT Analysis
    • 15.3.5 Intel Corporation
      • 15.3.5.1 Company Overview
      • 15.3.5.2 Product Portfolio
      • 15.3.5.3 Financials
      • 15.3.5.4 SWOT Analysis
    • 15.3.6 International Business Machines Corporation
      • 15.3.6.1 Company Overview
      • 15.3.6.2 Product Portfolio
      • 15.3.6.3 Financials
      • 15.3.6.4 SWOT Analysis
    • 15.3.7 Jiangsu Changjiang Electronics Technology Co., Ltd.
      • 15.3.7.1 Company Overview
      • 15.3.7.2 Product Portfolio
      • 15.3.7.3 Financials
    • 15.3.8 Powertech Technology Inc.
      • 15.3.8.1 Company Overview
      • 15.3.8.2 Product Portfolio
      • 15.3.8.3 Financials
      • 15.3.8.4 SWOT Analysis
    • 15.3.9 Qualcomm Incorporated
      • 15.3.9.1 Company Overview
      • 15.3.9.2 Product Portfolio
      • 15.3.9.3 Financials
      • 15.3.9.4 SWOT Analysis
    • 15.3.10 Samsung Electronics Co. Ltd.
      • 15.3.10.1 Company Overview
      • 15.3.10.2 Product Portfolio
      • 15.3.10.3 Financials
      • 15.3.10.4 SWOT Analysis
    • 15.3.11 STMicroelectronics International N.V.
      • 15.3.11.1 Company Overview
      • 15.3.11.2 Product Portfolio
      • 15.3.11.3 Financials
      • 15.3.11.4 SWOT Analysis
    • 15.3.12 Taiwan Semiconductor Manufacturing Company Limited
      • 15.3.12.1 Company Overview
      • 15.3.12.2 Product Portfolio
      • 15.3.12.3 Financials
      • 15.3.12.4 SWOT Analysis
    • 15.3.13 Texas Instruments Incorporated
      • 15.3.13.1 Company Overview
      • 15.3.13.2 Product Portfolio
      • 15.3.13.3 Financials
      • 15.3.13.4 SWOT Analysis

List of Figures

  • Figure 1: Global: Semiconductor Packaging Market: Major Drivers and Challenges
  • Figure 2: Global: Semiconductor Packaging Market: Sales Value (in Billion US$), 2018-2023
  • Figure 3: Global: Semiconductor Packaging Market Forecast: Sales Value (in Billion US$), 2024-2032
  • Figure 4: Global: Semiconductor Packaging Market: Breakup by Type (in %), 2023
  • Figure 5: Global: Semiconductor Packaging Market: Breakup by Packaging Material (in %), 2023
  • Figure 6: Global: Semiconductor Packaging Market: Breakup by Technology (in %), 2023
  • Figure 7: Global: Semiconductor Packaging Market: Breakup by End User (in %), 2023
  • Figure 8: Global: Semiconductor Packaging Market: Breakup by Region (in %), 2023
  • Figure 9: Global: Semiconductor Packaging (Flip Chip) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 10: Global: Semiconductor Packaging (Flip Chip) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 11: Global: Semiconductor Packaging (Embedded DIE) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 12: Global: Semiconductor Packaging (Embedded DIE) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 13: Global: Semiconductor Packaging (Fan-in WLP) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 14: Global: Semiconductor Packaging (Fan-in WLP) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 15: Global: Semiconductor Packaging (Fan-out WLP) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 16: Global: Semiconductor Packaging (Fan-out WLP) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 17: Global: Semiconductor Packaging (Organic Substrate) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 18: Global: Semiconductor Packaging (Organic Substrate) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 19: Global: Semiconductor Packaging (Bonding Wire) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 20: Global: Semiconductor Packaging (Bonding Wire) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 21: Global: Semiconductor Packaging (Leadframe) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 22: Global: Semiconductor Packaging (Leadframe) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 23: Global: Semiconductor Packaging (Ceramic Package) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 24: Global: Semiconductor Packaging (Ceramic Package) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 25: Global: Semiconductor Packaging (Die Attach Material) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 26: Global: Semiconductor Packaging (Die Attach Material) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 27: Global: Semiconductor Packaging (Other Packaging Materials) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 28: Global: Semiconductor Packaging (Other Packaging Materials) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 29: Global: Semiconductor Packaging (Grid Array) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 30: Global: Semiconductor Packaging (Grid Array) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 31: Global: Semiconductor Packaging (Small Outline Package) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 32: Global: Semiconductor Packaging (Small Outline Package) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 33: Global: Semiconductor Packaging (Flat no-leads Package) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 34: Global: Semiconductor Packaging (Flat no-leads Package) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 35: Global: Semiconductor Packaging (Dual In-Line Package) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 36: Global: Semiconductor Packaging (Dual In-Line Package) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 37: Global: Semiconductor Packaging (Other Technologies) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 38: Global: Semiconductor Packaging (Other Technologies) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 39: Global: Semiconductor Packaging (Consumer Electronics) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 40: Global: Semiconductor Packaging (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 41: Global: Semiconductor Packaging (Automotive) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 42: Global: Semiconductor Packaging (Automotive) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 43: Global: Semiconductor Packaging (Healthcare) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 44: Global: Semiconductor Packaging (Healthcare) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 45: Global: Semiconductor Packaging (IT and Telecommunication) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 46: Global: Semiconductor Packaging (IT and Telecommunication) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 47: Global: Semiconductor Packaging (Aerospace and Defense) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 48: Global: Semiconductor Packaging (Aerospace and Defense) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 49: Global: Semiconductor Packaging (Other End Users) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 50: Global: Semiconductor Packaging (Other End Users) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 51: North America: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 52: North America: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 53: United States: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 54: United States: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 55: Canada: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 56: Canada: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 57: Asia-Pacific: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 58: Asia-Pacific: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 59: China: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 60: China: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 61: Japan: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 62: Japan: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 63: India: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 64: India: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 65: South Korea: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 66: South Korea: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 67: Australia: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 68: Australia: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 69: Indonesia: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 70: Indonesia: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 71: Others: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 72: Others: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 73: Europe: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 74: Europe: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 75: Germany: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 76: Germany: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 77: France: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 78: France: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 79: United Kingdom: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 80: United Kingdom: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 81: Italy: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 82: Italy: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 83: Spain: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 84: Spain: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 85: Russia: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 86: Russia: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 87: Others: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 88: Others: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 89: Latin America: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 90: Latin America: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 91: Brazil: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 92: Brazil: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 93: Mexico: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 94: Mexico: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 95: Others: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 96: Others: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 97: Middle East and Africa: Semiconductor Packaging Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 98: Middle East and Africa: Semiconductor Packaging Market: Breakup by Country (in %), 2023
  • Figure 99: Middle East and Africa: Semiconductor Packaging Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 100: Global: Semiconductor Packaging Industry: SWOT Analysis
  • Figure 101: Global: Semiconductor Packaging Industry: Value Chain Analysis
  • Figure 102: Global: Semiconductor Packaging Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Semiconductor Packaging Market: Key Industry Highlights, 2023 and 2032
  • Table 2: Global: Semiconductor Packaging Market Forecast: Breakup by Type (in Million US$), 2024-2032
  • Table 3: Global: Semiconductor Packaging Market Forecast: Breakup by Packaging Material (in Million US$), 2024-2032
  • Table 4: Global: Semiconductor Packaging Market Forecast: Breakup by Technology (in Million US$), 2024-2032
  • Table 5: Global: Semiconductor Packaging Market Forecast: Breakup by End User (in Million US$), 2024-2032
  • Table 6: Global: Semiconductor Packaging Market Forecast: Breakup by Region (in Million US$), 2024-2032
  • Table 7: Global: Semiconductor Packaging Market: Competitive Structure
  • Table 8: Global: Semiconductor Packaging Market: Key Players